Bodo's News

All People Industry Event Product

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

Strategic Partnership to drive Zero-Emission Bus Transport in Europe

Learn more:
bmz-group.com

Industry News
2024-04-23

Daimler Buses and BMZ have entered into a strategic partnership for the development and supply of the next generation of e-bus batteries. Together with Daimler Buses, BMZ will further develop the existing battery technology specifically for the requirements of electrically powered buses. The new battery generation NMC4 – succeeding the current NMC3 technology – will combine high energy density, resulting in a longer range for e-buses, with an ultra-long cycle life. Customers of Daimler Buses will be able to use NMC4 batteries from the middle of the decade. Daimler Buses is pursuing an e-roadmap across all segments: Electrically powered city buses have already been in series production since 2018; intercity e-buses are to follow as of the middle of the decade and electrified coaches by 2030. With this, Daimler Buses aims to offer locally CO2-neutral models based on batteries or hydrogen in every segment by 2030.

Energy-Saving DC/DC Converter ICs in TSOT23 Package

Learn more:
rohm.com

Product Release
2024-04-23

ROHM has developed four compact DC/DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz. The company has developed products that achieve higher efficiency in an even smaller package than existing SOP-J8 (JEDEC standard: SOIC8 equivalent) products. These converter ICs deliver an output current of 1 A to 3 A in the compact TSOT23 package (2.8 mm × 2.9 mm). This reduces component area by up to 72% compared to the general SOP-J8 package (4.9 mm × 6.0 mm), contributing to the miniaturization of power supply blocks. On top, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance. The BD9E105FP4-Z, BD9E202FP4-Z, and BD9E304FP4-LBZ also utilize a COT control mode during light load operation. As a result, efficiency during light load operation is improved over standard products, making them well-suited for applications requiring low standby power consumption. In addition to the ICs, evaluation boards together with various support tools are available that enable immediate evaluation during application design.

High-Temperature Inductors are resistant to Thermal Aging

Learn more:
we-online.com

Product Release
2024-04-23

Würth Elektronik supplements its molded power inductors series with the high-temperature versions WE-MAPI and WE-LHMI. The inductors can be used continuously at high rated currents in a temperature range from -55 °C to +150 °C. The compact components have been tested for thermal aging for over 1000 hours at 200 ºC and are qualified to AEC-Q200. High temperatures in inductors with an iron alloy magnetic core result in thermal aging phenomena. Core losses rise sharply and efficiency drops. Aging can lead to increased self-heating in the component, which in turn exacerbates thermal aging. By expanding its inductor series, Würth Elektronik offers power inductors that are not only unaffected by thermal aging but also do not suffer any performance loss. The SMT power inductors boast low losses, high efficiency, lightweight design, and a low package profile. Their high-current-carrying capacity and capability of handling high transient current peaks can be utilized in applications such as DC/DC converters for high currents in power supplies or for field programmable gate arrays (FPGA), point of load (POL) converters or CPU/RAM power supplies.

Measurement Facility in Bengaluru/India

Learn more:
rohde-schwarz.com

Industry News
2024-04-22

Rohde & Schwarz has inaugurated a facility center in Bengaluru's Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. For Rohde & Schwarz, India is not merely a growth market but a vital component of its global strategy. The R&D team in Bengaluru is involved in developing next generation. The facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions.

Silicon Carbide Wafer Supply Agreement

Learn more:
rohm.com

Industry News
2024-04-22

ROHM and STMicroelectronics announced the expansion of the existing multi-year, long-term 150 mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, which is a ROHM group company. The multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million. Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented "This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions". "SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality". said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.

Power Factor Correction Chokes

Learn more:
itg-electronics.com

Product Release
2024-04-21

ITG Electronics has introduced a line of power factor correction (PFC) chokes whose slim design enables engineers to incorporate them into tight spaces. The company's PFC282820B and PFC282822B series of PFC chokes are suitable for 500 - 1000 W continuous conduction mode PFC boost converter applications. ITG Electronics also offers a wider design (27.5 x 28.5 mm3) compatible with power systems up to 2,000 W. These devices are part of ITG Electronics' broader Cubic Design PFC Choke series. Compared with traditional, toroidal-shaped PFC chokes, the new series extension incorporates a flat wire and square core to save space and increase power density. ITG Electronics' range of PFC chokes are appropriate for AC to DC power conversion in industrial equipment and automative components manufacturing environments.

Integration of Power Supply Company completed

Learn more:
emtron.de

Industry News
2024-04-19

With the official change of name, the legal step has been completed: Emtron electronic GmbH is now called FORTEC Power GmbH. Emtron electronic GmbH has already been part of FORTEC Elektronik AG since 1998. In July 2023, a change to a "branded house" was initiated within the FORTEC Group, i.e. holistic corporate brands were designed for the FORTEC group subsidiaries in order to offer the comprehensive product range of Display Technology, Embedded and Power Supplies under one brand and to appear as "FORTEC One" in communication with the market.

Innauguration of Plant in Malaysia

Learn more:
lem.com

Industry News
2024-04-19

LEM chose to make such a substantial investment in the state of Penang/Malaysia by opening a new plant in this region. From employing around 70 people in April 2024, LEM expects to increase the headcount to more than 200 people by March 2025 and eventually more than 500, with sales from the factory expected to reach over € 200 millions. With plans in place already for an extension on the additional 5,000 m² of land, the new 11,800 m² factory features a state-of-the-art logistic system including automatic guided vehicles (AGVs) on the shopfloor which transport components from the warehouse to the high-tech production lines. LEM Malaysia is also the pilot for the roll-out of the company's ERP system and will produce a substantial part of its energy through solar panels.

GaN IC enables solar-powered Irrigation Pump

Learn more:
navitassemi.com

Industry News
2024-04-18

Navitas has announced, that Virtual Forest one of India's leading electronics design companies specializing in motor control and human interface technologies for consumer appliances, fluid movement and mobility, has adopted its GaNFast power integrated circuits (IC) technology for a zero-emission, powerful 3 hp (2,250 W) solar-powered irrigation pump. This pump is remotely accessed via quad-band IoT with low power consumption. It can raise 200 l of water per minute to a height of about 30 m, enough to water 3 acres of farmland, and help to produce 10 tonnes of wheat. Further, the IoT enabled solar pump ensures optimal water usage through intelligent analytics, therefore minimizing ground water utilization. Currently, the majority of pumps in this area is powered by polluting and noisy diesel generators or expensive, lossy long-distance electrical cables. The Virtual Forest solar pump with maximum power point tracking (MPPT) operates in conjunction with solar panel and energy storage to provide robust, energy-independent and pollution-free performance at the point of use. In this application two GaN power FETs with GaN drivers, level-shifters, protection features and high-efficiency loss-less current sensing NV6269 half-bridge ICs are used.

Fully integrated 48 W Power Supply Board mount Module

Learn more:
gaia-converter.com

Product Release
2024-04-17

The PSDG-48 series is a fully integrated COTS multi-output 48 W isolated power supply board mount module from Gaia Converter. Dedicated to 24 & 28 VDC military and High Reliability applications, MIL-STD-461, MIL-STD-704, MIL-STD-1275, ABD100 and DO160 power supply requirements are all built into this module. It is equipped with an integrated EMI filter, reverse polarity protection, hold-up function (50 ms transparency timing managed with external capacitor), high & low input voltage transients and inrush current limit and short circuit and over-voltage protected outputs. The module operates from -40 °C to +105 °C (full load case operating temperature range) and is suitable for all rugged applications complying with MIL-STD-202 & 810 for altitude, humidity, temperature shocks & cycles, mechanical vibrations and shocks. The power supplys of the PSDG series use a fixed high frequency switching topology. It is fully encapsulated with thermally conductive resin for optimal power dissipation in harsh environments. The complete power supply efficiency up to 87%. It is integrated in a black anodized machined aluminium case measuring 91 x 54 x 9 mm³.

European and Korean Semiconductor Manufacturer cooperate on GaN and SiC

Learn more:
swegan.se

Industry News
2024-04-15

SweGaN, a European semiconductor manufacturer that develops and produces engineered high-performance Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, announces it has entered strategic partnership with South Korea based RFHIC Corporation. RFHIC is active in designing and manufacturing GaN RF & microwave semiconductors for communications and defense applications. The agreement encompasses an undisclosed equity investment from RFHIC. The two companies will focus on joint R&D and product development moving forward. Over the last decade, SweGaN has been developing and producing high-performance GaN-on-SiC epitaxial solutions for RF and power devices that can be used in various applications such 5G telecommunications infrastructure, defense radars, satellite communications, on-board chargers, and data centers. This strategic investment by RFHIC shows the recognition of SweGaN's QuanFINE® epitaxial solutions as a differentiator among GaN-on-SiC materials available on the market. In partnership with RFHIC, SweGaN gains additional resources to expedite market penetration and to achieve its business goals. RFHIC Corporation cites the partnership with SweGaN and investment strategy target strengthening RFHIC's gallium nitride semiconductor supply chain and further fortifying its competitiveness of RF and microwave products within the compound semiconductor arena. In the joint collaboration, SweGaN and RFHIC plan to address the increasing demand for GaN semiconductors and initiate new product developments for a variety of markets.

Expanded Power Portfolio

Learn more:
tek.com

Industry News
2024-04-12

Tektronix has acquired EA Elektro-Automatik (EA), a principal supplier of high-power electronic test solutions for energy storage, mobility, hydrogen, and renewable energy applications. The introduction of EA to the Tektronix team provides the company with expanded solutions, leveraging Tektronix's oscilloscopes and isolated probes, EA's power supplies and electronic loads, and Keithley's source meters and instrumentation. Combined, the Tektronix portfolio offers a set of capabilities for energy storage and power electronics design needs, from ultra-low to ultra-high power. With the addition of EA, Tektronix is well equipped to serve engineers who are electrifying our world. With emphasis on creating solutions for power electronics in the semiconductor, aerospace, and automotive industries, the Tektronix and EA product portfolio addresses issues in energy storage, mobility, and hydrogen fuel.

300 mm Wafer Fab dedicated for Power Semiconductors

Learn more:
renesas.com

Industry News
2024-04-12

Renesas has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. Renesas aims to boost its production capacity of power semiconductors in anticipation of the growing demand in electric vehicles (EVs). The Kofu Factory previously operated both 150 mm and 200 mm wafer fabrication lines until October 2014. Renesas made the decision to re-open the factory as a 300 mm wafer fab to support the growing demand for power semiconductors. The factory will start mass production of IGBTs and other products in 2025, doubling Renesas' current production capacity for power semiconductors.

Tiny Encapsulated Buck Regulators Supply up to 20 A with up to 94% Efficiency

Learn more:
recom-power.com

Product Release
2024-04-11

RECOM now offers a range of four encapsulated buck regulators in ultra-compact, thermally enhanced LGA and QFN packages with output current ratings of 1, 3, 10, and 20 A for cost-sensible markets. The first product, the RPL-1.0, comes in a 3 mm x 3 mm LGA footprint with a "height" of 2 mm and operates over an input range of 3 to 22 V with an adjustable output of 0.6 to 12 V. 1 A output will still be available when the ambient temperature exceeds 80 °C, depending on input/output voltage combinations with operation temperatures up to 125 °C ambient possible, however, with derating. Efficiency is up to 95%. RPH-3.0 is integrated in a 47-pad QFN package measuring 10 mm x 12 mm x 4 mm height, and provides 3 A at the output over an input range of 4.5 to 55 V. Its adjustable output range spreads from 1 to 15 V. Efficiency is up to 91%, and full output current can be delivered even at temperatures beyond 80 °C, for example at 12 Vin and 3.3 V_out. The third device, RPL-10, is rated at 10 A output and offers several additional features. Integrated in an LGA-M package (7 mm x 7 mm x 4.4 mm) the regulator operates with input voltages between 4 and 16 V while the programmable output voltage can be in the range of 0.6 to 5.5 V. Finally, the RPL-20 is claimed to take the "power density to a new level" with its 20 A rating from a programmable output of 0.6 to 5.5 V. Its input range spans from 4 to 16 V, and the maximum efficiency is 94%.

USB Type-C Protection Switch for increased Efficiency and Safety

Learn more:
aosmd.com

Product Release
2024-04-11

Alpha and Omega Semiconductor (AOS) has released the AOZ1377DI Type-C Protection Switch which is designed to enhance USB Type-C efficiency and safety. These protection Type-C switches have a current-limiting switch targeting applications that require comprehensive protections. AOZ1377DI supports up to 7 A with an input voltage of up to 20 V, making it usable for both sink and source applications. The AOZ1377DI offers features that significantly reduce voltage drop and power loss compared to back-to-back p-channel devices typically used in such applications. The device supports an input operating voltage range of 3.4 V to 23 V, with both V_IN and V_OUT terminals rated at a maximum of 28 V, and is capable of up to 7 A. These devices are suited for high-power applications requiring multi-port Type-C PD 3.0 current source supporting up to 100 W like in high-performance laptops, personal computers, monitors, docking stations, and other Type-C port applications. The AOZ1377DI has a True Reverse Current Blocking (TRCB) protection, which prevents undesired reverse current from V_OUT to V_IN. It also features an internal current-limiting and short-circuit current limit that protects the source device from large load current. The current limit threshold can be set externally with a resistor. Furthermore, the integrated back-to-back MOSFET is said to deliver "the industry's lowest ON resistance and highest SOA to safely handle high currents and a wide range of output capacitances on V_OUT".

Taiwanese Company opens Office in Japan

Learn more:
panjit.com.tw

Industry News
2024-04-11

The Taiwanese MOSFET manufacturer PANJIT has officially opened its Japan branch in Tokyo. This is a significant milestone and it shows PANJIT's dedication to global expansion and its commitment to serving the Japanese market. The Japan branch will serve as a key hub in Asia, enhancing service efficiency and improving communication with Japanese clients. This initiative aims to provide tailored solutions and localized support. At the opening ceremony, Jason Fang, President of the PANJIT Group, highlighted the significance of the Japan office: "The establishment of our Japan branch is central to our global ambitions and our dedication to the Japanese market. We are committed to delivering prompt, tailored service to ensure our Japanese customers feel highly valued and supported."

Wide Bandgap Applications Workshop in Sweden

Learn more:
scape2024.se

Event News
2024-04-10

WBG Power Center and RISE, in collaboration with Yole Group are pleased to announce the international workshop in applications of wide bandgap (WBG) power electronics, SCAPE 2024. The event will cover the latest results and innovations in power electronics applications of wide bandgap materials, such as silicon carbide and gallium nitride. SCAPE 2024 (previously known as ISiCPEAW and IWBGPEAW) is a three-day event, consisting of two workshop days, May 14 - 15, preceded by one tutorial day, May 13. The program is defined by WBG experts and reflects the status of WBG from an industry point of view. Specialists from all over the world will present their views on status, ongoing development and the opportunities of applications in the power electronics area. They will also present the latest products and solutions and will be available for detailed technical discussions.

1 W Isolated and Regulated DC/DC is just 1.18 mm tall

Learn more:
recom-power.com

Product Release
2024-04-09

Recom has introduced fully integrated RxxC1TF isolated DC/DC converters, which offer tightly regulated and selectable outputs at 3.3 V or 5 V in a 12-pad LGA surface mount package, just 5 x 4 x 1.18 mm³. The product is rated for 200 mA output up to 80 °C ambient, with derating to 125 °C, with an input range of 3 to 5.5 V_DC. Despite the tiny size of the part, an isolation rating of 3 kV_AC is achieved for 1 s along with full line and load regulation, on/off control, selectable outputs, and full protection against input under-voltage, over-temperature, and output overload and short circuits. Isolation capacitance is specified at 5 pF typical. Applications for the RxxC1TF include COM port and sensor isolation in industrial and building automation, datacomms, and IoT.

Power MOSFETs with high-speed Body Diode

Learn more:
toshiba.semicon-storage.com

Product Release
2024-04-09

Toshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 in TO-247 package are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series. This generation has a super junction structure suitable for switching power supplies in demanding applications including data centres and power conditioners for photovoltaic (PV) generators. The two power MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (t_rr) with values of 160 ns and 115 ns, respectively. Compared with Toshiba standard MOSFETs, the products reduce the reverse recovery charge (Q_rr) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of "drain-source On-resistance × gate-drain charge" (R_DS(ON) * Q_gd) has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. These features reduce power losses of equipment, which helps efficiency. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have R_DS(ON) values of 42 mΩ and 95 mΩ, respectively. They are capable of delivering drain currents (I_D) up to 55 A and 29 A. Both devices are housed in a TO-247 package. Furthermore a reference design is available.

GaN FETs for High-Performance Class-D Audio Amplifiers

Learn more:
epc-co.com

Product Release
2024-04-09

EPC has launched the EPC9192 reference design for efficient Class-D audio amplifiers. The EPC9192 showcases the capabilities of EPC's 200 V, EPC2307, eGaN FETs in a ground-referenced, split dual supply Single-Ended (SE) design, delivering 700 W per channel into a 4 Ω load. The EPC9192 features a modular design that allows for scalability and expandability. The motherboard hosts two PWM modulators and two half bridge power stage daughterboards, implementing a two-channel amplifier with 12 V housekeeping supplies and protections. Users are able to customize the PWM modulator and power stage, facilitating the evaluation and comparison of different devices and modulation techniques. The EPC9192 provides a dual split supply input, unregulated, ±42 V to ±85 V for power stage while its analog inputs may be balanced (XLR) or unbalanced (RCA). It is configurable for two independent SE channels or single channel BTL mode. Undervoltage, Overvoltage, Overcurrent, and Overtemperature protections are included in the device. Its switching frequency is beyond 600 kHz while the noise floor is 40 µV, and the frequency response in the range of 5 Hz - 20 kHz is +/- 0.5 dB, regardless of load.

Power MOSFETs with high-speed Body Diode

Learn more:
toshiba.semicon-storage.com

Product Release
2024-04-09

Toshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series – with a super junction structure suitable for switching power supplies in applications including data centres and power conditioners for photovoltaic generators. The MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (t_rr) with values of 160 ns and 115 ns, respectively. Compared with Toshiba's standard MOSFETs, the devices reduce the reverse recovery charge (Q_rr) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of R_DS(ON) * Q_gd has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have R_DS(ON) values of 42 mΩ and 95 mΩ, respectively, delivering drain currents up to 55 A and 29 A. Both devices are housed in a TO-247 package.

Position in Automotive Semiconductor Market improved

Learn more:
infineon.com

Industry News
2024-04-09

Infineon Technologies continued to expand its market position in automotive semiconductors in 2023. According to the latest research by TechInsights, the global automotive semiconductor market grew by 16.5 percent in 2023, reaching a new record size of US$ 69.2 billion. Infineon's overall market share increased by one percentage point, from nearly 13 percent in 2022 to about 14 percent in 2023, solidifying the company's position as a global leader in the automotive semiconductor market. Infineon's semiconductors are used in automotive key applications like driver assist and safety systems, powertrain and battery management, comfort, infotainment and security. According to TechInsights, Infineon has increased its market share in all regions and remained market leader in South Korea and China. In addition, the semiconductor manufacturer has made significant gains in the Japanese automotive semiconductor market. Infineon has strengthened its strong European presence as the second-largest player, as well as its top three position in North America. A major driver of Infineon's performance was strong automotive microcontroller (MCU) sales. For the first time, Infineon has reached the world's number one position in this market.

250 W Medical and Industrial Power Supply Series

Learn more:
lambda.tdk.com

Product Release
2024-04-09

TDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2 inches x 4 inches footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 V_AC input and has a earth leakage current of less than 150 µA – including all tolerances. The touch current is <10 µA (Class I) and <70 µA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80°C is also possible.

Expansion of Partnership with Foundry

Learn more:
microchip.com

Industry News
2024-04-08

Microchip announced it has expanded its partnership with the semiconductor foundry TSMC to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing (JASM), TSMC's majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip's ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners. The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip's potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.

Family of Power Analyzers

Learn more:
rohde-schwarz.com

Product Release
2024-04-04

A family of Rohde & Schwarz power analyzers is now available in three models to meet the requirements for measuring voltage, current, power and total harmonic distortion on both DC and AC sources. The R&S NPA101 power meter provides all basic measurements, the R&S NPA501 power analyzer adds enhanced measurement functions and graphical analysis, and the R&S NPA701 compliance tester includes evaluation functions in line with IEC 62301 and EN 50564 for power consumption and EN 61000-3-2 for EMC harmonic emission testing. All models of the R&S NPA family of power analyzers meet the requirements of these stages for power measurements at levels from 50 µW to 12 kW, at potential differences from 1 mV to 600 V and currents from 1 mA to 20 A. The R&S NPA501 and R&S NPA701 include interfaces for external probes or shunts to further extend the range. All three models feature a sampling rate of 500 ksample/s. The 16-bit resolution A/D convertor provides an accuracy of ± 0.05 % for both current and voltage readings. The three instruments of the R&S NPA family include the same 23 standard measurements of power, current, voltage, harmonic distortion and energy.

Opening of Manufacturing and After-Sales Support Facility in Thailand

Learn more:
recom-power.com

Industry News
2024-04-03

Recom has recently established its new manufacturing and after-sales support setup in Bangkok, Thailand. The initiative aims to enhance service quality for the global market and the local customer base, as well as to minimize supply chain risks for international clients. Claimed to set new standards in manufacturing, quality control, and after-sales services, the facility is said to represent "a significant advancement in Recom's operational capabilities". It also houses a logistics center designed to ensure efficient, on-time deliveries to both regional hubs and customers worldwide. Central to the new setup is a commitment to sustainability. Optimizing the supply chain, manufacturing processes, and transportation methods, the facility significantly reduces energy consumption. These efforts mark a major step in Recom's journey towards complete sustainability and achieving zero emissions across the full value chain. In 2024, the focus is on reaching a significant milestone: Recom Thailand is set to ship over 1 million pieces of a wide range of low- and high-power products, from 1 W to 2 kW, catering to the global market.

Rad Hard GaN Gate Driver IC

Learn more:
epc.space

Product Release
2024-04-03

EPC Space announces the launch of EPC7009L16SH, a Radiation Hardened Gallium Nitride gate driver integrated circuit. Built on EPC's proprietary eGaN IC technology, the company claims that the device "delivers the best solution for power management where size, efficiency and simple design are critical". The EPC7009L16SH integrates input logic interface, undervoltage lockout (UVLO) protection, a 10 V-to-5.25 V linear regulator and driver circuit within a hermetically sealed 16-pin SMT package to create a driver that can switch at rates of up to 3.0 MHz. The total ionizing dose is guaranteed to 1000 kRad, and the SEE immunity for LET at 84 MeV/mg/cm² with the IC's primary supply voltage at 100% of its maximum operating value. Moreover, EPC7009L16SH can drive at least four EPC Space discrete GaN devices. The component is part of a family of space-level Rad Hard ICs that EPC and EPC Space will be launching starting this year. EPC7009L16SH applications include high speed DC-DC conversion, motor drivers, power switches/actuators, and satellite electrical systems.

General Manager & Vice President EMEA appointed

Learn more:
schurter.com

People
2024-04-02

SHURTER welcomes Steffen Lindner to its leadership team. As of April 1, 2024, he has taken over the newly created position of General Manager & Vice President EMEA. In this role, Steffen Lindner will be responsible for all company activities in EMEA, including product management, engineering, sales, and production. After completing his education as a radio and television technician and earning a graduate degree in electrical engineering / communications engineering, Steffen Lindner began his career in sales at Phoenix Contact. After two decades at Phoenix Contact, Steffen Lindner took over sales for Europe, Middle East and Africa at TE Connectivity Industrial. He adapted the sales organization to the changing market conditions and customer needs and introduced a potential-oriented market approach. By strategically focusing on key customers in specific application areas and working in partnership with distributors, Steffen Lindner was able to achieve above-average growth with the new organization. During his almost seven years at TE Connectivity Industrial, he was involved in several company acquisitions and their integration processes.

Power Seminar in German Language

Learn more:
mankel-engineering.de

Event News
2024-04-02

Targeting Hardware-/Software design engineers, product development, business development and key accounts Mankel Engineering is organizing a hands-on-oriented user symposium about motors and inverters of xEVs. The seminar, which will take place at the end of June 2024 in northwestern Germany, can only be attended with physical presence, and the conference language is German. After an introduction about electrical motors the main focus will be on the components of a power inverter.

CEO of Swiss Company now in charge

Learn more:
datwyler.com

People
2024-04-02

As announced in October 2023, Volker Cwielong took over as CEO of Datwyler on 1 April 2024. Dirk Lambrecht, who had held the position since 2017, stepped down at the end of March 2024 and was elected to the Board of Directors at the Annual General Meeting. Volker Cwielong has been a member of the management team of the globally present Eberspächer Group since 2017. As Co-CEO of the Purem by Eberspächer division, he was responsible for net sales of some EUR 2 billion and for more than 7'000 employees at over 40 locations on three continents. He led the sales, production, technology and innovation units and had full responsibility for the division's results. Before, Volker Cwielong held various global management positions for international industrial groups and automotive suppliers. Volker Cwielong is a mechanical engineer and holds an MBA.

Managing Director of Power Company

Learn more:
emea.lambda.tdk.com

People
2024-04-02

TDK Corporation announces the appointment of Christopher Haas as Managing Director at TDK-Lambda Germany from 1st April 2024. Christopher has been a member of the Board of Directors since 2012 and will retain his previous duties heading the Quality & Compliance organisation within the EMEA region in his new role. With over 20 years of experience working in the electronics industry, Christopher brings a comprehensive portfolio of technical knowledge, as well as an enterprising skill set, holding an Executive Master's in International Business. Christopher succeeds Gustav Erl, who will retire on 30th June 2024, after 38 years of seniority. In his new role, Christopher intends to lead the organisation with a vision of sustainable and future-oriented growth, building on the company's foundation and values.

Power Conversion Solutions for 48V Zonal Architectures at WCX 2024

Learn more:
vicorpower.com

Event News
2024-04-02

As the automotive industry moves toward 48V zonal architectures, power system design engineers are looking for new high voltage power conversion solutions that have leading power density, weight and scalability attributes. Vicor will be presenting five papers at World Congress Experience 2024 (WCX™) in Detroit on April 16 – 18, detailing its innovative approach to 800V and 48V power conversion using new high-density, scalable power modules with proprietary topologies and innovative packaging.

Semiconductor Manufacturer fully merges its Subsidiary

Learn more:
rohm.com

Industry News
2024-04-01

ROHM announces an absorption-type merger of its fully owned subsidiary LAPIS Technology on April 1, 2024. The merger is intended to integrate the technologies of ROHM and LAPIS Technology. The newly-organized company will work as one to develop products that meet the needs of its customers. ROHM explicitly reassured that the business relationship with its customers as well as the existing products of LAPIS Technology will be continued by ROHM. "Amid dramatic changes in the business environment in the semiconductor industry, it is necessary to build a robust group-wide management structure in order to improve competitiveness", ROHM reports. "LAPIS Technology is a wholly owned subsidiary responsible for the planning and development of IC products. By enhancing the integration density of the technologies that both companies excel in, we will not only cultivate existing products, but also strengthen our development capability for high-value-added products with digital control added to power and analog products."

Global Distribution Agreement with Power Solutions Company

Learn more:
mouser.com

Industry News
2024-03-27

Mouser Electronics announced a global distribution agreement with Vox Power, a manufacturer of AC/DC power supplies and DC/DC converters. As part of this agreement, Mouser Electronics will distribute Vox Power's configurable, and rugged fanless conduction-cooled power supplies. These products have been specifically designed for the medical, industrial, and technology markets, providing high-density solutions that fit into compact spaces for demanding applications that conventional products cannot meet. The NEVO+600 modular configurable power supply, available from Mouser, is said to be the smallest in its class and "the ultimate solution for demanding applications where size, power density and weight matter".

