Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Power Consumption and Die Size of Power Management ICs Reduced
news image
Full press release:
towersemi.com
  • Industry News
  • 2020-03-23

Tower Semiconductor announced the release of design kits for a novel 0.18um high-performance power management technology which offers over 35% power efficiency improvement and/or equivalent amount of die-area directly contributing to the die’s price competitiveness. This offering enables scalable IC operation of up to 24 volts making it ideal for the world’s growing consumer, industrial, automotive, and computing markets. This complements the Company’s previously announced low-voltage, 65nm Power BCD process, as well as its high-voltage 140V Resurf bulk and 200V SOI technologies, providing customers with best-in-class performance across the entire range of 1.2V to 200V from a single foundry with the same design tools and design experience. The technology builds on six generations of the Company’s very successful existing high-performance 0.18um power management platforms and is largely backward compatible making it easy to port existing parts and designs to the more efficient novel process. “We are very excited to announce the release of design kits for this novel technology that provides our customers with breakthrough performance not available elsewhere,” said Shimon Greenberg, Vice President and General Manager of Power Management Business Unit, Tower Semiconductor. “We are committed to continue our investment in developing and providing best in class Power Management technology enabling our customers to bring to market advanced products and gain share in this large and growing segment of the semiconductor market”.

European Market Monitor on Energy Storage
news image
Full press release:
delta-ee.com/press-releases
  • Industry News
  • 2020-03-23

The European Association for Storage of Energy (EASE) and Delta-EE launched the fourth edition of the European Market Monitor on Energy Storage (EMMES). The report demonstrates the European market grew by a total of 1GWh in 2019, a significant slow-down compared to 2018. Front-of-meter installations slowed dramatically in 2019, while residential behind-the-meter capacity was the fastest growing market segment. The EMMES also highlights that 2018 saw a particularly rapid increase in front-of-the-meter projects, partly driven by Enhanced Frequency Response (EFR) tenders, bringing significant levels of storage to market. This resulted in higher competition, lower prices and revenue streams partly explaining the slowdown in rate of growth in 2019. Patrick Clerens, EASE Secretary General said, “The message is clear: even if energy storage is a key enabler of the energy transition and clearly seen as a major tool to achieve the emissions targets linked to the Paris agreement, more support is needed. Customers, governments and the energy industry are keen to see the market develop and provide more value to the energy system. The “Clean Energy for All Europeans” Package (CEP) is an important step in this process by creating, amongst other things, a clear definition for storage, which should allow energy storage to reach its full potential fast.”

Controller for 5V USB-C Charging Applications
news image
Full press release:
newsroom.st.com
  • Product Release
  • 2020-03-19

The STUSB4500L from STMicroelectronics is a small-footprint addition to the Company’s USB-C controller IC family designed and certified for pure 5V sink-only applications. All mandatory features to use the USB-C connector as a 5V universal power plug are integrated, allowing designers to implement USB-C charging solutions quickly and easily without studying the standard or writing code. USB-C is rapidly becoming established as a replacement for Micro-B or Mini-B plugs, for both power and data connections, as it offers the advantages of reversible orientation and greater robustness — up to 10,000 connect/disconnect cycles. ST’s USB-C controller IC is a stand-alone, plug-and-play interface product, targeting low-voltage applications such as Bluetooth speakers, computer accessories, Wi-Fi access points, point-of-sale equipment, LED lighting, and USB dongles. It can also be used for powering equipment such as single-board computers and hardware development kits. The controller IC runs without additional code and requires no external support from the microcontroller, which eases adoption of the USB-C connector standard by saving time-consuming design work. The STUSB4500L is auto-powered via VBUS from the connected source and does not need to be supplied from a local battery or on-board power. Zero leakage current prevents draining the battery when not charging. Input over-voltage protection prevents low-voltage equipment being damaged if it is incorrectly connected, for example, to a 20V source from a USB PD AC adapter rather than the required 5V supply.

Fan-Cooled PSU Offers a Maximum of 4000 W
news image
Full press release:
belfuse.com/news
  • Product Release
  • 2020-03-19

Bel Power Solutions announced the expansion of their high power portfolio with the TXP4000 Series, a maximum 4000 W AC-DC power supply suitable for industrial, process and control, railway and machinery applications. The TXP4000 Series of AC-DC converters employs a PFC front-end stage and an isolated DC-DC stage to convert the 3-phase input voltage to a low DC output voltage in a broad array of industrial applications where high efficiency is a requirement, with emphasis on both reliability and long product life. The TXP4000 Series also include DSP technologies which enable monitoring of electrical parameters (including input voltage of all 3-phases) and allow control of the PSU from a system controller. RS485 / CAN bus communication is available to command, monitor and provide diagnostic information that can be used to interface with a system controller. TXP4000 Series power supplies feature a compact footprint (135 x 85 x 465 mm / 5.31 x 3.35 x 18.31 inches) and accommodate the worldwide 3-phase input voltage range of 350-528 Vrms at up to 63 Hz, with active current share system available. Units can be used in parallel (8 units) or serial configurations (4 units), generating a maximum output power of 32 kW.

Joining the Responsible Business Alliance
news image
Full press release:
tdk.com/press
  • Industry News
  • 2020-03-19

TDK Corporation announces that it has recently joined the Responsible Business Alliance (headquartered in Virginia, U.S.A.; hereinafter “RBA”), the world’s largest industry coalition dedicated to corporate social responsibility in global supply chains. As an Affiliate Member of the RBA, TDK fully supports the vision and mission of the RBA and continuously improve its own operations in accordance with the RBA Code of Conduct. TDK will also support and encourage its first-tier suppliers to do the same. The purpose of joining the RBA is to bolster efforts for the rights, health and safety of workers in the global TDK Group and its first-tier suppliers, as well as for the environment. We aim to fulfill our social responsibility and further enhance the credibility of the TDK Group by publicly pledging to practice the RBA Code of Conduct, the global standard, and making it the clear standard for the TDK Group. TDK will continue to put in practice its corporate motto, “Contribute to culture and industry through creativity,” and strengthen its CSR activities with its customers, suppliers and other stakeholders to advance the development of a sustainable society and champion well-being for all people through its innovative core technologies and solutions.

SiC Switching-Loss Optimized Half-Bridge Module
news image
Full press release:
richardsonrfpd.com/Products
  • Product Release
  • 2020-03-19

Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company. The CAB425M12XM3 is an addition to Wolfspeed’s XM3 power module platform, developed to maximize the benefits of SiC, while keeping the module and system design robust, simple and cost effective. With half the weight and volume of a standard 62 mm module, the XM3 power module maximizes power density while minimizing loop inductance and enabling simple power bussing. The XM3’s SiC-optimized packaging enables 175°C continuous junction operation, with a high-reliability silicon nitride (Si3N4) power substrate to ensure mechanical robustness under extreme conditions. The CAB425M12XM3 targets applications with maximum current requirements at high switching frequencies, focused on power density, including vehicle fast chargers, uninterruptable power supplies, motor and traction drives, and smart-grid or grid-tied distributed generation. An associated inverter reference design, the CRD250DA12E-XM3, is also available.

Dual Output IGBT / MOSFET Driver
  • Product Release
  • 2020-03-19

Toshiba Electronics Europe has announced an IGBT/MOSFET gate driver equipped with additional built-in functionality. The TLP5231 will simplify the design task in a wide range of applications including industrial inverters, uninterruptible power supplies (UPS), power conditioners for solar energy and motor controls. The pre-driver has a pair of outputs that are designed to drive external p-channel and n-channel MOSFETs used for current buffers. This allows the usage of a wide range of MOSFETs with various current ratings, meaning that the IGBT can be controlled by a rail to rail gate voltage. The driver can source and sink peak currents up to 2.5 A and is rated for 1.0 A continuously. The device incorporates overcurrent detection, implemented by sensing VCE(sat) as well as undervoltage lock out (UVLO), both of which provide an open collector fault signal to the primary side. These features are not available on existing products (such as the TLP5214 & TLP5214A) and their inclusion on the TLP5231 significantly eases the process of gate drive circuit design. Additionally, the “gate voltage soft turn off time” after VCE(sat) overcurrent detection can be controlled by another external n-channel MOSFET. Propagation delays (L/H & H/L) are as low as 100ns.

Silver Quill Award Winners
news image
Full press release:
indium.com/news
  • People
  • 2020-03-18

Indium Corporation's Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to award employees for generating leading-edge research and thought-leadership technical content that addresses issues concerning customers in the electronics industry. The 2019 Paper of the Year award went to Kenneth Thum, Senior Technical Support Engineer, and Sze Pei Lim, Regional Product Manager for Semiconductor Products, for their paper Ultrafine Solder Paste Dispensing for Heterogeneous Integration. The paper examines how heterogeneous integration for advanced packaging is driving the need for ultrafine solder paste dispensing in tightly packed components where printing is not possible. Thum and Lim also offered solutions on how to achieve consistent fine-dot printing, including examining different dispensing equipment technologies and important solder paste characteristics. Additionally, Bernie Leavitt, Jr., Senior Product Specialist, High-Temperature Engineered Solders, was recognized with an honorable mention award for his outstanding contribution and research paper, The Impact of AuSn Preforms Thickness on Solder Joint Reliability. His paper examines how to overcome the diminishing power of semiconductor lasers as their operational heat increases during use. One technique utilized to counteract this challenge is the application of a thinner 80Au/20Sn solder joint for die-attach to aid in thermal transfer to the copper heat-sinks. Leavitt reviewed the results of a study designed to help engineers gain insight into the optimal preform thickness for laser diode applications, as well as other die-attach applications. Indium Corporation also thanked Andreas Karch, Regional Technical Manager, and Miloš Lazic, Technical Support Engineer, for their work advancing materials science and building the company's technical knowledge and expertise.

700, 1200 and 1700V SBD-Based Power Modules
news image
Full press release:
microchip.com/pressreleasepage
  • Product Release
  • 2020-03-16

Microchip Technology announced its expanded portfolio of smaller, lighter and more efficient SiC power modules. Together with its broad portfolio of microcontrollers (MCUs) and analog products, Microchip serves the needs of high power system control, gate drive and power stage – supporting customers with total system solutions. Microchip’s SiC family includes commercially-qualified Schottky Barrier Diode (SBD)-based power modules in 700, 1200 and 1700V variants. The power module family includes various topologies including Dual Diode, Full Bridge, Phase Leg, Dual Common Cathode and 3-Phase bridge, in addition to offering different current and package options. The addition of SiC SBD modules simplifies designs by integrating multiple SiC diode die with the option to mix and match substrate and baseplate material into a single module – which maximizes switching efficiency, reduces thermal rise and allows for a smaller system footprint. The flexible portfolio of 700, 1200 and 1700V SiC SBD modules utilize Microchip’s newest generation of SiC die, which maximizes system reliability and ruggedness and enables stable and lasting application life. The devices’ high avalanche performance allows system designers to reduce the need for snubber circuits, and the body diode stability allows designs to use the internal body diode without long-term degradation. Through Microchip internal and third-party testing, critical reliability metrics have proven Microchip devices’ superior performance when compared to other SiC manufactured devices. 

Voltage Regulators with COT Engine
news image
Full press release:
infineon.com/press
  • Product Release
  • 2020-03-16

Infineon Technologies introduces the IR3887M, IR3888M and IR3889M devices in its family of integrated-point-of-load voltage regulators featuring a fast constant-on-time (COT) engine. This product family is designed for today’s server, base station and telecom (operating at 85°C ambient temperature) and storage applications requiring both high efficiency and high density. The IR3887M is the smallest 30 A device on the market. Fusing Infineon’s latest FET generation and enhanced package technology allows for thermal support for 30 A in a small 4 mm x 5 mm footprint. The OptiMOS™ IPOL product family comes with an enhanced-stability COT engine with ceramic capacitors without the need for external compensation. Wide input voltage range of 4.3 V - 17 V, 2 V min with 5 V external bias, and precise output voltage (0.5 % accurate reference voltage) are supported. The voltage regulators offer high efficiency at light-load and thermally-compensated internal overcurrent protection with four selectable limits for a less expensive and smaller inductor. High switching frequency (up to 2 MHz) for small PCB size and fewer bill-of-materials (BOM) is guaranteed with easy design and layout. These products provide benchmark efficiency, low power losses and the ability to thermally handle up to 30 A of continuous current. Customers can also benefit from the benchmark output voltage regulation and enhanced load transients response.

Global Distribution Partnership
news image
Full press release:
unitedsic.com/news
  • Industry News
  • 2020-03-16

UnitedSiC has announced a distribution agreement with Digi-Key Electronics. The partnership will provide Digi-Key customers with worldwide, 24-hour availability of UnitedSiC’s Silicon Carbide product portfolio – including the only standard gate drive SiC devices currently in the market. Yalcin Bulut, VP of Global Sales and Marketing at UnitedSiC, said: “This partnership focuses on expanding the UnitedSiC product line to an even wider group of power designers by leveraging Digi-Key’s world-class distribution expertise. We will now be able to provide our SiC wide bandgap technology to the markets and customers served so well by Digi-Key.” The UnitedSiC products available through Digi-Key will be especially beneficial to engineers focused on electric vehicles, battery charging, IT infrastructure, renewable energy and circuit protection. David Stein, VP of Global Supplier Management at Digi-Key said: “We are excited to partner with UnitedSiC and bring on their portfolio of silicon carbide semiconductor devices. With ever increasing pressure on power engineers to deliver optimal efficiency and cost-effectiveness, it is critical for Digi-Key to work with companies who have market leading technology.  We look forward to introducing UnitedSiC’s product portfolio to our global engineering community.”

Access to Wide Range of Triacs & Thyristors
news image
Full press release:
transonics.com
  • Industry News
  • 2020-03-15

Following the signing of an exclusive deal with JJ Micro, Transonics is now holding one million triacs and thyristors in stock at its UK warehouse. Transonics’ extensive UK inventory includes JJ Micro’s internally-isolated tab Triacs ranging from mAs up to 40A, with sensitive data recurring currents. JJ Micro’s range of Triacs extends to 1400V and products - where not held in stock - are available on a 6-8 week lead time as opposed to 20 weeks plus. Comments Daniel French, MD at Transonics: “JJ Micro is the third largest manufacturer of Triacs in the world - the largest in China – and fully-approved to international quality standards. So with products from established brand names on variable leadtimes, finally, there is a credible, qualified alternative available.” Also available from JJ Micro and in stock at Transonics are diodes, MOSFETs, protection devices, thyristors and transistors.

PCIM Europe Postponed
news image
Full press release:
pcim.mesago.com/press
  • Event News
  • 2020-03-13

Due to the increasing spread of covid-19 in Europe, Mesago Messe Frankfurt GmbH has decided to postpone the PCIM Europe exhibition and conference from 5-7 May 2020 to 28-30 July 2020. The venue remains the Nuremberg Exhibition Centre. Visitor tickets already purchased remain valid for the new date.

Sinter Paste with Thermal Conductivity
news image
Full press release:
heraeus.com/press
  • Product Release
  • 2020-03-12

Heraeus Electronics announced the launch of a sinter paste with the product name mAgic DA295A. It is a low temperature, non-pressure sintering solution and part of Heraeus’ mAgic sinter pastes product series. It offers superior thermal conductivity and is suited for power applications with high operation temperatures. “We are constantly developing new die attach materials optimized for the growing demands of power semiconductors," says Dr. Klemens Brunner, President of Heraeus Electronics. "Our new paste mAgic DA295A enables devices to achieve higher performance and higher reliability – especially for high frequency power amplifier packages.” Due to its patented formulation, mAgic DA295A creates a robust pure silver die-attach layer with high thermal dissipation. The improved formulation further widens the processing window to reduce the overall cost of ownership. Moreover, mAgic DA295A’s simple processing provides flexibility and improved workability characteristics to benefit manufacturability. Heraeus is the only sinter paste supplier using micro scaled Silver powder. This ensures higher yields, a wider process window and is less expensive compared to nano powders. Heraeus not only provides high-quality sinter materials, but also makes its process knowledge available to customers. In its power electronics application centers, the company helps manufacturers to improve their processes by jointly simulating them and developing prototypes. Manufacturers furthermore benefit from Heraeus’ sinter seminars and training courses.

