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Wide Band Gap Conference 5th of Dec 2017 Munich-Airport
New JEDEC Committee to Set Standards for Wide Band Gap Power Semiconductors
Workforce Challenges & Opportunities Facing Power Electronics Industry
Completion of 150mm SiC n-type Wafer Development
Full Program for Semiconductors
Cutting-Edge Technologies from the Automation Industry
Speed Time to Market for European Chipmakers
Littelfuse to Acquire IXYS Corporation
World's First Conduction Cooled Modular Power Platform
The 20th European Microwave Week 2017 Oct 8th – 13th
Solder Paste for Fine Printing at SEMICON Taiwan Sep 13th -15th
50V GaN HEMT Family with 3GHz Unmatched 250W Device
IVT-S Measures Current in the Fraunhofer Development Platform foxBMS
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