Substrates for Organic Field Effect Transistors (OFETs)

Learn more:
ipms.fraunhofer.de

Industry News
2024-03-27

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion. Customized designs enable the optimal measurement of semiconductors and conductors. Organic semiconductors are key components in organic electronics and photovoltaics. They are used to make flexible electronic devices and printed solar cells. Typical for this class of materials are low temperature processes as well as large area deposition and patterning using various coating and printing techniques. The active semiconductor materials significantly determine the performance of the entire system. Therefore, an easy to handle and reliable electronic characterization of conductivity, carrier mobility, contact resistance and on/off current ratio of these semiconductors is an essential requirement for material and process developers. Fraunhofer IPMS develops and manufactures silicon substrates with single transistor structures in bottom-gate architecture, which are used for the fabrication of organic field-effect transistors (OFETs) or for the characterization of electrical material parameters of conductive materials, e.g. for organic photovoltaics. Substrates for organic field-effect transistors (OFET) for the development of high-tech materials.

Ultrafast Soft Recovery Diode Modules deliver High Reliability

Learn more:
vishay.com

Product Release
2024-03-27

Vishay Intertechnology introduced two FRED Pt 500 A ultrafast soft recovery diode modules in a TO-244 Gen III package. Offering higher reliability than previous-generation solutions, the Vishay Semiconductors VS-VSUD505CW60 and VS-VSUD510CW60 are designed to reduce losses and EMI / RFI in high frequency power conditioning systems. The rugged TO-244 package of the diode modules withstands 46 000 IOL cycles at given conditions, offering an up to 5x improved life expectancy over previous-generation devices. In addition, the industry-standard package is footprint-compatible with competing solutions in the TO-244 to provide a drop-in replacement for existing designs. The VS-VSUD505CW60 and VS-VSUD510CW60 are suited for high frequency welding, high current converters and ballast water management systems (BWMS) in railway equipment, cranes, and ships, UPS and other applications where switching losses comprise a significant portion of the total losses. In these applications, the softness of their recovery eliminates the need for a snubber. Offered in a common cathode configuration, the diode modules provide forward voltage drop down to 0.82 V, thermal resistance - junction to case - of 0.16 °C/W, and an operating temperature range up to +175 °C.

Series of Narrow Body Power Beads

Learn more:
itg-electronics.com

Product Release
2024-03-27

ITG Electronics has launched a line of narrow body power beads for high-density applications where component space is at a premium. With a footprint of 5 x 9 mm and a height of 9.5 mm, the company's SLA36385A Series are well-suited for data centers, primary mother boards for servers and storage devices, and other scenarios requiring components to offer high current with low footprint. Featuring more than a dozen items, ITG Electronics SLA36385A Series features inductance values ranging from 35 – 470 nH; the 35 nH component can handle more than 200 A of current, with approximately 20% roll off. Each item in the series offers a DC resistance rate of 0.125 mOhm for high-current functionality. The SLA36385A Series is immersion cooling ready. The SLA36385A Series constitutes ferrite-based SMD inductors. The components feature operating frequencies up to 5.0 MHz, and a temperature range of -55 °C to + 130 °C. Each item in the series is both RoHS & HF compliant. To meet varying current sensing requirements, options for 5% tight tolerance control on DC resistance are also available.

CEO of Soft-Switching Company joins Executive Board of Engineering School

Learn more:
pre-switch.com

People
2024-03-27

Pre-Switch has announced that its CEO Bruce Renouard has accepted an invitation to join the executive board of the Bobby B. Lyle School of Engineering at Southern Methodist University (SMU) in Dallas, Texas/USA. Board members provide advice and counsel on a wide range of subjects, and are also advocates for the facility and involved in fundraising activities. Renouard joined SMU's engineering Co-op program where he worked at Rockwell Collins to gain real world engineering experience prior to graduating from SMU's School of Engineering (Lyle) in 1983 with a BSEE degree. Currently, Pre-Switch, the company he founded in 2015, is bringing its patented, AI-powered soft-switching technology to the automotive and other high voltage markets, resulting in significant improvements in system level efficiency.

Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries

Learn more:
thermalmanagementexpo.com

Event News
2024-03-26

Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. No other event provides the opportunity for professionals working across sectors like Automotive, Aerospace & Defense, Electronics, Energy, Telecoms/5G, and Medical to delve into the latest thermal innovations and solutions. Attendees can tap into the advantages of cross-sector networking and in-person engagements with the latest thermal materials, components, and technologies available in the market. Co-located with Ceramics Expo, this event is scheduled for April 29 – May 1, 2024 at Suburban Collection Showplace, Novi, Michigan, USA. Thermal Management Expo promises to showcase the latest systems, materials, and technologies to address thermal management challenges across several high-tech industries. Global market leading suppliers and manufacturers including Alloy Enterprises, Burger Group, Henkel, Huber, Linseis, Parker Hannifin, TCLAD, Thermtest and Stirweld, will be showcasing their innovative solutions. In addition to the exhibition, the free-to-attend conference will feature sessions led by technical experts from prominent companies like Intergalatic, Heraeus, Blueshift, Diabatix, Neural Concept, ZF Group and more. These sessions will provide insights into thermal management systems and design, covering topics such as supply chain optimization, EV thermal management, data center cooling, thermal design and AI, thermal simulation, microelectronics and semiconductors.

100 V Trench Schottky Rectifier Diodes

Learn more:
st.com

Product Release
2024-03-26

STMicroelectronics has introduced 100 V trench Schottky rectifier diodes increasing efficiency in power converters operated at high switching frequencies. ST's trench Schottky diodes are claimed to "significantly reduce the rectifier losses, with superior forward-voltage and reverse-recovery characteristics that enable increased power density with high efficiency." The forward voltage is said to be "50-100 mV better than in comparable planar diodes", depending on current and temperature conditions. Changing to these devices might increase the efficiency by 0.5%. There are 28 variants in the family, with eight current ratings from 1 A to 15 A, multiple surface-mount packages, in industrial and automotive grades. The industrial-grade parts target applications such as miniature switched-mode power supplies and auxiliary power supplies for telecom, server, and smart-metering equipment. In automotive, typical uses include space-constrained applications such as LED lighting, reverse-polarity protection, and low-voltage DC/DC converters. The parts are AEC-Q101 qualified, manufactured in PPAP-capable facilities, and specified from -40 °C to 175 °C. The diodes are 100% avalanche tested in production.

Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications

Learn more:
aosmd.com

Product Release
2024-03-26

Alpha and Omega Semiconductor announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications. The USB PD 3.1 EPR increases the USB-C maximum power up to 240 W. AONZ66412 is defined to support the most commonly addressed power range of up to 140 W at 28 V, with two 40 V N-Channel MOSFETs in a half-bridge configuration in a symmetric XSPairFET 5 mm x 6 mm package. The AONZ66412 can replace two single DFN5x6 MOSFETs. The AONZ66412 is suited for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs. The AONZ66412 is an extension to the AOS XSPairFET lineup. The improved package parasitics make 1 MHz operation achievable, allowing inductor size and height to be reduced. AONZ66412 has been tested to achieve 97% efficiency @1 MHz in typical USB PD 3.1 EPR conditions of 28 V input, 17.6 V output, and 8 A load conditions.

Digital WE Days: Expert Knowledge Online

Learn more:
we-online.com

Event News
2024-03-26

The transfer of expertise is a fundamental element of Würth Elektronik's service concept. This includes in-depth expert presentations in digital format. As part of Digital WE Days, experts from Würth Elektronik and its partner companies will be presenting on important topics like intelligent power and control systems, EMC, electromechanics, wireless power, optoelectronics, and PCBs. "Last year, more than 4,300 participants took advantage of our online service offerings," says Alexander Gerfer, CTO at Würth Elektronik eiSos. "This shows that we are in touch with the times with our Digital WE Days. We are continuing this successful concept this year." From April 22 to 25, 2024, experts from Würth Elektronik, Rohde & Schwarz, onsemi, Infineon, Texas Instruments, Cambridge GaN Devices, Silent Solutions, as well as Wired & Wireless Technologies, will provide for a varied and high-caliber presentation program. A 30-minute presentation is followed by an interactive Q&A session lasting around a quarter of an hour, which further deepens the knowledge imparted in the expert presentation. "We know the current market and technology trends as well as our customers," Gerfer continues. "On this basis, we've once again put together an interesting and contemporary presentation program this year – from practitioners for practitioners." Digital WE Days 2024 is a free service from Würth Elektronik. All presentations can be booked individually. Registration for the virtual conference is now open.

Exhibition spreading from Coil-Winding to e-Mobility

Learn more:
berlin.cwiemeevents.com

Event News
2024-03-25

Taking place from May 14-16 2024, this CWIEME Berlin exhibition will see leading professionals come together to discuss and showcase innovative products from the coil winding, transformer, generator, electric motor manufacturing and e-mobility sectors. For 2024, the event has secured many industry professionals to participate in sessions and talks that will discuss latest innovations, technologies and key issues in the electrical engineering industry. Confirmed speakers include representatives from The International Copper Association, Syensqo, S&P Global Mobility, Siemens Energy, Thyssenkrupp Steel Europe, Hitachi Energy, SGB-SMIT GmbH, STILRIDE, Mckinsey Center for Future Mobility and Ford Europe. The central stage will cover a host of topics such as innovation in transformers oils, driving sustainability in the manufacturing and energy sectors with a deep dive into eco-friendly practices in the steel industry, and a panel discussion on what the future holds for rare earth materials. The e-mobility stage will host talks including a keynote speech on decarbonisation in the automotive sector, a session on the importance of reliability for electric vehicle (EV) infrastructure, a panel discussion on the emerging trends, a talk on innovations and advancements in new motor technologies, and a session on how the automotive industry can remain competitive in the age of electrification.

Successful Funding of GaN Technology Company

Learn more:
q-p-t.com

Industry News
2024-03-25

Cambridge/UK-based QPT, a company which is active in developing highly efficient GaN-based electric motor controls, has announced that its Crowdcube funding round has just passed the one million pound milestone. Rupert Baines, QPT's new CEO, said, "QPT has a … combination of an amazing technology that can cut the power consumption of electric motors by 10% thereby providing a way to actively help reduce climate change and a management team of veterans of the GaN industry." QPT's qGaN technology is a solution for the issues of overheating and RF interference that currently limit the speeds that GaN can be driven at. "Now GaN transistors can be run at much higher speeds than any other rival technology – 20 times faster than SiC for example", Rupert Baines adds. "Our solution is smaller with a significantly lower system cost and saves more energy than rivals according to our studies. I am really excited to be heading a company with a real roadmap to make the world a better place."

Polyimide Coated Magnet Wires for >800 V

Learn more:
bieglo.com

Product Release
2024-03-21

Electrical breakdown of high-temperature insulation materials can be prevented by using thermoplastic Polyimide, TPI. This polymer can be extrusion-coated as other polymers, but AURUM®, TPI reduces electrical and magnetic losses. With 245 °C AURUM claims to have the highest T_g of any commercially available Thermoplastic, and its insulation performance especially at temperatures above 150 °C is stated to beat any other know insulation. AURUM reduces electrical and magnetic losses with a comparative tracking index (CTI) of > 600 volts. Thermoplastic Polyimide (TPI) produced by Mitsui Chemicals of Japan, and sold by BEIGLO GmbH is known for its thermal stability, high-temperature resistance, and electrical insulation properties. TPI coated magnet wires are a suitable choice for high-voltage applications (800 V and above).

Automotive N-Channel MOSFETs for 48 V Applications

Learn more:
toshiba.semicon-storage.com

Product Release
2024-03-21

Toshiba has launched two automotive N-channel power MOSFET devices to meet the growing demand for 48 V batteries and systems within automotive applications including inverters, semiconductor relays, load switches, motor drives and more. The 80V XPQR8308QB and 100V XPQ1R00AQB are based upon Toshiba's U-MOS X-H process. This gives low levels of on-resistance with the XPQR8308QB measuring less than 0,83 mΩ while the XPQ1R00AQB does not exceed 1,03 mΩ. The devices are rated for I_D values of 350 A (XPQR8308QB) and 300 A (XPQ1R00AQB) continuously with pulsed values (I_DP) of 1050 A and 900 A respectively. Supporting these values, the L-TOGL™ package adopts a thick copper clip-based leadframe structure that thermally and electrically connects the MOSFET die to the package leads. This reduces the package resistance by approximately 70% and channel-to-case thermal impedance by 50% compared with the TO-220SM(W) package. Together, the process and clip reduce losses and heat generation while creating a very thermally efficient solution. Furthermore, the L-TOGL package uses compliant gull-wing leads which reduce mounting stress and improve the reliability of solder joints. Both devices are AEC-Q101 qualified for automotive applications. Toshiba offers to ship devices grouped to within 0.4V based upon their gate threshold voltage.

Reference Design for Qi2 Wireless Charging Implementation

Learn more:
microchip.com

Product Release
2024-03-21

As major charger manufacturers, including those in the automotive industry, are working to implement Qi® v2.0 (Qi2) standards, Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller. Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip's automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety and supports Autosar. An integrated CryptoAuthentication™ IC provides security to meet the stringent authentication requirement of Qi standards. The reference design is hardware reconfigurable and capable of supporting most transmitter topologies.

DC/DC Converter for 500 W with High Reliability

Learn more:
gaia-converter.com

Product Release
2024-03-21

The MGDS-500 Series from Gaia feature a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications. With 500 W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design. Standard models are available with wide input voltage ranges of 9-36V_DC and 16-80V_DC, and provide output voltages of 12, 15, 24, 28, and 48 V_DC. Over the entire 500 W output power range the MGDM-500, which is integrated into a half-brick package, operates with an efficiency of up to 91%. Its Galvanic isolation is 1500 V_DC, while the switching frequency is 300 kHz. Trim adjustment is possible from 90% to 110%, and the external synchronization range is specified 270 to 330 kHz. The synchronization function allows more than one converter to operate with an external source frequency. All modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple. The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection. Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.

Akquisition of Industrial Drive Technology Company

Learn more:
siemens.com

Industry News
2024-03-21

Siemens has signed an agreement to acquire the industrial drive technology (IDT) business of ebm-papst. The business, which employs around 650 people, includes intelligent, integrated mechatronic systems in the protective extra-low voltage range and innovative motion control systems. These systems are used in free-range driverless transport systems. The transaction is to be completed by mid-2025, subject to the necessary foreign trade and merger control approvals. The IDT business of ebm-papst is located in St. Georgen, Germany and Lauf an der Pegnitz, Germany, as well as in Oradea, Romania.

Potential for SiC Replacement: Patents for GaN-on-Si

Learn more:
5nplus.com

Industry News
2024-03-21

5N+, a producer of specialty semiconductors and performance materials, announced that it is officially launching the commercialization rights for its portfolio of gallium nitride on silicon (GaN-on-Si) patents. These key patents can enable the rapid prototype development and first-to-market commercialization of vertical GaN-on-Si power devices by companies operating in the High-Power Electronics (HPE), Electric Vehicles (EV) and Artificial Intelligence (AI) server sectors. Today, lateral GaN is primarily used in low voltage (<400 V) applications, such as chargers, but vertical GaN-on-Si has the potential to replace SiC, which is the current preferred material for medium and high voltage applications (i.e. EV inverters operating 650 V). SiC is expensive and not easily available, whereas GaN-on-Si is more efficient and cost-effective. Recent academic demonstrations utilizing key 5N+ patents have shown that vertical GaN-on-Si, as opposed to lateral GaN transistors showing destructive breakdown, offers soft breakdown with avalanche capability for safe, compact and more efficient devices. The commercial rights of the 54 granted patents owned by 5N+ include mandatory use of large diameter thick silicon substrates (over 1 mm), combined with masking layers to filter the dislocations. Increasing the thickness of large diameter silicon substrates in vertical GaN-on-Si devices enables increased voltage capacity without increasing the chip size. Also included in this patent is the ability to remove the substrate to form the backside contacts once the GaN growth is complete.

Industrial AC/DC Power Supplies

Learn more:
lambda.tdk.com

Product Release
2024-03-21

TDK Corporation introduced its ZWS-C series of 10, 15, 30 and 50 W rated industrial AC/DC power supplies. The products meet EN55011/EN55032-B conducted and radiated EMI in either a Class I or Class II (double insulated) construction, without the need for external filtering or shielding. With electrolytic capacitor lifetimes of up to 15 years, the ZWS-C can be used in factory automation, robotics, semiconductor fabrication manufacturing and test and measurement equipment. Available output voltages are 5 V, 12 V, 15 V, 24 V as well as 48 V for the ZWS50-C model only. The ZWS10-C and the ZWS15-C models measure 63.5 x 45.7 x 22.1 mm³ (L x W x H), the ZWS30-C 76.2 x 50.8 x 24.2mm³, and the ZWS50-C 76.2 x 50.8 x 26.7 mm³. The operating temperature with convection cooling and standard mounting is -10 oC to 70 oC derating linearly to 50% load above 50 to 70 oC. With an external airflow of 0.8 m/s, the power supplies can operate at full load. No load power consumption is typically less than 0.3 W. The power supplies have a 3 kVac input to output, 2 kVac input to ground and 750 Vac output to ground (Class I) isolation. All models are certified to the IEC/UL/CSA/EN62368-1 for AV, information and communication equipment standard and EN60335-1 for household electrical equipment.

Paving the Way to use Diamonds in UWBG Semiconductors

Learn more:
heraeus-group.com

Industry News
2024-03-20

Heraeus is making a multi-million-euro investment in Compound Semiconductor (Xiamen) Technology Co. (CSMH), a China-headquartered material supplier of premium industrial diamond. This strategic partnership aims to drive innovations in the semiconductor industry by leveraging diamond's unique thermal conductivity and electrical insulation properties. Heraeus signed an investment agreement with CSMH, and the deal is expected to close in several weeks. As part of the agreement, Heraeus will hold a stake in the company and receive a seat on the board of directors. Single-crystal diamond is ultra-wideband gap (UWBG) semiconductor material with the highest known thermal conductivity, surpassing existing thermal solutions such as copper by several times. Typical silicon has a thermal conductivity around 140 W/(m-K), copper is about 400 W/(m-K), and diamond has a much higher thermal conductivity up to 2200 W/(m-K). This allows heat to be dissipated more efficiently, enabling high-performance components to endure with maximum efficiency. In addition to its superior heat dissipation properties, diamond also withstands extremely high voltages without causing an electric breakdown. This is critical for advancing miniaturization, efficiency, and robustness in power electronics. CSMH's core business includes the production of polycrystalline and large-sized monocrystalline diamonds, which are particularly important for high-end applications in the semiconductor industry.

Conference on Topics around Electric Drives Production

Learn more:
edpc.eu

Event News
2024-03-19

The Electric Drives Production Conference (E|DPC) 2024 is a platform for the exchange of developers, researchers and users of electric drives. Now the call for papers is open to present the latest technical expertise in front of professionals from science and industry. The E|DPC will take place as a hybrid event from November 26 to 27, 2024 at the marinaforum Regensburg and online. Key topics include electric machine design, power electronics and control methods, new materials and semi-finished products, magnet materials and processing, manufacturing technologies for soft magnetic materials, winding technologies, insulation technologies, assembly and handling technologies, electric drive production systems, production of electrical actuators, industry 4.0 applications in electric drives production, sustainability in product lifecycle, new applications for electric drives, electromobility, electric drive specific testing, accompanying economic research, additive manufacturing, energy transfer for electric vehicles and interconnecting technologies.

GaN for Low-cost E-Bikes, Drones, and Robotics

Learn more:
epc-co.com

Product Release
2024-03-19

EPC now offers the EPC9193, a 3-phase BLDC motor drive inverter using the EPC2619 eGaN FET. The EPC9193 operates with a input DC voltage ranging from 14 V and 65 V and has two configurations – a standard unit and a high current version: While the EPC9193 standard reference design uses a single FET for each switch position for delivering up to 30 Arms maximum output current, a high current configuration version of the reference design, the EPC9193HC, uses two paralleled FETs per switch position with the ability to deliver up to 60 A_pk (42 A_rms) maximum output current. Both versions of the EPC9193 contain all the necessary critical function circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The EPC9193 boards measure 130 mm x 100 mm (including connector). Major benefits of a GaN-based motor drive are exhibited with these reference design boards, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, and lower torque ripple for improved precision. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight. EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that reduce design cycle times.

Trade Show in Kuala Lumpur, Malaysia: Doubling Participation

Learn more:
semiconsea.org

Event News
2024-03-19

With the Southeast Asia semiconductor sector attracting growing worldwide investments as more regions diversify their supply chains, the stage is set for SEMICON Southeast Asia 2024 as visionaries and experts gather May 28-30, 2024 at MITEC in Kuala Lumpur, Malaysia for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development. Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 will feature more than 500 exhibiting companies and more than 1,000 booths, doubling participation from last year's exhibition and conference. The exponential expansion underscores the rising interest in Southeast Asia's semiconductor sector and the increasing importance of SEMICON Southeast Asia, the region's premier global electronics manufacturing and supply chain event, in bringing industry stakeholders together to pursue new innovation and growth opportunities. For example, there will regional pavilions from semiconductor regions such as China, Europe, Malaysia, Netherlands, Korea, Singapore, Taiwan and Southeast Asia. Several forums will focus on market and industry trends, sustainability, chiplet and heterogeneous integration, advanced product testing and more. In industry gala night will enable the attendees to connect and to expand their business network.

Primary LDO Family for Automotive Applications

Learn more:
rohm.com

Product Release
2024-03-14

ROHM has developed 45 V rated 500 mA output primary LDO regulators, the BD9xxM5-C series. These devices are suitable for supplying power to automotive electronic components such as ECUs that operate from vehicle batteries. The BD9xxM5-C incorporates original QuiCur™ high-speed load response technology that is stated to deliver excellent response characteristics to load current fluctuations. For example, the LDO can maintain output to within 100 mV of set voltage even as the load changes between 0 and 500 mA in 1 µs (Rise time/Fall time). Furthermore, low 9.5 µA (typ.) current consumption contributes to lower power consumption in automotive applications. These products will be available in four packages, ranging from the compact HTSOP-J8 to the high heat dissipation TO252 (TO252-3/TO252-5) and HRP5 types. This allows users to select the most suitable package for each use case. The BD9xxM5-C meets the basic requirements for automotive products, including 150 °C operation and qualification under the AEC-Q100 automotive reliability standard. The lineup will be expanded to comprise a total of 18 models, (including the TO252-3, TO252-5, and HRP5 packages) by FY2024.

Trade Show about EMC Components, Testing and Shielding

Learn more:
emv.mesago.com

Event News
2024-03-14

The EMV achieved an impressive response in Cologne from March 12 - 14, 2024. The trade fair, accompanied by a scientific conference with workshops, featured 111 national and international exhibitors from 20 countries. Key players such as Rohde & Schwarz, Frankonia and EMC Test NRW as well as 21 companies, taking part in the EMV for the first time, were also present. More than 2,500 trade visitors – including the editorial team of Bodo's Power Systems – took the opportunity to find out about the industry's entire range of topics: from filters and filter components to EMC testing and shielding including its latest developments. A lively exchange of specialist knowledge was also high on the agenda in Cologne. Current trends this time around included EMC in electromobility, smart technologies, power electronics and the use of artificial intelligence in EMC. Parallel to the trade fair, the EMV Conference offered an extensive program with 49 conference lectures, 24 workshops and poster presentations held for the first time. The event demonstrated the growing importance of EMC in an increasingly networked world. In view of the growing number of potential sources of interference and even more complex systems, it has become clear that awareness of EMC issues is steadily rising. More than 700 conference bookings illustrated the high level of interest in the event. The next EMV event will take place from 25 - 27.3.2025 in Stuttgart.

Oscilloscope Days Event

Learn more:
rohde-schwarz.com

Event News
2024-03-13

Rohde & Schwarz has announced that its Oscilloscope Days educational event will return for two days, April 17 to 18, 2024. Experts from Rohde & Schwarz and partner companies will present the latest updates on fundamentals and test features for engineers using next-generation oscilloscopes, covering topics such as power electronics and EMC, as well as signal and power integrity. The Oscilloscope Days event will be hosted online over two days and will deliver insights into the accurate measurement of digital signals and power electronics for purposes including product design, development, debugging and compliance testing. Rohde & Schwarz application engineers, together with experts from long-time event partners Würth Elektronik and PE-Systems, will present measurement challenges and techniques. There will be eight online sessions of up to 30 minutes each over the two mornings, with time for questions and answers after each session. Each session will be presented in English and will include cases based on real applications. Registrants can select the sessions they wish to attend.

200 V MOSFETs stated to set a new Industry Benchmark

Learn more:
infineon.com

Product Release
2024-03-13

Infineon claims that motor drive applications are taking a leap forward with the launch of the company's OptiMOS™ 6 200 V MOSFET product family. The new portfolio is designed to deliver high performance in applications such as e-scooters, micro-EVs, and E-forklifts. The improved conduction losses and switching behavior for these MOSFETs reduce the electromagnetic interference (EMI) and switching losses e. g. in applications like servers, telecom, energy storage systems, audio and solar. Additionally, the combination of a wide safe operating area (SOA) and "industry-leading R _DSon" fits to static switching applications such as battery management systems. With the introduction of the OptiMOS 6 200 V product family, Infineon claims to set "a new industry benchmark with increased power density, efficiency, and system reliability". Compared to its predecessor, OptiMOS 3, OptiMOS 6 200 V features a 42 percent lower R _DSon and a diode behaviour softness, which is more than three times that of the OptiMOS 3. Combined with up to 89 percent reduction in Q _RRtyp, the switching and EMI behaviors are significantly improved. The technology also features improvements in parasitic capacitance linearity (C _oss and C _rss), which reduces oscillation during switching and lowers voltage overshoot. A tighter V _GSth spread and lower transconductance aid in MOSFET paralleling and current sharing, leading to more uniform temperatures and reducing the number of paralleled MOSFETs.

German Company founds US Subsidiary in Detroit Metro Area

Learn more:
customcells.com

Industry News
2024-03-12

CustomCells opens its first international location: The German company has founded a U.S.-based subsidiary with its own office in the innovation and manufacturing metropolis of Detroit, Michigan. The location will initially serve as a central hub for coordinating the company's activities in the North American market to respond to local customer inquiries even faster. The establishment of an innovation and R&D center will follow. Plans for a future production facility on site are already being discussed. In addition to high-performance battery cells for the premium segment in the automotive and motorsport industries, CustomCells also offers solutions for e-motorcycles, electrified aviation, and applications on and underwater. The development and production of round cells play a key role, which is a topic for the future of many mobility industries.

Resettable Thermal Cutoff Devices

Learn more:
bourns.com

Product Release
2024-03-12

Bourns announced some miniature resettable thermal cutoff (TCO) device series, also known as mini-breakers, that are designed to control abnormal, excessive current virtually instantaneously, up to rated limits. The Model NX Series offers higher current-carrying capabilities combined with a very low-profile package at a height of 0.94 mm and body width of 2.8 mm. These features make this series an ideal overtemperature and overcurrent protection solution for lithium polymer and prismatic cells in high energy density, smaller batteries such as next-generation notebook PC and tablet battery cells, as well as handheld and wearable electronics. With the same footprint as the company's model NR series the model NX series can carry 40 percent more current. The new Model NX Series has current capabilities from 12 A to 20 A at 60 °C and is available with or without welding projections. These TCO devices are available with four trip temperature options of 77 °C, 82 °C, 85 °C and 90 °C - all of which operate within a ±5 °C tolerance. The Model NX Series also is designed with a high-rated corrosion resistant bimetal mechanism that delivers enhanced endurance in humid environments compared to standard TCO devices.