AI-Based Soft Switching Using Inverter Reference
news image
Full press release:
pre-switch.com
  • Product Release
  • 2020-03-11

Pre-Switch has released first data from its Cleanwave 200kW inverter reference. Double pulse test data demonstrates that the Pre-Switch soft-switching platform – comprising the Pre-Drive™3 controller board powered by the Pre-Flex™ FPGA, and RPG gate driver board – reduces total system switching losses by 90% or more. Pre-Switch is enabling customers to build systems with switching frequencies 4X-5X faster than their hard-switched IGBT systems and 35X faster than their hard-switched SiC and GaN systems: this is achieved with half the transistor count. In the case of a SiC-based EV inverter, increasing the Fsw from the ubiquitous 10kHz up to 100kHz or 300kHz creates a near perfect sine wave without any output filter. The result is elimination of unnecessary motor iron losses and an increased motor efficiency at low torque and low RPM. Higher switching frequencies also enable higher RPM motors that are lighter and lower cost. Previously, soft-switching has never been successfully-implemented for DC/AC systems with varying input voltage, temperature and load conditions. However, Pre-Switch has overcome the challenges by using Artificial Intelligence (AI) to constantly-adjust the relative timing of elements within the switching system required to force a resonance to offset the current and voltage wave forms – thereby minimizing switching losses.

electronica China: New Date Set for July 2020
news image
Full press release:
electronica-china.com/newsroom
  • Event News
  • 2020-03-10

The outbreak of the novel coronavirus (COVID-19) has strongly impacted developments in China. Following the directives of the Government of Shanghai Municipality to prevent and control the virus from spreading, Messe München Shanghai was compelled at the beginning of February to postpone electronica China, productronica China and LASER World of PHOTONICS CHINA, which were planned to take place in March. The new date has been set, combined with a unique change in location. The trade fairs will be held from July 3 to 5, 2020 at the National Exhibition and Convention Center (NECC) in Shanghai. Since the outbreak of the novel coronavirus (COVID-19), more than 300 trade fairs in China have been postponed. Due to the tight schedule of the Shanghai New International Expo Centre (SNIEC) it wasn't possible to find an alternative date at the SNIEC in 2020. After examining carefully all possible dates, Messe München Shanghai has decided on a one-time postponement of electronica China, productronica China and LASER World of PHOTONICS CHINA: The trade fairs will take place from July 3 to 5, 2020, at the National Exhibition and Convention Center in Shanghai. Stephen Lu, Chief Operating Officer of Messe München Shanghai, explains: "We are taking the spread of the coronavirus very seriously and have been monitoring the local situation closely. Based on current developments, we are confident that by setting a new date we will create good conditions for staging the trade fairs." After intense communication with the exhibitors, Stephen Lu believes that "despite the current uncertainties, the importance of our trade fairs at the Shanghai location remains intact. There is a still a great demand for participating in the trade fairs."

CFIUS Concludes Review of Planned Acquisition and Clears Transaction
news image
Full press release:
infineon.com/press
  • Industry News
  • 2020-03-10

The Committee on Foreign Investment in the United States ("CFIUS") concluded its review under Section 721 of the Defense Production Act of 1950, of the planned acquisition of Cypress Semiconductor Corporation as announced by Infineon Technologies on 3 June 2019. CFIUS cleared the transaction. The closing of the Merger remains subject to approval from China's State Administration for Market Regulation (SAMR) and other customary closing conditions under the merger agreement.

3-Phase Built-in Filter with Neutral Line
news image
Full press release:
schurter.com/Newsroom
  • Product Release
  • 2020-03-10

FMAD CP is the name of the latest 1-stage filter family for 3-phase systems with neutral line. Thanks to their extremely compact dimensions and high performance, the filters are ideally suited to the tight space conditions in today's machine and equipment construction. Thanks to an extended temperature range, they can also be used in critical applications. The filter family is ideally suited for devices with high EMC loads at low or medium power. Typical applications include converters for photovoltaics, battery storage or charging stations for electric vehicles. These powerful, particularly compact filters are also the first choice for modern frequency inverters for motor control. The FMAD CP filter series has 6.3 x 0.8 mm plug-in connections for quick and easy wiring. Thanks to a metal flange, a good earth connection is guaranteed when screwed to the chassis. The standard versions can be used over a temperature range of -40 °C to 100 °C. The filters are designed for currents from 3 A to 20 A at an ambient temperature of 50 °C. They have ENEC and cURus approval and are recommended for applications up to max. 520 VAC.

Producing High-Performance Si Power MOSFETs
  • Industry News
  • 2020-03-10

SkyWater Technology and Applied Novel Devices announced the companies have entered into a licensing and manufacturing agreement to offer an improved standard process flow for Si power MOSFETs (metal oxide semiconductor field-effect transistors). The partnership will enable AND to bring power device products to market based on its proprietary and patented technologies and SkyWater’s high volume manufacturing capabilities. The licensing agreement will also enable SkyWater to offer the technology as a standard foundry process flow to improve system-level performance for low-voltage (12V – 30V) applications. At the Applied Power Electronics Conference (APEC 2020), SkyWater plans to showcase this collaboration and its manufacturing services for discrete power devices which are in high demand due to the explosion of wireless and battery powered connected devices. AND’s high-performance Si power MOSFETs are based on novel channel and substrate engineering to improve critical power MOSFET figures of merit. These products offer low RDS(on) combined with low output capacitance/charge, low gate drive down to 2.5 V and an industry-first near zero reverse recovery charge enabling low switching losses in applications. Low RDS(on) and reverse recovery will enable improved efficiency and, in some cases, reduced part counts, yielding lower cost and higher efficiency switching systems in applications such as power supplies and motor controls.

Stackable DC/DC Buck Converter
news image
Full press release:
news.ti.com
  • Product Release
  • 2020-03-09

Texas Instruments introduced a 40-A SWIFTTM DC/DC buck converter, offering stackability of up to four integrated circuits (ICs). The TPS546D24A PMBus buck converter can deliver up to 160 A of output current at an 85°C ambient temperature – four times more current than competing power ICs. The TPS546D24A has the highest efficiency of any 40-A DC/DC converter, allowing engineers to reduce power loss by 1.5 W in high-performance data center and enterprise computing, medical, wireless infrastructure, and wired networking applications. Solution size and thermal performance are two key considerations for engineers designing power supplies for modern field-programmable gate arrays (FPGAs). With its unique stackability, the TPS546D24A buck converter addresses both. It comes with a PMBus interface that offers a selectable internal compensation network, enabling engineers to eliminate as many as six external compensation components from the board and shrink the overall power-supply solution size by more than 10% (or 130 mm2) for higher-current FPGA/application-specific ICs (ASICs) when compared to discrete multiphase controllers.

Polymer Aluminum Electrolytics Provides High Ripple Current and Capacitance
news image
Full press release:
cde.com/new-product
  • Product Release
  • 2020-03-09

The PPC Series of ultra-thin polymer aluminum electrolytic capacitors from Cornell Dubilier represents a totally new capacitor form factor. Designed specifically for applications requiring high ripple current and the thinnest possible profiles, type PPC opens up new product design options. In addition to being just 1 mm thin, the PPC uses versatile packaging technology that makes it possible for capacitors to be formed into custom shapes and sizes to accommodate available space. "A single PPC capacitor offers capacitance and ripple current equivalent to dozens of SMT capacitors or a bulky cylindrical device," said Mario DiPietro, Product Manager at Cornell Dubilier. As an example, the company claims that a single PPC capacitor is equivalent to a parallel bank of 50 or more polymer tantalum capacitors and occupies one fourth the height. Also, circuit reliability is improved by using a single component versus an entire array of SMT capacitors. Custom values are available within a capacitance range of 8,000 µF to 20,000 µF, with working voltages ranging from 6.3 to 24 WVDC. The company plans to extend the series to higher operating voltages later in the year. Operating life is 2,000 hours @ 125° C. The PPC is rated for 10 g peak for vibration and withstands shocks up to 100 g's (MIL-STD-202, Method 213, Condition I).

Foxy Power Established
news image
Full press release:
sales@foxypower.com
  • Industry News
  • 2020-03-06

Industry veterans Christopher Rocneanu and Michael Doktor started Foxy Power, a company specializing in business development, strategic sales and consulting for start-ups and manufacturers with disruptive technologies. Foxy Power provides sophisticated and custom-tailored hands-on support for the introduction of new products and sales for established product lines. For any further questions please contact sales@foxypower.com or call +4915121063411.

SiC MOSFET Power Module for E-mobility
news image
Full press release:
cissoid.com/news
  • Product Release
  • 2020-03-05

CISSOID announces a 3-Phase SiC MOSFET Intelligent Power Module (IPM) platform for E-mobility. This IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers. Co-optimizing the electrical, mechanical and thermal design of the power module and its proximity control, this scalable platform will improve time-to-market for Electric Car OEMs and electric motor manufacturers willing to rapidly adopt SiC-based inverters for more efficient and compact motor drives. With this SiC-based IPM solution, CISSOID maintains its focus on addressing challenges for automotive and industrial markets. The first product out of this scalable platform, a 3-Phase 1200V/450A SiC MOSFET IPM, features low conduction losses, with 3.25mOhms On resistance, and low switching losses, with respectively 8.3mJ turn-on and 11.2mJ turn-off energies at 600V/300A. It reduces losses by at least a factor 3 with respect to state-of-the-art IGBT power modules. The module is water-cooled through a lightweight AlSiC pin-fin baseplate for a junction-to-fluid thermal resistance of 0.15°C/W. The power module is rated for junction temperature up to 175°C. The IPM withstands isolation voltages up to 3600V (50Hz, 1min). The built-in gate driver includes three on-board isolated power supplies (one per phase) delivering each up to 5W allowing to easily drive the power module up to 25KHz and at ambient temperatures up to 125°C.

Acquisition Will Accelerate GaN Expertise
news image
Full press release:
newsroom.st.com
  • Industry News
  • 2020-03-05

STMicroelectronics announced it has signed an agreement to acquire a majority stake in French Gallium Nitride (GaN) innovator Exagan. Exagan's expertise in epitaxy, product development and application know-how will broaden and accelerate ST's power GaN roadmap and business for automotive, industrial and consumer applications. Exagan will continue to execute its product roadmap and will be supported by ST in the deployment of its products. Terms of the transaction were not disclosed and closing of the acquisition remains subject to customary regulatory approvals from French authorities. The signed agreement also provides for the acquisition by ST of the remaining minority stake in Exagan 24 months after the closing of the acquisition of the majority stake. The transaction is funded with available cash. "ST has built strong momentum in silicon carbide and is now expanding in another very promising compound material, gallium nitride, to drive adoption of the power products based on GaN by customers across the automotive, industrial and consumer markets" said Jean-Marc Chery, President and CEO of STMicroelectronics. "The acquisition of a majority stake in Exagan is another step forward in strengthening our global technology leadership in power semiconductors and our long-term GaN roadmap, ecosystem and business. It comes in addition to ongoing developments with CEA-Leti in Tours, France, and the recently-announced collaboration with TSMC."

Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs
news image
Full press release:
ftdichip.com
  • Product Release
  • 2020-03-04

FTDI Chip's latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol. Available in both 2-channel (FT2233HP) and 4-channel (FT4233HP) versions, the Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities. Furthermore, they are fully compliant with Rev 3.0 of the USB power delivery (PD) specification. Each features a Type-C/PD controller for taking care of all negotiation and power gauging, then deciding on the appropriate course of action (thereby offloading work that the system microcontroller would otherwise have to perform). This will enable any equipment that these ICs are integrated into to either draw or provide power as the situation dictates - with power levels of up to 100W being supported. Based on a 32-bit RISC processor core, with 8kB of data RAM and 48kB of code ROM embedded, the PD Policy Engine manages the respective PD ports. The PD1 port can act as either a power sink or power source, while the PD2 port only acts as a power sink.

Module Meets the Requirements of Industrial Voltage Network
news image
Full press release:
we-online.de/news
  • Product Release
  • 2020-03-04

The power modules with fixed 3.3 or 5 V output voltages are now also available with an input voltage of 36 V, following on from versions with maximum input voltages of 28 and 42 V. The components in a SIP-3 package represent cost-effective solutions to meet the requirements for the transient capability of a 24 V industrial voltage network. The modules operate from 6 to 36 V VIN and generate a fixed output voltage of 3.3 or 5 V at a current of up to 1 A. The FDSM series of MagI³C power modules are fully integrated DC/DC voltage converters with fixed output voltage. The modules comprise the power stage, controller, inductors, and effective operational input and output capacitors. They also come with thermal overload and short circuit protection. No external components are required for operation. The workload of circuit design is thus reduced to a minimum. This allows new applications to be brought to market quickly with very low development costs. The standard THT housing for easy mounting is pin-compatible with the L78x linear controllers.

Financing to Advance its GaN Power Conversion Business
news image
Full press release:
transphormusa.com/news
  • Industry News
  • 2020-03-03

Transphorm announced it raised $21.5 million in a private placement equity financing. Prior to the financing, Transphorm Technology completed a reverse merger with Peninsula Acquisition Corporation, a public Delaware corporation, whereby Transphorm became a wholly owned subsidiary of Peninsula. Following the merger, Peninsula changed its name to Transphorm, Inc., and will continue the historical business of Transphorm. Previous members of Transphorm's Board of Directors, David Kerko, Eiji Yatagawa, Brittany Bagley, Mario Rivas and Dr. Umesh Mishra will remain as directors of the Company. "We are thrilled to announce this new equity financing which will support and accelerate our product development, manufacturing, and sales for our GaN power solutions," said Mario Rivas, CEO. Mr. Rivas continued, "We believe the success of this financing demonstrates confidence and support in Transphorm's team, technology and products by both our current partners as well as our new investors." "Our core capabilities in GaN epitaxy, design, process and circuit applications have positioned us well to innovate and address the power conversion systems needs of our customers," said Dr. Primit Parikh, Co-founder and COO. "We have created an integrated device model and developed highly reliable, high performance GaN device technology, as well as amassed one of the largest intellectual property portfolios in the GaN power industry," Dr. Parikh added.

Partnership with Distributor in Turkey
  • Industry News
  • 2020-03-02

Panasonic Factory Solutions and Ankatek, a technical distributors of high-tech capital goods for electronics manufacturing in Turkey, announce their future cooperation. Ankatek will distribute the portfolio of Panasonic Factory Solutions, especially the automation products such as placement machines, printers and software for industry sectors like telecommunications, automotive, IT and consumer electronics. With a lot of experience in technical sales, Ankatek is a valuable partner who will bring Panasonic Industry's smart factory solutions directly to customers in Turkey. "For Panasonic Factory Solution, the partnership with Ankatek is a logical step to bring our proven hardware and software solutions closer to customers in Turkey. We are very much looking forward to an intensive cooperation," says Nils Heininger, Division Director Factory Solutions. Selim Ergül, Managing Director of Ankatek, is looking forward to the cooperation: "We are pleased to have found an experienced partner and global player for SMD Factory Solutions. Panasonic is also an expert beyond the SMD line, especially when it comes to the important topic of Smart Factory and machine communication".

Innovation Creates Future
news image
Full press release:
smt-wertheim.de/news
  • Product Release
  • 2020-02-27

As a manufacturer of machines for thermal process solutions from –50°C up to +450 °C, SMT Thermal Discoveries presents its complete portfolio with innovations in the areas of SMD reflow soldering, vacuum soldering, curing and temperature treatment for temperature function tests at the exhibition SMTconnect in Nuremberg. With the new reflow generation by SMT, the customer receives an improved heat transfer in the reflow soldering system due to the optimized airflow in the proven 3:1 zone concept. Flexible profile settings are easy to implement by combining "recipes" and "products" in the Thermal Tools operating software. The advanced, low-maintenance "KAT" process gas cleaning system is integrated directly into the process area and does not require any additional energy consumption. In contrast to conventional process gas cleaning systems, SMT has been relying on systems without any complex and fragile tubing for years. The customer benefits and saves not only energy losses in the tubes, but also an annual, several days lasting maintenance. Moreover, the customer can change the catalyst himself, thereby increasing the availability of the plant again. In the new reflow generation, cooling is done from above and below with one fan per zone only, which means better cooling performance with consistently low power consumption.

Programmable DC Power Supplies
news image
Full press release:
magna-power.com/news
  • Product Release
  • 2020-02-26

Magna-Power Electronics released 35 models to its expansive MagnaDC programmable DC power supply product line with increased output isolation ratings now up to 6,000 Vdc. The 35 new isolated high voltage models join over 1,000 models in Magna-Power's MagnaDC offering, with voltage ratings now from 5 Vdc to 6,000 Vdc, current ratings from 0.2 Adc to 24,000 Adc, and power ratings from 1.5 kW to 2,000 kW+. The new high voltage models address applications across many industries, including: capacitor testing and charging, semiconductor ion implantation and physical vapor deposition, tethered DC-powered vehicles, cable testing, among many others. The new isolated high voltage models include new models across many Magna-Power products series, including:
• 5 new 3,000 Vdc models in the 2U 2 kW to 10 kW XR Series
• 16 new 5,000 Vdc and 6,000 Vdc models in the 3U-8U 5 kW to 50 kW TS Series
• 8 new 5,000 Vdc and 6,000 Vdc models in the floor-standing 30 to 75 kW MS Series
• 6 new 5,000 Vdc and 6,000 Vdc models in the 100 kW to 250 kW floor-standing MT Series

The models are offered in the same physical dimensions as Magna-Power's existing models of the same power ratings, providing among the highest power density available on the market for high-voltage high-power products.

High-Voltage Half-Bridge Motor-Driver
news image
Full press release:
motor-driver.power.com/news
  • Product Release
  • 2020-02-25

Power Integrations announced that its BridgeSwitch integrated half-bridge (IHB) motor-driver IC family has been expanded and now supports applications requiring up to 400 W. BridgeSwitch ICs feature high- and low-side advanced FREDFETs (Fast Recovery Diode Field Effect Transistors) with integrated lossless current sensing, resulting in inverter efficiency of up to 99.2% in brushless DC (BLDC) motor-drive applications. This industry-leading efficiency performance along with the distributed thermal footprint provided by the IHB driver eliminates the need for a heatsink, reducing both system cost and weight. The 400 W BRD1167 and BRD1267 BridgeSwitch ICs deliver up to 1.33 A RMS, 11.5 A DC output peak current. Like the rest of the BridgeSwitch family, they are self-powered and available in the same compact InSOP-24C surface-mount package. These devices can drive single- or multi-phase high-voltage, synchronous or asynchronous motors, and support all popular MCU and motor control algorithms. All BridgeSwitch ICs feature cycle-by-cycle hardware–based overcurrent, over/under-voltage and over-temperature protection features, which eliminate the software component from many protection functions. This simplifies IEC 60335 and 60730 certification, saving time and cost.

More Female Leaders Wanted
news image
Full press release:
danfoss.com/news
  • People
  • 2020-02-25

Today, 30 percent of Danfoss employees are women, but only 20 percent of leadership positions are occupied by women. Therefore, it is now becoming a focus area for the entire Danfoss global organization to ensure that the number of female leaders is increased by 50 percent. “We have come a long way, but we are aware that in order to achieve our ambitious target of increasing our female leaders rate by 50%, an extraordinary effort is required. We need to go new and unconventional ways, challenge ourselves and send an unambiguous signal both to ourselves that this effort has a high priority and to our outside world that Danfoss is an attractive company for both genders,” says Ilonka Nussbaumer, head of HR at Danfoss. With the headline - diversity and inclusion, Danfoss is now launching a large number of significant and concrete efforts. It is about telling even more about Danfoss as a workplace and about the many opportunities you have as an employee. There will be a stronger focus on the recruitment process, on retaining talented women, and on developing and empowering female employees to become tomorrow's successful leaders. “We know that in many of the core countries, we operate in, females are still underrepresented in STEM educations. For us, this means that we have a responsibility to make engineering and STEM educations even more attractive to women. As an engineering and technology company, we must seize the opportunity to lead globally and show that more female leaders have and are of central importance to the future development of companies,” says Ilonka Nussbaumer.

Swedish GaN-on-SiC Wafer Specialist Reports Growth
news image
Full press release:
swegan.se/pressrelease
  • Industry News
  • 2020-02-25

SweGaN AB announced strong results for 2019 with 300% year-on-year growth from 2018. "2019 was an outstanding year for SweGaN with a doubling of commercial orders and collaboration in multiple prestigious EU projects", says Olof Kordina, CEO, SweGaN. The technology was highlighted in the largest Swedish technical magazine Ny Teknik which selected SweGaN as one of the most promising and innovative young companies. A featured article in Applied Physics Letters, Volume 115, Issue 22, "Transmorphic Epitaxial Growth of AlN Nucleation Layers on SiC Substrates for High-Breakdown Thin GaN Transistors", showed the material´s unique very high electrical breakdown voltage making it ideal for power devices. In 2020, we will continue focusing on ground-breaking product development, building our manufacturing capabilities and further energizing our global network of customers and strategic partners. In addition, SweGaN has further strengthened its board of directors with the introduction of new members Agneta Franksson and Richard Weil at its annual meeting.

Series of Intelligent MOSFET Power Modules
news image
Full press release:
aosmd.com/news
  • Product Release
  • 2020-02-25

Alpha and Omega Semiconductor announced the release of an intelligent power module, AIM702H50B, specialized for low-power BLDC motor drives system such as fan motors in home appliances and air-conditioners that require highly compact size with reliable and efficient design allowance. The IPM7 series consists of advanced super junction MOSFETs designed for motor drive and high voltage gate driving ICs with an integrated bootstrap circuit in an ultra-compact surface mountable package. "A BLDC-based inverter has been widely used in fan motors because it is quicker, quieter, and more energy-efficient than the conventional solutions using dc motors or ac induction motors with on/off control. Nowadays, its demand and expansion are becoming a mandatory requirement due to energy saving and regulations. Without a doubt, IPM7 will bring a lot of advantages for fan motor applications by significantly enhancing the cost-effective development of the system, reducing the inverter board size, and obtaining easy and reliable PCB assembly. Quick and precise detection of fault temperature in IPM7 will play a significant role in fan motor drives to secure a reliable design as well as a long time of operation," said Dr. Brian Suh, Vice President of IGBT/IPM product lines at AOS.

Fully Integrated Wireless-Charging IC
news image
Full press release:
newsroom.st.com/media-center
  • Product Release
  • 2020-02-24

In the age of 5G communication with ever-increasing demand for more power and higher efficiency, STMicroelectronics' STWLC68 product family provides the best solution for wireless-charging applications with industry-leading efficiency, highest power transfer, and safety. ST's wireless-charging products operate as both a high-power receiver and a transmitter enabling rapid power transfer and power sharing with FOD (Foreign Object Detection) and other important ST-proprietary safety IPs. ST's proprietary high-voltage technology, paired with excellent mixed signal design and highest quality assurance, enables our customers to deliver cutting-edge wireless-charging products. The STWLC68 family of highly integrated devices needs a very low external BoM (Bill of Materials), ideal for integration in a wide range of applications from small wearables and appliances to larger ones like smartphones and tablets. Being WPC Qi 1.2.4 compliant, the STWLC68 is fully compatible with all Qi certified devices in the market. With its fully integrated low-impedance, high-voltage synchronous rectifier and low drop-out linear regulator, the STWLC68 achieves high efficiency and low power dissipation, critical for applications that are highly sensitive to unnecessary heat buildup. An I2C interface allows firmware and platform parameters to be customized in the device and the configuration can be programmed into the embedded OTP. Additional firmware patching improves the IC's application flexibility.

Remote Control DIN-Rail Power Supply Range
news image
Full press release:
pulspower.com
  • Product Release
  • 2020-02-24

PULS Power has added a 40A output model to its remote-controlled DIN-Rail power supply family. The remote-control feature is particularly useful in smart buildings and industrial systems where centralised control of multiple system components is required and allows system administrators and building automation controllers to switch power supplies on or off by use of an external signal switch or transistor gate. The 24VDC, 40A output QS40.241 DIN-rail power supply joins the already very successful CP20.241-V1 24VDC, 20A model and both belong to the PULS DIMENSION series, which provide efficient solutions for designers and systems integrators requiring powerful and space-saving DIN rail power supplies. The QS40.241 DIN-rail power supply offers extremely high efficiency in a very compact footprint by using the latest synchronous rectification technology, a bridgeless PFC circuit and a number of other proprietary design details. Large power reserves of 150% and built-in large sized output capacitors support the starting of heavy loads such as DC motors or capacitive loads. In many cases this allows the use of a unit from a lower wattage class saving space reducing costs.

DC/DC Power Density in a SIP-8 Package
news image
Full press release:
recom-power.com
  • Product Release
  • 2020-02-24

RECOM announces the launch of its RS12-Z series of 4:1 input DC/DC converters, providing 12W in a SIP-8 package. Leveraging advanced planar technology, RECOM now offers a full 12W output in the industry-standard SIP-8 package from their new RS12-Z series of DC/DC converters up to 75 °C in free air, the highest power available in this format. With a footprint of just 2cm², the range features 4:1 inputs of 9 – 36V or 18 – 75V with surge ratings to 50V and 100V respectively and regulated single outputs of 3.3, 5, 12, 15 or 24V, all trimmable +/-10% and with remote on/off control. Short circuit and under-voltage protection are included along with 3kVDC/1s isolation and EN 62368-1 certification. EN 55032 class A or class B EMC levels are met with a simple, low cost external filter. The series features a metal casing providing EMI shielding as well as enhanced thermal performance with case tabs providing mechanical stability and additional heat sinking to the customer's PCB. "We have incorporated radical design changes in our new RS12-Z series, with a planar transformer construction and metal casing to push the limits of power density achievable in the SIP-8 package" commented Steve Roberts, Innovation Manager at RECOM. "The series is ideal for nominal 12, 24 or 48V systems where real estate is at a premium and full power is needed over a wide temperature range."

Battery Cell Competence Center
news image
Full press release:
about.keysight.com/newsroom
  • Industry News
  • 2020-02-21

Keysight Technologies announced the use of Keysight's Scienlab Battery Test Solution for comprehensive battery cell test in the recently opened BMW Group Battery Cell Competence Center in Munich, Germany. Keysight's Scienlab Battery Test Solution is comprised of Keysight's Scienlab Battery Test Systems to provide precise measurement results, and PathWave Lab Operations software, which ensures an optimized test lab operation by managing resources, hardware and information. Comprehensive functions provided by the solution support the planning and execution of test procedures including schedule definition, management, control and monitoring of the battery test systems and device under test. It also analyzes test results as well as the overall efficiency of the lab to identify potential improvements. "Our long-standing partnership with the BMW Group is based on mutual inspiration and collaboration as we work together to address the challenges associated with automotive power train electrification," stated Dr. Michael Schugt, senior manager of Keysight's Automotive and Energy Scienlab E-Mobility business. "We are proud to support the car manufacturers objectives with our innovative solutions and extensive expertise in battery test to continue driving e-mobility forward."

Ball-Attach and Flip-Chip Flux Introduced
news image
Full press release:
indium.com/news
  • Product Release
  • 2020-02-20

Indium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. WS-446HF is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces-including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.

• Includes a chemistry that eliminates dendrite issues, especially critical for fine-pitch flip-chip applications
• Provides tackiness suitable for holding solder spheres and large die in place during assembly, eliminating missing balls and reducing die tilt and non-wet-opens due to warpage
• Delivers consistent pin transfer, printing, and dipping performance, ensuring consistent joint quality and improving production yields
• Eliminates the need for multiple fluxing steps, enabling a single-step ball-attach process and eliminating the warpage-inducing effects of prefluxing
• Has good cleanability with room temperature DI water, avoiding the formation of white residue

System for Designing and Measuring Power Systems
news image
Full press release:
ridleyengineering.com
  • Product Release
  • 2020-02-20

Ridley Engineering will release a product March 16, 2020 to enhance its product line. The RidleyBox combines the following-a lifetime license for RidleyWorks Design Software, a 4-channel Frequency Response Analyzer, a 4-channel 200 MHz Oscilloscope, a Ridley Universal Injector, and an Intel computer-all in one product. Live demonstrations will be available at the Applied Power Electronics Conference in New Orleans, LA March 18-20, 2020 in the Exhibit Hall, booth 1517. "This began as a concept to condense our labs for travel and teaching. The resulting product is one from which the entire power electronics community can benefit," commented Dr. Ridley.

Power Supply Series Includes Two and Four Channel Models
news image
Full press release:
rohde-schwarz.com/news-press
  • Product Release
  • 2020-02-20

For any test and measurement application requiring up to four independent DC power supplies with full flexibility, full functionality, full safety and full connectivity, the Rohde &Schwarz NGP800 power supply series will boost the efficiency in any lab or production line. Users benefit from the large 5" high resolution touch screen, which also displays detailed statistics. The five R&S NGP800 models meet the needs of users seeking minimum device footprint for two or four independent power supplies, with maximum flexibility for voltages up to 250 V, currents up to 80 A and power up to 800 W. Each channel supplies up to 200 W with a maximum of 20 A or 64 V, also covering 48 V automotive and industrial applications. Channels can be operated fully independently or synchronized; the electrically equivalent and galvanically isolated outputs can be wired in series for outputs up to 250 V or in parallel for up to 80 A. The tracking function makes it possible for users to adjust voltage and current simultaneously on selected channels, with programmable output delays used to meet specific power-up sequences. The supplied voltage can be ramped up to the required level in any period from 10 ms to a minute. All outputs operate in either constant voltage mode or constant current mode.

BCD-on-SOI Technology Platform
news image
Full press release:
xfab.com/news
  • Product Release
  • 2020-02-20

X-FAB Silicon Foundries SE has announced the availability of medium-voltage transistors – complementing the company's leading 180nm BCD-on-SOI technology platform (XT018). The medium voltage devices cover voltages from 12V to 32V. With that customers now have access to a complete portfolio of different voltage options – covering a 10V to 200V voltage range. These complementary NMOS/PMOS devices support automotive AEC-Q100 grade 0 designs and deliver competitive on-resistance (Rdson) figures combined with robust safe-operating areas for Rdson, Idsat and Vth. Designs may be optimized for operational performance and size by selecting the most appropriate transistors. X-FAB's XT018 technology is also the only one that offers a full range of automotive grade-0 qualified memory options, including SONOS-based Flash and embedded EEPROM. In addition to the availability of the medium-voltage devices, X-FAB has also announced the full volume production of the 70V to 125V high-voltage transistors that it first released last summer. These devices are mainly targeted at the growing market for automotive 48V board net and battery management system (BMS) ICs. X-FAB has already received a number of customer designs that utilize the different voltage options in automotive, industrial and consumer applications. BCD-on-SOI is superior in many aspects when compared to conventional bulk BCD technologies, making it very attractive to design engineers.

Becoming a Carbon-Neutral Company
news image
Full press release:
infineon.com/press-releases
  • Industry News
  • 2020-02-20

Infineon Technologies AG will become carbon-neutral by 2030. The company presented its plans at its Annual General Meeting in Munich. Infineon is thus making an active contribution to reducing CO 2 worldwide and achieving the targets defined in the Paris Climate Agreement. The objective relates to its own greenhouse gas footprint and includes not only all direct emissions, but also indirect emissions from electricity and heat production. Emissions are to be cut by 70 percent over the 2019 levels by 2025. Energy efficiency and hence reducing CO 2 emissions have long been core elements of Infineon's business model. Making life greener is part of the company's mission. Through the use of its products and solutions by the customers of Infineon, 40 times more CO 2 can currently be avoided than is generated during production. With its goal of going carbon neutral, the company is thus taking the next strategic step to fulfill its own mission. "Climate change threatens the global ecosystem and so the very existence of mankind," said Dr. Reinhard Ploss, Chief Executive Officer of Infineon. "It's an acknowledged fact that we need to act. With our goal to become carbon-neutral, we are making a pledge by which others outside the company can measure us."

Accelerate Market Adoption of Gallium Nitride-Based Products
news image
Full press release:
newsroom.st.com/media-center
  • Industry News
  • 2020-02-20

STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market. Through this collaboration, ST's innovative and strategic GaN products will be manufactured using TSMC's leading GaN process technology. GaN is a wide bandgap semiconductor material which offers significant benefits over traditional Silicon-based semiconductors for power applications. These benefits include greater energy efficiency at higher power, leading to a substantial reduction in parasitic power losses. GaN technology also allows the design of more compact devices for better form factors. Additionally, GaN-based devices switch at speeds as much as 10X faster than Silicon-based devices while operating at higher peak temperatures. These robust and intrinsic material characteristics make GaN ideally suited for broad-based adoption in evolving automotive, industrial, telecom, and specific consumer applications across both the 100V and the 650V clusters. Specifically, Power GaN and GaN IC technology-based products will enable ST to provide solutions for medium and high-power applications with better efficiency compared to silicon technologies on the same topologies, including automotive converters and chargers for hybrid and electric vehicles. Power GaN and GaN IC technologies will help accelerate the megatrend of the electrification of consumer and commercial vehicles.

Belgian National Company Opened
news image
Full press release:
we-online.com/news
  • Industry News
  • 2020-02-20

Würth Elektronik continues its international expansion course and with the opening of Würth Elektronik België BV which celebrated the 23rd sales branch. From Turnhout, to the east of Antwerp, electronics developers and manufacturers throughout Belgium and Luxembourg are supported by five technical field staffers, who in turn are supported by a three back office staff. Components and samples are supplied within 24 hours from the central warehouses in Germany and France. Würth Elektronik has been active in Belgium with local employees since 2006. This is now followed by the conversion into a separate national company. "The foundation of the new company is a logical step in the positive development of the Würth Elektronik eiSos Group in BeNeLux. This creates the basis for further growth," said Thomas Schrott, CEO of the Würth Elektronik eiSos Group, on the occasion of the foundation of the Belgian sales office. The Country Manager is Dimitri Verhaert, who has established Würth Elektronik in the Belgian market with growing success since 2006.

Successful Business Year 2019
news image
Full press release:
bmz-group.com/media
  • Industry News
  • 2020-02-19

BMZ Poland, second largest production site of the international BMZ Group, doubles production area and reports 10% sales growth and thereby record results for the business year 2019. The past year 2019 led to a very positive result at the Polish subsidiary BMZ Poland, particularly in terms of operating profit growth. The economic situation has become more volatile, while global growth has slowed noticeably. Despite an increasingly difficult market environment, BMZ Poland remains on its course. This is a confirmation of the BMZ Group's continuous growth averaging 30% per year. In each month of the past year, activities were focused on sales and, in particular, results, which led to a significantly higher gross margin of 11% at the end of 2019, an increase of almost 50% over the previous year, confirming the confidence of customers in the BMZ brand. These good performances are the result of implemented optimization and production process balancing changes. New key customers, all leading OEMs in Europe, from the e-bus and power tool sectors are opening up access to fast-growing markets such as bus electrification. These customers ensure a stable order situation throughout 2020.

Investment for Design Center in Dublin, Ireland
news image
Full press release:
maximintegrated.com/newsroom
  • Industry News
  • 2020-02-19

Maxim Integrated announced the opening of a design center in Dublin, Ireland. The design center will focus on product development and conducting research and development in the areas of analog semiconductor design to deliver Maxim's innovative solutions across many end markets. To make this vision a reality, the company will recruit a strong team of mixed-signal and analog design engineers at this facility. The $25M investment will be primarily geared towards recruiting talent, equipment and building costs, as well as research and development. Located on the south side of Dublin, this is Maxim's seventh design center located in Europe. "With our rich history and depth of talent, I'm thrilled that Maxim Integrated has chosen Dublin for this important investment," said John Kirwan, vice president of Global Customer Operations at Maxim Integrated. "We encourage collaboration between employees representing a wealth of diverse, global experiences, from recent graduates of local universities to veteran designers who have been in the industry for many years." "Maxim's innovative IC designers create products that truly excite their design engineering customers and change everyday lives," said David Dwelley, chief technology officer at Maxim Integrated. "With this new facility, we plan to reinvent the way we develop technology and push innovation even further, giving our customers the products they need to succeed."