Automotive-grade Super-Junction MOSFETs

Learn more:
st.com

Product Release
2024-03-11

Automotive-grade 600 V/650 V super-junction MOSFETs in STPOWER MDmesh DM9 AG series are claimed to deliver superior efficiency and ruggedness for on-board chargers (OBCs) and DC/DC converter applications in both hard- and soft-switching topologies. Compared to the previous generation, the latest MDmesh DM9 technology ensures a tighter gate-source threshold voltage (V_GSth) spread that results in sharper switching for lower turn-on and turn-off losses. In addition, body-diode reverse recovery is improved, leveraging a new optimized process that also increases the MOSFETs' overall ruggedness. The diode's low reverse-recovery charge (Q_rr) and fast recovery time (t_rr) make the MDmesh DM9 AG series well-suited for phase-shift zero-voltage switching topologies that demanding high efficiency. The first device in the STPOWER MDmesh DM9 AG series from STMicroelectronics is the STH60N099DM9-2AG, a 27A AEC-Q101 qualified N-channel 600 V device in H2PAK-2, with 76 mΩ typical R_DSon. ST will expand the family to provide a full range of devices, covering a broad range of current ratings and R_DSon from 23 mΩ to 150 mΩ.

Supercapacitors with 3 Cells

Learn more:
cde.com

Product Release
2024-03-11

Knowles Precision Devices announced Electric Double Layer Capacitor (EDLC), or supercapacitor, modules using a three-cell package for higher operating voltages and printed circuit board space savings. Their large capacity makes it possible to support brief power interruptions, supplement batteries, or even to be used in place of batteries in several applications. These supercapacitors are suited for applications including solar and wind energy harvesting, mechanical actuators, AGV (Automated Guided Vehicles), EV transportation power, smart utility meters, IoT, pulse battery pack alternatives, memory backup, battery/capacitor hybrids, UPS systems, emergency lighting, LED power, solar lighting or anywhere that significant energy storage is needed. The supercapacitors offer a notable jump in voltage rating over typical radial-mount supercapacitors, up to 9.0 WVDC. A key feature of the DGH and DSF Series additions is the unique three-cell radial-leaded package. Both series include capacitance values from 0.33 to 5 Farads. Multiple devices can be banked for even higher capacitance or voltage. In addition, these supercapacitors perform their internal cell balancing with operating temperature ranges from -40 °C to +65 °C for DGH 8.1V/DSF 9.0V and -40 °C to +85 °C for DGH 6.9V/DSF 7.5V. They are designed to withstand over 500,000 charge/discharge cycles.

Generators and Multimeters added to portable Instrument Family

Learn more:
rigolna.com

Product Release
2024-03-11

Rigol Technologies is expanding its family of portable instruments with the introduction of the DG800 Pro and DG900 Pro Series Function / Arbitrary Waveform Generators, along with the DM858 Series Digital Multimeters. The DG800 Pro and DG900 Pro Series Function/Arbitrary Waveform Generators include the capabilities of noise generator, pulse generator, harmonic generator, analog/digital modulator, and frequency counter. They deliver up to 200 MHz maximum output frequency, 1.25 GSa/s sample rate, 16-bit vertical resolution, and 3 ns rise time in a chassis with a 7 inch color touch display. The DM858 Series is a benchtop 5.5 digit DMM with 7 inch color touch display. It provides 11 measurement functions and offers trend chart, histogram, and bar table visual display options, while providing competitive specifications, including 125 rdgs/s measurement speed and 500,000 points memory logging. Each unit is designed to comply with VESA 100x100 mounting, allowing the use of stands or movable arm mounts. The instruments include a Type-C interface, so the combination of their light weight (less than four pounds) and commercially available power banks make for an easy shift from the lab to the field.

GaN and SiC Technologies to Enable Next-Gen AI Power Delivery

Learn more:
navitassemi.com

Product Release
2024-03-11

Navitas Semiconductor has announced their AI data center technology roadmap for up to 3x power increase to support similar exponential growth in AI power demands expected in just the next 12-18 months. To meet this exponential power increase, Navitas is developing server power platforms which rapidly increase from 3kW to up to 10kW. In August 2023, Navitas introduced a 3.2kW data center power platform utilizing latest GaN technology enabling over 1638.7W/cm3 and over 96.5% efficiency. Now, Navitas is releasing a 4.5kW platform enabled by a combination of GaN and SiC to push densities over 2131.1W/cm³ and efficiencies over 97%. Navitas also announces its plans to introduce an 8-10kW power platform by the end of 2024 to support 2025 AI power requirements. The platform will utilize newer GaN and SiC technologies and further advances in architecture to set all-new industry standards in power density, efficiency and time-to-market. Navitas is already engaged with major data-center customers, with full platform launch anticipated in Q4 ’24, completing this 3x increase in power demands in only 12-18 months.

1200-V IGBTs on 300 mm Wafers

Learn more:
hitachienergy.com

Industry News
2024-03-06

Hitachi Energy increases its power semiconductor capacity by introducing the 300 mm wafer. The development enables more complex structures in 1200 V insulated gate bipolar transistors. Applications for IGBT include variable frequency drives (VFD), uninterruptible power supply (UPS) systems, electric cars, trains and air conditioners, among others. The larger wafer offers numerous benefits, including the potential to yield over double (2.4 times) the number of functioning integrated circuits per wafer as compared to the existing 200 mm wafer, leading to significant cost savings. It utilizes the latest fine pattern trench IGBT design, resulting in energy-efficient power conversion and control and minimizing power losses during operations. Semiconductor experts at Hitachi Energy achieved this milestone through close collaboration with a cross-functional team, including Product Management, Business Development, Research & Development, and a chip foundry partner.

Silicon Carbide Technology drives Decarbonization

Learn more:
infineon.com

Product Release
2024-03-05

The Infineon CoolSiC™ MOSFET 650 V and 1200 V Generation 2 improve MOSFET key performance figures such as stored energies and charges by up to 20 percent compared to the previous generation without compromising quality and reliability levels leading to higher overall energy efficiency and further contributing to decarbonization. CoolSiC MOSFET Generation 2 (G2) technology continues to leverage performance capabilities of silicon carbide by enabling lower energy loss that turns into higher efficiency during power conversion. This provides strong benefits to customers for various power semiconductor applications such as photovoltaics, energy storage, DC EV charging, motor drives and industrial power supplies. A DC fast charging station for electric vehicles which is equipped with CoolSiC G2 allows for up to 10 percent less power loss compared to previous generations, while enabling higher charging capacity without compromising form factors. Traction inverters based on CoolSiC G2 devices can further increase electric vehicle ranges. In the area of renewable energies, solar inverters designed with CoolSiC G2 make smaller sizes possible while maintaining a high power output, resulting in a lower cost per watt.

Energy Harvesting Workshop in Italy

Learn more:
enerharv.com

Event News
2024-03-05

A Workshop named EnerHarv 2024 is said “to bring together experts from around the world working on all technical areas relevant to energy harvesting, power management and its IoT applications”. This non-profit workshop, organized and sponsored by the Power Sources Manufacturers Association (PSMA), will be held in Perugia, Italy from June 26 to 28, 2024. The event will be hosted by the Noise in Physical Systems (NiPS Lab), Dept. of Physics & Geology of the University of Perugia (UNIPG). EnerHarv’s vision is “to create a focal point for experts and users of energy harvesting and related technologies to share knowledge, best practices, roadmaps, experiences and provide opportunities for collaboration to increase the uptake of such technologies”. The workshop is targeted at a broad audience from industry and academia working on materials and devices for energy harvesting and storage, low-power sensors and circuits, micro power management, and their applications in powering IoT devices for health and environmental monitoring, assisted living, and monitoring of equipment and buildings. It will comprise presentations (by invitation only), demos, poster, panels sessions and time for networking activities. There is an open call for demonstrations and posters.

Going for Mass Production: Funding Round to Support Growth for GaN Solutions

Learn more:
wise-integration.com

Industry News
2024-03-01

Wise-integration, a French company active in digital control of gallium nitride and GaN ICs for power supplies, has secure financing of 15 million Euros. The Series B round was led by imec.xpand with participation from other investors. The round will fuel mass production and commercial deployment of the company’s flagship products, WiseGan and WiseWare, its “disruptive digital-control technology”, and its support for clients globally as they adopt these solutions. It included the five investors from the previous funding and three new investors. Since its launch in 2020, the fabless company has been known as an innovator in the power electronics industry, building a portfolio of more than 10 patent families. WiseGan encompasses GaN power integrated circuits designed to maximize the benefits of GaN technology. WiseWare is a 32-bit, MCU- based, AC/DC digital controller optimized for GaN-based power supply architectures, which is said to offer simplified system design, a lower bill of materials and improved power density and efficiency. This combination enables the development of technologies facilitating chargers that are up to 3x smaller, 3x more efficient, and 3x lighter, catering to power requirements from 30 W to 7 kW. The company’s target markets include consumer electronics to industrial applications to electric vehicles.

PoE ASFETs and EMC-optimized MOSFETs

Learn more:
nexperia.com

Product Release
2024-02-27

Nexperia announced the release of several MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance. PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in _RDS(on). These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example. EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower R_DS(on) (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimized its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.

Collaboration to Accelerate Automotive Electrification

Learn more:
fiveyearsout.com

Industry News
2024-02-26

Arrow Electronics and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of electric vehicle (EV) chargers. Development of EV chargers, especially DC “fast chargers,” is becoming increasingly challenging to equipment manufacturers due to several factors, such as lack of prior experience, stringent functional safety and reliability requirements, and a fledgling support network. The collaboration between Arrow and Infineon aims to help innovators navigate these challenges while accelerating time-to-market. As part of the collaboration, Arrow’s High Power Center of Excellence has developed a 30 kW DC fast charger reference platform. This includes Infineon’s 1200V CoolSiC easy power modules and also hardware design, embedded firmware, bi-directional charging support and energy metering functionality.

Joint Solution for BLDC Motors

Learn more:
ambersi.com

Industry News
2024-02-26

AmberSemi and ST Microelectronics have jointly developed a reference design for brushless motors by using AmberSemi’s AC Direct DC Enabler Power Conversion Technology and ST’s STM32 MCU devices. The reference design takes a direct AC input through AmberSemi’s patented AC Direct DC Enabler technology and powers the ST microcontroller, gate drivers and Hall sensors for brushless motor applications. Compared to typical brushless DC motor-control design, AmberSemi’s off-line solution provides up to 5 W of regulated output, which is enough to drive today's requirement of control logic and sensors, with additional headroom for expanded intelligent functionality. The Enabler offers selectable output voltages determined by internal, configurable register settings or with a simple external voltage-divider feedback circuit. Through the integrated SPI communication port and coupled with an SPI-equipped MCU the designer can set alarm bits, protection thresholds, monitor status bits for over-current, over/under voltage, over-temperature and interrupt signals on the Enabler.

IGBT based Intelligent Power Modules

Learn more:
onsemi.com

Product Release
2024-02-26

onsemi announced the availability of its 1200V SPM31 Intelligent Power Modules (IPMs) featuring the latest generation Field Stop 7 (FS7) Insulated Gate Bipolar Transistor (IGBT) technology. The SPM31 IPMs deliver higher efficiency, smaller footprint and higher power density resulting in lower total system cost. Given the greater efficiency realized using optimized IGBTs, these IPMs are ideal for three-phase inverter drive applications such as heat pumps, commercial HVAC systems, servo motors, and industrial pumps and fans. The SPM31 IPMs control the power flow to the inverter compressor and fans in heat pumps and air conditioning systems by adjusting the frequency and voltage of the power supplied to three-phase motors for maximum efficiency. For example, onsemi’s 25A-rated SPM31 using FS7 IGBT technology can decrease power losses by up to 10% and increase in power density up to 9%, compared to our previous generation products. With the transition to electrification and heightened efficiency mandates, these modules help manufacturers drastically improve system design while increasing efficiency in heating and cooling applications. With the improved performance, our SPM31 IPM family featuring FS7 enables high efficiency with reduced energy losses, further reducing harmful emissions globally.

Series of Supercapacitor Modules

Learn more:
rutronik24.com

Product Release
2024-02-22

With the Supercapacitor modules of the SCM series from KYOCERA AVX, Rutronik offers robust components for industrial applications that require high peak performance. The SCM series is suitable for high-current or industrial applications, including renewable energy generation, grid-connected storage, or the buffering of power peaks. Thanks to active balancing, the capacitor modules have a stable voltage level in the individual cells installed in the module. They operate individually or in combination with batteries or accumulators. Either they supply energy as a backup or support providing power peaks together with batteries or accumulators. In this case, they often have a positive effect on the service life of the battery or accumulator. Due to the convincing characteristics of the individual capacitors used, the SCM modules achieve their special pulse load capacity. The combination of very high capacitance and very low internal resistance (ESR) enables a high power density and high efficiency. The modules are also characterized by a high mechanical load capacity and can withstand high currents, frequent charging and discharging cycles, and strong vibrations. They are designed for operating temperatures from -40 °C to +65 °C and can handle several million cycles, depending on the application. In addition, the modules are lead-free, RoHS-compliant, and meet the UL 810A standard.

Additional Manufacturing Capacity for wBMS Semiconductors

Learn more:
analog.com

Industry News
2024-02-22

Analog Devices (ADI) has made a special arrangement with TSMC to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL) applications.

PWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single Chip

Learn more:
powerdensity.com

Product Release
2024-02-22

Silanna Semiconductor has expanded its CO₂ Smart Power Family™ of AC/DC and DC/DC converter technologies with the launch of an active clamp flyback (ACF) controller that integrates adaptive digital PWM control with ultra-high-voltage (UHV) components comprising a 700 V primary GaN FET, X capacitor (X-Cap) discharge circuit, active clamp driver and start-up regulator. Silanna’s CO₂ Smart Power technologies help engineers by simplifying design and improving performance while addressing environmental sustainability goals through more efficient energy use. Well-suited for high-efficiency and high-power-density power supplies, USB-PD/QC AC/DC power adapters and battery charging applications, the SZ1200 integrated ACF controller combines the ease of design of a simple flyback controller with all the benefits of ACF. These include recycling of the leakage inductance energy of the flyback transformer and limiting primary FET drain voltage spikes during turn-off events. Delivering above 93% efficiency at low line, the SZ1200 offers consistent efficiency across the universal input voltage range (90 - 265 Vac) and various loading conditions of up to 150W single-port and multi-port USB-PD applications. Silanna’s OptiMode™ digital control architecture adjusts operation mode on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation and other key power supply parameters as line voltage and load vary. Very low no-load power consumption for the most stringent USB-PD applications further minimizes energy use during system stand-by.

Start-Ups present Energy and Mobility Solutions

Learn more:
thesmartere.de

Event News
2024-02-22

In order to demonstrate the impact of start-ups, The smarter E Europe, Europe’s largest alliance of exhibitions for the energy industry, provides them a platform of their own: the start-up area. In hall C5, across 2,500 square meters, around 150 start-ups will have the opportunity to present their pioneering energy and mobility solutions to a wide expert audience, and to connect with established companies. The smarter E Europe and its four exhibitions (Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe) will take place from June 19–21, 2024, at the Messe München fairgrounds. More than 2,800 exhibitors and over 115,000 visitors from all around the world are expected to attend. The event will take place across 19 exhibition halls and an outdoor exhibition area.

Two Backend Fabs sold – one in the Philippines, one in Korea

Learn more:
infineon.com

Industry News
2024-02-22

Infineon Technologies will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE Technology, a provider of independent semiconductor manufacturing services in assembly and test. The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments. Infineon Technologies Power Semitech is a backend manufacturing site with around 300 employees. The fab is located in Cheonan, South Korea, about 60 miles south of Seoul. Infineon Technologies Cavite, is a backend manufacturing site with more than 900 employees. It is located in one of the fastest growing and most industrialized provinces in the Philippines. The transaction is expected to close towards the end of the second calendar quarter of 2024, when all pending closing conditions will have been fulfilled.

Factory in Monterrey to open this Year

Learn more:
rogerscorp.com

Industry News
2024-02-22

Rogers Corporation announced that it has signed a lease on a factory in Monterrey, Mexico for advanced busbar manufacturing and engineering services. The first phase of the new site is slated for completion in late 2024 and continues Rogers' manufacturing footprint strategy of supporting customers in the regions where they operate. Rogers' Rolinx busbars provide power distribution in a variety of applications in the electric and hybrid-electric vehicle (EV/HEV), renewable energy, mass transit and industrial markets. "We are excited to expand our presence in North America to better support our global customers and the growing EV/HEV and renewable energy markets in this region. Our new factory in Monterrey will enable us to better support our customers with deeper technical collaboration, and local prototyping and supply capabilities that reduce lead times and improve service levels," said Jeff Tsao, Advanced Electronics Solutions (AES) Senior Vice President and General Manager.

Magnetically Shielded Flat Wire Power Inductors

Learn more:
sumida.com

Product Release
2024-02-21

Sumida introduced two series of AEC-Q200 qualified power inductors, the DPQ3535/T150 and DPQ5050/T150. These inductors are magnetically shielded and have a pin-type base for surface mounting on printed circuit boards. High surface area flat-wire windings minimize internal resistance at high frequencies and allow space savings and higher current ratings. The DPQ3535/T150 series offers a range of inductance values from 3.3 µH to 22 µH. Maximum saturation current ranges from 28 to 152 amps at 150°C. The larger DPQ5050/T150 is of similar design, with an inductance value of 10 µH and a saturation current of 112 amps at 20 °C. The absolute maximum voltage across the inductor is 500Vdc for each. Operating temperature is -40 °C to +150 °C (including the device’s self-temperature rise). The flat-wire inductor is encased in ferrite and mounted on an insulating base. Circuit connectivity is by two robust flat, tinned copper pins. Two additional pins provide additional mounting stability. Size for the DPQ3535/T150 is (HWD) 33x38.7x38.2 mm. The DPQ5050/T150 measures 44x53.5x53.3 mm. Applications include use as a buck/boost inductor for Onboard Chargers (OBC) in electric vehicles (xEV), DC-DC converters, point-of-load converters, LED drivers, class D audio amplifiers, and other general high-performance power applications.

The Battery Show Europe

Learn more:
thebatteryshow.eu

Event News
2024-02-21

The Battery Show Europe and Electric & Hybrid Vehicle Technology Expo return to the Messe Stuttgart, Germany on 18-20 June, 2024. Bringing together 19,000 + engineers, executives, managers, R&D experts, manufacturing professionals, quality control experts, buyers, thought leaders and professionals from across the advanced battery and H/EV supply chain, this is an event that you can't miss! Explore 800+ advanced battery and EV manufacturing suppliers representing the entire supply chain from raw materials through end of life, featuring some stellar industry names such as Donaldson Filtration Solutions, Keyence, Siemens and Lyric Germany. Expand new ideas on increasing efficiencies and lowering costs at The Battery Show Europe Conference and Open Tech Forum. With 37+ hours of educational content, exploring the latest hot topics such as next-gen materials, advances in battery tech and sustainability, recycling and end of life options, this is the place to place to broaden your understanding of the advanced battery and H/EV industry. That's not all, we're also giving you the opportunity to learn about the latest market innovations and cutting-edge solutions during live product showcases from top-industry suppliers on the expo floor, as well as the chance to network with thousands of industry peers and form new relationships over drinks and light bites at our free-to-attend hosted networking receptions. Register today to attend the leading advanced battery and H/EV technology tradeshow and conference in Europe!

Higher Power Density with 100 V GaN Power Stages

Learn more:
ti.com

Product Release
2024-02-20

Texas Instruments introduced two power conversion device portfolios to help engineers achieve more power in smaller spaces. According to TI these devices are "providing the highest power density at a lower cost". TI's 100 V integrated GaN power stages, LMG2100R044 and LMG3100R017, feature thermally enhanced dual-side cooled package technology to simplify thermal designs and "achieve the highest power density in mid-voltage applications at more than 1.5 kW/in³", which equals about 91,5 W/cm³. TI claims that its 1.5 W isolated DC/DC modules with integrated transformers are "the industry's smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by over 89 %". The devices allow designers to accomplish a system efficiency of 98% or higher given the lower output capacitance and lower gate-drive losses. A key enabler of the thermal performance in the 100 V GaN portfolio is the thermally enhanced dual-side cooled package. There is also an automotive-qualified solution available in this small package.

Seminars about Sensor and Measurement Topics

Learn more:
ama-sensorik.de

Event News
2024-02-20

The AMA Association for Sensors and Measurement (AMA) has published its seminar program for 2024, which includes a variety of seminars in German language on various topics, including ultrasonic measurement technology, optical spectroscopy, displacement measurement, industrial image processing and the discussion on "Chat-GPT - hype or hysteria". The seminars are offered online or as face-to-face events and are under scientific direction. They offer in-depth knowledge about sensors, sensor systems, their functions and possible applications. Participants are given the opportunity to choose the right sensors for their application and evaluate their advantages and disadvantages. The seminars are said to offer deep insights into specialist topics in sensor and measurement technology. The AMA seminars aim to provide participants with manufacturer-independent knowledge and to inform them about the current state of sensor and measurement technology. They are aimed at experts from the fields of design/development, research, production and sales.

Battery Exhibition and Conference

Learn more:
ees-europe.com

Event News
2024-02-20

The cooperation between ees Europe, an exhibition for batteries and energy storage systems and InterBattery, a battery exhibition in South Korea, enters its second round this year. The InterBattery Europe Showcase will once again provide visitors of ees Europe with an additional exhibition area where they can network with companies from South Korea. The Battery Day Europe conference complements the presentations in the exhibition area. This year, the conference will provide comprehensive insights into the world of EV batteries, covering everything from the latest legislation, how to secure battery materials as well as groundbreaking technologies and business trends. Special attention will be given to the German-Korean cooperation in the ReLioS network for innovative approaches to battery recycling. The conference will also shine a light on EV battery production technologies. ees Europe takes place from June 19–21, 2024 as part of The smarter E Europe, Europe's largest alliance of exhibitions for the energy industry, at Messe München in Munich. More than 115,000 visitors from all over the world and over 2,800 exhibitors – more than 1,000 of whom are battery and energy storage system suppliers – are expected to attend. The InterBattery Europe Showcase exhibition area is expected to host around 200 companies – including companies such as Samsung SDI, LG Energy Solution and SK On. Last year, this additional exhibition space presented 72 companies, 62 of which were South Korean.

Power Converters run on Vibrational Energy

Learn more:
leti-cea.com

Industry News
2024-02-20

University of California San Diego and CEA-Leti (located in Grenoble/France) scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density. This power topology, which extends beyond existing topologies, blends the advantages of piezoelectric converters with capacitive-based DC/DC converters. The power converters developed by the team are much smaller than the huge, bulky inductors currently used for this role. The devices could eventually be used for any type of DC/DC conversation, in everything from smart phones, to computers, to server farms and AR/VR headsets. The results were presented in the paper, "An Integrated Dual-side Series/Parallel Piezoelectric Resonator-based 20-to-2.2V DC/DC Converter Achieving a 310% Loss Reduction", at ISSCC 2024. The paper explains that a hybrid DSPPR converter exploits integrated circuits' ability to offer sophisticated power stages in a small area compared to discrete designs, and enables efficient device operation at voltage conversion ratios (VCR) of less than 0.1.

Plug-and-Play Gate Driver for High-Voltage SiC Power Modules

Learn more:
microchip.com

Product Release
2024-02-20

To help developers implement SiC solutions and fast-track the development process, Microchip Technology has developed the 3.3 kV XIFM plug-and-play mSiC gate driver with patented Augmented Switching technology, which is designed to work out-of-the-box with preconfigured module settings. To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution. The XIFM digital gate driver is a compact solution that features digital control, an integrated power supply and a robust fiber-optic interface that improves noise immunity. This gate driver has preconfigured "turn-on/off" gate drive profiles that are tailored to optimize module performance. It incorporates 10.2 kV primary-to-secondary reinforced isolation with built-in monitoring and protection functions including temperature and DC link monitoring, Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO), short-circuit/overcurrent protection (DESAT) and Negative Temperature Coefficient (NTC). This gate driver also complies with EN 50155, a key specification for railway applications.

New EMEA Headquarters for Distributor

Learn more:
eu.mouser.com

Industry News
2024-02-20

Mouser Electronics has opened its new EMEA headquarters in Munich. The opening took place in the presence of distinguished guests from customers, manufacturers, members of the media, TTI and local support companies. The new office, which is located relatively close to the Olympic stadium and directly above a subway station, is already in operation: People from 23 nations work there. Mark Burr-Lonnon, Senior Vice President Global Service provided a look at the company history from $ 21 million of sales in 2008 to far more than $ 1 billion in 2023 – and all of this just in Europe. While Europe participated less than 10 % to Mouser's worldwide sales in 2008 it contributed almost exactly one third to Mouser's worldwide turnover in 2023. And this is why Mark Burr-Lonnon invited all guests to participate in an office tour after enjoying a piece of a Mouser celebration cake, that he cut in person.

Compact MOSFET Modules for Efficiencies of up to 98%

Learn more:
semiq.com

Product Release
2024-02-19

SemiQ added a product to its QSiC family. The QSiC 1200 V SiC MOSFET modules in full-bridge configurations deliver near zero switching loss, significantly improving efficiency, reducing heat dissipation, and allowing the use of smaller heatsinks. With a high breakdown voltage exceeding 1400 V, the QSiC modules in full-bridge configurations withstand high-temperature operation at T_j = 175 °C with minimal R_DS(on) shift across the entire temperature spectrum. Using high-performance ceramics, SemiQ's modules are well-suited for demanding applications that require bidirectional power flow or a broader range of control, such as solar inverters, drives and chargers for Electric Vehicles DC/DC converters and power supplies. In solar inverter applications, SemiQ's technology allows reaching an efficiency of up to 98 % - as well as more compact designs. It helps reduce heat loss, improve thermal stability, and enhance reliability, backed by over 54 million hours of HTRB/H3TRB testing. The 1200 V MOSFETs also maximize efficiency gains in DC/DC converters while enhancing reliability and minimizing power dissipation. To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level, and all parts have undergone testing surpassing 1400V.

Distribution Agreement expanded to USA, Australia & New Zealand

Learn more:
pulsiv.co.uk

Industry News
2024-02-16

Pulsiv of Cambridge (UK) and Astute Electronics of Stevenage (UK) have expanded their distribution agreement to include USA, Australia and New Zealand. Astute Electronics was founded 35 years ago "to bridge the gap between broadline and independent distribution in the European supply chain". Still privately owned, the business now operates across five continents. Using a patented switching technique, Pulsiv has developed an special method for converting AC to DC that delivers a combination of benefits in power electronics designs. This technology has extended the range of conventional flyback topologies to replace expensive LLC solutions, while achieving "an unrivalled efficiency profile". Pulsiv offers Osmium microcontrollers which implement these switching techniques, AC/DC front-end circuit configurations that include a Pulsiv OSMIUM microcontroller and supporting components for a complete AC/DC front-end design as well as evaluation boards and reference designs.