Developing of A/D Converter Circuit Together
news image
Full press release:
renesas.com/press-center
  • Industry News
  • 2020-02-19

Renesas Electronics and Hitachi announced a technology collaboration to enable continuous-time digital calibration of a delta-sigma (ΔΣ) modulator and an analog-to-digital (A/D) converter circuit. Designed to boost the performance of ΔΣ A/D converters for stable performance under the harsh conditions required for automotive semiconductor devices, the technology comprises enhanced precision by using a least mean square (LMS) algorithm to measure and calibrate the transfer function of a continuous-time ΔΣ modulator, and the world’s first multi-rate LMS search algorithm, which lowers the order and operating frequency of the coefficient search circuit and FIR digital filter to reduce power consumption. The results of this joint effort with Hitachi were presented by Renesas on February 18 at the International Solid-State Circuits Conference (ISSCC) 2020. In recent years, as advanced driver assistance systems (ADAS) and self-driving vehicles come closer to becoming a reality, there has been an increasing need for automobiles to incorporate a variety of sensors, such as millimeter wave radar, LiDAR, and ultrasonic wave sensors, in order to detect objects and people, and to provide an awareness of the vehicle’s surroundings. A/D converters used to convert analog signals from such sensors into digital signals must operate at a high speed and with high precision. However, the harsh conditions specific to automotive vehicles have made obtaining stable performance an important issue.

High Clearance / Creepage Distance Isolation Power Transformer Series
news image
Full press release:
bourns.com/news
  • Product Release
  • 2020-02-19

Bourns introduced its high clearance/creepage distance isolation power transformer series. Bourns Model HCT series high-voltage isolation push-pull transformers are AEC-Q200 compliant. Bourns designed its latest transformer series to support isolated interface power for CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower-power LAN. Solutions that simplify isolated interface power are required in a broad range of applications including those designed to meet Industry 4.0 and in low/medium risk medical sensors, communication PHYs and metering. The capabilities of the Bourns Model HCT series are also ideal solutions for circuits requiring low DC power and any application where isolation from potentially hazardous voltages are needed such as from a high-voltage battery. The Bourns Model HCT series features an input range of 3.3 to 5 V and delivers 3.3 to 15 V and up to 350 mA output, configured in a variety of turns ratios. The series is constructed with a ferrite toroid core for high coupling factor and efficiency. Furthermore, the power transformers are offered in a low-profile 6.5 mm housing with reinforced insulation, at least 8 mm clearance / creepage distance and 4.2kVac withstanding voltage to provide an elevated degree of isolation from high voltage hazards.

Linear Thermistors Offer High Accuracy
news image
Full press release:
news.ti.com
  • Product Release
  • 2020-02-17

Texas Instruments (TI) expanded its temperature sensing portfolio to include linear thermistors that deliver up to 50% higher accuracy than negative temperature coefficient (NTC) thermistors. The higher accuracy of TI's thermistors enables operation closer to the thermal limits of the other components and the overall system, helping engineers maximize performance while reducing bill-of-materials (BOM) and total solution cost. TI's thermistors deliver reliable, highly accurate thermal measurements, particularly at temperatures above 80°C. This is especially important for industrial, automotive and consumer applications where precise, real-time temperature readings are fundamental to system performance and protection. NTC thermistors provide less accurate temperature readings due to their low sensitivity and high resistance tolerance at temperature extremes. To compensate for these challenges, many engineers calibrate at three points across the temperature range or use multiple thermistors to monitor different temperature ranges. These approaches can still produce unreliable temperature readings, which can require systems to shut down before reaching their true thermal limit. The linearity and high accuracy of TI's thermistors enable single-point calibration, which maximizes system performance and simplifies design.

Automotive CAN Isolated Transceiver Module
news image
Full press release:
mornsun-power.com
  • Product Release
  • 2020-02-13

Thanks to the simple CAN bus transmission and wiring, as well as the strong anti-interference ability, CAN bus has become the preferred communication protocol for the automotive electronics industry. Mornsun released an automotive CAN transceiver module series CTD-CAN. From design, verification to production processes, this CTD-CAN series is completely in accordance with IATF16949 system requirements and meets AEC-Q100 standards. With the design concept of compact size, SMD package high reliability and efficient production, the CTD-CAN series adopts IC integrated technology to integrate power isolation, signal isolation, CAN transceiver and bus protection in one module, which effectively solves the bus interference, abnormal communication issues. It can be used in applications of automotive electronics, automotive peripherals, instrumentation, communication, grid, etc.

Electrically Conductive Plastic Offers Flammability Rating
news image
Full press release:
parker.com/chomerics
  • Product Release
  • 2020-02-12

Chomerics Europe, a division of Parker Hannifin Corporation, has launched PREMIER PBT-250FR for EMI shielding in automotive applications. This polybutylene terephthalate (PBT) plastic will come to the assistance of any design engineer seeking a single pellet, electrically conductive, flame retardant material offering high levels of reliability whenever there is potential for fuel exposure or issues surrounding automotive fluid compatibility, thus providing complete peace of mind for the customer and end user. Of particular note, at 2.5mm thick, the material has been designated 5VA, the highest flammability rating from UL 94, the Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances. This level of flame retardant performance is obviously essential when the application involves highly flammable fluids. A 5VA rating means burning stops inside 60 seconds on a vertical specimen without dripping (and without creating a hole in the specimen). For those who require a thinner EMI housing, PREMIER PBT-250FR carries a UL 94 rating of V-0 at 1.5mm thick. "In ongoing discussions with our partners, one request we kept hearing over and over was how an electrically conductive plastic with a 5VA flammability rating would address a major gap in the marketplace," states John Beswick, engineered plastics solutions business unit manager, Parker Chomerics.

Thermal Conductivity Materials for High Power Applications
  • Product Release
  • 2020-02-12

Henkel announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. BERGQUIST GAP PAD TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today, an innovation which earned the material a coveted Circuits Assembly NPI Award at last month's IPC APEX EXPO event. "Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm," explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. "High-end routers, servers, switches and base band units continue to pack more capability into already small footprints. High thermal conductivity solutions are a necessity to dissipate the resulting heat for assurance of system reliability and optimal performance." Well-known for their high compliance, surface conformability and low stress, BERGQUIST GAP PADs have long been employed for telecom and datacom applications to effectively minimize the adverse impact of heat on device operation and lifetime. Henkel, addressing current and future market requirements, developed the latest GAP PAD to manage the challenging thermal loads inherent with increased power densities.

Battery Electric Vehicle Architectures Congress
news image
Full press release:
beva-alm-europe.com
  • Event News
  • 2020-02-10

To realise the transition towards zero-emission high-efficiency vehicles, battery weight reduction and design of lightweight structures become the main challenge for the automotive industry. To realise the transition, OEMs need to identify the right strategies in selecting and utilising lightweight materials; taking safety, performance, production volume and manufacturability into consideration, for longer range, with lower cost. Optimisation in design, engineering and manufacturing are key issues for all OEMs. In order to directly address these, and identify solutions, LBCG is delighted to announce the Battery Electric Vehicle Architectures & Lightweight Materials 2020 Congress, May 5 & 6, 2020, Munich, Germany, a combination of our successful BEVA series and GALM series on BEV lightweight structures and material utilisation.

Source-Down 25 V Power MOSFET
news image
Full press release:
infineon.com/market-news
  • Product Release
  • 2020-02-10

Infineon Technologies is focusing on system innovation with enhancements on component level by addressing the challenges of modern power management designs. The Source Down is the new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS TM 25 V in a PQFN 3.3x3.3 mm. The device sets a new industry benchmark in MOSFET performance, reducing on-state resistance (R DS(on)) and offering superior thermal management capability to the marketplace. The product is well-suited for a wide range of applications such as drives, SMPS (including server, telecom, and OR-ing) and battery management. The package concept connects the source potential (instead of the drain potential) to the thermal pad. Along with the enabled new PCB layout possibilities, this helps achieving ever higher power density and performance. Two different footprint versions are released – the Source-Down Standard-Gate and the Source-Down Center-Gate in a PQFN 3.3x3.3 mm package. The Source-Down Standard-Gate footprint is based on the current PQFN 3.3x3.3 mm pinout configuration. The location of the electrical connection remains the same, simplifying the drop-in replacement of today's standard Drain-Down packages with the new Source-Down package. For the Center-Gate version, the gate-pin is moved to the center supporting easy parallel configuration of multiple MOSFETs.

Iso 13485:2016 Certification Achieved
news image
Full press release:
eospower.com/News.pdf
  • Industry News
  • 2020-02-06

EOS Power is proud to announce that it has received certification for ISO 13485:2016, Quality management system for Medical devices. The certification was granted by LL-C Certification, Czech Republic. EOS Power is engaged in design, manufacturing and selling of Medical grade power supplies. EOS Provides standard, modified and custom design power solutions to customer needs. All Medical grade power supplies are approved to latest medical certifications required globally and now in addition EOS Power design process, manufacturing and quality systems are certified to ISO13485 standards. This allows EOS Power to become a "one stop" solution for medical device manufacturers for their power supply and any EMS/PCBA requirements required in their medical application. ISO 13485:2016 standard is recognized by the Global Harmonization Task Force (GHTF) and has become the model QMS standard for the medical industry. "EOS Power's manufacturing facility obtaining ISO 13485:2016 certification is an advantage when working with Medical customers, allows us to add potential opportunities in the medical device markets we have being missing where this certification was required." says Mr. Paul Scholz, VP-Sales. This certification provides additional leverage with customers, added Ms. Teresa Fernandez, EMEA Sales Manager. "Successfully achieving ISO 13485:2016 certification is a huge milestone for EOS Power in its journey of becoming a world class organization. This will certainly help to position EOS Power as a global leader in the medical device industry" says Mr. Vijay Gujarathi, COO and Director.

EMEA Distribution Agreement
news image
Full press release:
schurter.com/Newsroom
  • Industry News
  • 2020-02-06

SCHURTER and TTI are pleased to announce the signing of an EMEA distribution agreement. This will extend the long-standing, successful cooperation in France to include the rest of Europe, Africa and the Middle East. TTI, Inc. was founded in 1971 and now has over 6700 employees across the globe. With the acquisition of Mateleco in France in 2008, TTI has become an important distributor of SCHURTER products. The SCHURTER portfolio and TTI's Specialist passive, electromechanical and discrete strategy are a perfect fit "We are delighted to now be able to offer SCHURTER high quality products to even more customers and combine our value propositions to provide the best service to our customers. We are looking forward to a successful launch and long term partnership", says Felix Corbett, Supplier Marketing Director at TTI Europe. Laurent Brühl, Managing Director of SCHURTER S.A.S., sums up: "TTI has proven to be a reliable and competent partner who has been able to clearly exceed its ambitious goals in the past years of successful cooperation. With TTI as an EMEA wide distributor we will be able to serve various markets even better in the future". With over 133 subsidiaries in Europe, America and Asia, TTI is established as one of the largest distributors of electromechanical components.

PCIM Europe 2020's Trending Topics and Highlights
news image
Full press release:
pcim.mesago.com/press
  • Event News
  • 2020-02-06

Every year the power electronics industry from all over the world meets at the PCIM Europe in Nuremberg. In 2020, trade visitors of the leading international exhibition and conference for power electronics can, once again, look forward to highly specialized highlight topics and an attractive program of lectures. From 5 - 7 May 2020, Nuremberg will revolve around power electronics and its applications. Some 500 exhibiting companies from 30 countries are expected to present a broad range of products and solutions to trade visitors – from components to intelligent systems along the entire value chain. New trends and developments will be presented to the public for the first time at the meeting point for experts from industry and science. Trade visitors will receive a deeper insight into product innovations and enjoy a personal exchange with manufacturers – whether they come from the field of power electronic converter systems, sensors, semiconductors, passive components or power quality and energy storage. For those interested in power electronics for electric mobility, the E-mobility Area is the first place to go. Here, numerous suppliers will provide information on relevant products and components from this application area. In addition, there is a special E-mobility Forum with exciting technical presentations to be discovered on all three days of the exhibition.

Intelligent Power Devices Enabling Standalone System Protection
news image
Full press release:
rohm.com/news
  • Product Release
  • 2020-02-06

ROHM announced the availability of the BV2Hx045EFU-C, a family of high voltage (41V) dual channel output high side switch (Intelligent Power Devices, IPD) optimized for automotive ECUs in transmission control, engine control, and other vehicle systems. IPDs are semiconductor devices that protect electronic circuits from breakdown (i.e. due to overcurrent during abnormalities). Unlike conventional fuses, IPD as semiconductor fuses can protect circuits without degrading or breaking down, making it possible to achieve maintenance-free systems. The BV2Hx045EFU-C are the industry's first high-side IPDs capable of providing standalone protection against overcurrent by incorporating an original overcurrent protection function. Conventional IPDs only protect against inrush current at startup, so MCUs and overcurrent detection ICs are needed for protection of steady-state currents, and there is still the possibility of an out of control situation due to compatibility issues with subsequent circuits connected to the IPD output. In contrast, this new series can protect the system against both inrush and steady state overcurrent, ensuring greater system safety by providing a high reliability solution with fewer parts compared to conventional products. In addition, the overcurrent protection range can be adjusted with external components to enable broad compatibility.

24V Industrial Power Supply
news image
Full press release:
emea.lambda.tdk.com/news
  • Product Release
  • 2020-02-05

TDK Corporation announces the introduction of the TPS4000-24 power supply rated at up to 4,080W at 24V. The TPS series can operate automatically from 400, 440, and 480Vac nominal delta or WYE inputs, without wiring changes or the need for large, costly step-down transformers. This industrial grade power supply is ideal for use in a wide range of applications including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, laser cutting and RF power amplifiers. The TPS4000 is fully featured with output voltage and current programming, warning signals, configurable remote on/off, a 12V 0.3A standby voltage and a PMBus interface. Using this communications function allows remote monitoring of the output voltage, output current, internal temperature, status signals and fan speed. The output voltage, over current limit and the remote on/off are programmable via the PMBus. The output voltage is adjustable from 19.2 to 28.5V and the current limit point by 70-105% using front panel potentiometers or an analogue 0-5Vdc voltage. An internal ORing FET simplifies the parallel operation of up to 8 units for redundant or higher power requirements. Excluding the output busbars, the unit measures 107 x 84.4 x 335mm, making it suitable for 2U high racking systems. The weight of the product is just 4kg.

ees Europe 2020: Energy Storage for Companies
news image
Full press release:
ees-europe.com/news-press
  • Event News
  • 2020-02-04

From June 17 to 19, 2020, ees Europe is set to showcase a wide range of market-ready energy storage systems at Messe Mu¨nchen and highlight the progress made by the storage industry as a whole over the past few years. The exhibition is part of The smarter E Europe, the innovation hub for new energy solutions. 55 percent of managers are reporting competitive advantages as a result of their commitment to the climate, while 79 percent say an improved brand reputation has been their biggest economic advantage. Moreover, 52 percent are finding that investors have greater trust in them, and 63 percent say that they are driving innovation as a result of their climate targets. The potential of reducing carbon emissions and the economic benefits of using intelligent energy storage systems are so great that innovative solutions are now being implemented in numerous areas across a variety of economic sectors. The energy industry has come to understand that it's not enough to simply use batteries on their quest to become carbon neutral – the battery production process also needs to be optimized in terms of carbon emission reductions. The battery manufacturer "Northvolt", for example, wants to manufacture the world's greenest battery using hydropower from the north of Sweden. Its plant in Skelleftea° is operated using electricity from hydropower, with excess heat stored and fed into the local power grid. The raw materials used for the batteries are obtained from reliable, secure sources. From 2024 onwards, the company intends to supply more than 400,000 car batteries each year.

The World of Power Semiconductor Devices Meets in Vienna
news image
Full press release:
ispsd2020.com
  • Event News
  • 2020-02-03

The 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) will be held in Vienna, Austria, May 17–21, 2020. It is the premier forum for technical discussion in all areas of power semiconductor devices, power integrated circuits, their hybrid technologies, and applications. With an attendance of about 500 experts it is firmly established as the must-attend conference for the power semiconductor industry reflecting the growing importance of power electronics and power semiconductors for a sustainable world. It is technical co-sponsored by IEEE and its societies EDS, PELS and IAS, as well as by ECPE and IEEJ. The ISPSD captures all areas of power semiconductor devices and power integrated circuits (low and high voltage power devices & circuits, all semiconductor materials including Si, SiC, GaN and Ga2O3, as well as power semiconductor packaging). The conference offers an attractive short course program on Sunday covering important topics like modelling of package parasitics for fast switching devices, system level optimization of power converters, bipolar and super junction device concepts for SiC, GaN integrated circuit design, processes and devices with materials beyond SiC & GaN (like AlN, Ga2O3), and last but not least silicon high power devices (IGBTs and Fast Recovery Diodes).

E Cores Solve Challenging Power Conversion Applications
news image
Full press release:
micrometals.com/shapes/e-core
  • Product Release
  • 2020-02-01

Micrometals continues to expand their prototyping and custom core capabilities with the expansion of E Core variations available. Micrometals E Cores are renowned for their performance and quality by delivering exceptional part-to-part consistency. With over 20 industry standard E Core sizes, from 12.7mm to 210mm, in both Iron and Alloy materials, Micrometals leads the industry in COTS shapes and materials. One significant advantage to Micrometal's E Cores are their distributed gap materials, which do not require any gapping to improve saturation like ferrite cores. The expanded prototyping and customization capabilities allows Micrometals to customize their standard E Cores by shaping the outer legs or center post to improve the usability for customers. This customization permits the use of pre-wound coils for higher winding density compared to traditionally square shaped E Cores. Further, these custom E Cores deliver superior performance compared to similar shaped cores that are custom tooled. Jim Cox, Micrometals President commented "For decades, our customers have trusted Micrometals cores to deliver exceptional reliability, consistency and performance. With these expanded customization capabilities we deliver that same performance and consistency, but with more application friendly features that exceed our customer's expectations in terms of performance and functionality. Customer are also thrilled that they can get these as prototypes or production parts without any tooling costs, allowing them to test multiple designs without a large investment."

PEMD 2020
news image
Full press release:
theiet.org/pemd
  • Event News
  • 2020-01-29

10th International Conference on Power Electronics, Machines and Drives

21 - 23 April 2020. East Midlands Conference Centre, Nottingham, UK

We're pleased to be a media partner of #PEMD2020 – the IET's popular conference on power electronics, machines and drives. The conference includes 39 sessions of the high quality, technical content that PEMD is so well known for. You will gain insight into the latest developments, learn from authors worldwide and put you and your organisation ahead of the game! Technical sessions include novel converter topologies and applications, permanent magnet machines, machine control, advanced manufacturing and power electronic converters for energy systems. See the full programme at

Low RDS(on) MOSFET
news image
Full press release:
nexperia.com/press-releases
  • Product Release
  • 2020-01-29

Nexperia announced the release of its lowest-ever RDS(on) power MOSFET. The PSMNR51-25YLH sets a new standard of 0.57 m? at 25 V. Utilising Nexperia's NextPowerS3 technology, this performance is offered without compromising other important parameters such as maximum drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG. Very low RDS(on) devices are required in many applications such as ORing, hot-swap operation, synchronous rectification, motor control and battery protection, to reduce I²R losses and increase efficiency. However, some competing devices with similar RDS(on) values suffer from reduced SOA – a measure of the ruggedness of the MOSFET – and reduced ID(max)) ratings due to shrinking cell-pitches. Nexperia's PSMNR51-25YLH MOSFET offers a maximum drain current rating up to 380 Amps. This parameter is especially important in motor control applications where motor-stall can result in very high current surges for short periods, which the MOSFET must withstand for safe and reliable operation. Some competitors provide only computed ID(max) whereas Nexperia demonstrates continuous current capability up to 380 Amps. The device is packaged in LFPAK56, Nexperia's 5mm x 6mm Power-SO8 compatible package, offering a high performance copper-clip construction which absorbs thermal stresses, increasing quality & lifetime reliability.

Wide Bandgap Power Amplifier
news image
Full press release:
mouser.com/pressroom
  • Product Release
  • 2020-01-28

Mouser Electronics continues to push forward with new product introduction activity in the analogue space, by adding further Qorvo devices to its expansive portfolio. The 100-W QPA3069 power amplifier is predominantly focused on defence and avionics applications (such as radar). This high power density IC covers the 2.7-GHz to 3.5-GHz radio frequency (RF) band and offers a 25-dB power gain along with a 53% power-added efficiency (PAE). Fabricated using Qorvo's 0.25-µm gallium nitride on silicon carbide (GaN-on-SiC) semiconductor process, this high-performance S-band amplifier has greater than 58-dBm of saturated output power and is subject to only minimal power losses. It is supplied in a compact 7.0-mm × 7.0-mm × 0.85mm package, with each of its two RF ports incorporating a DC blocking capacitor. A minus 40 to 85 degree Celsius operational temperature range is supported.

Jetting Solder Paste
news image
Full press release:
indium.com/news
  • Product Release
  • 2020-01-28

Indium Corporation continues to develop innovative solder paste solutions to fit customers' needs. PicoShot NC-5M is designed for customers needing a no-clean halogen-free SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules. PicoShot NC-5M jetting solder paste is the first material to come out of Indium Corporation's new partnership with Mycronic, a global leader in dispensing and jet printing equipment. PicoShot NC-5M is a no-clean halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic's MY 600/700 jetting systems. PicoShot can be used in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield attach, and microBGA. It also complements the stencil printing of Indium8.9HF. Designed as a no-clean solder paste, PicoShot can be cleaned easily with industry standard cleaning solutions. Indium Corporation also offers a PicoShot NC-5M conditioner (purging gel) designed to allow the rapid purging, cleaning, and long-term storage of jetting, dispense, and microdispense systems without the use of liquid solvents. PicoShot Conditioner C-1 is a chemically benign, bright blue-colored translucent, viscous gel that aids in visual endpoint detection and prevents inconsistent dispense volumes and clogging caused by solder paste dry-out.

Shining the Spotlight on Intelligent Charging Systems 
news image
Full press release:
powertodrive.de/press-releases
  • Event News
  • 2020-01-28

The expansion of charging infrastructure is one of the most important factors that will determine the success of the transportation transition. With this in mind, many European countries are stepping up investments in this infrastructure. Smart charging is resulting in e-mobility becoming increasingly intelligent by, for example, charging electric cars when it makes economic sense to do so or by allowing car batteries to temporarily store electricity for use in the car owner's home or the power grid. A new white paper produced by the European business association SmartEN (Smart Energy Europe) in cooperation with Power2Drive Europe, the international exhibition for charging infrastructure and e-mobility, sheds light on the latest trends. The topic will also be a key feature of the exhibition itself, which will take place in Munich from June 17 to 19, 2020. One highlight of the event will be the introduction of new smart charging and vehicle-to-grid concepts (V2G).

Signal Integrity Debugging with Jitter Decomposition
news image
Full press release:
rohde-schwarz.com/news-press
  • Product Release
  • 2020-01-23

Rohde & Schwarz has developed method for analyzing the individual components of jitter, providing electronic circuit designers with previously unavailable in-depth knowledge invaluable for debugging high-speed signals. As data rates increase and voltage swings decrease, the jitter in digital interfaces becomes a significant percentage of the signaling interval, and potential source of failures. Increasingly, engineers require tools that accurately characterize the signal jitter including the break-down into its individual components. The R&S RTO-/ RTP-K133 advanced jitter analysis option introduces an analytic approach to separating the individual components of jitter such as random jitter, and deterministic jitter components, such as data dependent and periodic jitter. This approach is based on a parametric signal model that fully characterizes the behavior of the transmission link under test. A core benefit of this Rohde & Schwarz method is that the jitter model includes the complete waveform characteristic of the signal under test, in contrast to conventional methods that reduce the data to a set of Time Interval Error measurements. The result is consistent measurement data even for relatively short signal sequences, plus previously unavailable information such as the step response, or a distinction between vertical and horizontal periodic jitter.

Non-Isolated Converter Saves Board Area
news image
Full press release:
emea.lambda.tdk.com/i6a
  • Product Release
  • 2020-01-22

TDK Corporation announces the addition of the TDK-Lambda brand i6A4W SIP (Single Inline Package) to the popular i6A series of 250W rated non-isolated DC-DC converters. Requiring less than 3 cm2 (0.47in2) of board area, this provides a saving of 60% over the i6A 1/16th brick package. Offering adjustment ranges of up to 3.3V to 40V the 10 to 20A rated step-down converters can accept input voltages between 9 and 53V. The i6A4W series allows the creation of multiple, high current output voltages from a single output 12V, 24V, 36V or 48V AC-DC power supply, and is suitable for use in communications, industrial, test and measurement, broadcast and portable equipment. With overall dimensions of 33 mm x 11.4 mm x 24.8 mm (L x W x H), these converters have ultra-high efficiencies of up to 97%. This allows operation in ambient temperatures of -40°C to +125°C with the minimised output derating, even in low airflow and high ambient temperature conditions. The product's optimised dynamic voltage response reduces the need for external capacitors, saving cost and additional board space. Standard features include a trim pin for output voltage adjustment, + remote sense, remote on-off (positive or negative logic), input under-voltage, over-current and over-temperature protection. Power good, operating frequency synchronisation and output sequencing are available as options.

Reduce System Costs for Inverters
news image
Full press release:
infineon.com/market-news
  • Industry News
  • 2020-01-21

The installed photovoltaic capacity is growing rapidly worldwide. Photovoltaic systems with a total output of around 600 GW now supply clean and cost-effective electricity – replacing around 600 medium-sized coal-fired power plants. SMA Solar Technology AG (SMA) and Infineon Technologies support this growth trend with the latest generation of innovative silicon carbide (SiC)-based solar inverters. The semiconductor material reduces the system costs for inverters and increases their efficiency. The production costs for solar power are thus further reduced. With the Sunny Highpower PEAK3 from SMA, available since 2019, decentralized photovoltaic power plants can be planned flexibly and efficiently up to the megawatt range. The basis for this is the compact design designed for 1500 VDC, which delivers an output of 150 kW per unit. This is made possible by SiC technology from Infineon: Six power modules of the type CoolSiC EasyPACK 2B and 36 gate drivers of the EiceDRIVER family 1ED20 convert the direct current generated by the solar cells into grid-compatible alternating current - with an efficiency of over 99 percent. "Silicon carbide enables us to build the inverters compact, powerful and reliable," said Sven Bremicker, Head of Technology Development Center at SMA. "In the Sunny Highpower PEAK3, the CoolSiC modules almost double the specific output from 0.97 to 1.76 kW/kg. Due to the compact design, the inverters are much easier to transport and much faster to install."

"Not Knowing the Rules Can Ruin Your Power Converter Design"
news image
Full press release:
psma.com
  • Event News
  • 2020-01-21

The Power Sources Manufacturers Association (PSMA) Energy Management Committee is sponsoring Industry Session IS29 at APEC2020 on Thursday, March 19th, at 1:45 pm in the Ernest N. Morial New Orleans Convention Center. Four presentations each address an "if" that can throw a wrench into a power converter design:
•"If Your Efficiency is Too Low, Your Sales will be Too Low"
Ada Cheng, Ada'Clock
•"If Your Standby Power is Too High, Your Power Converter Won't Sell"
David Chen, Power Integrations' Director Applications Engineering
•"If Your Power Converter is Not Safe, You May Have an Expensive Recall"
Mark Batulan, Product Safety Engineer, Power Integrations
•"EMI: If You Don't Comply, It Will Interfere with Your Sales."
Jim Spangler, Spangler Prototype
Kevin Parmenter, Taiwan Semiconductor US

Most power converter designers know that a product design must meet its design specification. They may not be aware of regional standards and regulations that also must be met. The testing of the product and its labeling may have special requirements as well. Failure to comply may mean that the product cannot be marketed or used in some jurisdictions or for some applications. The topics in this Industry Session will address the more important standards and regulations that must be met.

PSMA Energy Management Committee Meeting Notice
Interested individuals are also invited to participate in the PSMA Energy Management Committee meeting on Tuesday, March 17th from 2:00 – 4:00 pm to plan the committee program for the coming year.

A New Solar Era in Spain Begins 
news image
Full press release:
thesmartere.com/press-releases
  • Industry News
  • 2020-01-21

By adding an estimated 4.7 GW in 2019, Spain returns to the continent's top solar markets and is the clear market leader in Europe. The forecasts for the future development remain promising. According to Solar Power Europe's "European Market Outlook 2019-2023", Spain is expected to have a compound annual growth rate of 34% by 2023 in the medium scenario. A total installed solar PV capacity of 25.6 GW will then be reached. What role corporate sourcing of renewables and PPAs (Power Purchase Agreements) will play in this process and what obstacles still have to be overcome will be discussed on May 19, 2020 at Intersolar Summit Spain in Barcelona. After a successful start in 2019, Intersolar Summit Spain is taking place for the second time and will welcome more than 250 attendees. At the beginning of 2019, the Spanish government approved the submission of the draft Integrated National Energy and Climate Plan 2021-2030 (NECP/ PNIEC). It defines caps on national greenhouse gas emissions, taking into account renewable energy and energy efficiency measures. The main goals are, to reduce greenhouse gas emissions by 21% with respect to 1990, to achieve 42% renewable energy in the country's final energy use, and to achieve 74% renewable energy in electricity generation by 2030.

Cooling Units Offer Easy Installation
news image
Full press release:
cuidevices.com/press-releases
  • Product Release
  • 2020-01-21

CUI Devices Thermal Management Group announced the addition of two models to its Peltier cooling unit product offering. The CPM-2C and CPM-2H carry 7 A and 8.5 A current ratings respectively, adding to the 6 A current rating of the previously released CPM-2F. As complete Peltier cooling units, the CPM models feature a tighter seal structure for water resistance and absorption of thermal stress as well as easy installation. With wide temperature deltas up to 85.9°C (Th=50°C) and 70 mm x 70 mm package sizes, these thermoelectric cooling units are well suited for industrial, refrigeration, and sealed applications where forced air cooling is not an option. In addition to their tight seal structure and easy installation, the CPM models also integrate CUI Devices' innovative arcTEC structure. This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from premium silicon ingot. When combined, these features reduce stress on the module and improve performance during thermal cycling conditions, while enabling faster, more uniform cooling.

Current Sensors Combine Small Size and High Performance
  • Product Release
  • 2020-01-21

ICE Components announces a series of current sensors for use in a wide range of pcb mount applications. The ISE current sensors measure both DC and AC current from 50A up to 200A. The sensors include an integrated core to improve accuracy and provide protection from external stray fields. The ISE series is available in four standard current ratings of 50A, 100A, 150A and 200A. For applications of over 5k pcs the current sensors can be programmed for unique current ranges or output slopes. They are rated for an operating temperature range of -40 to +130 degrees C.

Key Features Include:
- Integrated bus bar for easy application onto your pcb
- Programmable current measurement slope
- 25.4mm x 18mm footprint and 10.8mm low profile height
- Integrated shield for EMC immunity
- 3 µ-Sec response time (200kHz bandwidth)
- High level of output accuracy
- Outstanding linearity. Predictable output vs. current measurement
- Operates off an input voltage of 5 VDC and provides a 0.5 to 4.5 VDC output voltage that is ratiometric to the input.

SEMICON Korea 2020
news image
Full press release:
semi.website
  • Event News
  • 2020-01-16

Explore what's happening in the Korea electronics manufacturing ecosystem at SEMICON Korea, February 5-7, COEX, Seoul. With over 1,900 booths and over 500 companies from 20 countries you can "Connect, Collaborate, and Innovate." Attend forums in smart manufacturing, metrology and inspection, test, the MEMS & Sensor Summit, AI Summit, and more. Register now.

Integrated Active Clamp Flyback Controllers
  • Product Release
  • 2020-01-16

Silanna Semiconductor announced that its SZ1101 and SZ1105 fully integrated active clamp flyback (ACF) controllers for designing high-power-density AC/DC power adapters are now fully qualified and in production. The SZ1101 33W version is suited for designing mobile phone travel adapters, while the SZ1105 65W version is suited for designing compact adapters for powering notebooks, video game consoles, and multi-port wall chargers. The SZ1101 and SZ1105 Flyback PWM Controllers are unique in that they combine four key ACF components: an advanced adaptive digital ACF controller and three ultra-high-voltage (UHV) components – an active clamp MOSFET, an active clamp FET driver, and a startup voltage regulator. This unprecedented level of integration facilitates designing efficient, high-power-density AC/DC power adapters with low bill-of-material (BOM) cost. Released products and evaluation boards (EVBs) are now available showing industry leading efficiencies in an all-Silicon solution, while achieving more than 6dB margin for Electromagnetic Interference (EMI). "Silanna is excited with the full production release of these parts and is looking forward to the adoption from the many customers currently in design," said Mark Drucker, CEO of Silanna Semiconductor. "Our customers are achieving extremely high power densities by overcoming the thermal challenges of packing increasing amounts of power into today's slim, compact power adapters."

Coalition Dedicated to Corporate Social Responsibility
news image
Full press release:
microchip.com/pressreleasepage
  • Industry News
  • 2020-01-16

Microchip Technology announced it has joined the Responsible Business Alliance (RBA), a nonprofit coalition of companies dedicated to the improvement of social, environmental and ethical conditions in their global supply chains. The RBA Code of Conduct is a set of social, environmental and ethical industry standards. The standards set out in the Code of Conduct reference international norms and standards including but not limited to the Universal Declaration of Human Rights, ILO International Labor Standards, OECD Guidelines for Multinational Enterprises plus ISO and SA standards. "With the principles of corporate social responsibility as a fundamental part of Microchip's DNA, we remain committed in every aspect of our business and operations to advancing human rights, ethics and health and safety worldwide," said Ganesh Moorthy, president and chief operating officer. "Along with RBA member companies, we align under a set of common values that send a clear message of commitment to the global supply base and to our customers." Microchip's values and operating principles including its Code of Business Conduct and Ethics, certifications, sustainability reporting and other standards are reflected in the company's practices and actions of employees worldwide. Microchip is committed to aligning with organizations and companies worldwide to advocate for principals regarding workforce and labor standards, human rights, sustainability and anti-corruption.