Automotive-Grade 3-Phase SiC MOSFET Power Modules

Learn more:
inventchip.com

Product Release
2024-02-15

Inventchip announced the release of an automotive-grade 3-phase SiC MOSFET transfer-molded power module IVTM12080TA2Z. The module is 1200V 80mΩ in a compact, topside-cooling through-hole package with a plastic surface size of 23mm x 42mm. Compared with a discrete TO-247 solution, the module saves about 30% PCB space, and the more important thing is that the SiC MOSFET dies are arranged in a much more compact way, which reduces over all stray-inductance of power loops. The reduction of the stray inductance reduces MOSFET Vds overshoot, Vgs ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with the TO-247 solution with external electrical isolation assembly, the module with high performance ceramic lowers junction-to-heatsink thermal resistance by over 50% for the same 80m 1200V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The package has a minimum 5mm creepage from terminals to the package’s heatsink mounting surface, which can safely work for both 400V and 800V systems without isolation reinforce. For production, with isolated top-side cooling, the module solution eliminates any external isolation process and reduces system assembly time and cost. It also minimizes human assembly errors and improves product reliability.

Distributor stocks MOSFET Family with now higher Power Efficiency

Learn more:
rutronik24.com

Product Release
2024-02-15

Rutronik integrates the StrongIRFET™ 2 MOSFETs from Infineon into its product portfolio. This generation provides a higher power efficiency, which leads to improved overall system performance. Due to a higher current load tolerance, several parallel connected components are no longer necessary. That saves space on the PCB and reduces costs. The transistors are in stock and available in different housing variants such as TO-220; TO-220 FullPAK, D2PAK, D2PAK 7-pin, DPAK, and TOLL. Compared to the previous StrongIRFET components in the 40 V to 100 V range, the technology offers up to 40 percent better on-resistance and up to 60 percent lower nominal gate charge. In addition, higher rated currents enable improved current carrying capacity and the new generation is suitable for both high and low switching frequencies. Standard pinouts enable simple drop-in replacement. The MOSFETs are 100 percent safety-tested, RoHS-compliant, halogen-free following IEC61249-2-21 product validation, and meet the JEDEC standard. They can be used in a wide range of applications, e.g. for UPS, battery management, or motor drives.

Semiconductor Company to buy PCB Design Company

Learn more:
renesas.com

Industry News
2024-02-15

Renesas intends to acquire Altium by way of a Scheme of Arrangement. The acquisition is said to enable "two industry leaders to join forces and establish an integrated and open electronics system design and lifecycle management platform that allows for collaboration across component, subsystem, and system-level design". Together, Renesas and Altium, aim to build an integrated and open electronics system design and lifecycle management platform that unifies the steps from component selection and evaluation to simulation and PCB physical design at a system level. The acquisition brings together Altium's cloud platform capabilities with Renesas' semiconductor portfolio. The combination will also enable integration with third-party vendors across the ecosystem to execute all electronic design steps seamlessly on the cloud. The electronics system design and lifecycle management platform will deliver integration and standardization of various electronic design data and functions and enhanced component lifecycle management, while enabling seamless digital iteration of design processes to increase overall productivity. This is said to bring "significantly faster innovation" and to "lower barriers to entry for system designers by reducing development resources and inefficiencies". Altium's history began in 1985 from Australia as one of the world's first printed-circuit board (PCB) design tool providers. The transaction has been unanimously approved by the boards of directors of both companies and is expected to close in the second half of 2024. Altium will continue to be led by CEO Aram Mirkazemi as a wholly-owned subsidiary of Renesas.

Schottky Barrier Diodes with short Reverse Recovery Time

Learn more:
rohm.com

Product Release
2024-02-15

ROHM has developed 100 V breakdown Schottky barrier diodes (SBDs) that deliver a short reverse recovery time (t_rr) of 15ns for power supply and protection circuits in automotive, industrial, and consumer applications. Although numerous types of diodes exist, highly efficient SBDs are increasingly being used inside a variety of applications. Particularly SBDs with a trench MOS structure that provide lower V_F than planar types enable higher efficiency in rectification applications. One drawback of trench MOS structures, however, is that they typically feature worse trr than planar topologies – resulting in higher power loss when used for switching. In response, ROHM developed a series utilizing a proprietary trench MOS structure that simultaneously reduces both V_F and I_R (which are in a trade-off relationship) while also achieving a short t_rr. Expanding on the four existing conventional SBD lineups optimized for a variety of requirements, the YQ series is ROHM's first to adopt a trench MOS structure. The design reduces t_rr losses by approximately 37 % and overall switching losses by around 26 % over general trench-type MOS products. As such, the devices are are well-suited for sets requiring high-speed switching, such as drive circuits for automotive LED headlamps and DC-DC converters in xEVs that are prone to generate heat.

Power Supplies for Industrial Applications

Learn more:
coseleurope.eu

Product Release
2024-02-15

COSEL has announced the launch of the PDA series of AC/DC power supplies with further enhanced reliability for industrial applications. The PDA series uses a quasi-resonant topology with a limited number of components, resulting in higher reliability. It is 100% form, fit and function backwards compatible with the PBA series, which is retiring after 20 years of powering high volume applications worldwide. The first models introduced are the 15W PDA15F, the 30W PDA30F and the 50W PDA50F, with other versions to follow. The PDA series is designed for use in a wide range of applications and can operate over a wide temperature range from -20 to +70 degrees C. The power supplies are UL/EN62368-1 certified. Designed for worldwide applications, the PDA series has an input voltage range of 85VAC to 264VAC single phase and meets safety standards with an input voltage range of 100-240VAC (50/60Hz). The 15W PDA15F, the 30W PDA30F and the 50W PDA50F are available in three output voltages, 5V, 12V and 24V with corresponding output currents. The output voltage can be adjusted by a built-in potentiometer.

DC-DC Converter Designed for the ‘NewSpace’ Market

Learn more:
vptpower.com

Product Release
2024-02-14

VPT announces the addition of the VSC100-2800S to the VSC Series of space COTS DC-DC converters. Designed for the “NewSpace” market, the VSC Series complements VPT’s hermetic hybrid SV / SVL Series of rad hard products available on DLA SMDs. The VSC Series is intended for use in commercial rad tolerant satellite applications and NASA Class D missions where the balance of cost and guaranteed performance is critical. The VSC100-2800S features output voltages of +3.3 V / 66W, +5 V / 100W, +12 V / 100W, and +15 V / 100W, as well as a wide input voltage range. Sensitive semiconductors are RLAT to 40 krad (Si) per MIL-STD-883 Method 1019 and guaranteed to 30 krad (Si) TID. Converters are characterized to LET > 42 MeV/mg/cm² for catastrophic events and LET > to 30 MeV/mg/cmysup>2 for SET and SEFI. Our proprietary packaging creates a dual-side heatsinking option with very low outgassing. VPT’s Vice President of Engineering, Leonard Leslie, stated, “We are pleased to introduce the VSC100-2800S as the newest addition to our VSC Series. Drawing on VPT’s extensive expertise in the development of radiation-hardened DC-DC converters, the VSC Series ensures the optimal level of radiation performance for low Earth orbit (LEO) applications, all while maintaining an exceptionally competitive cost.”

Electrolytic Polymer Hybrid Performance

Learn more:
industry.panasonic.eu

Product Release
2024-02-14

Panasonic introduces the ZV Series Electrolytic Polymer Hybrid capacitor. Achieving a maximum Ripple Current (3.3~4.6 Arms) approximately 50% higher than comparable case-sizes from competitors, the ZV Series ensures performance in demanding applications. While comparable capacitors usually come up with a ESR of around 16 m&ohm, at 35V, the ZV series has a significantly lower ESR of 12 mΩ at this voltage – and thus enhances efficiency and reliability in electronic systems. This capacitor is AEC-Q200 compliant, enforcing stringent quality control standards, particularly crucial for the automotive industry. It boasts high-temperature endurance, one of the industry's highest ratings at 4000 hours at 135°C and 125°C. With a focus on durability, the ZV Series offers vibration-proof variants capable of withstanding shocks up to 30G, making it a reliable choice. The ZV Series finds its applications in various "under the hood" scenarios, including water pumps, oil pumps, cooling fans, high-current DC to DC converters, and ADAS applications. It is also suitable for use in inverter power supplies for robotics, cooling fans, solar power systems, and more, covering the DC side of both inverter and rectifier circuits.

How to Design the Compensation Circuit for a Flyback Converter

Learn more:
we-online.com

Product Release
2024-02-13

Würth Elektronik has published its Application Note "Compensating the feedback loop of a current-controlled flyback converter with optocoupler". The guide is aimed at developers looking to use a DC/DC flyback converter to achieve greater stability and reliability in power supply design. It might also be useful for those who use optocouplers for galvanic isolation of the feedback path. Applications include primary and auxiliary power supplies for home appliances, battery chargers for smartphones and tablets, as well as LED lighting. This Application Note also provides assistance with power supplies for desktop and laptop computers, industrial power supplies and auxiliary supplies in motor drives, or for Power-over-Ethernet (PoE). AppNote ANP113 explains in detail how the feedback loop can be compensated using a current-controlled flyback converter with optocoupler, and which aspects require special attention. The CTR (current transfer ratio) influences the control loop of the compensation circuit and therefore must be carefully considered in the design stage. ANP113 places particular emphasis on design constraints imposed by the optocoupler parameters and on the related solutions. The validation results of a 30 W flyback converter prototype are also included in the AppNote.

Automotive-Grade SiC MOSFET Half Bridge SMPD Modules

Learn more:
inventchip.com

Product Release
2024-02-13

Inventchip Technology has added two automotive-grade SiC MOSFET half bridge SMPD modules named IVSM12080HA2Z and IVSM06025HA2Z. The modules are specified 1200 V/80 mΩ and 650 V/25 mΩ. SMPD is a compact, topside-cooling surface-mounted package with a plastic surface size of 25 mm x 23 mm. Compared with TO-247, the SMPD saves over 25 % PCB space, and the more important thing is that the SMPD reduces the half-bridge stray-inductance of power loop by around 40 %. The reduction of the stray inductance reduces MOSFET V_DS overshoot, V_GS ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with TO-247 with external electrical isolation assembly, SMPD with traditional AL₂O₃ and SiN lowers junction-to-heatsink thermal resistance by over 20 % and 50 % respectively for the same 25 mΩ/1200 V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the SMPD package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The SMPD package has a minimum 4 mm creepage from terminals to the package's heatsink mounting surface, which can safely work for both 400 V and 800 V systems without isolation reinforce. Both modules are AEC Q101 and AQG 324 certified.

Joint Efforts for Magnetic Component Solutions

Learn more:
itg-electronics.com

Product Release
2024-02-12

ITG Electronics has collaborated with STMicroelectronics (ST) in developing magnetic component solutions for 54 V/48 V to 12 V converter applications. ST's patented 54 V/48 V to 12 V stacked buck converter features an on-board solution with a quarter brick space using the PM6780 dual digital multiphase controller, the STPRDC02A high-voltage full-bridge driver, and ITG's L101353A-3R6MHF non-coupling dual inductors. This magnetics design collaboration is named Stacked buck converter with unified coupled inductor. Combined with ST's PM6780 and STPRDC02A, ITG's L101456A-1R4MHF can elevate the overall power rating of ST's 48 V solution to 1500 W. This product combination is claimed to "provide the industry's highest power density rating for 48 V solutions". The on-board stacked buck converter 48 V conversion system offers cost savings, form factor flexibility, and a customizable design compared to power-module designs.

100 V bi-directional GaN IC for 48 V/60 V BMS Applications

Learn more:
innoscience.com

Product Release
2024-02-12

Innoscience Technology has launched another 100 V bi-directional member of the company's VGaN IC family. The first family of VGaN devices rated 40 V with an on-resistance range between 1.2 mOhm and 12 mOhm have been successfully deployed in the USB OVP of several mobile phones. The 100 V VGaN (INV100FQ030A) can be employed to achieve high efficiency in 48 V or 60 V battery management systems (BMS), as well as for high-side load switch applications in bidirectional converters, switching circuits in power systems, and other fields. Such device it is usable in applications such as home batteries, portable charging stations, e-scooters, e-bikes etc. One VGaN replaces two back-to-back Si MOSFETs; they are connected with a common drain to achieve bidirectional switching of battery charging and discharging, further reducing on-resistance and loss significantly with respect to traditional Silicon solution. BOM count, PCB space and costs are also reduced accordingly. The INV100FQ030A 100V VGaN IC supports two-way pass-through, two-way cut-off and no-reverse-recovery modes of operation. Devices feature a low gate charge of 90 nC, a dynamic on-resistance of 3.2 mOhm and a package size of 4 mm x 6 mm. These 100 V GaN series products are in mass production in En-FCQFN (exposed top side cooling) and FCQFN packaging.