Programmable DC Load Product Series
news image
Full press release:
vitrek.com/press
  • Product Release
  • 2020-01-15

Vitrek introduces the DL Series of Digital, Programmable DC Loads, designed to support the testing requirements for the latest generation of off-line power supplies, dc-dc converters and LED drivers. The DL Series is also equipped to handle a wide range of battery testing requirements. The devices are offered in three power ratings (125W, 250W and 500W), each with input voltages of 0-150V or 0-500 VDC. Unlike comparable programmable DC loads, the DL Series is capable of supporting loading sequences utilizing constant voltage (CV), constant resistance (CR), constant current (CC) and constant power (CW) in any combination in single or arbitrary sequences of up to 100 steps. The DL Series provides high-current transient loading capability twenty times higher than other units in this class while also being capable of generating µA loads. Measurement accuracy is typically an order of magnitude better at lower loading levels and double that of competing devices at higher loads. The instruments allow for a current or power sweep of up to 500 steps in each direction to and from set values and a voltage dependent current loading mode for complex variable output supplies. Standard OCP/OPP/OTP/OVP features and battery test modes are among other loading modes also included.

Multi-Year Silicon Carbide Wafer Supply Agreement
news image
Full press release:
rohm.com/news
  • Industry News
  • 2020-01-15

ROHM and STMicroelectronics announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe. The agreement governs the supply of over 120 million dollars of advanced 150mm silicon carbide wafers by SiCrystal to STMicroelectronics during this period of demand ramp-up for silicon carbide power devices. "This additional long-term SiC substrate supply agreement comes on top of the external capacity we have already secured and the internal capacity we are ramping. It will enable ST to increase the volume and balance of the wafers we will need to meet the strong demand ramp-up from customers for automotive and industrial programs over the next years", said Jean-Marc Chery, President and CEO of STMicroelectronics. "SiCrystal is a group company of ROHM and has been manufacturing SiC wafers for many years. We are very pleased to enter into this supply agreement with our longstanding customer ST. We will continue to support our partner to expand silicon carbide business by ramping up wafer quantities continuously and by providing reliable quality at all times", said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company. The adoption of power solutions with SiCs is accelerating in both the automotive and industrial markets. With this agreement, the two companies will contribute to the widespread use of SiC in these markets.

SiC-based Power Converters Using Gate Drive Evaluation Platform
news image
Full press release:
littelfuse.com/news-releases
  • Product Release
  • 2020-01-15

Littelfuse, Inc. announced the Gate Drive Evaluation Platform (GDEV). The evaluation platform helps designers evaluate SiC MOSFETs, SiC Schottky diodes, and other peripheral components like gate driver circuitry, so that they can better understand how silicon carbide technologies will behave in converter applications under continuous operating conditions. The GDEV offers quick connect header pin terminals that allow for rapid and consistent comparison of different gate drive circuits, unlike most other SiC evaluation platforms. The GDEV supports an 800 V DC link input voltage and up to 200 kHz switching frequency. "The Gate Drive Evaluation Platform (GDEV) is a critical addition to our SiC technology portfolio because SiC is still relatively new and there are some unknowns surrounding the operating characteristics under various conditions," said Corey Deyalsingh, Director, Power Control at Littelfuse.  "The GDEV helps engineers understand the operating characteristics of SiC devices. By utilizing this evaluation platform, designers will be better informed about the incredibly energy efficient opportunities that SiC technologies present. Equipped with that knowledge, we anticipate that designers will be more likely to incorporate SiC into their future designs."

Aluminum Electrolytic Snap-in Capacitors
news image
Full press release:
cde.com/news
  • Product Release
  • 2020-01-15

Cornell Dubilier Electronics, Inc. (CDE) introduces its 381LL series of long-life snap-in aluminum electrolytic capacitors. The series, designated with an expected life of 8,000 hours at full-rated conditions, demonstrates superb stability in capacitance and DC leakage current over time on test. The snap-in series is targeted for use in critical applications where long life and reliability are paramount. Capacitance values range from 740µF to 100,000µF at working voltages of 16 to 250 WVDC with ripple current ratings up to 10 Amps @ 105 °C. The snap-in series is available in two pin configurations in the smaller diameters with 4 and 5 pin options in the larger diameters. General applications include any circuit requiring high capacitance with low ESR, high ripple current and long life. This includes switch-mode power supplies, UPS systems, solar and other high-power inverters. CDE's 381LL, long-life aluminum electrolytic capacitors are available from the company's franchised distributors.

Gate Drivers for Fast Switching SiC Power Modules
news image
Full press release:
cissoid.com/news
  • Product Release
  • 2020-01-14

CISSOID delivers robust Gate Drivers for XM3 SiC MOSFET Power Modules from Wolfspeed. Aiming high power density converters, the Gate Driver board safely drives the fast switching SiC power modules to achieve low losses and operates in high temperature environments found inside space-constrained motor drives, compact power supplies or fast battery chargers. The CMT-TIT0697 Gate Driver board has been designed to be directly mounted on CAB450M12XM3 1200V/450A SiC MOSFET Power Modules. With an on-board isolated power supply delivering up to 2.5W per channel without derating up to 125°C (Ta), the gate driver can drive XM3 modules up to 100KHz, enabling high power density. Peak gate current up to 10A and immunity to high dV/dt (>50KV/µs) make possible to drive the power module with zero gate resistance achieving minimum switching losses. The board withstands isolation voltages up to 3600V (50Hz, 1min) and offers creepage distances of 14mm. Protection functions such as undervoltage lockout (UVLO), Active Miller Clamping (AMC), Desaturation detection and Soft-shut-down (SSD) ensure the safe drive and reliable protection of the power module in case of fault events. 

Gate Drivers Achieve Automotive Qualification
news image
Full press release:
power.com/press-releases
  • Product Release
  • 2020-01-14

Power Integrations announced the launch of its automotive-qualified SID1181KQ SCALE-iDriver gate driver for 750 V-rated IGBTs. The part expands the company's range of auto-qualified driver ICs, following the introduction of the 1200 V SID1182KQ driver IC. Compact, efficient and highly robust, the driver IC uses Power Integrations' high-speed FluxLink communications technology to ensure system safety even during fault conditions. FluxLink technology dramatically improves the reliability and isolation capability of the new AEC-Q100-qualified gate drivers, replacing optocouplers and capacitive or silicon-based inductively coupled solutions. SCALE-iDriver devices also include critical protection features such as desaturation monitoring, primary and secondary Undervoltage Lock-out (UVLO) and Advanced Soft Shut Down (ASSD) that protect the switch during short-circuit turn-off. Comments Michael Hornkamp, senior director of marketing for automotive gate-driver products at Power Integrations: "The SCALE-iDriver family with FluxLink technology supports safe, cost-effective designs for a wide range of IGBT drivers for electric vehicle applications including powertrain, on-board chargers and charger stations, and other high reliability drivers and inverters." SCALE-iDriver ICs minimize the number of external components required, eliminating tantalum and electrolytic capacitors and simplifying the isolated power supply, requiring only one transformer secondary winding. A simple two-layer PCB can be used, further increasing design simplicity and easing supply-chain management.

TestConX Keynote on Materials Science Innovations
news image
Full press release:
indium.com/news-releases
  • People
  • 2020-01-14

Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held March 1-4, 2020 in Mesa, Arizona, USA. Demands for entertainment connectivity, edge computing, energy efficiency, speed, convenience, safety, and much more are driving changes in electronic architecture, especially advanced packaging. In his presentation entitled "Materials Science Innovation in Advanced Packaging", Berntson will examine the advances in materials technologies, with an emphasis on the interconnect systems and thermal management necessary to support these new packages. Performance, processing challenges, and total cost will be discussed for each material, and Berntson will also share some of the roadmap gaps that need to be addressed with new materials and possible solutions. Ross Berntson is President and Chief Operating Officer for Indium Corporation. He is responsible for Indium Corporation's global sales, marketing, technical support, operations, engineering, human resources, and product R&D functions. Berntson joined Indium Corporation in 1996 as a Product Specialist. He quickly rose to the roles of Product Manager, Marketing Leader, Sales Leader, and Tech Support Leader. Most recently, he has served as Executive Vice President and President of Indium Corporation's Asia Holdings. Berntson lived in Singapore for two years, learning much about the daily activities in Southeast Asia and China. While there, he expanded his understanding of the regional business needs and opportunities for our company.

Relay with Power Contacts on NO and NC Side
news image
Full press release:
industry.panasonic.eu
  • Product Release
  • 2020-01-13

More than 30 years ago, Panasonic changed the way how to design safety modules by bringing a low profile 8pole safety relay on the market. Now the launch of the new 1a1b SFM relay will start the next phase of the market revolution. With a height of only 7.8mm and reflow soldering capability, SFM provides great design possibilities and is ready for future production processes. As all Panasonic Industry safety relays, SFM offers power contacts on both NO (6A) and NC (4A) side to control loads like valves directly without another relay in between. Contrarywise, the silver alloy contacts can handle low level loads down to 10V 1mA as well to support e.g. signaling boards in the railway sector. A very high shock and vibration resistance = 20g, low coil holding power of 100mW, an ambient temperature range from -40°C to 85°C and reinforced insulation = 5.5mm (V=230V overvoltage category III, 6KV) on NO side contribute to an almost unlimited field of applications.

Supervisory Board with New Line-Up
news image
Full press release:
infineon.com/press
  • Industry News
  • 2020-01-13

The terms of office of all employee representatives on the Supervisory Board and of six of the eight members on the side of the shareholders will expire at the close of the Annual General Meeting of Infineon Technology. The future employee representatives were already elected in December 2019. The remaining members are to be elected by the shareholders at the upcoming Annual General Meeting; the Supervisory Board proposes Xiaoqun Clever, Dr. Friedrich Eichiner, Dr. Ulrich Spiesshofer and Margret Suckale for election. The re-election of the current shareholder representatives Hans-Ulrich Holdenried and Dr. Manfred Puffer is also planned. The current mandates of the Supervisory Board members Dr. Wolfgang Eder and Géraldine Picaud remain unaffected by the election process at the upcoming Annual General Meeting. Peter Bauer, Dr. Herbert Diess, Prof. Dr. Renate Köcher and Dr. Eckart Sünner will therefore no longer be members of the Supervisory Board.

DC/DC Converter for Industrial & Railway Applications
news image
Full press release:
tracopower.us/tthn10wir
  • Product Release
  • 2020-01-10

TRACO POWER announces their THN 10 WIR series of 10 watt high-density DC/DC Converters in the industry standard 1" x 1" footprint and qualified for rugged industrial and railway applications and certified to EN 50155 and EN 61373 standards. The THN 10WIR series of ruggedized 10 Watt DC/DC converters are designed and manufactured for high reliability in harsh environments. The converters have ultra-wide wide 4:1 input ranges of 9-36, 18-78 and 36-160 VDC with single and dual outputs ranging from 3.3-24 VDC. The innovative design provides high efficiencies up to 90% and enables a full load operating temperature range from -40 to +80°C without derating and increased resistance against electromagnetic interference, shock/vibration and thermal shock. All models are safety approved to IEC/EN/UL 62368-1 with CB Report and EN 50155 certified qualifying them for harsh environments in industrial, railway and transportation systems and further qualified for fire behavior of components per EN 45545-2. Features include: an internal EN 55032 class A input filter; input under-voltage-lockout; short circuit protection; remote On/Off; and output voltage trim. All models offer extreme reliability with an MTBF in excess of 2.3 million hours and are supported by TRACO POWER'S 3 year warranty.

SMD Fuse Family Extended
news image
Full press release:
schurter.com/Newsroom
  • Product Release
  • 2020-01-09

The proven UMF 250 SMD fuse family is extended by a 15 A version. SCHURTER is now offering the UMF 250 in a total of 15 rated currents between 500 mA and 15 A. It is particularly suitable for electromobility applications with higher rated currents.With its quick characteristics (small melting integral) according to IEC 60127-4, the UMF 250 is the logical addition to the successful UMT 250 range. It is sealed against potting compound to achieve a hermetic seal for use in intrinsically safe applications according to ATEX and IECEx requirements. Thanks to its high cycle stability and minimal temperature derating, it is extremely robust and resistant to ageing. Thanks to its low internal resistance, the UMF 250 is ideally suited for primary and secondary protection on SMD circuit boards. Applications of the UMF 250 include the protection of battery-powered systems with high switch-off capacities of 500 A @ 125 VDC (e.g. electromobility). The fuse is also suitable for primary protection in the AC range, for example in voltage regulator modules and charging stations. The UMF 250 can is a halogen-free and RoHS-compliant fuse for lead-free soldering processes. The solder surface compatibility with the most important competitor products allows SCHURTER to offer the UMF 250 as a replacement product. The fuse is cURus approved.

North Carolina State University to Host EnerHarv
news image
Full press release:
psma.com/workshop
  • Event News
  • 2020-01-09

The Power Sources Manufacturers Association (PSMA) and North Carolina StateUniversity (NCSU) are pleased to announce the EnerHarv 2020 International Workshop on Energy Harvesting and Micro-Power Management will be held from June 16-18, 2020 in Raleigh, North Carolina and hosted by North Carolina State University. The event will be managed by the Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (ASSIST) at NCSU. EnerHarv 2020 will build upon the inaugural event held in 2018 at the Tyndall National Institute in Cork, Ireland. The mission remains the same - to create a focal point for a community of experts and users of energy harvesting & related technologies to share knowledge, best practices, roadmaps, experiences and to create opportunities for collaboration primarily in the wireless IoT edge device sector. "EnerHarv was set up as a key biennial event to help solve the 'trillion sensor challenge' of 2025, recognizing that most of the world's IoT devices will require a portable power source such as a battery needing to outlive the device that it powers," commented Brian Zahnstecher, PSMA Energy Harvesting Committee and EnerHarv Co-Chair.

Quad-Output DC/DC µModule Regulators
news image
Full press release:
analog.com
  • Product Release
  • 2020-01-09

Analog Devices, Inc. introduced the LTM4668 and LTM4668A µModule regulators, quad-output DC/DC regulators with up to 4.8A output capability. The devices integrate switching controllers, power FETs, inductors and support components, easing the design process while reducing power consumption and board space. They are ideal for telecom, networking and industrial applications. Operating over an input voltage range of 2.7V to 17V, the LTM4668 and LTM4668A support an output voltage range of 0.6V to 5.5V. The devices support frequency synchronization, PolyPhase operation, selectable Burst Mode operation, 100% duty cycle and low IQ operation. Their high switching frequency and a current mode architecture enable a very fast transient response to line and load changes without sacrificing stability. The LTM4668 and LTM4668A are available today in 6.25mm x 6.25mm x 2.1mm BGA packages.

The Lighting Industry Comes Together
news image
Full press release:
led-professional-symposium.com
  • Event News
  • 2020-01-09

The focus for the workshops and panel discussions at LpS/TiL in Bregenz will be centred around the third industrial revolution and what this really means for lighting designers, technologists, manufacturers and regulators.  All parties can inspire, contribute and influence the next steps companies must make in order to satisfy end-users and harness IoT capabilities. A new industrial revolution is characterized by three major technological advances occurring almost simultaneously; new energy sources, new communication channels and new transport options. Renewable energy sources, the world of the Internet, IoT and self-propelled traffic on land and in the air show these developments in concrete terms. After 200 years of industrial activity, resource depletion and climate change, the lighting industry is navigating future technologies, infrastructure and investment decisions.  There is a palpable biosphere consciousness and drive to protect nature and the environment, to guard our habitat for future generations as well as for ourselves. LpS/TiL 2020 will explore how and with what the light sector, including Photonics, can contribute. The new world for architects is dominated by smart retro-fit programmes and data-driven optimization.  The new world for manufacturers is designing for a circular economy including interoperability and standardization. Eminent speakers from these fields will come together to help share perspectives and understand the necessary collaborations and obstacles ahead.

Competence for System Solutions of Universal Chargers
news image
Full press release:
infineon.com/market-news
  • Industry News
  • 2020-01-09

Infineon Technologies expands with Rompower its expertise for the development of universal chargers with high efficiency and compact design. These USB-PD chargers (Power Delivery) with the universal USB-C connector enable the power supply of e.g. monitors or smart speakers and charge the batteries of mobile devices such as smartphones or tablets. Today, these plugs already perform other functions, such as fast charging smartphones. Using the USB-PD technology, smartphones can be fully charged in less than an hour. USB-PD is made possible by the universal USB-C connector, which allows for higher data transfer and higher power transfer compared to widely established micro-USB and USB-A/B connectors. The next development stage for all these functions will be permanently installed USB-PD wall outlets. With a maximum power output of 100 W made possible by the USB-PD standard, they not only support fast charging of mobile devices, but also function as permanently installed adapters. In the medium term, USB-PD charging sockets will be used in public buildings, such as airports and hotels, as well as in private households and will reduce the need for adapters and chargers. Within the partnership, Infineon will contribute its semiconductor expertise, Rompower will offer its technologies and international know-how in the system area as well as in the construction of compact, small and highly efficient charging solutions. The first step is the development of system solutions for compact fast chargers for smartphones and USB-PD wall outlets. 

Quarter-Brick with Digital Control for Telecom and Compute Equipment
news image
Full press release:
advancedenergy.com
  • Product Release
  • 2020-01-08

Artesyn Embedded Power announced the BDQ1300, a 1300 watt quarter-brick dc-dc converter, designed to provide the highest efficiency on-board 12V output for telecom, computing and server applications, with optional digital control. With efficiency rated over 97 percent, the BDQ1300 is designed as a voltage source for non-isolated point-of-load converters. It can accept an input voltage range from 40 to 60 volts, making it ideal for 48-volt data center and communications network equipment. Rated for up to 110 amps, the Artesyn BDQ1300 is a fully isolated dc-dc converter, which can be applied with separate input and output ground connections. This isolation means that EMI management and any possible fault condition can be contained within the primary side of the converter. The modules use a standard high-current quarter-brick pin-out. A pair of power pins are provided for the positive output and ground connections to enable the current to be conducted to the host PCB. Conduction losses from the module are minimized using large diameter pins.