More News	Teaser	NewsID	NewsSection	Title	Text	Announced	AnnouncedMMM	Picture	PicturePath	WebLink	WebLinkText
Strategic Partnership to drive Zero-Emission Bus Transport in Europe	Daimler Buses and BMZ have entered into a strategi...	11892	Industry News	Strategic Partnership to drive Zero-Emission Bus Transport in Europe	Daimler Buses and BMZ have entered into a strategic partnership for the development and supply of the next generation of e-bus batteries. Together with Daimler Buses, BMZ will further develop the existing battery technology specifically for the requirements of electrically powered buses. The new battery generation NMC4 – succeeding the current NMC3 technology – will combine high energy density, resulting in a longer range for e-buses, with an ultra-long cycle life. Customers of Daimler Buses will be able to use NMC4 batteries from the middle of the decade. Daimler Buses is pursuing an e-roadmap across all segments: Electrically powered city buses have already been in series production since 2018; intercity e-buses are to follow as of the middle of the decade and electrified coaches by 2030. With this, Daimler Buses aims to offer locally CO2-neutral models based on batteries or hydrogen in every segment by 2030.	23.04.2024 13:00:00	Apr	news_2024-05-01_8a.jpg	\images\news_2024-05-01_8a.jpg	https://bmz-group.com/images/PDF-Downloads/press-release/202240422_FINAL_Press_news_Daimler_Buses_BMZEN.pdf	bmz-group.com
Energy-Saving DC/DC Converter ICs in TSOT23 Package	ROHM has developed four compact DC/DC step-down co...	11899	Product Release	Energy-Saving DC/DC Converter ICs in TSOT23 Package	ROHM has developed four compact DC/DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz. The company has developed products that achieve higher efficiency in an even smaller package than existing SOP-J8 (JEDEC standard: SOIC8 equivalent) products. These converter ICs deliver an output current of 1 A to 3 A in the compact TSOT23 package (2.8 mm × 2.9 mm). This reduces component area by up to 72% compared to the general SOP-J8 package (4.9 mm × 6.0 mm), contributing to the miniaturization of power supply blocks. On top, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance. The BD9E105FP4-Z, BD9E202FP4-Z, and BD9E304FP4-LBZ also utilize a COT control mode during light load operation. As a result, efficiency during light load operation is improved over standard products, making them well-suited for applications requiring low standby power consumption. In addition to the ICs, evaluation boards together with various support tools are available that enable immediate evaluation during application design.	23.04.2024 10:30:00	Apr	news_2024-05-01_15a.jpg	\images\news_2024-05-01_15a.jpg	https://www.rohm.com/news-detail?news-title=2024-04-23_news_dcdc&defaultGroupId=false	rohm.com
High-Temperature Inductors are resistant to Thermal Aging	Würth Elektronik supplements its molded power indu...	11897	Product Release	High-Temperature Inductors are resistant to Thermal Aging	Würth Elektronik supplements its molded power inductors series with the high-temperature versions WE-MAPI and WE-LHMI. The inductors can be used continuously at high rated currents in a temperature range from -55 °C to +150 °C. The compact components have been tested for thermal aging for over 1000 hours at 200 ºC and are qualified to AEC-Q200. High temperatures in inductors with an iron alloy magnetic core result in thermal aging phenomena. Core losses rise sharply and efficiency drops. Aging can lead to increased self-heating in the component, which in turn exacerbates thermal aging. By expanding its inductor series, Würth Elektronik offers power inductors that are not only unaffected by thermal aging but also do not suffer any performance loss. The SMT power inductors boast low losses, high efficiency, lightweight design, and a low package profile. Their high-current-carrying capacity and capability of handling high transient current peaks can be utilized in applications such as DC/DC converters for high currents in power supplies or for field programmable gate arrays (FPGA), point of load (POL) converters or CPU/RAM power supplies.	23.04.2024 08:30:00	Apr	news_2024-05-01_13a.jpg	\images\news_2024-05-01_13a.jpg	https://www.we-online.com/en/news-center/press?d=thermal-aging	we-online.com
Measurement Facility in Bengaluru/India	Rohde & Schwarz has inaugurated a facility center ...	11891	Industry News	Measurement Facility in Bengaluru/India	Rohde & Schwarz has inaugurated a facility center in Bengaluru's Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. For Rohde & Schwarz, India is not merely a growth market but a vital component of its global strategy. The R&D team in Bengaluru is involved in developing next generation. The facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions.	22.04.2024 12:00:00	Apr	news_2024-05-01_7a.jpg	\images\news_2024-05-01_7a.jpg	https://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-expands-footprint-in-india-by-opening-new-state-of-the-art-facility-in-bengaluru-press-release-detailpage_229356-1490561.html	rohde-schwarz.com
Silicon Carbide Wafer Supply Agreement	ROHM and STMicroelectronics announced the expansio...	11887	Industry News	Silicon Carbide Wafer Supply Agreement	ROHM and STMicroelectronics announced the expansion of the existing multi-year, long-term 150 mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, which is a ROHM group company. The multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million. Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented "This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions". "SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality". said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.	22.04.2024 08:00:00	Apr	news_2024-05-01_3a.jpg	\images\news_2024-05-01_3a.jpg	https://www.rohm.com/news-detail?news-title=2024-04-22_news&defaultGroupId=false	rohm.com
Power Factor Correction Chokes	ITG Electronics has introduced a line of power fac...	11903	Product Release	Power Factor Correction Chokes	ITG Electronics has introduced a line of power factor correction (PFC) chokes whose slim design enables engineers to incorporate them into tight spaces. The company's PFC282820B and PFC282822B series of PFC chokes are suitable for 500 - 1000 W continuous conduction mode PFC boost converter applications. ITG Electronics also offers a wider design (27.5 x 28.5 mm3) compatible with power systems up to 2,000 W. These devices are part of ITG Electronics' broader Cubic Design PFC Choke series. Compared with traditional, toroidal-shaped PFC chokes, the new series extension incorporates a flat wire and square core to save space and increase power density. ITG Electronics' range of PFC chokes are appropriate for AC to DC power conversion in industrial equipment and automative components manufacturing environments.	21.04.2024 14:30:00	Apr	news_2024-05-01_19a.jpg	\images\news_2024-05-01_19a.jpg	https://itg-electronics.com/en/series/909	itg-electronics.com
Integration of Power Supply Company completed	With the official change of name, the legal step h...	11893	Industry News	Integration of Power Supply Company completed	With the official change of name, the legal step has been completed: Emtron electronic GmbH is now called FORTEC Power GmbH. Emtron electronic GmbH has already been part of FORTEC Elektronik AG since 1998. In July 2023, a change to a "branded house" was initiated within the FORTEC Group, i.e. holistic corporate brands were designed for the FORTEC group subsidiaries in order to offer the comprehensive product range of Display Technology, Embedded and Power Supplies under one brand and to appear as "FORTEC One" in communication with the market.	19.04.2024 14:00:00	Apr	news_2024-05-01_9a.jpg	\images\news_2024-05-01_9a.jpg	https://emtron.de/Blog/emtron-ist-jetzt-fortec-power	emtron.de
Innauguration of Plant in Malaysia	LEM chose to make such a substantial investment in...	11886	Industry News	Innauguration of Plant in Malaysia	LEM chose to make such a substantial investment in the state of Penang/Malaysia by opening a new plant in this region. From employing around 70 people in April 2024, LEM expects to increase the headcount to more than 200 people by March 2025 and eventually more than 500, with sales from the factory expected to reach over € 200 millions. With plans in place already for an extension on the additional 5,000 m<sup>2</sup> of land, the new 11,800 m<sup>2</sup> factory features a state-of-the-art logistic system including automatic guided vehicles (AGVs) on the shopfloor which transport components from the warehouse to the high-tech production lines. LEM Malaysia is also the pilot for the roll-out of the company's ERP system and will produce a substantial part of its energy through solar panels.	19.04.2024 07:00:00	Apr	news_2024-05-01_2a.jpg	\images\news_2024-05-01_2a.jpg	https://www.lem.com/en/lem-inaugurates-new-hightech-plant-malaysia#:~:text=New%20Factory%20in%20Penang%20Fuels%20Growth%20and%20Sustainability&text=From%20employing%20around%2070%20people,to%20reach%20over%20%E2%82%AC200m.	lem.com
GaN IC enables solar-powered Irrigation Pump	Navitas has announced, that Virtual Forest one of ...	11890	Industry News	GaN IC enables solar-powered Irrigation Pump	Navitas has announced, that Virtual Forest one of India's leading electronics design companies specializing in motor control and human interface technologies for consumer appliances, fluid movement and mobility, has adopted its GaNFast power integrated circuits (IC) technology for a zero-emission, powerful 3 hp (2,250 W) solar-powered irrigation pump. This pump is remotely accessed via quad-band IoT with low power consumption. It can raise 200 l of water per minute to a height of about 30 m, enough to water 3 acres of farmland, and help to produce 10 tonnes of wheat. Further, the IoT enabled solar pump ensures optimal water usage through intelligent analytics, therefore minimizing ground water utilization. Currently, the majority of pumps in this area is powered by polluting and noisy diesel generators or expensive, lossy long-distance electrical cables. The Virtual Forest solar pump with maximum power point tracking (MPPT) operates in conjunction with solar panel and energy storage to provide robust, energy-independent and pollution-free performance at the point of use. In this application two GaN power FETs with GaN drivers, level-shifters, protection features and high-efficiency loss-less current sensing NV6269 half-bridge ICs are used.	18.04.2024 11:00:00	Apr	news_2024-05-01_6a.jpg	\images\news_2024-05-01_6a.jpg	https://navitassemi.com/navitas-virtual-forest-join-hands-to-advance-net-zero-in-agriculture/	navitassemi.com
Fully integrated 48 W Power Supply Board mount Module	The PSDG-48 series is a fully integrated COTS mult...	11902	Product Release	Fully integrated 48 W Power Supply Board mount Module	The PSDG-48 series is a fully integrated COTS multi-output 48 W isolated power supply board mount module from Gaia Converter. Dedicated to 24 & 28 VDC military and High Reliability applications, MIL-STD-461, MIL-STD-704, MIL-STD-1275, ABD100 and DO160 power supply requirements are all built into this module. It is equipped with an integrated EMI filter, reverse polarity protection, hold-up function (50 ms transparency timing managed with external capacitor), high & low input voltage transients and inrush current limit and short circuit and over-voltage protected outputs. The module operates from -40 °C to +105 °C (full load case operating temperature range) and is suitable for all rugged applications complying with MIL-STD-202 & 810 for altitude, humidity, temperature shocks & cycles, mechanical vibrations and shocks. The power supplys of the PSDG series use a fixed high frequency switching topology. It is fully encapsulated with thermally conductive resin for optimal power dissipation in harsh environments. The complete power supply efficiency up to 87%. It is integrated in a black anodized machined aluminium case measuring 91 x 54 x 9 mm<sup>3</sup>.	17.04.2024 13:30:00	Apr	news_2024-05-01_18a.jpg	\images\news_2024-05-01_18a.jpg	https://www.gaia-converter.com/new-flhg-60-m-n-copy/	gaia-converter.com
European and Korean Semiconductor Manufacturer cooperate on GaN and SiC	SweGaN, a European semiconductor manufacturer that...	11888	Industry News	European and Korean Semiconductor Manufacturer cooperate on GaN and SiC	SweGaN, a European semiconductor manufacturer that develops and produces engineered high-performance Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, announces it has entered strategic partnership with South Korea based RFHIC Corporation. RFHIC is active in designing and manufacturing GaN RF & microwave semiconductors for communications and defense applications. The agreement encompasses an undisclosed equity investment from RFHIC. The two companies will focus on joint R&D and product development moving forward. Over the last decade, SweGaN has been developing and producing high-performance GaN-on-SiC epitaxial solutions for RF and power devices that can be used in various applications such 5G telecommunications infrastructure, defense radars, satellite communications, on-board chargers, and data centers. This strategic investment by RFHIC shows the recognition of SweGaN's QuanFINE® epitaxial solutions as a differentiator among GaN-on-SiC materials available on the market. In partnership with RFHIC, SweGaN gains additional resources to expedite market penetration and to achieve its business goals. RFHIC Corporation cites the partnership with SweGaN and investment strategy target strengthening RFHIC's gallium nitride semiconductor supply chain and further fortifying its competitiveness of RF and microwave products within the compound semiconductor arena. In the joint collaboration, SweGaN and RFHIC plan to address the increasing demand for GaN semiconductors and initiate new product developments for a variety of markets.	15.04.2024 09:00:00	Apr	news_2024-05-01_4a.jpg	\images\news_2024-05-01_4a.jpg	https://swegan.se/3087/	swegan.se
Expanded Power Portfolio	Tektronix has acquired EA Elektro-Automatik (EA), ...	11895	Industry News	Expanded Power Portfolio	Tektronix has acquired EA Elektro-Automatik (EA), a principal supplier of high-power electronic test solutions for energy storage, mobility, hydrogen, and renewable energy applications. The introduction of EA to the Tektronix team provides the company with expanded solutions, leveraging Tektronix's oscilloscopes and isolated probes, EA's power supplies and electronic loads, and Keithley's source meters and instrumentation. Combined, the Tektronix portfolio offers a set of capabilities for energy storage and power electronics design needs, from ultra-low to ultra-high power. With the addition of EA, Tektronix is well equipped to serve engineers who are electrifying our world. With emphasis on creating solutions for power electronics in the semiconductor, aerospace, and automotive industries, the Tektronix and EA product portfolio addresses issues in energy storage, mobility, and hydrogen fuel.	12.04.2024 16:00:00	Apr	news_2024-05-01_11a.jpg	\images\news_2024-05-01_11a.jpg	https://www.tek.com/en/blog/ea-elektro-automatik-greatly-expands-tektronixs-high-power-test-and-measurement-coverage	tek.com
300 mm Wafer Fab dedicated for Power Semiconductors	Renesas has started operations at its Kofu Factory...	11894	Industry News	300 mm Wafer Fab dedicated for Power Semiconductors	Renesas has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. Renesas aims to boost its production capacity of power semiconductors in anticipation of the growing demand in electric vehicles (EVs). The Kofu Factory previously operated both 150 mm and 200 mm wafer fabrication lines until October 2014. Renesas made the decision to re-open the factory as a 300 mm wafer fab to support the growing demand for power semiconductors. The factory will start mass production of IGBTs and other products in 2025, doubling Renesas' current production capacity for power semiconductors.	12.04.2024 15:00:00	Apr	news_2024-05-01_10a.jpg	\images\news_2024-05-01_10a.jpg	https://www.renesas.com/us/en/about/press-room/renesas-commences-operations-kofu-factory-dedicated-300-mm-wafer-fab-power-semiconductors	renesas.com
Tiny Encapsulated Buck Regulators Supply up to 20 A with up to 94% Efficiency	RECOM now offers a range of four encapsulated buck...	11898	Product Release	Tiny Encapsulated Buck Regulators Supply up to 20 A with up to 94% Efficiency	RECOM now offers a range of four encapsulated buck regulators in ultra-compact, thermally enhanced LGA and QFN packages with output current ratings of 1, 3, 10, and 20 A for cost-sensible markets. The first product, the RPL-1.0, comes in a 3 mm x 3 mm LGA footprint with a "height" of 2 mm and operates over an input range of 3 to 22 V with an adjustable output of 0.6 to 12 V. 1 A output will still be available when the ambient temperature exceeds 80 °C, depending on input/output voltage combinations with operation temperatures up to 125 °C ambient possible, however, with derating. Efficiency is up to 95%. RPH-3.0 is integrated in a 47-pad QFN package measuring 10 mm x 12 mm x 4 mm height, and provides 3 A at the output over an input range of 4.5 to 55 V. Its adjustable output range spreads from 1 to 15 V. Efficiency is up to 91%, and full output current can be delivered even at temperatures beyond 80 °C, for example at 12 Vin and 3.3 V<sub>out</sub>. The third device, RPL-10, is rated at 10 A output and offers several additional features. Integrated in an LGA-M package (7 mm x 7 mm x 4.4 mm) the regulator operates with input voltages between 4 and 16 V while the programmable output voltage can be in the range of 0.6 to 5.5 V. Finally, the RPL-20 is claimed to take the "power density to a new level" with its 20 A rating from a programmable output of 0.6 to 5.5 V. Its input range spans from 4 to 16 V, and the maximum efficiency is 94%.	11.04.2024 09:30:00	Apr	news_2024-05-01_14a.jpg	\images\news_2024-05-01_14a.jpg	https://recom-power.com/en/rec-n-new-rpl-and-rph-buck-converters-provide-up-to-20a-315.html?3	recom-power.com
USB Type-C Protection Switch for increased Efficiency and Safety	Alpha and Omega Semiconductor (AOS) has released t...	11896	Product Release	USB Type-C Protection Switch for increased Efficiency and Safety	Alpha and Omega Semiconductor (AOS) has released the AOZ1377DI Type-C Protection Switch which is designed to enhance USB Type-C efficiency and safety. These protection Type-C switches have a current-limiting switch targeting applications that require comprehensive protections. AOZ1377DI supports up to 7 A with an input voltage of up to 20 V, making it usable for both sink and source applications. The AOZ1377DI offers features that significantly reduce voltage drop and power loss compared to back-to-back p-channel devices typically used in such applications. The device supports an input operating voltage range of 3.4 V to 23 V, with both V<sub>IN</sub> and V<sub>OUT</sub> terminals rated at a maximum of 28 V, and is capable of up to 7 A. These devices are suited for high-power applications requiring multi-port Type-C PD 3.0 current source supporting up to 100 W like in high-performance laptops, personal computers, monitors, docking stations, and other Type-C port applications. The AOZ1377DI has a True Reverse Current Blocking (TRCB) protection, which prevents undesired reverse current from V<sub>OUT</sub> to V<sub>IN</sub>. It also features an internal current-limiting and short-circuit current limit that protects the source device from large load current. The current limit threshold can be set externally with a resistor. Furthermore, the integrated back-to-back MOSFET is said to deliver "the industry's lowest ON resistance and highest SOA to safely handle high currents and a wide range of output capacitances on V<sub>OUT</sub>".	11.04.2024 07:30:00	Apr	news_2024-05-01_12a.jpg	\images\news_2024-05-01_12a.jpg	https://aosmd.com/sites/default/files/2024-04/AOS_1377DI-01_02_PR.pdf	aosmd.com
Taiwanese Company opens Office in Japan	The Taiwanese MOSFET manufacturer PANJIT has offic...	11885	Industry News	Taiwanese Company opens Office in Japan	The Taiwanese MOSFET manufacturer PANJIT has officially opened its Japan branch in Tokyo. This is a significant milestone and it shows PANJIT's dedication to global expansion and its commitment to serving the Japanese market. The Japan branch will serve as a key hub in Asia, enhancing service efficiency and improving communication with Japanese clients. This initiative aims to provide tailored solutions and localized support. At the opening ceremony, Jason Fang, President of the PANJIT Group, highlighted the significance of the Japan office: "The establishment of our Japan branch is central to our global ambitions and our dedication to the Japanese market. We are committed to delivering prompt, tailored service to ensure our Japanese customers feel highly valued and supported."	11.04.2024 06:00:00	Apr	news_2024-05-01_1a.jpg	\images\news_2024-05-01_1a.jpg	https://www.panjit.com.tw/en/News/PANJIT_Japan_Grand_Opening	panjit.com.tw
Wide Bandgap Applications Workshop in Sweden	WBG Power Center and RISE, in collaboration with Y...	11853	Event News	Wide Bandgap Applications Workshop in Sweden	WBG Power Center and RISE, in collaboration with Yole Group are pleased to announce the international workshop in applications of wide bandgap (WBG) power electronics, SCAPE 2024. The event will cover the latest results and innovations in power electronics applications of wide bandgap materials, such as silicon carbide and gallium nitride. SCAPE 2024 (previously known as ISiCPEAW and IWBGPEAW) is a three-day event, consisting of two workshop days, May 14 - 15, preceded by one tutorial day, May 13. The program is defined by WBG experts and reflects the status of WBG from an industry point of view. Specialists from all over the world will present their views on status, ongoing development and the opportunities of applications in the power electronics area. They will also present the latest products and solutions and will be available for detailed technical discussions.	10.04.2024 19:00:00	Apr	news_2024-04-15_14.jpg	\images\news_2024-04-15_14.jpg	https://www.scape2024.se/	scape2024.se
1 W Isolated and Regulated DC/DC is just 1.18 mm tall	Recom has introduced fully integrated RxxC1TF isol...	11864	Product Release	1 W Isolated and Regulated DC/DC is just 1.18 mm tall	Recom has introduced fully integrated RxxC1TF isolated DC/DC converters, which offer tightly regulated and selectable outputs at 3.3 V or 5 V in a 12-pad LGA surface mount package, just 5 x 4 x 1.18 mm<sup>3</sup>. The product is rated for 200 mA output up to 80 °C ambient, with derating to 125 °C, with an input range of 3 to 5.5 V<sub>DC</sub>. Despite the tiny size of the part, an isolation rating of 3 kV<sub>AC</sub> is achieved for 1 s along with full line and load regulation, on/off control, selectable outputs, and full protection against input under-voltage, over-temperature, and output overload and short circuits. Isolation capacitance is specified at 5 pF typical. Applications for the RxxC1TF include COM port and sensor isolation in industrial and building automation, datacomms, and IoT.	09.04.2024 16:30:00	Apr	news_2024-04-15_25.jpg	\images\news_2024-04-15_25.jpg	https://recom-power.com/en/company/newsroom/rec-n-new-standard-set-for-a-1w-isolated-and-regulated-dc!sdc-313.html?3	recom-power.com
Power MOSFETs with high-speed Body Diode	Toshiba has launched a range of 650 V N-channel po...	11901	Product Release	Power MOSFETs with high-speed Body Diode	Toshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 in TO-247 package are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series. This generation has a super junction structure suitable for switching power supplies in demanding applications including data centres and power conditioners for photovoltaic (PV) generators. The two power MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (t<sub>rr</sub>) with values of 160 ns and 115 ns, respectively. Compared with Toshiba standard MOSFETs, the products reduce the reverse recovery charge (Q<sub>rr</sub>) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of "drain-source On-resistance × gate-drain charge" (R<sub>DS(ON)</sub> * Q<sub>gd</sub>) has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. These features reduce power losses of equipment, which helps efficiency. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have R<sub>DS(ON)</sub> values of 42 mΩ and 95 mΩ, respectively. They are capable of delivering drain currents (I<sub>D</sub>) up to 55 A and 29 A. Both devices are housed in a TO-247 package. Furthermore a reference design is available.	09.04.2024 12:30:00	Apr	news_2024-05-01_17a.jpg	\images\news_2024-05-01_17a.jpg	https://toshiba.semicon-storage.com/eu/company/news/2024/04/mosfet-20240409-1.html	toshiba.semicon-storage.com
GaN FETs for High-Performance Class-D Audio Amplifiers	EPC has launched the EPC9192 reference design for ...	11900	Product Release	GaN FETs for High-Performance Class-D Audio Amplifiers	EPC has launched the EPC9192 reference design for efficient Class-D audio amplifiers. The EPC9192 showcases the capabilities of EPC's 200 V, EPC2307, eGaN FETs in a ground-referenced, split dual supply Single-Ended (SE) design, delivering 700 W per channel into a 4 Ω load. The EPC9192 features a modular design that allows for scalability and expandability. The motherboard hosts two PWM modulators and two half bridge power stage daughterboards, implementing a two-channel amplifier with 12 V housekeeping supplies and protections. Users are able to customize the PWM modulator and power stage, facilitating the evaluation and comparison of different devices and modulation techniques. The EPC9192 provides a dual split supply input, unregulated, ±42 V to ±85 V for power stage while its analog inputs may be balanced (XLR) or unbalanced (RCA). It is configurable for two independent SE channels or single channel BTL mode. Undervoltage, Overvoltage, Overcurrent, and Overtemperature protections are included in the device. Its switching frequency is beyond 600 kHz while the noise floor is 40 µV, and the frequency response in the range of 5 Hz - 20 kHz is +/- 0.5 dB, regardless of load.	09.04.2024 11:30:00	Apr	news_2024-05-01_16a.jpg	\images\news_2024-05-01_16a.jpg	https://epc-co.com/epc/about-epc/events-and-news/news/artmid/1627/articleid/3168/design-high-performance-class-d-audio-amplifiers-with-gan-fets	epc-co.com
Power MOSFETs with high-speed Body Diode	Toshiba has launched a range of 650 V N-channel po...	11859	Product Release	Power MOSFETs with high-speed Body Diode	Toshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series – with a super junction structure suitable for switching power supplies in applications including data centres and power conditioners for photovoltaic generators. The MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (t<sub>rr</sub>) with values of 160 ns and 115 ns, respectively. Compared with Toshiba's standard MOSFETs, the devices reduce the reverse recovery charge (Q<sub>rr</sub>) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of R<sub>DS(ON)</sub> * Q<sub>gd</sub> has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have R<sub>DS(ON)</sub> values of 42 mΩ and 95 mΩ, respectively, delivering drain currents up to 55 A and 29 A. Both devices are housed in a TO-247 package.	09.04.2024 11:30:00	Apr	news_2024-04-15_20.jpg	\images\news_2024-04-15_20.jpg	https://toshiba.semicon-storage.com/eu/company/news/2024/04/mosfet-20240409-1.html	toshiba.semicon-storage.com
Position in Automotive Semiconductor Market improved	Infineon Technologies continued to expand its mark...	11889	Industry News	Position in Automotive Semiconductor Market improved	Infineon Technologies continued to expand its market position in automotive semiconductors in 2023. According to the latest research by TechInsights, the global automotive semiconductor market grew by 16.5 percent in 2023, reaching a new record size of US$ 69.2 billion. Infineon's overall market share increased by one percentage point, from nearly 13 percent in 2022 to about 14 percent in 2023, solidifying the company's position as a global leader in the automotive semiconductor market. Infineon's semiconductors are used in automotive key applications like driver assist and safety systems, powertrain and battery management, comfort, infotainment and security. According to TechInsights, Infineon has increased its market share in all regions and remained market leader in South Korea and China. In addition, the semiconductor manufacturer has made significant gains in the Japanese automotive semiconductor market. Infineon has strengthened its strong European presence as the second-largest player, as well as its top three position in North America. A major driver of Infineon's performance was strong automotive microcontroller (MCU) sales. For the first time, Infineon has reached the world's number one position in this market.	09.04.2024 10:00:00	Apr	news_2024-05-01_5a.jpg	\images\news_2024-05-01_5a.jpg	https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFATV202404-091.html	infineon.com
250 W Medical and Industrial Power Supply Series	TDK announces additional output voltage models to ...	11857	Product Release	250 W Medical and Industrial Power Supply Series	TDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2 inches x 4 inches footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 V<sub>AC</sub> input and has a earth leakage current of less than 150 µA – including all tolerances. The touch current is <10 µA (Class I) and <70 µA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80°C is also possible.	09.04.2024 09:30:00	Apr	news_2024-04-15_18.jpg	\images\news_2024-04-15_18.jpg	https://www.emea.lambda.tdk.com/uk/news/article/19923	lambda.tdk.com
Expansion of Partnership with Foundry	Microchip announced it has expanded its partnershi...	11848	Industry News	Expansion of Partnership with Foundry	Microchip announced it has expanded its partnership with the semiconductor foundry TSMC to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing (JASM), TSMC's majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip's ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners. The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip's potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.	08.04.2024 14:00:00	Apr	news_2024-04-15_9.jpg	\images\news_2024-04-15_9.jpg	https://www.microchip.com/en-us/about/news-releases/corporate/microchip-technology-expands-partnership-with-tsmc-to-strengthen	microchip.com
Family of Power Analyzers	A family of Rohde & Schwarz power analyzers is now...	11855	Product Release	Family of Power Analyzers	A family of Rohde & Schwarz power analyzers is now available in three models to meet the requirements for measuring voltage, current, power and total harmonic distortion on both DC and AC sources. The R&S NPA101 power meter provides all basic measurements, the R&S NPA501 power analyzer adds enhanced measurement functions and graphical analysis, and the R&S NPA701 compliance tester includes evaluation functions in line with IEC 62301 and EN 50564 for power consumption and EN 61000-3-2 for EMC harmonic emission testing. All models of the R&S NPA family of power analyzers meet the requirements of these stages for power measurements at levels from 50 µW to 12 kW, at potential differences from 1 mV to 600 V and currents from 1 mA to 20 A. The R&S NPA501 and R&S NPA701 include interfaces for external probes or shunts to further extend the range. All three models feature a sampling rate of 500 ksample/s. The 16-bit resolution A/D convertor provides an accuracy of ± 0.05 % for both current and voltage readings. The three instruments of the R&S NPA family include the same 23 standard measurements of power, current, voltage, harmonic distortion and energy.	04.04.2024 07:30:00	Apr	news_2024-04-15_16.jpg	\images\news_2024-04-15_16.jpg	https://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-introduces-new-r-s-npa-family-of-compact-power-analyzers-for-all-power-measurement-requirements-press-release-detailpage_229356-1484872.html?change_c=true	rohde-schwarz.com
Opening of Manufacturing and After-Sales Support Facility in Thailand	Recom has recently established its new manufacturi...	11852	Industry News	Opening of Manufacturing and After-Sales Support Facility in Thailand	Recom has recently established its new manufacturing and after-sales support setup in Bangkok, Thailand. The initiative aims to enhance service quality for the global market and the local customer base, as well as to minimize supply chain risks for international clients. Claimed to set new standards in manufacturing, quality control, and after-sales services, the facility is said to represent "a significant advancement in Recom's operational capabilities". It also houses a logistics center designed to ensure efficient, on-time deliveries to both regional hubs and customers worldwide. Central to the new setup is a commitment to sustainability. Optimizing the supply chain, manufacturing processes, and transportation methods, the facility significantly reduces energy consumption. These efforts mark a major step in Recom's journey towards complete sustainability and achieving zero emissions across the full value chain. In 2024, the focus is on reaching a significant milestone: Recom Thailand is set to ship over 1 million pieces of a wide range of low- and high-power products, from 1 W to 2 kW, catering to the global market.	03.04.2024 18:00:00	Apr	news_2024-04-15_13.jpg	\images\news_2024-04-15_13.jpg	https://recom-power.com/en/rec-n-recom-expands-global-reach-with-state-of-the-art-facility-in-bangkok,-thailand-314.html?2	recom-power.com
Rad Hard GaN Gate Driver IC	EPC Space announces the launch of EPC7009L16SH, a ...	11854	Product Release	Rad Hard GaN Gate Driver IC	EPC Space announces the launch of EPC7009L16SH, a Radiation Hardened Gallium Nitride gate driver integrated circuit. Built on EPC's proprietary eGaN IC technology, the company claims that the device "delivers the best solution for power management where size, efficiency and simple design are critical". The EPC7009L16SH integrates input logic interface, undervoltage lockout (UVLO) protection, a 10 V-to-5.25 V linear regulator and driver circuit within a hermetically sealed 16-pin SMT package to create a driver that can switch at rates of up to 3.0 MHz. The total ionizing dose is guaranteed to 1000 kRad, and the SEE immunity for LET at 84 MeV/mg/cm<sup>2</sup> with the IC's primary supply voltage at 100% of its maximum operating value. Moreover, EPC7009L16SH can drive at least four EPC Space discrete GaN devices. The component is part of a family of space-level Rad Hard ICs that EPC and EPC Space will be launching starting this year. EPC7009L16SH applications include high speed DC-DC conversion, motor drivers, power switches/actuators, and satellite electrical systems.	03.04.2024 06:30:00	Apr	news_2024-04-15_15.jpg	\images\news_2024-04-15_15.jpg	https://epc.space/2024/04/epc-space-launches-rad-hard-gan-gate-driver-ic/	epc.space
General Manager & Vice President EMEA appointed	SHURTER welcomes Steffen Lindner to its leadership...	11850	People	General Manager & Vice President EMEA appointed	SHURTER welcomes Steffen Lindner to its leadership team. As of April 1, 2024, he has taken over the newly created position of General Manager & Vice President EMEA. In this role, Steffen Lindner will be responsible for all company activities in EMEA, including product management, engineering, sales, and production. After completing his education as a radio and television technician and earning a graduate degree in electrical engineering / communications engineering, Steffen Lindner began his career in sales at Phoenix Contact. After two decades at Phoenix Contact, Steffen Lindner took over sales for Europe, Middle East and Africa at TE Connectivity Industrial. He adapted the sales organization to the changing market conditions and customer needs and introduced a potential-oriented market approach. By strategically focusing on key customers in specific application areas and working in partnership with distributors, Steffen Lindner was able to achieve above-average growth with the new organization. During his almost seven years at TE Connectivity Industrial, he was involved in several company acquisitions and their integration processes.	02.04.2024 16:00:00	Apr	news_2024-04-15_11.jpg	\images\news_2024-04-15_11.jpg	https://www.schurter.com/en/news/schurter-strengthens-its-leadership-team	schurter.com
Power Seminar in German Language	Targeting Hardware-/Software design engineers, pro...	11847	Event News	Power Seminar in German Language	Targeting Hardware-/Software design engineers, product development, business development and key accounts Mankel Engineering is organizing a hands-on-oriented user symposium about motors and inverters of xEVs. The seminar, which will take place at the end of June 2024 in northwestern Germany, can only be attended with physical presence, and the conference language is German. After an introduction about electrical motors the main focus will be on the components of a power inverter.	02.04.2024 13:00:00	Apr	news_2024-04-15_8.jpg	\images\news_2024-04-15_8.jpg	https://www.mankel-engineering.de/SeminareWorkshops/Seminare/	mankel-engineering.de
CEO of Swiss Company now in charge	As announced in October 2023, Volker Cwielong took...	11846	People	CEO of Swiss Company now in charge	As announced in October 2023, Volker Cwielong took over as CEO of Datwyler on 1 April 2024. Dirk Lambrecht, who had held the position since 2017, stepped down at the end of March 2024 and was elected to the Board of Directors at the Annual General Meeting. Volker Cwielong has been a member of the management team of the globally present Eberspächer Group since 2017. As Co-CEO of the Purem by Eberspächer division, he was responsible for net sales of some EUR 2 billion and for more than 7'000 employees at over 40 locations on three continents. He led the sales, production, technology and innovation units and had full responsibility for the division's results. Before, Volker Cwielong held various global management positions for international industrial groups and automotive suppliers. Volker Cwielong is a mechanical engineer and holds an MBA.	02.04.2024 12:00:00	Apr	news_2024-04-15_7.jpg	\images\news_2024-04-15_7.jpg	https://datwyler.com/media/news/new-ceo-volker-cwielong	datwyler.com
Managing Director of Power Company	TDK Corporation announces the appointment of Chris...	11844	People	Managing Director of Power Company	TDK Corporation announces the appointment of Christopher Haas as Managing Director at TDK-Lambda Germany from 1st April 2024. Christopher has been a member of the Board of Directors since 2012 and will retain his previous duties heading the Quality & Compliance organisation within the EMEA region in his new role. With over 20 years of experience working in the electronics industry, Christopher brings a comprehensive portfolio of technical knowledge, as well as an enterprising skill set, holding an Executive Master's in International Business. Christopher succeeds Gustav Erl, who will retire on 30th June 2024, after 38 years of seniority. In his new role, Christopher intends to lead the organisation with a vision of sustainable and future-oriented growth, building on the company's foundation and values.	02.04.2024 10:00:00	Apr	news_2024-04-15_5.jpg	\images\news_2024-04-15_5.jpg	https://www.emea.lambda.tdk.com/de-en/news/article/19922	emea.lambda.tdk.com
Power Conversion Solutions for 48V Zonal Architectures at WCX 2024	As the automotive industry moves toward 48V zonal ...	11840	Event News	Power Conversion Solutions for 48V Zonal Architectures at WCX 2024	As the automotive industry moves toward 48V zonal architectures, power system design engineers are looking for new high voltage power conversion solutions that have leading power density, weight and scalability attributes. Vicor will be presenting five papers at World Congress Experience 2024 (WCX™) in Detroit on April 16 – 18, detailing its innovative approach to 800V and 48V power conversion using new high-density, scalable power modules with proprietary topologies and innovative packaging.	02.04.2024 06:00:00	Apr	news_2024-04-15_1.jpg	\images\news_2024-04-15_1.jpg	https://www.vicorpower.com/resource-library/events/wcx-2024	vicorpower.com
Semiconductor Manufacturer fully merges its Subsidiary	ROHM announces an absorption-type merger of its fu...	11849	Industry News	Semiconductor Manufacturer fully merges its Subsidiary	ROHM announces an absorption-type merger of its fully owned subsidiary LAPIS Technology on April 1, 2024. The merger is intended to integrate the technologies of ROHM and LAPIS Technology. The newly-organized company will work as one to develop products that meet the needs of its customers. ROHM explicitly reassured that the business relationship with its customers as well as the existing products of LAPIS Technology will be continued by ROHM. "Amid dramatic changes in the business environment in the semiconductor industry, it is necessary to build a robust group-wide management structure in order to improve competitiveness", ROHM reports. "LAPIS Technology is a wholly owned subsidiary responsible for the planning and development of IC products. By enhancing the integration density of the technologies that both companies excel in, we will not only cultivate existing products, but also strengthen our development capability for high-value-added products with digital control added to power and analog products."	01.04.2024 15:00:00	Apr	news_2024-04-15_10.jpg	\images\news_2024-04-15_10.jpg	https://www.rohm.com/lapis-tech	rohm.com
Global Distribution Agreement with Power Solutions Company	Mouser Electronics announced a global distribution...	11851	Industry News	Global Distribution Agreement with Power Solutions Company	Mouser Electronics announced a global distribution agreement with Vox Power, a manufacturer of AC/DC power supplies and DC/DC converters. As part of this agreement, Mouser Electronics will distribute Vox Power's configurable, and rugged fanless conduction-cooled power supplies. These products have been specifically designed for the medical, industrial, and technology markets, providing high-density solutions that fit into compact spaces for demanding applications that conventional products cannot meet. The NEVO+600 modular configurable power supply, available from Mouser, is said to be the smallest in its class and "the ultimate solution for demanding applications where size, power density and weight matter".	27.03.2024 17:00:00	Mar	news_2024-04-15_12.jpg	\images\news_2024-04-15_12.jpg	https://eu.mouser.com/manufacturer/vox-power/	mouser.com
Substrates for Organic Field Effect Transistors (OFETs)	How efficient are new materials? Does changing the...	11828	Industry News	Substrates for Organic Field Effect Transistors (OFETs)	How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion. Customized designs enable the optimal measurement of semiconductors and conductors. Organic semiconductors are key components in organic electronics and photovoltaics. They are used to make flexible electronic devices and printed solar cells. Typical for this class of materials are low temperature processes as well as large area deposition and patterning using various coating and printing techniques. The active semiconductor materials significantly determine the performance of the entire system. Therefore, an easy to handle and reliable electronic characterization of conductivity, carrier mobility, contact resistance and on/off current ratio of these semiconductors is an essential requirement for material and process developers. Fraunhofer IPMS develops and manufactures silicon substrates with single transistor structures in bottom-gate architecture, which are used for the fabrication of organic field-effect transistors (OFETs) or for the characterization of electrical material parameters of conductive materials, e.g. for organic photovoltaics. Substrates for organic field-effect transistors (OFET) for the development of high-tech materials.	27.03.2024 14:00:00	Mar	news_2024-04-01_9.jpg	\images\news_2024-04-01_9.jpg	https://www.ipms.fraunhofer.de/en/press-media/press/2024/material-characterization-of-printed-electronics.html	ipms.fraunhofer.de
Ultrafast Soft Recovery Diode Modules deliver High Reliability	Vishay Intertechnology introduced two FRED Pt 500 ...	11861	Product Release	Ultrafast Soft Recovery Diode Modules deliver High Reliability	Vishay Intertechnology introduced two FRED Pt 500 A ultrafast soft recovery diode modules in a TO-244 Gen III package. Offering higher reliability than previous-generation solutions, the Vishay Semiconductors VS-VSUD505CW60 and VS-VSUD510CW60 are designed to reduce losses and EMI / RFI in high frequency power conditioning systems. The rugged TO-244 package of the diode modules withstands 46 000 IOL cycles at given conditions, offering an up to 5x improved life expectancy over previous-generation devices. In addition, the industry-standard package is footprint-compatible with competing solutions in the TO-244 to provide a drop-in replacement for existing designs. The VS-VSUD505CW60 and VS-VSUD510CW60 are suited for high frequency welding, high current converters and ballast water management systems (BWMS) in railway equipment, cranes, and ships, UPS and other applications where switching losses comprise a significant portion of the total losses. In these applications, the softness of their recovery eliminates the need for a snubber. Offered in a common cathode configuration, the diode modules provide forward voltage drop down to 0.82 V, thermal resistance - junction to case - of 0.16 °C/W, and an operating temperature range up to +175 °C.	27.03.2024 13:30:00	Mar	news_2024-04-15_22.jpg	\images\news_2024-04-15_22.jpg	https://www.vishay.com/en/company/press/releases/2024/VS-VSUD510CW60/	vishay.com
Series of Narrow Body Power Beads	ITG Electronics has launched a line of narrow body...	11856	Product Release	Series of Narrow Body Power Beads	ITG Electronics has launched a line of narrow body power beads for high-density applications where component space is at a premium. With a footprint of 5 x 9 mm and a height of 9.5 mm, the company's SLA36385A Series are well-suited for data centers, primary mother boards for servers and storage devices, and other scenarios requiring components to offer high current with low footprint. Featuring more than a dozen items, ITG Electronics SLA36385A Series features inductance values ranging from 35 – 470 nH; the 35 nH component can handle more than 200 A of current, with approximately 20% roll off. Each item in the series offers a DC resistance rate of 0.125 mOhm for high-current functionality. The SLA36385A Series is immersion cooling ready. The SLA36385A Series constitutes ferrite-based SMD inductors. The components feature operating frequencies up to 5.0 MHz, and a temperature range of -55 °C to + 130 °C. Each item in the series is both RoHS & HF compliant. To meet varying current sensing requirements, options for 5% tight tolerance control on DC resistance are also available.	27.03.2024 08:30:00	Mar	news_2024-04-15_17.jpg	\images\news_2024-04-15_17.jpg	https://itg-electronics.com/en/series/709	itg-electronics.com
CEO of Soft-Switching Company joins Executive Board of Engineering School	Pre-Switch has announced that its CEO Bruce Renoua...	11841	People	CEO of Soft-Switching Company joins Executive Board of Engineering School	Pre-Switch has announced that its CEO Bruce Renouard has accepted an invitation to join the executive board of the Bobby B. Lyle School of Engineering at Southern Methodist University (SMU) in Dallas, Texas/USA. Board members provide advice and counsel on a wide range of subjects, and are also advocates for the facility and involved in fundraising activities. Renouard joined SMU's engineering Co-op program where he worked at Rockwell Collins to gain real world engineering experience prior to graduating from SMU's School of Engineering (Lyle) in 1983 with a BSEE degree. Currently, Pre-Switch, the company he founded in 2015, is bringing its patented, AI-powered soft-switching technology to the automotive and other high voltage markets, resulting in significant improvements in system level efficiency.	27.03.2024 07:00:00	Mar	news_2024-04-15_2.jpg	\images\news_2024-04-15_2.jpg	https://pre-switch.com/	pre-switch.com
Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries	Thermal Management Expo North America is a unique,...	11839	Event News	Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries	Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. No other event provides the opportunity for professionals working across sectors like Automotive, Aerospace & Defense, Electronics, Energy, Telecoms/5G, and Medical to delve into the latest thermal innovations and solutions. Attendees can tap into the advantages of cross-sector networking and in-person engagements with the latest thermal materials, components, and technologies available in the market. Co-located with Ceramics Expo, this event is scheduled for April 29 – May 1, 2024 at Suburban Collection Showplace, Novi, Michigan, USA. Thermal Management Expo promises to showcase the latest systems, materials, and technologies to address thermal management challenges across several high-tech industries. Global market leading suppliers and manufacturers including Alloy Enterprises, Burger Group, Henkel, Huber, Linseis, Parker Hannifin, TCLAD, Thermtest and Stirweld, will be showcasing their innovative solutions. In addition to the exhibition, the free-to-attend conference will feature sessions led by technical experts from prominent companies like Intergalatic, Heraeus, Blueshift, Diabatix, Neural Concept, ZF Group and more. These sessions will provide insights into thermal management systems and design, covering topics such as supply chain optimization, EV thermal management, data center cooling, thermal design and AI, thermal simulation, microelectronics and semiconductors.	26.03.2024 16:30:00	Mar	news_2024-04-01_20.jpg	\images\news_2024-04-01_20.jpg	https://register.visitcloud.com/survey/1zvv3hrcg7n3t?utm_source=engineering_update&utm_medium=socials&utm_campaign=tme24_visprom_partners	thermalmanagementexpo.com
100 V Trench Schottky Rectifier Diodes	STMicroelectronics has introduced 100 V trench Sch...	11862	Product Release	100 V Trench Schottky Rectifier Diodes	STMicroelectronics has introduced 100 V trench Schottky rectifier diodes increasing efficiency in power converters operated at high switching frequencies. ST's trench Schottky diodes are claimed to "significantly reduce the rectifier losses, with superior forward-voltage and reverse-recovery characteristics that enable increased power density with high efficiency." The forward voltage is said to be "50-100 mV better than in comparable planar diodes", depending on current and temperature conditions. Changing to these devices might increase the efficiency by 0.5%. There are 28 variants in the family, with eight current ratings from 1 A to 15 A, multiple surface-mount packages, in industrial and automotive grades. The industrial-grade parts target applications such as miniature switched-mode power supplies and auxiliary power supplies for telecom, server, and smart-metering equipment. In automotive, typical uses include space-constrained applications such as LED lighting, reverse-polarity protection, and low-voltage DC/DC converters. The parts are AEC-Q101 qualified, manufactured in PPAP-capable facilities, and specified from -40 °C to 175 °C. The diodes are 100% avalanche tested in production.	26.03.2024 14:30:00	Mar	news_2024-04-15_23.jpg	\images\news_2024-04-15_23.jpg	https://newsroom.st.com/media-center/press-item.html/n4617.html	st.com
Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications	Alpha and Omega Semiconductor announced its AONZ66...	11858	Product Release	Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications	Alpha and Omega Semiconductor announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications. The USB PD 3.1 EPR increases the USB-C maximum power up to 240 W. AONZ66412 is defined to support the most commonly addressed power range of up to 140 W at 28 V, with two 40 V N-Channel MOSFETs in a half-bridge configuration in a symmetric XSPairFET 5 mm x 6 mm package. The AONZ66412 can replace two single DFN5x6 MOSFETs. The AONZ66412 is suited for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs. The AONZ66412 is an extension to the AOS XSPairFET lineup. The improved package parasitics make 1 MHz operation achievable, allowing inductor size and height to be reduced. AONZ66412 has been tested to achieve 97% efficiency @1 MHz in typical USB PD 3.1 EPR conditions of 28 V input, 17.6 V output, and 8 A load conditions.	26.03.2024 10:30:00	Mar	news_2024-04-15_19.jpg	\images\news_2024-04-15_19.jpg	https://aosmd.com/sites/default/files/2024-03/AONZ66412_PR.pdf	aosmd.com
Digital WE Days: Expert Knowledge Online	The transfer of expertise is a fundamental element...	11820	Event News	Digital WE Days: Expert Knowledge Online	The transfer of expertise is a fundamental element of Würth Elektronik's service concept. This includes in-depth expert presentations in digital format. As part of Digital WE Days, experts from Würth Elektronik and its partner companies will be presenting on important topics like intelligent power and control systems, EMC, electromechanics, wireless power, optoelectronics, and PCBs. "Last year, more than 4,300 participants took advantage of our online service offerings," says Alexander Gerfer, CTO at Würth Elektronik eiSos. "This shows that we are in touch with the times with our Digital WE Days. We are continuing this successful concept this year." From April 22 to 25, 2024, experts from Würth Elektronik, Rohde & Schwarz, onsemi, Infineon, Texas Instruments, Cambridge GaN Devices, Silent Solutions, as well as Wired & Wireless Technologies, will provide for a varied and high-caliber presentation program. A 30-minute presentation is followed by an interactive Q&A session lasting around a quarter of an hour, which further deepens the knowledge imparted in the expert presentation. "We know the current market and technology trends as well as our customers," Gerfer continues. "On this basis, we've once again put together an interesting and contemporary presentation program this year – from practitioners for practitioners." Digital WE Days 2024 is a free service from Würth Elektronik. All presentations can be booked individually. Registration for the virtual conference is now open.	26.03.2024 06:00:00	Mar	news_2024-04-01_1.jpg	\images\news_2024-04-01_1.jpg	https://www.we-online.com/en/news-center/press?d=digital-we-days-2024	we-online.com
Exhibition spreading from Coil-Winding to e-Mobility	Taking place from May 14-16 2024, this CWIEME Berl...	11827	Event News	Exhibition spreading from Coil-Winding to e-Mobility	Taking place from May 14-16 2024, this CWIEME Berlin exhibition will see leading professionals come together to discuss and showcase innovative products from the coil winding, transformer, generator, electric motor manufacturing and e-mobility sectors. For 2024, the event has secured many industry professionals to participate in sessions and talks that will discuss latest innovations, technologies and key issues in the electrical engineering industry. Confirmed speakers include representatives from The International Copper Association, Syensqo, S&P Global Mobility, Siemens Energy, Thyssenkrupp Steel Europe, Hitachi Energy, SGB-SMIT GmbH, STILRIDE, Mckinsey Center for Future Mobility and Ford Europe. The central stage will cover a host of topics such as innovation in transformers oils, driving sustainability in the manufacturing and energy sectors with a deep dive into eco-friendly practices in the steel industry, and a panel discussion on what the future holds for rare earth materials. The e-mobility stage will host talks including a keynote speech on decarbonisation in the automotive sector, a session on the importance of reliability for electric vehicle (EV) infrastructure, a panel discussion on the emerging trends, a talk on innovations and advancements in new motor technologies, and a session on how the automotive industry can remain competitive in the age of electrification.	25.03.2024 13:00:00	Mar	news_2024-04-01_8.jpg	\images\news_2024-04-01_8.jpg	https://berlin.cwiemeevents.com/home	berlin.cwiemeevents.com
Successful Funding of GaN Technology Company	Cambridge/UK-based QPT, a company which is active ...	11825	Industry News	Successful Funding of GaN Technology Company	Cambridge/UK-based QPT, a company which is active in developing highly efficient GaN-based electric motor controls, has announced that its Crowdcube funding round has just passed the one million pound milestone. Rupert Baines, QPT's new CEO, said, "QPT has a … combination of an amazing technology that can cut the power consumption of electric motors by 10% thereby providing a way to actively help reduce climate change and a management team of veterans of the GaN industry." QPT's qGaN technology is a solution for the issues of overheating and RF interference that currently limit the speeds that GaN can be driven at. "Now GaN transistors can be run at much higher speeds than any other rival technology – 20 times faster than SiC for example", Rupert Baines adds. "Our solution is smaller with a significantly lower system cost and saves more energy than rivals according to our studies. I am really excited to be heading a company with a real roadmap to make the world a better place."	25.03.2024 11:00:00	Mar	news_2024-04-01_6.jpg	\images\news_2024-04-01_6.jpg	https://www.q-p-t.com/	q-p-t.com
Polyimide Coated Magnet Wires for >800 V	Electrical breakdown of high-temperature insulatio...	11836	Product Release	Polyimide Coated Magnet Wires for >800 V	Electrical breakdown of high-temperature insulation materials can be prevented by using thermoplastic Polyimide, TPI. This polymer can be extrusion-coated as other polymers, but AURUM®, TPI reduces electrical and magnetic losses. With 245 °C AURUM claims to have the highest T<sub>g</sub> of any commercially available Thermoplastic, and its insulation performance especially at temperatures above 150 °C is stated to beat any other know insulation. AURUM reduces electrical and magnetic losses with a comparative tracking index (CTI) of > 600 volts. Thermoplastic Polyimide (TPI) produced by Mitsui Chemicals of Japan, and sold by BEIGLO GmbH is known for its thermal stability, high-temperature resistance, and electrical insulation properties. TPI coated magnet wires are a suitable choice for high-voltage applications (800 V and above).	21.03.2024 13:30:00	Mar	news_2024-04-01_17.jpg	\images\news_2024-04-01_17.jpg	https://www.bieglo.com/applications-of-thermoplastic-polyimide-aurum/	bieglo.com
Automotive N-Channel MOSFETs for 48 V Applications	Toshiba has launched two automotive N-channel powe...	11835	Product Release	Automotive N-Channel MOSFETs for 48 V Applications	Toshiba has launched two automotive N-channel power MOSFET devices to meet the growing demand for 48 V batteries and systems within automotive applications including inverters, semiconductor relays, load switches, motor drives and more. The 80V XPQR8308QB and 100V XPQ1R00AQB are based upon Toshiba's U-MOS X-H process. This gives low levels of on-resistance with the XPQR8308QB measuring less than 0,83 mΩ while the XPQ1R00AQB does not exceed 1,03 mΩ. The devices are rated for I<sub>D</sub> values of 350 A (XPQR8308QB) and 300 A (XPQ1R00AQB) continuously with pulsed values (I<sub>DP</sub>) of 1050 A and 900 A respectively. Supporting these values, the L-TOGL™ package adopts a thick copper clip-based leadframe structure that thermally and electrically connects the MOSFET die to the package leads. This reduces the package resistance by approximately 70% and channel-to-case thermal impedance by 50% compared with the TO-220SM(W) package. Together, the process and clip reduce losses and heat generation while creating a very thermally efficient solution. Furthermore, the L-TOGL package uses compliant gull-wing leads which reduce mounting stress and improve the reliability of solder joints. Both devices are AEC-Q101 qualified for automotive applications. Toshiba offers to ship devices grouped to within 0.4V based upon their gate threshold voltage.	21.03.2024 12:30:00	Mar	news_2024-04-01_16.jpg	\images\news_2024-04-01_16.jpg	https://toshiba.semicon-storage.com/eu/company/news/2024/03/mosfet-20240321-1.html	toshiba.semicon-storage.com
Reference Design for Qi2 Wireless Charging Implementation	As major charger manufacturers, including those in...	11834	Product Release	Reference Design for Qi2 Wireless Charging Implementation	As major charger manufacturers, including those in the automotive industry, are working to implement Qi® v2.0 (Qi2) standards, Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller. Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip's automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety and supports Autosar. An integrated CryptoAuthentication™ IC provides security to meet the stringent authentication requirement of Qi standards. The reference design is hardware reconfigurable and capable of supporting most transmitter topologies.	21.03.2024 11:30:00	Mar	news_2024-04-01_15.jpg	\images\news_2024-04-01_15.jpg	https://www.microchip.com/en-us/about/news-releases/products/microchip-technology-releases-qi-v2-0-standards-compliant-dspic-based	microchip.com
DC/DC Converter for 500 W with High Reliability	The MGDS-500 Series from Gaia feature a full range...	11832	Product Release	DC/DC Converter for 500 W with High Reliability	The MGDS-500 Series from Gaia feature a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications. With 500 W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design. Standard models are available with wide input voltage ranges of 9-36V<sub>DC</sub> and 16-80V<sub>DC</sub>, and provide output voltages of 12, 15, 24, 28, and 48 V<sub>DC</sub>. Over the entire 500 W output power range the MGDM-500, which is integrated into a half-brick package, operates with an efficiency of up to 91%. Its Galvanic isolation is 1500 V<sub>DC</sub>, while the switching frequency is 300 kHz. Trim adjustment is possible from 90% to 110%, and the external synchronization range is specified 270 to 330 kHz. The synchronization function allows more than one converter to operate with an external source frequency. All modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple. The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection. Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.	21.03.2024 09:30:00	Mar	news_2024-04-01_13.jpg	\images\news_2024-04-01_13.jpg	https://www.gaia-converter.com/products/mgdm-500/	gaia-converter.com
Akquisition of Industrial Drive Technology Company	Siemens has signed an agreement to acquire the ind...	11823	Industry News	Akquisition of Industrial Drive Technology Company	Siemens has signed an agreement to acquire the industrial drive technology (IDT) business of ebm-papst. The business, which employs around 650 people, includes intelligent, integrated mechatronic systems in the protective extra-low voltage range and innovative motion control systems. These systems are used in free-range driverless transport systems. The transaction is to be completed by mid-2025, subject to the necessary foreign trade and merger control approvals. The IDT business of ebm-papst is located in St. Georgen, Germany and Lauf an der Pegnitz, Germany, as well as in Oradea, Romania.	21.03.2024 09:00:00	Mar	news_2024-04-01_4.jpg	\images\news_2024-04-01_4.jpg	https://press.siemens.com/global/en/pressrelease/siemens-acquire-industrial-drive-technology-business-ebm-papst	siemens.com
Potential for SiC Replacement: Patents for GaN-on-Si	5N+, a producer of specialty semiconductors and pe...	11843	Industry News	Potential for SiC Replacement: Patents for GaN-on-Si	5N+, a producer of specialty semiconductors and performance materials, announced that it is officially launching the commercialization rights for its portfolio of gallium nitride on silicon (GaN-on-Si) patents. These key patents can enable the rapid prototype development and first-to-market commercialization of vertical GaN-on-Si power devices by companies operating in the High-Power Electronics (HPE), Electric Vehicles (EV) and Artificial Intelligence (AI) server sectors. Today, lateral GaN is primarily used in low voltage (<400 V) applications, such as chargers, but vertical GaN-on-Si has the potential to replace SiC, which is the current preferred material for medium and high voltage applications (i.e. EV inverters operating 650 V). SiC is expensive and not easily available, whereas GaN-on-Si is more efficient and cost-effective. Recent academic demonstrations utilizing key 5N+ patents have shown that vertical GaN-on-Si, as opposed to lateral GaN transistors showing destructive breakdown, offers soft breakdown with avalanche capability for safe, compact and more efficient devices. The commercial rights of the 54 granted patents owned by 5N+ include mandatory use of large diameter thick silicon substrates (over 1 mm), combined with masking layers to filter the dislocations. Increasing the thickness of large diameter silicon substrates in vertical GaN-on-Si devices enables increased voltage capacity without increasing the chip size. Also included in this patent is the ability to remove the substrate to form the backside contacts once the GaN growth is complete.	21.03.2024 09:00:00	Mar	news_2024-04-15_4.jpg	\images\news_2024-04-15_4.jpg	https://www.5nplus.com/en/news/5n-patents-uniquely-positioned-to-expedite-first-t/	5nplus.com
Industrial AC/DC Power Supplies	TDK Corporation introduced its ZWS-C series of 10,...	11830	Product Release	Industrial AC/DC Power Supplies	TDK Corporation introduced its ZWS-C series of 10, 15, 30 and 50 W rated industrial AC/DC power supplies. The products meet EN55011/EN55032-B conducted and radiated EMI in either a Class I or Class II (double insulated) construction, without the need for external filtering or shielding. With electrolytic capacitor lifetimes of up to 15 years, the ZWS-C can be used in factory automation, robotics, semiconductor fabrication manufacturing and test and measurement equipment. Available output voltages are 5 V, 12 V, 15 V, 24 V as well as 48 V for the ZWS50-C model only. The ZWS10-C and the ZWS15-C models measure 63.5 x 45.7 x 22.1 mm<sup>3</sup> (L x W x H), the ZWS30-C 76.2 x 50.8 x 24.2mm<sup>3</sup>, and the ZWS50-C 76.2 x 50.8 x 26.7 mm<sup>3</sup>. The operating temperature with convection cooling and standard mounting is -10 oC to 70 oC derating linearly to 50% load above 50 to 70 oC. With an external airflow of 0.8 m/s, the power supplies can operate at full load. No load power consumption is typically less than 0.3 W. The power supplies have a 3 kVac input to output, 2 kVac input to ground and 750 Vac output to ground (Class I) isolation. All models are certified to the IEC/UL/CSA/EN62368-1 for AV, information and communication equipment standard and EN60335-1 for household electrical equipment.	21.03.2024 07:30:00	Mar	news_2024-04-01_11.jpg	\images\news_2024-04-01_11.jpg	https://www.emea.lambda.tdk.com/uk/news/article/19889	lambda.tdk.com
Paving the Way to use Diamonds in UWBG Semiconductors	Heraeus is making a multi-million-euro investment ...	11821	Industry News	Paving the Way to use Diamonds in UWBG Semiconductors	Heraeus is making a multi-million-euro investment in Compound Semiconductor (Xiamen) Technology Co. (CSMH), a China-headquartered material supplier of premium industrial diamond. This strategic partnership aims to drive innovations in the semiconductor industry by leveraging diamond's unique thermal conductivity and electrical insulation properties. Heraeus signed an investment agreement with CSMH, and the deal is expected to close in several weeks. As part of the agreement, Heraeus will hold a stake in the company and receive a seat on the board of directors. Single-crystal diamond is ultra-wideband gap (UWBG) semiconductor material with the highest known thermal conductivity, surpassing existing thermal solutions such as copper by several times. Typical silicon has a thermal conductivity around 140 W/(m-K), copper is about 400 W/(m-K), and diamond has a much higher thermal conductivity up to 2200 W/(m-K). This allows heat to be dissipated more efficiently, enabling high-performance components to endure with maximum efficiency. In addition to its superior heat dissipation properties, diamond also withstands extremely high voltages without causing an electric breakdown. This is critical for advancing miniaturization, efficiency, and robustness in power electronics. CSMH's core business includes the production of polycrystalline and large-sized monocrystalline diamonds, which are particularly important for high-end applications in the semiconductor industry.	20.03.2024 07:00:00	Mar	news_2024-04-01_2.jpg	\images\news_2024-04-01_2.jpg	https://www.heraeus-group.com/en/news-and-stories/investment-in-csmh/	heraeus-group.com
Conference on Topics around Electric Drives Production	The Electric Drives Production Conference (E\|DPC) ...	11826	Event News	Conference on Topics around Electric Drives Production	The Electric Drives Production Conference (E\|DPC) 2024 is a platform for the exchange of developers, researchers and users of electric drives. Now the call for papers is open to present the latest technical expertise in front of professionals from science and industry. The E\|DPC will take place as a hybrid event from November 26 to 27, 2024 at the marinaforum Regensburg and online. Key topics include electric machine design, power electronics and control methods, new materials and semi-finished products, magnet materials and processing, manufacturing technologies for soft magnetic materials, winding technologies, insulation technologies, assembly and handling technologies, electric drive production systems, production of electrical actuators, industry 4.0 applications in electric drives production, sustainability in product lifecycle, new applications for electric drives, electromobility, electric drive specific testing, accompanying economic research, additive manufacturing, energy transfer for electric vehicles and interconnecting technologies.	19.03.2024 12:00:00	Mar	news_2024-04-01_7.jpg	\images\news_2024-04-01_7.jpg	https://www.edpc.eu/call-for-papers	edpc.eu