Fuses Designed for Automotive and In-Rush Current Applications
news image
Full press release:
belfuse.com/news
  • Product Release
  • 2020-01-08

Bel Fuse-Circuit Protection announces their 0680L Series of ceramic surface mount fuses with in-rush current withstand capability in a 2410 SMD package size. These slow blow fuses are designed for automotive and applications which require high DC voltage ratings and high DC interrupting ratings. Bel's 0680L Series fuses are compatible with the 260º, IR Pb-free solder process and feature a current rating from 375mA to 12A and a wide operating temperature range of -55º to 125ºC. These fuses are also AEC-Q200 compliant, RoHS compliant (with exemption 7(a)), halogen free (MSL = 1) and lead free. In addition, they are packaged in tape and reel for the auto-insert SMD process and meet the Bel automotive qualification, which is based on the AEC-Q test plan. Typical application use for the 0680L Series includes notebooks, LCD/LED monitors and TVs, PC computers and office electronic equipment, industrial and medical equipment, PoE, PoE+, power supplies, storage systems, telecommunication systems, wireless base stations, white goods, game consoles and battery charging circuit protection applications which require slow blow or time delay fuses to power the 2410 chip. The 0680L Series is in stock with Digi-Key and Mouser in up to 1,000 or 5,000 pieces in tape and reel. Product samples also available upon request.

Thermal Management Solutions for High-power Applications
news image
Full press release:
interplex.com/power
  • Product Release
  • 2020-01-08

Heat sinks are used in a myriad of devices for both electronic and mechanical applications such as automotive LED headlights, HVAC systems and ECUs, as well as busbars and power modules for energy applications. Traditionally, thermal management takes the form of extruded, forged or die-casted heat sinks connected to heat-generating electronics. However, with the rise of more powerful microelectronics and the push toward more compact designs, it becomes increasingly difficult to accommodate the bulky size and weight of these conventional designs. Interplex's heat sink design approaches that enable design freedom with 3D individualizable fin characteristics. These approaches provide for tight integration into the target sub-systems, minimize product cost, and enable fast ramp-up to high-volume production. Product engineers now have an expanded range of custom thermal management solutions that deliver on excellent heat dissipation while significantly reducing weight.

Transistor Technology Reaches Record Frequencies
  • Industry News
  • 2020-01-08

Scientists at the Fraunhofer Institute for Applied Solid State Physics IAF have succeeded in developing a novel type of transistor with extremely high cut-off frequencies: metal oxide semiconductor HEMTs, in short MOSHEMTs. To achieve this, they have replaced the Schottky barrier of a conventional HEMT with an oxide. The result is a transistor that enables even smaller and more powerful devices. It has already reached record frequencies of 640 GHz. This technology is expected to advance next generation electronics. The high frequency characteristics of high eElectron mobility transistors (HEMTs) have been steadily improved in the past years. The transistors have become increasingly faster by downscaling the gate length to 20 nm. However, a HEMT encounters a problem at such small structure sizes: The thinner the barrier material of InAlAs (indium aluminum arsenide) becomes, the more electrons leak from the current carrying channel through the gate. These unwanted gate leakage currents have a negative impact on the efficiency and durability of the transistor, which renders further downscaling attempts impossible. The current transistor geometry of a conventional HEMT has reached its scaling limit. Silicon MOSFETs (metal oxide semiconductor field effect transistors) are no stranger to this problem, either. However, they possess an oxide layer that can prevent unwanted leakage currents for longer than it is the case with HEMTs.

Electrolytic Capacitors with Solder Lugs
news image
Full press release:
ftcap.de
  • Product Release
  • 2020-01-08

Aluminium electrolytic capacitors with solder lugs are needed in applications where the capacitor is separate from the electronic circuitry and cannot be mounted directly on the printed circuit board. In this case, the solder lugs allow flexible connection by means of a soldered cable. FTCAP (part of the Mersen Group) offers different series with numerous solder lug variations in this product area. The fully welded design increases the life of the capacitors. "There are two basic types of solder lugs or solder pins: with closed and open eyes", explains André Tausche, Managing Director of FTCAP. "The difference is that in the second version the cable can be fed through the eye. But we also offer numerous variations within these two categories. This allows us to offer customers maximum flexibility in connecting the cable." In addition to the extensive product range, solder lug capacitors from FTCAP feature a fully welded design: The life of these capacitors is much longer than that of riveted models. FTCAP electrolytic capacitors with solder lugs provide reliable solutions with high energy density, which in turn allows high discharge currents. Potential areas of application for solder lug capacitors include switch-mode power supplies, computers, industrial electronics, and drive systems.

Introduction to Engineering
news image
Full press release:
ziehl-abegg.com
  • Industry News
  • 2020-01-08

"Our aim was to inspire children's interest in the technical world," explains Peter Fenkl. The Door-Opener Day of the "Show with the Mouse" is held every year when hundreds of German institutions and companies open their doors to children. "As a specialist in quiet and efficient fans and electric motors, Ziehl-Abegg was putting the focus of the 2019 Door-Opener Day on its core area of expertise, the electric motor", says the CEO.
The "Show with the Mouse" doesn't aim to be just an "Open Day" – the intention instead is to provide children with glimpses behind the scenes and – as far as possible – enable them to make something themselves. Roughly 100 children between 9 and 12 year came to Ziehl-Abegg in Derrimut (Australia), Singapore (Asia), Johannesburg (South Africa), Cajamar (Brazil), Greensboro (USA) and Kupferzell (Germany). They all built an electric motor. Project manager Sophie Grill emphasises that this international action goes hand in hand with the company's development: "We started selling our products on the international markets in 1972, then 'internationalised' our production and subsequently brought the successful model of dual training to France, Hungary, Brazil and the USA – making an international Door-Opener Day for the "Show with the Mouse" the next logical step."

High Voltage Molded Power Inductors
news image
Full press release:
coilcraft.com
  • Product Release
  • 2020-01-07

Coilcraft has expanded its XEL Family of molded power inductors to include three higher-voltage series: the XEL401xV, XEL4020V and XEL4030V. All three offer operating voltage ratings of 120 V, 50% higher than the standard versions. They also offer exceptionally low DC resistance and ultra-low AC losses for greater power converter efficiency at high frequencies (2 to 5+ MHz) and high ripple current. XEL40xxV Family inductors measure just 4.0 x 4.0 mm with a maximum height of 3.2 mm and feature a rugged, composite construction that provides magnetic shielding and minimizes audible buzzing. The XEL401xV Series is available in six inductance values from 92 to 780 nH, with current ratings up to 24.0 Amps. The XEL4020V Series has 10 values from 0.08 to 2.2 µH and current ratings up to 33.2 Amps. The XEL4030V Series is offered in 13 values from 0.10 to 6.8 µH and current ratings up to 30.0 Amps. All models offer soft saturation characteristics to withstand high current spikes. They are qualified to AEC-Q200 Grade 1 (-40°C to +125°C) standards and exhibit no thermal aging issues, making them ideal for automotive and other harsh-environment applications. They also feature RoHS-compliant, tin-silver-over-copper terminations and are halogen free.