GaN for Low-cost E-Bikes, Drones, and Robotics	EPC now offers the EPC9193, a 3-phase BLDC motor d...	11831	Product Release	GaN for Low-cost E-Bikes, Drones, and Robotics	EPC now offers the EPC9193, a 3-phase BLDC motor drive inverter using the EPC2619 eGaN FET. The EPC9193 operates with a input DC voltage ranging from 14 V and 65 V and has two configurations – a standard unit and a high current version: While the EPC9193 standard reference design uses a single FET for each switch position for delivering up to 30 Arms maximum output current, a high current configuration version of the reference design, the EPC9193HC, uses two paralleled FETs per switch position with the ability to deliver up to 60 A<sub>pk</sub> (42 A<sub>rms</sub>) maximum output current. Both versions of the EPC9193 contain all the necessary critical function circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The EPC9193 boards measure 130 mm x 100 mm (including connector). Major benefits of a GaN-based motor drive are exhibited with these reference design boards, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, and lower torque ripple for improved precision. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight. EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that reduce design cycle times.	19.03.2024 08:30:00	Mar	news_2024-04-01_12.jpg	\images\news_2024-04-01_12.jpg	https://epc-co.com/epc/about-epc/events-and-news/news/artmid/1627/articleid/3164/gan-for-low-cost-e-bikes-drones-and-robotics	epc-co.com
Trade Show in Kuala Lumpur, Malaysia: Doubling Participation	With the Southeast Asia semiconductor sector attra...	11822	Event News	Trade Show in Kuala Lumpur, Malaysia: Doubling Participation	With the Southeast Asia semiconductor sector attracting growing worldwide investments as more regions diversify their supply chains, the stage is set for SEMICON Southeast Asia 2024 as visionaries and experts gather May 28-30, 2024 at MITEC in Kuala Lumpur, Malaysia for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development. Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 will feature more than 500 exhibiting companies and more than 1,000 booths, doubling participation from last year's exhibition and conference. The exponential expansion underscores the rising interest in Southeast Asia's semiconductor sector and the increasing importance of SEMICON Southeast Asia, the region's premier global electronics manufacturing and supply chain event, in bringing industry stakeholders together to pursue new innovation and growth opportunities. For example, there will regional pavilions from semiconductor regions such as China, Europe, Malaysia, Netherlands, Korea, Singapore, Taiwan and Southeast Asia. Several forums will focus on market and industry trends, sustainability, chiplet and heterogeneous integration, advanced product testing and more. In industry gala night will enable the attendees to connect and to expand their business network.	19.03.2024 08:00:00	Mar	news_2024-04-01_3.jpg	\images\news_2024-04-01_3.jpg	https://www.semiconsea.org/	semiconsea.org
Primary LDO Family for Automotive Applications	ROHM has developed 45 V rated 500 mA output primar...	11837	Product Release	Primary LDO Family for Automotive Applications	ROHM has developed 45 V rated 500 mA output primary LDO regulators, the BD9xxM5-C series. These devices are suitable for supplying power to automotive electronic components such as ECUs that operate from vehicle batteries. The BD9xxM5-C incorporates original QuiCur™ high-speed load response technology that is stated to deliver excellent response characteristics to load current fluctuations. For example, the LDO can maintain output to within 100 mV of set voltage even as the load changes between 0 and 500 mA in 1 µs (Rise time/Fall time). Furthermore, low 9.5 µA (typ.) current consumption contributes to lower power consumption in automotive applications. These products will be available in four packages, ranging from the compact HTSOP-J8 to the high heat dissipation TO252 (TO252-3/TO252-5) and HRP5 types. This allows users to select the most suitable package for each use case. The BD9xxM5-C meets the basic requirements for automotive products, including 150 °C operation and qualification under the AEC-Q100 automotive reliability standard. The lineup will be expanded to comprise a total of 18 models, (including the TO252-3, TO252-5, and HRP5 packages) by FY2024.	14.03.2024 14:30:00	Mar	news_2024-04-01_18.jpg	\images\news_2024-04-01_18.jpg	https://www.rohm.com/news-detail?news-title=2024-03-14_news_ldo&defaultGroupId=false	rohm.com
Trade Show about EMC Components, Testing and Shielding	The EMV achieved an impressive response in Cologne...	11824	Event News	Trade Show about EMC Components, Testing and Shielding	The EMV achieved an impressive response in Cologne from March 12 - 14, 2024. The trade fair, accompanied by a scientific conference with workshops, featured 111 national and international exhibitors from 20 countries. Key players such as Rohde & Schwarz, Frankonia and EMC Test NRW as well as 21 companies, taking part in the EMV for the first time, were also present. More than 2,500 trade visitors – including the editorial team of Bodo's Power Systems – took the opportunity to find out about the industry's entire range of topics: from filters and filter components to EMC testing and shielding including its latest developments. A lively exchange of specialist knowledge was also high on the agenda in Cologne. Current trends this time around included EMC in electromobility, smart technologies, power electronics and the use of artificial intelligence in EMC. Parallel to the trade fair, the EMV Conference offered an extensive program with 49 conference lectures, 24 workshops and poster presentations held for the first time. The event demonstrated the growing importance of EMC in an increasingly networked world. In view of the growing number of potential sources of interference and even more complex systems, it has become clear that awareness of EMC issues is steadily rising. More than 700 conference bookings illustrated the high level of interest in the event. The next EMV event will take place from 25 - 27.3.2025 in Stuttgart.	14.03.2024 10:00:00	Mar	news_2024-04-01_5.jpg	\images\news_2024-04-01_5.jpg	https://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/finalreport24.html	emv.mesago.com
Oscilloscope Days Event	Rohde & Schwarz has announced that its Oscilloscop...	11808	Event News	Oscilloscope Days Event	Rohde & Schwarz has announced that its Oscilloscope Days educational event will return for two days, April 17 to 18, 2024. Experts from Rohde & Schwarz and partner companies will present the latest updates on fundamentals and test features for engineers using next-generation oscilloscopes, covering topics such as power electronics and EMC, as well as signal and power integrity. The Oscilloscope Days event will be hosted online over two days and will deliver insights into the accurate measurement of digital signals and power electronics for purposes including product design, development, debugging and compliance testing. Rohde & Schwarz application engineers, together with experts from long-time event partners Würth Elektronik and PE-Systems, will present measurement challenges and techniques. There will be eight online sessions of up to 30 minutes each over the two mornings, with time for questions and answers after each session. Each session will be presented in English and will include cases based on real applications. Registrants can select the sessions they wish to attend.	13.03.2024 12:00:00	Mar	news_2024-03-15_8.jpg	\images\news_2024-03-15_8.jpg	https://www.rohde-schwarz.com/de/unternehmen/news-und-presse/all-news/rohde-schwarz-hosts-next-edition-of-popular-oscilloscope-days-event-in-april-2024-pressemitteilungen-detailseite_229356-1476672.html	rohde-schwarz.com
200 V MOSFETs stated to set a new Industry Benchmark	Infineon claims that motor drive applications are ...	11833	Product Release	200 V MOSFETs stated to set a new Industry Benchmark	Infineon claims that motor drive applications are taking a leap forward with the launch of the company's OptiMOS™ 6 200 V MOSFET product family. The new portfolio is designed to deliver high performance in applications such as e-scooters, micro-EVs, and E-forklifts. The improved conduction losses and switching behavior for these MOSFETs reduce the electromagnetic interference (EMI) and switching losses e. g. in applications like servers, telecom, energy storage systems, audio and solar. Additionally, the combination of a wide safe operating area (SOA) and "industry-leading R <sub>DSon</sub>" fits to static switching applications such as battery management systems. With the introduction of the OptiMOS 6 200 V product family, Infineon claims to set "a new industry benchmark with increased power density, efficiency, and system reliability". Compared to its predecessor, OptiMOS 3, OptiMOS 6 200 V features a 42 percent lower R <sub>DSon</sub> and a diode behaviour softness, which is more than three times that of the OptiMOS 3. Combined with up to 89 percent reduction in Q <sub>RRtyp</sub>, the switching and EMI behaviors are significantly improved. The technology also features improvements in parasitic capacitance linearity (C <sub>oss</sub> and C <sub>rss</sub>), which reduces oscillation during switching and lowers voltage overshoot. A tighter V <sub>GSth</sub> spread and lower transconductance aid in MOSFET paralleling and current sharing, leading to more uniform temperatures and reducing the number of paralleled MOSFETs.	13.03.2024 10:30:00	Mar	news_2024-04-01_14.jpg	\images\news_2024-04-01_14.jpg	https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202403-076.html	infineon.com
German Company founds US Subsidiary in Detroit Metro Area	CustomCells opens its first international location...	11845	Industry News	German Company founds US Subsidiary in Detroit Metro Area	CustomCells opens its first international location: The German company has founded a U.S.-based subsidiary with its own office in the innovation and manufacturing metropolis of Detroit, Michigan. The location will initially serve as a central hub for coordinating the company's activities in the North American market to respond to local customer inquiries even faster. The establishment of an innovation and R&D center will follow. Plans for a future production facility on site are already being discussed. In addition to high-performance battery cells for the premium segment in the automotive and motorsport industries, CustomCells also offers solutions for e-motorcycles, electrified aviation, and applications on and underwater. The development and production of round cells play a key role, which is a topic for the future of many mobility industries.	12.03.2024 11:00:00	Mar	news_2024-04-15_6.jpg	\images\news_2024-04-15_6.jpg	https://customcells.com/customcells-founds-u-s-subsidiary-with-detroit-site/	customcells.com
Resettable Thermal Cutoff Devices	Bourns announced some miniature resettable thermal...	11829	Product Release	Resettable Thermal Cutoff Devices	Bourns announced some miniature resettable thermal cutoff (TCO) device series, also known as mini-breakers, that are designed to control abnormal, excessive current virtually instantaneously, up to rated limits. The Model NX Series offers higher current-carrying capabilities combined with a very low-profile package at a height of 0.94 mm and body width of 2.8 mm. These features make this series an ideal overtemperature and overcurrent protection solution for lithium polymer and prismatic cells in high energy density, smaller batteries such as next-generation notebook PC and tablet battery cells, as well as handheld and wearable electronics. With the same footprint as the company's model NR series the model NX series can carry 40 percent more current. The new Model NX Series has current capabilities from 12 A to 20 A at 60 °C and is available with or without welding projections. These TCO devices are available with four trip temperature options of 77 °C, 82 °C, 85 °C and 90 °C - all of which operate within a ±5 °C tolerance. The Model NX Series also is designed with a high-rated corrosion resistant bimetal mechanism that delivers enhanced endurance in humid environments compared to standard TCO devices.	12.03.2024 06:30:00	Mar	news_2024-04-01_10.jpg	\images\news_2024-04-01_10.jpg	https://www.bourns.com/news/press-releases/pr/2024/03/12/bourns'-latest-miniature-resettable-thermal-cutoff-(tco)-devices-feature-higher-current-carrying-capabilities-to-protect-today's-high-energy-density-batteries	bourns.com
Automotive-grade Super-Junction MOSFETs	Automotive-grade 600 V/650 V super-junction MOSFET...	11838	Product Release	Automotive-grade Super-Junction MOSFETs	Automotive-grade 600 V/650 V super-junction MOSFETs in STPOWER MDmesh DM9 AG series are claimed to deliver superior efficiency and ruggedness for on-board chargers (OBCs) and DC/DC converter applications in both hard- and soft-switching topologies. Compared to the previous generation, the latest MDmesh DM9 technology ensures a tighter gate-source threshold voltage (V<sub>GSth</sub>) spread that results in sharper switching for lower turn-on and turn-off losses. In addition, body-diode reverse recovery is improved, leveraging a new optimized process that also increases the MOSFETs' overall ruggedness. The diode's low reverse-recovery charge (Q<sub>rr</sub>) and fast recovery time (t<sub>rr</sub>) make the MDmesh DM9 AG series well-suited for phase-shift zero-voltage switching topologies that demanding high efficiency. The first device in the STPOWER MDmesh DM9 AG series from STMicroelectronics is the STH60N099DM9-2AG, a 27A AEC-Q101 qualified N-channel 600 V device in H2PAK-2, with 76 mΩ typical R<sub>DSon</sub>. ST will expand the family to provide a full range of devices, covering a broad range of current ratings and R<sub>DSon</sub> from 23 mΩ to 150 mΩ.	11.03.2024 15:30:00	Mar	news_2024-04-01_19.jpg	\images\news_2024-04-01_19.jpg	https://newsroom.st.com/media-center/press-item.html/n4613.html	st.com
Supercapacitors with 3 Cells	Knowles Precision Devices announced Electric Doubl...	11863	Product Release	Supercapacitors with 3 Cells	Knowles Precision Devices announced Electric Double Layer Capacitor (EDLC), or supercapacitor, modules using a three-cell package for higher operating voltages and printed circuit board space savings. Their large capacity makes it possible to support brief power interruptions, supplement batteries, or even to be used in place of batteries in several applications. These supercapacitors are suited for applications including solar and wind energy harvesting, mechanical actuators, AGV (Automated Guided Vehicles), EV transportation power, smart utility meters, IoT, pulse battery pack alternatives, memory backup, battery/capacitor hybrids, UPS systems, emergency lighting, LED power, solar lighting or anywhere that significant energy storage is needed. The supercapacitors offer a notable jump in voltage rating over typical radial-mount supercapacitors, up to 9.0 WVDC. A key feature of the DGH and DSF Series additions is the unique three-cell radial-leaded package. Both series include capacitance values from 0.33 to 5 Farads. Multiple devices can be banked for even higher capacitance or voltage. In addition, these supercapacitors perform their internal cell balancing with operating temperature ranges from -40 °C to +65 °C for DGH 8.1V/DSF 9.0V and -40 °C to +85 °C for DGH 6.9V/DSF 7.5V. They are designed to withstand over 500,000 charge/discharge cycles.	11.03.2024 15:30:00	Mar	news_2024-04-15_24.jpg	\images\news_2024-04-15_24.jpg	https://www.cde.com/news/2024/3/supercaps/	cde.com
Generators and Multimeters added to portable Instrument Family	Rigol Technologies is expanding its family of port...	11860	Product Release	Generators and Multimeters added to portable Instrument Family	Rigol Technologies is expanding its family of portable instruments with the introduction of the DG800 Pro and DG900 Pro Series Function / Arbitrary Waveform Generators, along with the DM858 Series Digital Multimeters. The DG800 Pro and DG900 Pro Series Function/Arbitrary Waveform Generators include the capabilities of noise generator, pulse generator, harmonic generator, analog/digital modulator, and frequency counter. They deliver up to 200 MHz maximum output frequency, 1.25 GSa/s sample rate, 16-bit vertical resolution, and 3 ns rise time in a chassis with a 7 inch color touch display. The DM858 Series is a benchtop 5.5 digit DMM with 7 inch color touch display. It provides 11 measurement functions and offers trend chart, histogram, and bar table visual display options, while providing competitive specifications, including 125 rdgs/s measurement speed and 500,000 points memory logging. Each unit is designed to comply with VESA 100x100 mounting, allowing the use of stands or movable arm mounts. The instruments include a Type-C interface, so the combination of their light weight (less than four pounds) and commercially available power banks make for an easy shift from the lab to the field.	11.03.2024 12:30:00	Mar	news_2024-04-15_21.jpg	\images\news_2024-04-15_21.jpg	https://www.rigolna.com/news/2024/8854/	rigolna.com
GaN and SiC Technologies to Enable Next-Gen AI Power Delivery	Navitas Semiconductor has announced their AI data ...	11809	Product Release	GaN and SiC Technologies to Enable Next-Gen AI Power Delivery	Navitas Semiconductor has announced their AI data center technology roadmap for up to 3x power increase to support similar exponential growth in AI power demands expected in just the next 12-18 months. To meet this exponential power increase, Navitas is developing server power platforms which rapidly increase from 3kW to up to 10kW. In August 2023, Navitas introduced a 3.2kW data center power platform utilizing latest GaN technology enabling over 1638.7W/cm3 and over 96.5% efficiency. Now, Navitas is releasing a 4.5kW platform enabled by a combination of GaN and SiC to push densities over 2131.1W/cm<sup>3</sup> and efficiencies over 97%. Navitas also announces its plans to introduce an 8-10kW power platform by the end of 2024 to support 2025 AI power requirements. The platform will utilize newer GaN and SiC technologies and further advances in architecture to set all-new industry standards in power density, efficiency and time-to-market. Navitas is already engaged with major data-center customers, with full platform launch anticipated in Q4 ’24, completing this 3x increase in power demands in only 12-18 months.	11.03.2024 06:30:00	Mar	news_2024-03-15_9.jpg	\images\news_2024-03-15_9.jpg	https://navitassemi.com/navitas-gan-and-sic-technologies-to-enable-next-gen-ai-power-delivery/	navitassemi.com
1200-V IGBTs on 300 mm Wafers	Hitachi Energy increases its power semiconductor c...	11802	Industry News	1200-V IGBTs on 300 mm Wafers	Hitachi Energy increases its power semiconductor capacity by introducing the 300 mm wafer. The development enables more complex structures in 1200 V insulated gate bipolar transistors. Applications for IGBT include variable frequency drives (VFD), uninterruptible power supply (UPS) systems, electric cars, trains and air conditioners, among others. The larger wafer offers numerous benefits, including the potential to yield over double (2.4 times) the number of functioning integrated circuits per wafer as compared to the existing 200 mm wafer, leading to significant cost savings. It utilizes the latest fine pattern trench IGBT design, resulting in energy-efficient power conversion and control and minimizing power losses during operations. Semiconductor experts at Hitachi Energy achieved this milestone through close collaboration with a cross-functional team, including Product Management, Business Development, Research & Development, and a chip foundry partner.	06.03.2024 07:00:00	Mar	news_2024-03-15_2.jpg	\images\news_2024-03-15_2.jpg	https://www.hitachienergy.com/news/features/2024/03/hitachi-energy-advances-its-semiconductor-technology-with-first-300-mm-wafer-for-igbt	hitachienergy.com
Silicon Carbide Technology drives Decarbonization	The Infineon CoolSiC™ MOSFET 650 V and 1200 ...	11813	Product Release	Silicon Carbide Technology drives Decarbonization	The Infineon CoolSiC™ MOSFET 650 V and 1200 V Generation 2 improve MOSFET key performance figures such as stored energies and charges by up to 20 percent compared to the previous generation without compromising quality and reliability levels leading to higher overall energy efficiency and further contributing to decarbonization. CoolSiC MOSFET Generation 2 (G2) technology continues to leverage performance capabilities of silicon carbide by enabling lower energy loss that turns into higher efficiency during power conversion. This provides strong benefits to customers for various power semiconductor applications such as photovoltaics, energy storage, DC EV charging, motor drives and industrial power supplies. A DC fast charging station for electric vehicles which is equipped with CoolSiC G2 allows for up to 10 percent less power loss compared to previous generations, while enabling higher charging capacity without compromising form factors. Traction inverters based on CoolSiC G2 devices can further increase electric vehicle ranges. In the area of renewable energies, solar inverters designed with CoolSiC G2 make smaller sizes possible while maintaining a high power output, resulting in a lower cost per watt.	05.03.2024 10:30:00	Mar	news_2024-03-15_13.jpg	\images\news_2024-03-15_13.jpg	https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFGIP202403-073.html	infineon.com
Energy Harvesting Workshop in Italy	A Workshop named EnerHarv 2024 is said “to bring t...	11803	Event News	Energy Harvesting Workshop in Italy	A Workshop named EnerHarv 2024 is said “to bring together experts from around the world working on all technical areas relevant to energy harvesting, power management and its IoT applications”. This non-profit workshop, organized and sponsored by the Power Sources Manufacturers Association (PSMA), will be held in Perugia, Italy from June 26 to 28, 2024. The event will be hosted by the Noise in Physical Systems (NiPS Lab), Dept. of Physics & Geology of the University of Perugia (UNIPG). EnerHarv’s vision is “to create a focal point for experts and users of energy harvesting and related technologies to share knowledge, best practices, roadmaps, experiences and provide opportunities for collaboration to increase the uptake of such technologies”. The workshop is targeted at a broad audience from industry and academia working on materials and devices for energy harvesting and storage, low-power sensors and circuits, micro power management, and their applications in powering IoT devices for health and environmental monitoring, assisted living, and monitoring of equipment and buildings. It will comprise presentations (by invitation only), demos, poster, panels sessions and time for networking activities. There is an open call for demonstrations and posters.	05.03.2024 08:00:00	Mar	news_2024-03-15_3.jpg	\images\news_2024-03-15_3.jpg	https://www.enerharv.com/	enerharv.com
Going for Mass Production: Funding Round to Support Growth for GaN Solutions	Wise-integration, a French company active in digit...	11807	Industry News	Going for Mass Production: Funding Round to Support Growth for GaN Solutions	Wise-integration, a French company active in digital control of gallium nitride and GaN ICs for power supplies, has secure financing of 15 million Euros. The Series B round was led by imec.xpand with participation from other investors. The round will fuel mass production and commercial deployment of the company’s flagship products, WiseGan and WiseWare, its “disruptive digital-control technology”, and its support for clients globally as they adopt these solutions. It included the five investors from the previous funding and three new investors. Since its launch in 2020, the fabless company has been known as an innovator in the power electronics industry, building a portfolio of more than 10 patent families. WiseGan encompasses GaN power integrated circuits designed to maximize the benefits of GaN technology. WiseWare is a 32-bit, MCU- based, AC/DC digital controller optimized for GaN-based power supply architectures, which is said to offer simplified system design, a lower bill of materials and improved power density and efficiency. This combination enables the development of technologies facilitating chargers that are up to 3x smaller, 3x more efficient, and 3x lighter, catering to power requirements from 30 W to 7 kW. The company’s target markets include consumer electronics to industrial applications to electric vehicles.	01.03.2024 12:00:00	Mar	news_2024-03-15_7.jpg	\images\news_2024-03-15_7.jpg	https://wise-integration.com/wise-integration-raises-e15-million-in-series-b-funding-round-to-support-international-growth-for-its-innovative-gan-solutions/	wise-integration.com
PoE ASFETs and EMC-optimized MOSFETs	Nexperia announced the release of several MOSFETs ...	11814	Product Release	PoE ASFETs and EMC-optimized MOSFETs	Nexperia announced the release of several MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance. PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in <sub>RDS(on)</sub>. These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example. EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower R<sub>DS(on)</sub> (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimized its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.	27.02.2024 11:30:00	Feb	news_2024-03-15_14.jpg	\images\news_2024-03-15_14.jpg	https://www.nexperia.com/about/news-events/press-releases/Nexperia-broadens-its-range-of-discrete-FET-solutions-at-APEC-2024	nexperia.com
Collaboration to Accelerate Automotive Electrification	Arrow Electronics and its engineering services com...	11806	Industry News	Collaboration to Accelerate Automotive Electrification	Arrow Electronics and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of electric vehicle (EV) chargers. Development of EV chargers, especially DC “fast chargers,” is becoming increasingly challenging to equipment manufacturers due to several factors, such as lack of prior experience, stringent functional safety and reliability requirements, and a fledgling support network. The collaboration between Arrow and Infineon aims to help innovators navigate these challenges while accelerating time-to-market. As part of the collaboration, Arrow’s High Power Center of Excellence has developed a 30 kW DC fast charger reference platform. This includes Infineon’s 1200V CoolSiC easy power modules and also hardware design, embedded firmware, bi-directional charging support and energy metering functionality.	26.02.2024 11:00:00	Feb	news_2024-03-15_6.jpg	\images\news_2024-03-15_6.jpg	https://news.fiveyearsout.com/news-releases/news-details/2024/Arrow-Electronics-and-Infineon-Collaborate-to-Accelerate-Automotive-Electrification/default.aspx	fiveyearsout.com
Joint Solution for BLDC Motors	AmberSemi and ST Microelectronics have jointly dev...	11804	Industry News	Joint Solution for BLDC Motors	AmberSemi and ST Microelectronics have jointly developed a reference design for brushless motors by using AmberSemi’s AC Direct DC Enabler Power Conversion Technology and ST’s STM32 MCU devices. The reference design takes a direct AC input through AmberSemi’s patented AC Direct DC Enabler technology and powers the ST microcontroller, gate drivers and Hall sensors for brushless motor applications. Compared to typical brushless DC motor-control design, AmberSemi’s off-line solution provides up to 5 W of regulated output, which is enough to drive today's requirement of control logic and sensors, with additional headroom for expanded intelligent functionality. The Enabler offers selectable output voltages determined by internal, configurable register settings or with a simple external voltage-divider feedback circuit. Through the integrated SPI communication port and coupled with an SPI-equipped MCU the designer can set alarm bits, protection thresholds, monitor status bits for over-current, over/under voltage, over-temperature and interrupt signals on the Enabler.	26.02.2024 09:00:00	Feb	news_2024-03-15_4.jpg	\images\news_2024-03-15_4.jpg	https://ambersi.com/ambersemi-showcases-its-power-products-with-st-embedded-solutions/	ambersi.com
IGBT based Intelligent Power Modules	onsemi announced the availability of its 1200V SPM...	11810	Product Release	IGBT based Intelligent Power Modules	onsemi announced the availability of its 1200V SPM31 Intelligent Power Modules (IPMs) featuring the latest generation Field Stop 7 (FS7) Insulated Gate Bipolar Transistor (IGBT) technology. The SPM31 IPMs deliver higher efficiency, smaller footprint and higher power density resulting in lower total system cost. Given the greater efficiency realized using optimized IGBTs, these IPMs are ideal for three-phase inverter drive applications such as heat pumps, commercial HVAC systems, servo motors, and industrial pumps and fans. The SPM31 IPMs control the power flow to the inverter compressor and fans in heat pumps and air conditioning systems by adjusting the frequency and voltage of the power supplied to three-phase motors for maximum efficiency. For example, onsemi’s 25A-rated SPM31 using FS7 IGBT technology can decrease power losses by up to 10% and increase in power density up to 9%, compared to our previous generation products. With the transition to electrification and heightened efficiency mandates, these modules help manufacturers drastically improve system design while increasing efficiency in heating and cooling applications. With the improved performance, our SPM31 IPM family featuring FS7 enables high efficiency with reduced energy losses, further reducing harmful emissions globally.	26.02.2024 07:30:00	Feb	news_2024-03-15_10.jpg	\images\news_2024-03-15_10.jpg	https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-introduces-7th-gen-igbt-based-intelligent-power-modules-to-reduce-energy-consumption-in-heating-and-cooling	onsemi.com
Series of Supercapacitor Modules	With the Supercapacitor modules of the SCM series ...	11819	Product Release	Series of Supercapacitor Modules	With the Supercapacitor modules of the SCM series from KYOCERA AVX, Rutronik offers robust components for industrial applications that require high peak performance. The SCM series is suitable for high-current or industrial applications, including renewable energy generation, grid-connected storage, or the buffering of power peaks. Thanks to active balancing, the capacitor modules have a stable voltage level in the individual cells installed in the module. They operate individually or in combination with batteries or accumulators. Either they supply energy as a backup or support providing power peaks together with batteries or accumulators. In this case, they often have a positive effect on the service life of the battery or accumulator. Due to the convincing characteristics of the individual capacitors used, the SCM modules achieve their special pulse load capacity. The combination of very high capacitance and very low internal resistance (ESR) enables a high power density and high efficiency. The modules are also characterized by a high mechanical load capacity and can withstand high currents, frequent charging and discharging cycles, and strong vibrations. They are designed for operating temperatures from -40 °C to +65 °C and can handle several million cycles, depending on the application. In addition, the modules are lead-free, RoHS-compliant, and meet the UL 810A standard.	22.02.2024 16:30:00	Feb	news_2024-03-15_19.jpg	\images\news_2024-03-15_19.jpg	https://www.rutronik24.com/kyocera-avx.html	rutronik24.com
Additional Manufacturing Capacity for wBMS Semiconductors	Analog Devices (ADI) has made a special arrangemen...	11801	Industry News	Additional Manufacturing Capacity for wBMS Semiconductors	Analog Devices (ADI) has made a special arrangement with TSMC to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL) applications.	22.02.2024 14:00:00	Feb	news_2024-03-01_9.jpg	\images\news_2024-03-01_9.jpg	https://www.analog.com/en/newsroom/press-releases/2024/2-22-2024-adi-strengthens-capacity-resiliency-through-expanded-partnership-tsmc.html	analog.com
PWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single Chip	Silanna Semiconductor has expanded its CO<sub>2</s...	11816	Product Release	PWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single Chip	Silanna Semiconductor has expanded its CO<sub>2</sub> Smart Power Family™ of AC/DC and DC/DC converter technologies with the launch of an active clamp flyback (ACF) controller that integrates adaptive digital PWM control with ultra-high-voltage (UHV) components comprising a 700 V primary GaN FET, X capacitor (X-Cap) discharge circuit, active clamp driver and start-up regulator. Silanna’s CO<sub>2</sub> Smart Power technologies help engineers by simplifying design and improving performance while addressing environmental sustainability goals through more efficient energy use. Well-suited for high-efficiency and high-power-density power supplies, USB-PD/QC AC/DC power adapters and battery charging applications, the SZ1200 integrated ACF controller combines the ease of design of a simple flyback controller with all the benefits of ACF. These include recycling of the leakage inductance energy of the flyback transformer and limiting primary FET drain voltage spikes during turn-off events. Delivering above 93% efficiency at low line, the SZ1200 offers consistent efficiency across the universal input voltage range (90 - 265 Vac) and various loading conditions of up to 150W single-port and multi-port USB-PD applications. Silanna’s OptiMode™ digital control architecture adjusts operation mode on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation and other key power supply parameters as line voltage and load vary. Very low no-load power consumption for the most stringent USB-PD applications further minimizes energy use during system stand-by.	22.02.2024 13:30:00	Feb	news_2024-03-15_16.jpg	\images\news_2024-03-15_16.jpg	https://powerdensity.com/2024/02/22/silanna-semiconductor-takes-acf-integration-to-the-next-level-with-their-new-sz1200/	powerdensity.com
Start-Ups present Energy and Mobility Solutions	In order to demonstrate the impact of start-ups, T...	11805	Event News	Start-Ups present Energy and Mobility Solutions	In order to demonstrate the impact of start-ups, The smarter E Europe, Europe’s largest alliance of exhibitions for the energy industry, provides them a platform of their own: the start-up area. In hall C5, across 2,500 square meters, around 150 start-ups will have the opportunity to present their pioneering energy and mobility solutions to a wide expert audience, and to connect with established companies. The smarter E Europe and its four exhibitions (Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe) will take place from June 19–21, 2024, at the Messe München fairgrounds. More than 2,800 exhibitors and over 115,000 visitors from all around the world are expected to attend. The event will take place across 19 exhibition halls and an outdoor exhibition area.	22.02.2024 10:00:00	Feb	news_2024-03-15_5.jpg	\images\news_2024-03-15_5.jpg	https://www.thesmartere.de/press-release/start-ups-at-tse-2024?lang=en	thesmartere.de
Two Backend Fabs sold – one in the Philippines, one in Korea	Infineon Technologies will sell two backend manufa...	11785	Industry News	Two Backend Fabs sold – one in the Philippines, one in Korea	Infineon Technologies will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE Technology, a provider of independent semiconductor manufacturing services in assembly and test. The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments. Infineon Technologies Power Semitech is a backend manufacturing site with around 300 employees. The fab is located in Cheonan, South Korea, about 60 miles south of Seoul. Infineon Technologies Cavite, is a backend manufacturing site with more than 900 employees. It is located in one of the fastest growing and most industrialized provinces in the Philippines. The transaction is expected to close towards the end of the second calendar quarter of 2024, when all pending closing conditions will have been fulfilled.	22.02.2024 08:00:00	Feb	news_2024-03-01_3.jpg	\images\news_2024-03-01_3.jpg	https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202402-061.html	infineon.com
Factory in Monterrey to open this Year	Rogers Corporation announced that it has signed a ...	11842	Industry News	Factory in Monterrey to open this Year	Rogers Corporation announced that it has signed a lease on a factory in Monterrey, Mexico for advanced busbar manufacturing and engineering services. The first phase of the new site is slated for completion in late 2024 and continues Rogers' manufacturing footprint strategy of supporting customers in the regions where they operate. Rogers' Rolinx busbars provide power distribution in a variety of applications in the electric and hybrid-electric vehicle (EV/HEV), renewable energy, mass transit and industrial markets. "We are excited to expand our presence in North America to better support our global customers and the growing EV/HEV and renewable energy markets in this region. Our new factory in Monterrey will enable us to better support our customers with deeper technical collaboration, and local prototyping and supply capabilities that reduce lead times and improve service levels," said Jeff Tsao, Advanced Electronics Solutions (AES) Senior Vice President and General Manager.	22.02.2024 08:00:00	Feb	news_2024-04-15_3.jpg	\images\news_2024-04-15_3.jpg	https://www.rogerscorp.com/news/2024/rogers-corporation-announces-new-factory-in-monterrey-mexico	rogerscorp.com
Magnetically Shielded Flat Wire Power Inductors	Sumida introduced two series of AEC-Q200 qualified...	11817	Product Release	Magnetically Shielded Flat Wire Power Inductors	Sumida introduced two series of AEC-Q200 qualified power inductors, the DPQ3535/T150 and DPQ5050/T150. These inductors are magnetically shielded and have a pin-type base for surface mounting on printed circuit boards. High surface area flat-wire windings minimize internal resistance at high frequencies and allow space savings and higher current ratings. The DPQ3535/T150 series offers a range of inductance values from 3.3 µH to 22 µH. Maximum saturation current ranges from 28 to 152 amps at 150°C. The larger DPQ5050/T150 is of similar design, with an inductance value of 10 µH and a saturation current of 112 amps at 20 °C. The absolute maximum voltage across the inductor is 500Vdc for each. Operating temperature is -40 °C to +150 °C (including the device’s self-temperature rise). The flat-wire inductor is encased in ferrite and mounted on an insulating base. Circuit connectivity is by two robust flat, tinned copper pins. Two additional pins provide additional mounting stability. Size for the DPQ3535/T150 is (HWD) 33x38.7x38.2 mm. The DPQ5050/T150 measures 44x53.5x53.3 mm. Applications include use as a buck/boost inductor for Onboard Chargers (OBC) in electric vehicles (xEV), DC-DC converters, point-of-load converters, LED drivers, class D audio amplifiers, and other general high-performance power applications.	21.02.2024 14:30:00	Feb	news_2024-03-15_17.jpg	\images\news_2024-03-15_17.jpg	https://products.sumida.com/ProductsInfo/ProductGuide/PowerInductors/	sumida.com
The Battery Show Europe	The Battery Show Europe and Electric & Hybrid Vehi...	11783	Event News	The Battery Show Europe	The Battery Show Europe and Electric & Hybrid Vehicle Technology Expo return to the Messe Stuttgart, Germany on 18-20 June, 2024. Bringing together 19,000 + engineers, executives, managers, R&D experts, manufacturing professionals, quality control experts, buyers, thought leaders and professionals from across the advanced battery and H/EV supply chain, this is an event that you can't miss! Explore 800+ advanced battery and EV manufacturing suppliers representing the entire supply chain from raw materials through end of life, featuring some stellar industry names such as Donaldson Filtration Solutions, Keyence, Siemens and Lyric Germany. Expand new ideas on increasing efficiencies and lowering costs at The Battery Show Europe Conference and Open Tech Forum. With 37+ hours of educational content, exploring the latest hot topics such as next-gen materials, advances in battery tech and sustainability, recycling and end of life options, this is the place to place to broaden your understanding of the advanced battery and H/EV industry. That's not all, we're also giving you the opportunity to learn about the latest market innovations and cutting-edge solutions during live product showcases from top-industry suppliers on the expo floor, as well as the chance to network with thousands of industry peers and form new relationships over drinks and light bites at our free-to-attend hosted networking receptions. Register today to attend the leading advanced battery and H/EV technology tradeshow and conference in Europe!	21.02.2024 06:00:00	Feb	news_2024-03-01_1.png	\images\news_2024-03-01_1.png	https://register.thebatteryshow.eu/10igTW	thebatteryshow.eu
Higher Power Density with 100 V GaN Power Stages	Texas Instruments introduced two power conversion ...	11799	Product Release	Higher Power Density with 100 V GaN Power Stages	Texas Instruments introduced two power conversion device portfolios to help engineers achieve more power in smaller spaces. According to TI these devices are "providing the highest power density at a lower cost". TI's 100 V integrated GaN power stages, LMG2100R044 and LMG3100R017, feature thermally enhanced dual-side cooled package technology to simplify thermal designs and "achieve the highest power density in mid-voltage applications at more than 1.5 kW/in<sup>3</sup>", which equals about 91,5 W/cm<sup>3</sup>. TI claims that its 1.5 W isolated DC/DC modules with integrated transformers are "the industry's smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by over 89 %". The devices allow designers to accomplish a system efficiency of 98% or higher given the lower output capacitance and lower gate-drive losses. A key enabler of the thermal performance in the 100 V GaN portfolio is the thermally enhanced dual-side cooled package. There is also an automotive-qualified solution available in this small package.	20.02.2024 13:30:00	Feb	news_2024-03-01_18.jpg	\images\news_2024-03-01_18.jpg	https://news.ti.com/2024-02-20-New-portfolios-from-TI-push-the-limits-of-power-design-further,-help-engineers-achieve-industry-leading-power-density	ti.com
Seminars about Sensor and Measurement Topics	The AMA Association for Sensors and Measurement (A...	11790	Event News	Seminars about Sensor and Measurement Topics	The AMA Association for Sensors and Measurement (AMA) has published its seminar program for 2024, which includes a variety of seminars in German language on various topics, including ultrasonic measurement technology, optical spectroscopy, displacement measurement, industrial image processing and the discussion on "Chat-GPT - hype or hysteria". The seminars are offered online or as face-to-face events and are under scientific direction. They offer in-depth knowledge about sensors, sensor systems, their functions and possible applications. Participants are given the opportunity to choose the right sensors for their application and evaluate their advantages and disadvantages. The seminars are said to offer deep insights into specialist topics in sensor and measurement technology. The AMA seminars aim to provide participants with manufacturer-independent knowledge and to inform them about the current state of sensor and measurement technology. They are aimed at experts from the fields of design/development, research, production and sales.	20.02.2024 13:00:00	Feb	news_2024-03-01_8.jpg	\images\news_2024-03-01_8.jpg	https://www.ama-sensorik.de/presse/ama-pressemitteilungen-2024/	ama-sensorik.de
Battery Exhibition and Conference	The cooperation between ees Europe, an exhibition ...	11787	Event News	Battery Exhibition and Conference	The cooperation between ees Europe, an exhibition for batteries and energy storage systems and InterBattery, a battery exhibition in South Korea, enters its second round this year. The InterBattery Europe Showcase will once again provide visitors of ees Europe with an additional exhibition area where they can network with companies from South Korea. The Battery Day Europe conference complements the presentations in the exhibition area. This year, the conference will provide comprehensive insights into the world of EV batteries, covering everything from the latest legislation, how to secure battery materials as well as groundbreaking technologies and business trends. Special attention will be given to the German-Korean cooperation in the ReLioS network for innovative approaches to battery recycling. The conference will also shine a light on EV battery production technologies. ees Europe takes place from June 19–21, 2024 as part of The smarter E Europe, Europe's largest alliance of exhibitions for the energy industry, at Messe München in Munich. More than 115,000 visitors from all over the world and over 2,800 exhibitors – more than 1,000 of whom are battery and energy storage system suppliers – are expected to attend. The InterBattery Europe Showcase exhibition area is expected to host around 200 companies – including companies such as Samsung SDI, LG Energy Solution and SK On. Last year, this additional exhibition space presented 72 companies, 62 of which were South Korean.	20.02.2024 10:00:00	Feb	news_2024-03-01_5.jpg	\images\news_2024-03-01_5.jpg	https://www.ees-europe.com/press-release/interbattery-showcase-2024?ref=m646dffd6bfeb497a66427d25-t1709163862-cee539bea	ees-europe.com
Power Converters run on Vibrational Energy	University of California San Diego and CEA-Leti (l...	11786	Industry News	Power Converters run on Vibrational Energy	University of California San Diego and CEA-Leti (located in Grenoble/France) scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density. This power topology, which extends beyond existing topologies, blends the advantages of piezoelectric converters with capacitive-based DC/DC converters. The power converters developed by the team are much smaller than the huge, bulky inductors currently used for this role. The devices could eventually be used for any type of DC/DC conversation, in everything from smart phones, to computers, to server farms and AR/VR headsets. The results were presented in the paper, "An Integrated Dual-side Series/Parallel Piezoelectric Resonator-based 20-to-2.2V DC/DC Converter Achieving a 310% Loss Reduction", at ISSCC 2024. The paper explains that a hybrid DSPPR converter exploits integrated circuits' ability to offer sophisticated power stages in a small area compared to discrete designs, and enables efficient device operation at voltage conversion ratios (VCR) of less than 0.1.	20.02.2024 09:00:00	Feb	news_2024-03-01_4.jpg	\images\news_2024-03-01_4.jpg	https://www.leti-cea.com/cea-tech/leti/english/Pages/What's-On/Press%20release/ISSCC-2024-papers.aspx	leti-cea.com
Plug-and-Play Gate Driver for High-Voltage SiC Power Modules	To help developers implement SiC solutions and fas...	11793	Product Release	Plug-and-Play Gate Driver for High-Voltage SiC Power Modules	To help developers implement SiC solutions and fast-track the development process, Microchip Technology has developed the 3.3 kV XIFM plug-and-play mSiC gate driver with patented Augmented Switching technology, which is designed to work out-of-the-box with preconfigured module settings. To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution. The XIFM digital gate driver is a compact solution that features digital control, an integrated power supply and a robust fiber-optic interface that improves noise immunity. This gate driver has preconfigured "turn-on/off" gate drive profiles that are tailored to optimize module performance. It incorporates 10.2 kV primary-to-secondary reinforced isolation with built-in monitoring and protection functions including temperature and DC link monitoring, Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO), short-circuit/overcurrent protection (DESAT) and Negative Temperature Coefficient (NTC). This gate driver also complies with EN 50155, a key specification for railway applications.	20.02.2024 07:30:00	Feb	news_2024-03-01_12.jpg	\images\news_2024-03-01_12.jpg	https://www.microchip.com/en-us/about/news-releases/products/microchip-expands-msic-solutions-with-3-3-kv-xifm-gate-driver	microchip.com
New EMEA Headquarters for Distributor	Mouser Electronics has opened its new EMEA headqua...	11784	Industry News	New EMEA Headquarters for Distributor	Mouser Electronics has opened its new EMEA headquarters in Munich. The opening took place in the presence of distinguished guests from customers, manufacturers, members of the media, TTI and local support companies. The new office, which is located relatively close to the Olympic stadium and directly above a subway station, is already in operation: People from 23 nations work there. Mark Burr-Lonnon, Senior Vice President Global Service provided a look at the company history from $ 21 million of sales in 2008 to far more than $ 1 billion in 2023 – and all of this just in Europe. While Europe participated less than 10 % to Mouser's worldwide sales in 2008 it contributed almost exactly one third to Mouser's worldwide turnover in 2023. And this is why Mark Burr-Lonnon invited all guests to participate in an office tour after enjoying a piece of a Mouser celebration cake, that he cut in person.	20.02.2024 07:00:00	Feb	news_2024-03-01_2.jpg	\images\news_2024-03-01_2.jpg	https://eu.mouser.com/	eu.mouser.com
Compact MOSFET Modules for Efficiencies of up to 98%	SemiQ added a product to its QSiC family. The QSiC...	11796	Product Release	Compact MOSFET Modules for Efficiencies of up to 98%	SemiQ added a product to its QSiC family. The QSiC 1200 V SiC MOSFET modules in full-bridge configurations deliver near zero switching loss, significantly improving efficiency, reducing heat dissipation, and allowing the use of smaller heatsinks. With a high breakdown voltage exceeding 1400 V, the QSiC modules in full-bridge configurations withstand high-temperature operation at T<sub>j</sub> = 175 °C with minimal R<sub>DS(on)</sub> shift across the entire temperature spectrum. Using high-performance ceramics, SemiQ's modules are well-suited for demanding applications that require bidirectional power flow or a broader range of control, such as solar inverters, drives and chargers for Electric Vehicles DC/DC converters and power supplies. In solar inverter applications, SemiQ's technology allows reaching an efficiency of up to 98 % - as well as more compact designs. It helps reduce heat loss, improve thermal stability, and enhance reliability, backed by over 54 million hours of HTRB/H3TRB testing. The 1200 V MOSFETs also maximize efficiency gains in DC/DC converters while enhancing reliability and minimizing power dissipation. To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level, and all parts have undergone testing surpassing 1400V.	19.02.2024 10:30:00	Feb	news_2024-03-01_15.jpg	\images\news_2024-03-01_15.jpg	https://semiq.com/highly-efficient-compact-mosfet-modules-in-full-bridge-configurations-for-solar-inverter-and-ev-charging/	semiq.com
Distribution Agreement expanded to USA, Australia & New Zealand	Pulsiv of Cambridge (UK) and Astute Electronics of...	11789	Industry News	Distribution Agreement expanded to USA, Australia & New Zealand	Pulsiv of Cambridge (UK) and Astute Electronics of Stevenage (UK) have expanded their distribution agreement to include USA, Australia and New Zealand. Astute Electronics was founded 35 years ago "to bridge the gap between broadline and independent distribution in the European supply chain". Still privately owned, the business now operates across five continents. Using a patented switching technique, Pulsiv has developed an special method for converting AC to DC that delivers a combination of benefits in power electronics designs. This technology has extended the range of conventional flyback topologies to replace expensive LLC solutions, while achieving "an unrivalled efficiency profile". Pulsiv offers Osmium microcontrollers which implement these switching techniques, AC/DC front-end circuit configurations that include a Pulsiv OSMIUM microcontroller and supporting components for a complete AC/DC front-end design as well as evaluation boards and reference designs.	16.02.2024 12:00:00	Feb	news_2024-03-01_7.jpg	\images\news_2024-03-01_7.jpg	https://pulsiv.co.uk/news/pulsiv-and-astute-electronics-expand-distribution-agreement/	pulsiv.co.uk
Automotive-Grade 3-Phase SiC MOSFET Power Modules	Inventchip announced the release of an automotive-...	11815	Product Release	Automotive-Grade 3-Phase SiC MOSFET Power Modules	Inventchip announced the release of an automotive-grade 3-phase SiC MOSFET transfer-molded power module IVTM12080TA2Z. The module is 1200V 80m&ohm; in a compact, topside-cooling through-hole package with a plastic surface size of 23mm x 42mm. Compared with a discrete TO-247 solution, the module saves about 30% PCB space, and the more important thing is that the SiC MOSFET dies are arranged in a much more compact way, which reduces over all stray-inductance of power loops. The reduction of the stray inductance reduces MOSFET Vds overshoot, Vgs ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with the TO-247 solution with external electrical isolation assembly, the module with high performance ceramic lowers junction-to-heatsink thermal resistance by over 50% for the same 80m 1200V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The package has a minimum 5mm creepage from terminals to the package’s heatsink mounting surface, which can safely work for both 400V and 800V systems without isolation reinforce. For production, with isolated top-side cooling, the module solution eliminates any external isolation process and reduces system assembly time and cost. It also minimizes human assembly errors and improves product reliability.	15.02.2024 12:30:00	Feb	news_2024-03-15_15.jpg	\images\news_2024-03-15_15.jpg	https://www.inventchip.com.cn/en/	inventchip.com
Distributor stocks MOSFET Family with now higher Power Efficiency	Rutronik integrates the StrongIRFET™ 2 MOSFE...	11797	Product Release	Distributor stocks MOSFET Family with now higher Power Efficiency	Rutronik integrates the StrongIRFET™ 2 MOSFETs from Infineon into its product portfolio. This generation provides a higher power efficiency, which leads to improved overall system performance. Due to a higher current load tolerance, several parallel connected components are no longer necessary. That saves space on the PCB and reduces costs. The transistors are in stock and available in different housing variants such as TO-220; TO-220 FullPAK, D2PAK, D2PAK 7-pin, DPAK, and TOLL. Compared to the previous StrongIRFET components in the 40 V to 100 V range, the technology offers up to 40 percent better on-resistance and up to 60 percent lower nominal gate charge. In addition, higher rated currents enable improved current carrying capacity and the new generation is suitable for both high and low switching frequencies. Standard pinouts enable simple drop-in replacement. The MOSFETs are 100 percent safety-tested, RoHS-compliant, halogen-free following IEC61249-2-21 product validation, and meet the JEDEC standard. They can be used in a wide range of applications, e.g. for UPS, battery management, or motor drives.	15.02.2024 11:30:00	Feb	news_2024-03-01_16.jpg	\images\news_2024-03-01_16.jpg	https://www.rutronik24.com/	rutronik24.com
Semiconductor Company to buy PCB Design Company	Renesas intends to acquire Altium by way of a Sche...	11788	Industry News	Semiconductor Company to buy PCB Design Company	Renesas intends to acquire Altium by way of a Scheme of Arrangement. The acquisition is said to enable "two industry leaders to join forces and establish an integrated and open electronics system design and lifecycle management platform that allows for collaboration across component, subsystem, and system-level design". Together, Renesas and Altium, aim to build an integrated and open electronics system design and lifecycle management platform that unifies the steps from component selection and evaluation to simulation and PCB physical design at a system level. The acquisition brings together Altium's cloud platform capabilities with Renesas' semiconductor portfolio. The combination will also enable integration with third-party vendors across the ecosystem to execute all electronic design steps seamlessly on the cloud. The electronics system design and lifecycle management platform will deliver integration and standardization of various electronic design data and functions and enhanced component lifecycle management, while enabling seamless digital iteration of design processes to increase overall productivity. This is said to bring "significantly faster innovation" and to "lower barriers to entry for system designers by reducing development resources and inefficiencies". Altium's history began in 1985 from Australia as one of the world's first printed-circuit board (PCB) design tool providers. The transaction has been unanimously approved by the boards of directors of both companies and is expected to close in the second half of 2024. Altium will continue to be led by CEO Aram Mirkazemi as a wholly-owned subsidiary of Renesas.	15.02.2024 11:00:00	Feb	news_2024-03-01_6.jpg	\images\news_2024-03-01_6.jpg	https://www.renesas.com/us/en/about/press-room/renesas-acquire-pcb-design-software-leader-altium-make-electronics-design-accessible-broader-market	renesas.com
Schottky Barrier Diodes with short Reverse Recovery Time	ROHM has developed 100 V breakdown Schottky barrie...	11794	Product Release	Schottky Barrier Diodes with short Reverse Recovery Time	ROHM has developed 100 V breakdown Schottky barrier diodes (SBDs) that deliver a short reverse recovery time (t<sub>rr</sub>) of 15ns for power supply and protection circuits in automotive, industrial, and consumer applications. Although numerous types of diodes exist, highly efficient SBDs are increasingly being used inside a variety of applications. Particularly SBDs with a trench MOS structure that provide lower V<sub>F</sub> than planar types enable higher efficiency in rectification applications. One drawback of trench MOS structures, however, is that they typically feature worse trr than planar topologies – resulting in higher power loss when used for switching. In response, ROHM developed a series utilizing a proprietary trench MOS structure that simultaneously reduces both V<sub>F</sub> and I<sub>R</sub> (which are in a trade-off relationship) while also achieving a short t<sub>rr</sub>. Expanding on the four existing conventional SBD lineups optimized for a variety of requirements, the YQ series is ROHM's first to adopt a trench MOS structure. The design reduces t<sub>rr</sub> losses by approximately 37 % and overall switching losses by around 26 % over general trench-type MOS products. As such, the devices are are well-suited for sets requiring high-speed switching, such as drive circuits for automotive LED headlamps and DC-DC converters in xEVs that are prone to generate heat.	15.02.2024 08:30:00	Feb	news_2024-03-01_13.jpg	\images\news_2024-03-01_13.jpg	https://www.rohm.com/news-detail?news-title=2024-02-15_news_sbd&defaultGroupId=false	rohm.com
Power Supplies for Industrial Applications	COSEL has announced the launch of the PDA series o...	11811	Product Release	Power Supplies for Industrial Applications	COSEL has announced the launch of the PDA series of AC/DC power supplies with further enhanced reliability for industrial applications. The PDA series uses a quasi-resonant topology with a limited number of components, resulting in higher reliability. It is 100% form, fit and function backwards compatible with the PBA series, which is retiring after 20 years of powering high volume applications worldwide. The first models introduced are the 15W PDA15F, the 30W PDA30F and the 50W PDA50F, with other versions to follow. The PDA series is designed for use in a wide range of applications and can operate over a wide temperature range from -20 to +70 degrees C. The power supplies are UL/EN62368-1 certified. Designed for worldwide applications, the PDA series has an input voltage range of 85VAC to 264VAC single phase and meets safety standards with an input voltage range of 100-240VAC (50/60Hz). The 15W PDA15F, the 30W PDA30F and the 50W PDA50F are available in three output voltages, 5V, 12V and 24V with corresponding output currents. The output voltage can be adjusted by a built-in potentiometer.	15.02.2024 08:30:00	Feb	news_2024-03-15_11.jpg	\images\news_2024-03-15_11.jpg	https://www.coseleurope.eu/news-item-1588-enhanced-reliability-power-supplies-for-industrial	coseleurope.eu
DC-DC Converter Designed for the ‘NewSpace’ Market	VPT announces the addition of the VSC100-2800S to ...	11818	Product Release	DC-DC Converter Designed for the ‘NewSpace’ Market	VPT announces the addition of the VSC100-2800S to the VSC Series of space COTS DC-DC converters. Designed for the “NewSpace” market, the VSC Series complements VPT’s hermetic hybrid SV / SVL Series of rad hard products available on DLA SMDs. The VSC Series is intended for use in commercial rad tolerant satellite applications and NASA Class D missions where the balance of cost and guaranteed performance is critical. The VSC100-2800S features output voltages of +3.3 V / 66W, +5 V / 100W, +12 V / 100W, and +15 V / 100W, as well as a wide input voltage range. Sensitive semiconductors are RLAT to 40 krad (Si) per MIL-STD-883 Method 1019 and guaranteed to 30 krad (Si) TID. Converters are characterized to LET > 42 MeV/mg/cm<sup>2</sup> for catastrophic events and LET > to 30 MeV/mg/cmysup>2</sup> for SET and SEFI. Our proprietary packaging creates a dual-side heatsinking option with very low outgassing. VPT’s Vice President of Engineering, Leonard Leslie, stated, “We are pleased to introduce the VSC100-2800S as the newest addition to our VSC Series. Drawing on VPT’s extensive expertise in the development of radiation-hardened DC-DC converters, the VSC Series ensures the optimal level of radiation performance for low Earth orbit (LEO) applications, all while maintaining an exceptionally competitive cost.”	14.02.2024 15:30:00	Feb	news_2024-03-15_18.jpg	\images\news_2024-03-15_18.jpg	https://www.vptpower.com/press-releases/vpt-introduces-vsc100-2800s-space-cots-dc-dc-converters/	vptpower.com
Electrolytic Polymer Hybrid Performance	Panasonic introduces the ZV Series Electrolytic Po...	11812	Product Release	Electrolytic Polymer Hybrid Performance	Panasonic introduces the ZV Series Electrolytic Polymer Hybrid capacitor. Achieving a maximum Ripple Current (3.3~4.6 Arms) approximately 50% higher than comparable case-sizes from competitors, the ZV Series ensures performance in demanding applications. While comparable capacitors usually come up with a ESR of around 16 m&ohm, at 35V, the ZV series has a significantly lower ESR of 12 m&ohm; at this voltage – and thus enhances efficiency and reliability in electronic systems. This capacitor is AEC-Q200 compliant, enforcing stringent quality control standards, particularly crucial for the automotive industry. It boasts high-temperature endurance, one of the industry's highest ratings at 4000 hours at 135°C and 125°C. With a focus on durability, the ZV Series offers vibration-proof variants capable of withstanding shocks up to 30G, making it a reliable choice. The ZV Series finds its applications in various "under the hood" scenarios, including water pumps, oil pumps, cooling fans, high-current DC to DC converters, and ADAS applications. It is also suitable for use in inverter power supplies for robotics, cooling fans, solar power systems, and more, covering the DC side of both inverter and rectifier circuits.	14.02.2024 09:30:00	Feb	news_2024-03-15_12.jpg	\images\news_2024-03-15_12.jpg	https://industry.panasonic.eu/company/newsroom/enhanced-electrolytic-polymer-hybrid-performance-panasonic-industry-unveils-zv-series	industry.panasonic.eu
How to Design the Compensation Circuit for a Flyback Converter	Würth Elektronik has published its Application Not...	11798	Product Release	How to Design the Compensation Circuit for a Flyback Converter	Würth Elektronik has published its Application Note "Compensating the feedback loop of a current-controlled flyback converter with optocoupler". The guide is aimed at developers looking to use a DC/DC flyback converter to achieve greater stability and reliability in power supply design. It might also be useful for those who use optocouplers for galvanic isolation of the feedback path. Applications include primary and auxiliary power supplies for home appliances, battery chargers for smartphones and tablets, as well as LED lighting. This Application Note also provides assistance with power supplies for desktop and laptop computers, industrial power supplies and auxiliary supplies in motor drives, or for Power-over-Ethernet (PoE). AppNote ANP113 explains in detail how the feedback loop can be compensated using a current-controlled flyback converter with optocoupler, and which aspects require special attention. The CTR (current transfer ratio) influences the control loop of the compensation circuit and therefore must be carefully considered in the design stage. ANP113 places particular emphasis on design constraints imposed by the optocoupler parameters and on the related solutions. The validation results of a 30 W flyback converter prototype are also included in the AppNote.	13.02.2024 12:30:00	Feb	news_2024-03-01_17.jpg	\images\news_2024-03-01_17.jpg	https://www.we-online.com/en/news-center/press?d=anp113	we-online.com
Automotive-Grade SiC MOSFET Half Bridge SMPD Modules	Inventchip Technology has added two automotive-gra...	11792	Product Release	Automotive-Grade SiC MOSFET Half Bridge SMPD Modules	Inventchip Technology has added two automotive-grade SiC MOSFET half bridge SMPD modules named IVSM12080HA2Z and IVSM06025HA2Z. The modules are specified 1200 V/80 mΩ and 650 V/25 mΩ. SMPD is a compact, topside-cooling surface-mounted package with a plastic surface size of 25 mm x 23 mm. Compared with TO-247, the SMPD saves over 25 % PCB space, and the more important thing is that the SMPD reduces the half-bridge stray-inductance of power loop by around 40 %. The reduction of the stray inductance reduces MOSFET V<sub>DS</sub> overshoot, V<sub>GS</sub> ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with TO-247 with external electrical isolation assembly, SMPD with traditional AL<sub>2</sub>O<sub>3</sub> and SiN lowers junction-to-heatsink thermal resistance by over 20 % and 50 % respectively for the same 25 mΩ/1200 V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the SMPD package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The SMPD package has a minimum 4 mm creepage from terminals to the package's heatsink mounting surface, which can safely work for both 400 V and 800 V systems without isolation reinforce. Both modules are AEC Q101 and AQG 324 certified.	13.02.2024 07:30:00	Feb	news_2024-03-01_11.jpg	\images\news_2024-03-01_11.jpg	https://www.inventchip.com.cn/en/	inventchip.com
Joint Efforts for Magnetic Component Solutions	ITG Electronics has collaborated with STMicroelect...	11800	Product Release	Joint Efforts for Magnetic Component Solutions	ITG Electronics has collaborated with STMicroelectronics (ST) in developing magnetic component solutions for 54 V/48 V to 12 V converter applications. ST's patented 54 V/48 V to 12 V stacked buck converter features an on-board solution with a quarter brick space using the PM6780 dual digital multiphase controller, the STPRDC02A high-voltage full-bridge driver, and ITG's L101353A-3R6MHF non-coupling dual inductors. This magnetics design collaboration is named Stacked buck converter with unified coupled inductor. Combined with ST's PM6780 and STPRDC02A, ITG's L101456A-1R4MHF can elevate the overall power rating of ST's 48 V solution to 1500 W. This product combination is claimed to "provide the industry's highest power density rating for 48 V solutions". The on-board stacked buck converter 48 V conversion system offers cost savings, form factor flexibility, and a customizable design compared to power-module designs.	12.02.2024 14:30:00	Feb	news_2024-03-01_19.jpg	\images\news_2024-03-01_19.jpg	https://itg-electronics.com/en/series/908	itg-electronics.com
100 V bi-directional GaN IC for 48 V/60 V BMS Applications	Innoscience Technology has launched another 100 V ...	11795	Product Release	100 V bi-directional GaN IC for 48 V/60 V BMS Applications	Innoscience Technology has launched another 100 V bi-directional member of the company's VGaN IC family. The first family of VGaN devices rated 40 V with an on-resistance range between 1.2 mOhm and 12 mOhm have been successfully deployed in the USB OVP of several mobile phones. The 100 V VGaN (INV100FQ030A) can be employed to achieve high efficiency in 48 V or 60 V battery management systems (BMS), as well as for high-side load switch applications in bidirectional converters, switching circuits in power systems, and other fields. Such device it is usable in applications such as home batteries, portable charging stations, e-scooters, e-bikes etc. One VGaN replaces two back-to-back Si MOSFETs; they are connected with a common drain to achieve bidirectional switching of battery charging and discharging, further reducing on-resistance and loss significantly with respect to traditional Silicon solution. BOM count, PCB space and costs are also reduced accordingly. The INV100FQ030A 100V VGaN IC supports two-way pass-through, two-way cut-off and no-reverse-recovery modes of operation. Devices feature a low gate charge of 90 nC, a dynamic on-resistance of 3.2 mOhm and a package size of 4 mm x 6 mm. These 100 V GaN series products are in mass production in En-FCQFN (exposed top side cooling) and FCQFN packaging.	12.02.2024 09:30:00	Feb	news_2024-03-01_14.jpg	\images\news_2024-03-01_14.jpg	https://www.innoscience.com/site/details/711?el=mdnav	innoscience.com