More NewsTeaserNewsIDNewsSectionTitleTextAnnouncedAnnouncedMMMPictureWebLinkWebLinkText
Power Consumption and Die Size of Power Management ICs ReducedTower Semiconductor announced the release of desig...8612Industry NewsPower Consumption and Die Size of Power Management ICs ReducedTower Semiconductor announced the release of design kits for a novel 0.18um high-performance power management technology which offers over 35% power efficiency improvement and/or equivalent amount of die-area directly contributing to the die’s price competitiveness. This offering enables scalable IC operation of up to 24 volts making it ideal for the world’s growing consumer, industrial, automotive, and computing markets. This complements the Company’s previously announced low-voltage, 65nm Power BCD process, as well as its high-voltage 140V Resurf bulk and 200V SOI technologies, providing customers with best-in-class performance across the entire range of 1.2V to 200V from a single foundry with the same design tools and design experience. The technology builds on six generations of the Company’s very successful existing high-performance 0.18um power management platforms and is largely backward compatible making it easy to port existing parts and designs to the more efficient novel process. “We are very excited to announce the release of design kits for this novel technology that provides our customers with breakthrough performance not available elsewhere,” said Shimon Greenberg, Vice President and General Manager of Power Management Business Unit, Tower Semiconductor. “We are committed to continue our investment in developing and providing best in class Power Management technology enabling our customers to bring to market advanced products and gain share in this large and growing segment of the semiconductor market”.23.03.2020 14:00:00Mar\images\news_tower-semi.jpghttps://towersemi.com/2020/03/23/03232020/towersemi.com
European Market Monitor on Energy Storage The European Association for Storage of Energy (EA...8613Industry NewsEuropean Market Monitor on Energy Storage The European Association for Storage of Energy (EASE) and Delta-EE launched the fourth edition of the European Market Monitor on Energy Storage (EMMES). The report demonstrates the European market grew by a total of 1GWh in 2019, a significant slow-down compared to 2018. Front-of-meter installations slowed dramatically in 2019, while residential behind-the-meter capacity was the fastest growing market segment. The EMMES also highlights that 2018 saw a particularly rapid increase in front-of-the-meter projects, partly driven by Enhanced Frequency Response (EFR) tenders, bringing significant levels of storage to market. This resulted in higher competition, lower prices and revenue streams partly explaining the slowdown in rate of growth in 2019. Patrick Clerens, EASE Secretary General said, “The message is clear: even if energy storage is a key enabler of the energy transition and clearly seen as a major tool to achieve the emissions targets linked to the Paris agreement, more support is needed. Customers, governments and the energy industry are keen to see the market develop and provide more value to the energy system. The “Clean Energy for All Europeans” Package (CEP) is an important step in this process by creating, amongst other things, a clear definition for storage, which should allow energy storage to reach its full potential fast.” 23.03.2020 13:00:00Mar\images\news_2020-04-01_8.jpghttps://www.delta-ee.com/press-releasesdelta-ee.com/press-releases
Controller for 5V USB-C Charging ApplicationsThe STUSB4500L from STMicroelectronics is a small-...8604Product ReleaseController for 5V USB-C Charging ApplicationsThe STUSB4500L from STMicroelectronics is a small-footprint addition to the Company’s USB-C controller IC family designed and certified for pure 5V sink-only applications. All mandatory features to use the USB-C connector as a 5V universal power plug are integrated, allowing designers to implement USB-C charging solutions quickly and easily without studying the standard or writing code. USB-C is rapidly becoming established as a replacement for Micro-B or Mini-B plugs, for both power and data connections, as it offers the advantages of reversible orientation and greater robustness — up to 10,000 connect/disconnect cycles. ST’s USB-C controller IC is a stand-alone, plug-and-play interface product, targeting low-voltage applications such as Bluetooth speakers, computer accessories, Wi-Fi access points, point-of-sale equipment, LED lighting, and USB dongles. It can also be used for powering equipment such as single-board computers and hardware development kits. The controller IC runs without additional code and requires no external support from the microcontroller, which eases adoption of the USB-C connector standard by saving time-consuming design work. The STUSB4500L is auto-powered via VBUS from the connected source and does not need to be supplied from a local battery or on-board power. Zero leakage current prevents draining the battery when not charging. Input over-voltage protection prevents low-voltage equipment being damaged if it is incorrectly connected, for example, to a 20V source from a USB PD AC adapter rather than the required 5V supply.19.03.2020 15:30:00Mar\images\news_2020-04-01_17.jpghttps://newsroom.st.com/media-center/press-item.html/n4242.htmlnewsroom.st.com
Fan-Cooled PSU Offers a Maximum of 4000 WBel Power Solutions announced the expansion of the...8605Product ReleaseFan-Cooled PSU Offers a Maximum of 4000 WBel Power Solutions announced the expansion of their high power portfolio with the TXP4000 Series, a maximum 4000 W AC-DC power supply suitable for industrial, process and control, railway and machinery applications. The TXP4000 Series of AC-DC converters employs a PFC front-end stage and an isolated DC-DC stage to convert the 3-phase input voltage to a low DC output voltage in a broad array of industrial applications where high efficiency is a requirement, with emphasis on both reliability and long product life. The TXP4000 Series also include DSP technologies which enable monitoring of electrical parameters (including input voltage of all 3-phases) and allow control of the PSU from a system controller. RS485 / CAN bus communication is available to command, monitor and provide diagnostic information that can be used to interface with a system controller. TXP4000 Series power supplies feature a compact footprint (135 x 85 x 465 mm / 5.31 x 3.35 x 18.31 inches) and accommodate the worldwide 3-phase input voltage range of 350-528 Vrms at up to 63 Hz, with active current share system available. Units can be used in parallel (8 units) or serial configurations (4 units), generating a maximum output power of 32 kW. 19.03.2020 14:30:00Mar\images\news_2020-04-01_16.pnghttps://belfuse.com/news-detail/bel-power-solutions-announces-expansion-of-high-power-portfolio-with-txp4000-series-for-industrial-applicationsbelfuse.com/news
Joining the Responsible Business AllianceTDK Corporation announces that it has recently joi...8616Industry NewsJoining the Responsible Business AllianceTDK Corporation announces that it has recently joined the Responsible Business Alliance (headquartered in Virginia, U.S.A.; hereinafter “RBA”), the world’s largest industry coalition dedicated to corporate social responsibility in global supply chains. As an Affiliate Member of the RBA, TDK fully supports the vision and mission of the RBA and continuously improve its own operations in accordance with the RBA Code of Conduct. TDK will also support and encourage its first-tier suppliers to do the same. The purpose of joining the RBA is to bolster efforts for the rights, health and safety of workers in the global TDK Group and its first-tier suppliers, as well as for the environment. We aim to fulfill our social responsibility and further enhance the credibility of the TDK Group by publicly pledging to practice the RBA Code of Conduct, the global standard, and making it the clear standard for the TDK Group. TDK will continue to put in practice its corporate motto, “Contribute to culture and industry through creativity,” and strengthen its CSR activities with its customers, suppliers and other stakeholders to advance the development of a sustainable society and champion well-being for all people through its innovative core technologies and solutions.19.03.2020 10:00:00Mar\images\news_tdk.jpghttps://www.tdk.com/corp/en/news_center/press/20200319_01.htmtdk.com/press
SiC Switching-Loss Optimized Half-Bridge Module Richardson RFPD announced the availability and ful...8609Product ReleaseSiC Switching-Loss Optimized Half-Bridge Module Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company. The CAB425M12XM3 is an addition to Wolfspeed’s XM3 power module platform, developed to maximize the benefits of SiC, while keeping the module and system design robust, simple and cost effective. With half the weight and volume of a standard 62 mm module, the XM3 power module maximizes power density while minimizing loop inductance and enabling simple power bussing. The XM3’s SiC-optimized packaging enables 175°C continuous junction operation, with a high-reliability silicon nitride (Si3N4) power substrate to ensure mechanical robustness under extreme conditions. The CAB425M12XM3 targets applications with maximum current requirements at high switching frequencies, focused on power density, including vehicle fast chargers, uninterruptable power supplies, motor and traction drives, and smart-grid or grid-tied distributed generation. An associated inverter reference design, the CRD250DA12E-XM3, is also available.19.03.2020 08:30:00Mar\images\news_2020-04-01_12.jpghttps://www.richardsonrfpd.com/Products/Product/CAB425M12XM3?utm_campaign=Wolfspeed-CAB425M12XM3&utm_source=PR&utm_medium=ProductLinkrichardsonrfpd.com/Products
Dual Output IGBT / MOSFET DriverToshiba Electronics Europe has announced an IGBT/M...8610Product ReleaseDual Output IGBT / MOSFET DriverToshiba Electronics Europe has announced an IGBT/MOSFET gate driver equipped with additional built-in functionality. The TLP5231 will simplify the design task in a wide range of applications including industrial inverters, uninterruptible power supplies (UPS), power conditioners for solar energy and motor controls. The pre-driver has a pair of outputs that are designed to drive external p-channel and n-channel MOSFETs used for current buffers. This allows the usage of a wide range of MOSFETs with various current ratings, meaning that the IGBT can be controlled by a rail to rail gate voltage. The driver can source and sink peak currents up to 2.5 A and is rated for 1.0 A continuously. The device incorporates overcurrent detection, implemented by sensing VCE(sat) as well as undervoltage lock out (UVLO), both of which provide an open collector fault signal to the primary side. These features are not available on existing products (such as the TLP5214 & TLP5214A) and their inclusion on the TLP5231 significantly eases the process of gate drive circuit design. Additionally, the “gate voltage soft turn off time” after VCE(sat) overcurrent detection can be controlled by another external n-channel MOSFET. Propagation delays (L/H & H/L) are as low as 100ns.19.03.2020 07:30:00Mar\images\news_2020-04-01_11.jpghttps://toshiba.semicon-storage.com/eu/company/news/2020/03/opto-20200319-1.htmltoshiba.semicon-storage.com/news
Silver Quill Award WinnersIndium Corporation's Silver Quill Award program re...8615PeopleSilver Quill Award WinnersIndium Corporation's Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to award employees for generating leading-edge research and thought-leadership technical content that addresses issues concerning customers in the electronics industry. The 2019 Paper of the Year award went to Kenneth Thum, Senior Technical Support Engineer, and Sze Pei Lim, Regional Product Manager for Semiconductor Products, for their paper Ultrafine Solder Paste Dispensing for Heterogeneous Integration. The paper examines how heterogeneous integration for advanced packaging is driving the need for ultrafine solder paste dispensing in tightly packed components where printing is not possible. Thum and Lim also offered solutions on how to achieve consistent fine-dot printing, including examining different dispensing equipment technologies and important solder paste characteristics. Additionally, Bernie Leavitt, Jr., Senior Product Specialist, High-Temperature Engineered Solders, was recognized with an honorable mention award for his outstanding contribution and research paper, The Impact of AuSn Preforms Thickness on Solder Joint Reliability. His paper examines how to overcome the diminishing power of semiconductor lasers as their operational heat increases during use. One technique utilized to counteract this challenge is the application of a thinner 80Au/20Sn solder joint for die-attach to aid in thermal transfer to the copper heat-sinks. Leavitt reviewed the results of a study designed to help engineers gain insight into the optimal preform thickness for laser diode applications, as well as other die-attach applications. Indium Corporation also thanked Andreas Karch, Regional Technical Manager, and Miloš Lazic, Technical Support Engineer, for their work advancing materials science and building the company's technical knowledge and expertise.18.03.2020 11:00:00Mar\images\news_2020-04-01_6.jpghttps://www.indium.com/corporate/communications/news/indium-corp-names%20-silver-quill-awards/indium.com/news
700, 1200 and 1700V SBD-Based Power Modules Microchip Technology announced its expanded portfo...8603Product Release700, 1200 and 1700V SBD-Based Power Modules Microchip Technology announced its expanded portfolio of smaller, lighter and more efficient SiC power modules. Together with its broad portfolio of microcontrollers (MCUs) and analog products, Microchip serves the needs of high power system control, gate drive and power stage – supporting customers with total system solutions. Microchip’s SiC family includes commercially-qualified Schottky Barrier Diode (SBD)-based power modules in 700, 1200 and 1700V variants. The power module family includes various topologies including Dual Diode, Full Bridge, Phase Leg, Dual Common Cathode and 3-Phase bridge, in addition to offering different current and package options. The addition of SiC SBD modules simplifies designs by integrating multiple SiC diode die with the option to mix and match substrate and baseplate material into a single module – which maximizes switching efficiency, reduces thermal rise and allows for a smaller system footprint. The flexible portfolio of 700, 1200 and 1700V SiC SBD modules utilize Microchip’s newest generation of SiC die, which maximizes system reliability and ruggedness and enables stable and lasting application life. The devices’ high avalanche performance allows system designers to reduce the need for snubber circuits, and the body diode stability allows designs to use the internal body diode without long-term degradation. Through Microchip internal and third-party testing, critical reliability metrics have proven Microchip devices’ superior performance when compared to other SiC manufactured devices. 16.03.2020 16:30:00Mar\images\news_2020-04-01_18.jpghttps://www.microchip.com/en/pressreleasepage/microchip-expands-silicon-carbide-(sic)-family-of-power-electronics-to-provide-system-level-improvements-in-efficiency-size-and-reliabilitymicrochip.com/pressreleasepage
Voltage Regulators with COT Engine Infineon Technologies introduces the IR3887M, IR38...8607Product ReleaseVoltage Regulators with COT Engine Infineon Technologies introduces the IR3887M, IR3888M and IR3889M devices in its family of integrated-point-of-load voltage regulators featuring a fast constant-on-time (COT) engine. This product family is designed for today’s server, base station and telecom (operating at 85°C ambient temperature) and storage applications requiring both high efficiency and high density. The IR3887M is the smallest 30 A device on the market. Fusing Infineon’s latest FET generation and enhanced package technology allows for thermal support for 30 A in a small 4 mm x 5 mm footprint. The OptiMOS™ IPOL product family comes with an enhanced-stability COT engine with ceramic capacitors without the need for external compensation. Wide input voltage range of 4.3 V - 17 V, 2 V min with 5 V external bias, and precise output voltage (0.5 % accurate reference voltage) are supported. The voltage regulators offer high efficiency at light-load and thermally-compensated internal overcurrent protection with four selectable limits for a less expensive and smaller inductor. High switching frequency (up to 2 MHz) for small PCB size and fewer bill-of-materials (BOM) is guaranteed with easy design and layout. These products provide benchmark efficiency, low power losses and the ability to thermally handle up to 30 A of continuous current. Customers can also benefit from the benchmark output voltage regulation and enhanced load transients response.16.03.2020 12:30:00Mar\images\news_2020-04-01_14.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFPMM202003-039.htmlinfineon.com/press
Global Distribution PartnershipUnitedSiC has announced a distribution agreement w...8620Industry NewsGlobal Distribution PartnershipUnitedSiC has announced a distribution agreement with Digi-Key Electronics. The partnership will provide Digi-Key customers with worldwide, 24-hour availability of UnitedSiC’s Silicon Carbide product portfolio – including the only standard gate drive SiC devices currently in the market. Yalcin Bulut, VP of Global Sales and Marketing at UnitedSiC, said: “This partnership focuses on expanding the UnitedSiC product line to an even wider group of power designers by leveraging Digi-Key’s world-class distribution expertise. We will now be able to provide our SiC wide bandgap technology to the markets and customers served so well by Digi-Key.” The UnitedSiC products available through Digi-Key will be especially beneficial to engineers focused on electric vehicles, battery charging, IT infrastructure, renewable energy and circuit protection. David Stein, VP of Global Supplier Management at Digi-Key said: “We are excited to partner with UnitedSiC and bring on their portfolio of silicon carbide semiconductor devices. With ever increasing pressure on power engineers to deliver optimal efficiency and cost-effectiveness, it is critical for Digi-Key to work with companies who have market leading technology.  We look forward to introducing UnitedSiC’s product portfolio to our global engineering community.”16.03.2020 06:00:00Mar\images\news_2020-04-01_1.jpghttps://unitedsic.com/news/unitedsic-announces-new-global-distribution-partnership-with-digi-key/unitedsic.com/news
Access to Wide Range of Triacs & Thyristors Following the signing of an exclusive deal with JJ...8617Industry NewsAccess to Wide Range of Triacs & Thyristors Following the signing of an exclusive deal with JJ Micro, Transonics is now holding one million triacs and thyristors in stock at its UK warehouse. Transonics’ extensive UK inventory includes JJ Micro’s internally-isolated tab Triacs ranging from mAs up to 40A, with sensitive data recurring currents. JJ Micro’s range of Triacs extends to 1400V and products - where not held in stock - are available on a 6-8 week lead time as opposed to 20 weeks plus. Comments Daniel French, MD at Transonics: “JJ Micro is the third largest manufacturer of Triacs in the world - the largest in China – and fully-approved to international quality standards. So with products from established brand names on variable leadtimes, finally, there is a credible, qualified alternative available.” Also available from JJ Micro and in stock at Transonics are diodes, MOSFETs, protection devices, thyristors and transistors.15.03.2020 09:00:00Mar\images\news_2020-04-01_4.jpghttps://www.transonics.com/transonics.com
PCIM Europe PostponedDue to the increasing spread of covid-19 in Europe...8602Event NewsPCIM Europe PostponedDue to the increasing spread of covid-19 in Europe, Mesago Messe Frankfurt GmbH has decided to postpone the PCIM Europe exhibition and conference from 5-7 May 2020 to 28-30 July 2020. The venue remains the Nuremberg Exhibition Centre. Visitor tickets already purchased remain valid for the new date.13.03.2020 13:00:00Mar\images\news_pcim-europe.pnghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/postponed.htmlpcim.mesago.com/press
Sinter Paste with Thermal ConductivityHeraeus Electronics announced the launch of a sint...8611Product ReleaseSinter Paste with Thermal ConductivityHeraeus Electronics announced the launch of a sinter paste with the product name mAgic DA295A. It is a low temperature, non-pressure sintering solution and part of Heraeus’ mAgic sinter pastes product series. It offers superior thermal conductivity and is suited for power applications with high operation temperatures. “We are constantly developing new die attach materials optimized for the growing demands of power semiconductors," says Dr. Klemens Brunner, President of Heraeus Electronics. "Our new paste mAgic DA295A enables devices to achieve higher performance and higher reliability – especially for high frequency power amplifier packages.” Due to its patented formulation, mAgic DA295A creates a robust pure silver die-attach layer with high thermal dissipation. The improved formulation further widens the processing window to reduce the overall cost of ownership. Moreover, mAgic DA295A’s simple processing provides flexibility and improved workability characteristics to benefit manufacturability. Heraeus is the only sinter paste supplier using micro scaled Silver powder. This ensures higher yields, a wider process window and is less expensive compared to nano powders. Heraeus not only provides high-quality sinter materials, but also makes its process knowledge available to customers. In its power electronics application centers, the company helps manufacturers to improve their processes by jointly simulating them and developing prototypes. Manufacturers furthermore benefit from Heraeus’ sinter seminars and training courses.12.03.2020 06:30:00Mar\images\news_2020-04-01_10.jpghttps://www.heraeus.com/en/het/company_het/press_and_news_het/2020_het/03_heraeus_sinter_paste_launch_magic_da295a.htmlheraeus.com/press
AI-Based Soft Switching Using Inverter ReferencePre-Switch has released first data from its Cleanw...8608Product ReleaseAI-Based Soft Switching Using Inverter ReferencePre-Switch has released first data from its Cleanwave 200kW inverter reference. Double pulse test data demonstrates that the Pre-Switch soft-switching platform – comprising the Pre-Drive™3 controller board powered by the Pre-Flex™ FPGA, and RPG gate driver board – reduces total system switching losses by 90% or more. Pre-Switch is enabling customers to build systems with switching frequencies 4X-5X faster than their hard-switched IGBT systems and 35X faster than their hard-switched SiC and GaN systems: this is achieved with half the transistor count. In the case of a SiC-based EV inverter, increasing the Fsw from the ubiquitous 10kHz up to 100kHz or 300kHz creates a near perfect sine wave without any output filter. The result is elimination of unnecessary motor iron losses and an increased motor efficiency at low torque and low RPM. Higher switching frequencies also enable higher RPM motors that are lighter and lower cost. Previously, soft-switching has never been successfully-implemented for DC/AC systems with varying input voltage, temperature and load conditions. However, Pre-Switch has overcome the challenges by using Artificial Intelligence (AI) to constantly-adjust the relative timing of elements within the switching system required to force a resonance to offset the current and voltage wave forms – thereby minimizing switching losses.11.03.2020 09:30:00Mar\images\news_2020-04-01_13.jpghttps://www.pre-switch.com/pre-switch.com
electronica China: New Date Set for July 2020The outbreak of the novel coronavirus (COVID-19) h...8581Event Newselectronica China: New Date Set for July 2020The outbreak of the novel coronavirus (COVID-19) has strongly impacted developments in China. Following the directives of the Government of Shanghai Municipality to prevent and control the virus from spreading, Messe München Shanghai was compelled at the beginning of February to postpone electronica China, productronica China and LASER World of PHOTONICS CHINA, which were planned to take place in March. The new date has been set, combined with a unique change in location. The trade fairs will be held from July 3 to 5, 2020 at the National Exhibition and Convention Center (NECC) in Shanghai. Since the outbreak of the novel coronavirus (COVID-19), more than 300 trade fairs in China have been postponed. Due to the tight schedule of the Shanghai New International Expo Centre (SNIEC) it wasn't possible to find an alternative date at the SNIEC in 2020. After examining carefully all possible dates, Messe München Shanghai has decided on a one-time postponement of electronica China, productronica China and LASER World of PHOTONICS CHINA: The trade fairs will take place from July 3 to 5, 2020, at the National Exhibition and Convention Center in Shanghai. Stephen Lu, Chief Operating Officer of Messe München Shanghai, explains: "We are taking the spread of the coronavirus very seriously and have been monitoring the local situation closely. Based on current developments, we are confident that by setting a new date we will create good conditions for staging the trade fairs." After intense communication with the exhibitors, Stephen Lu believes that "despite the current uncertainties, the importance of our trade fairs at the Shanghai location remains intact. There is a still a great demand for participating in the trade fairs."10.03.2020 19:33:00Mar\images\news_2020-03-15_21.jpghttps://electronica-china.com/en/press/newsroom/press-releases/detail/electronica-china-new-date-in-july-2020-has-been-set.php?utm_campaign=eloqua&utm_medium=email&etcc_ctv=ELC_2020_P_PI_01_DE&utm_content=ELC_2020_P_PI_01_DE&utm_source=eloquaelectronica-china.com/newsroom
CFIUS Concludes Review of Planned Acquisition and Clears TransactionThe Committee on Foreign Investment in the United ...8593Industry NewsCFIUS Concludes Review of Planned Acquisition and Clears TransactionThe Committee on Foreign Investment in the United States ("CFIUS") concluded its review under Section 721 of the Defense Production Act of 1950, of the planned acquisition of Cypress Semiconductor Corporation as announced by Infineon Technologies on 3 June 2019. CFIUS cleared the transaction. The closing of the Merger remains subject to approval from China's State Administration for Market Regulation (SAMR) and other customary closing conditions under the merger agreement.10.03.2020 14:00:00Mar\images\news_infineon.pnghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2020/INFXX202003-037.htmlinfineon.com/press
3-Phase Built-in Filter with Neutral LineFMAD CP is the name of the latest 1-stage filter f...8606Product Release3-Phase Built-in Filter with Neutral LineFMAD CP is the name of the latest 1-stage filter family for 3-phase systems with neutral line. Thanks to their extremely compact dimensions and high performance, the filters are ideally suited to the tight space conditions in today's machine and equipment construction. Thanks to an extended temperature range, they can also be used in critical applications. The filter family is ideally suited for devices with high EMC loads at low or medium power. Typical applications include converters for photovoltaics, battery storage or charging stations for electric vehicles. These powerful, particularly compact filters are also the first choice for modern frequency inverters for motor control. The FMAD CP filter series has 6.3 x 0.8 mm plug-in connections for quick and easy wiring. Thanks to a metal flange, a good earth connection is guaranteed when screwed to the chassis. The standard versions can be used over a temperature range of -40 °C to 100 °C. The filters are designed for currents from 3 A to 20 A at an ambient temperature of 50 °C. They have ENEC and cURus approval and are recommended for applications up to max. 520 VAC.10.03.2020 13:30:00Mar\images\news_2020-04-01_15.jpghttps://www.schurter.com/Newsroom/Timeline/FMAD-CP-3-phase-built-in-filter-with-neutral-lineschurter.com/Newsroom
Producing High-Performance Si Power MOSFETsSkyWater Technology and Applied Novel Devices anno...8618Industry NewsProducing High-Performance Si Power MOSFETsSkyWater Technology and Applied Novel Devices announced the companies have entered into a licensing and manufacturing agreement to offer an improved standard process flow for Si power MOSFETs (metal oxide semiconductor field-effect transistors). The partnership will enable AND to bring power device products to market based on its proprietary and patented technologies and SkyWater’s high volume manufacturing capabilities. The licensing agreement will also enable SkyWater to offer the technology as a standard foundry process flow to improve system-level performance for low-voltage (12V – 30V) applications. At the Applied Power Electronics Conference (APEC 2020), SkyWater plans to showcase this collaboration and its manufacturing services for discrete power devices which are in high demand due to the explosion of wireless and battery powered connected devices. AND’s high-performance Si power MOSFETs are based on novel channel and substrate engineering to improve critical power MOSFET figures of merit. These products offer low RDS(on) combined with low output capacitance/charge, low gate drive down to 2.5 V and an industry-first near zero reverse recovery charge enabling low switching losses in applications. Low RDS(on) and reverse recovery will enable improved efficiency and, in some cases, reduced part counts, yielding lower cost and higher efficiency switching systems in applications such as power supplies and motor controls. 10.03.2020 08:00:00Mar\images\news_skywater.pnghttps://www.skywatertechnology.com/press-releases/skywater-chosen-by-applied-novel-devices-and-to-produce-new-high-performance-si-power-mosfets/skywatertechnology.com/press-releases
Stackable DC/DC Buck ConverterTexas Instruments introduced a 40-A SWIFTTM DC/DC ...8582Product ReleaseStackable DC/DC Buck ConverterTexas Instruments introduced a 40-A SWIFTTM DC/DC buck converter, offering stackability of up to four integrated circuits (ICs). The TPS546D24A PMBus buck converter can deliver up to 160 A of output current at an 85°C ambient temperature – four times more current than competing power ICs. The TPS546D24A has the highest efficiency of any 40-A DC/DC converter, allowing engineers to reduce power loss by 1.5 W in high-performance data center and enterprise computing, medical, wireless infrastructure, and wired networking applications. Solution size and thermal performance are two key considerations for engineers designing power supplies for modern field-programmable gate arrays (FPGAs). With its unique stackability, the TPS546D24A buck converter addresses both. It comes with a PMBus interface that offers a selectable internal compensation network, enabling engineers to eliminate as many as six external compensation components from the board and shrink the overall power-supply solution size by more than 10% (or 130 mm2) for higher-current FPGA/application-specific ICs (ASICs) when compared to discrete multiphase controllers.09.03.2020 16:30:00Mar\images\news_2020-03-15_20.jpghttps://news.ti.com/stackable-dcdc-buck-converter-maximizes-power-density-in-high-current-fpga-and-processor-power-suppliesnews.ti.com
Polymer Aluminum Electrolytics Provides High Ripple Current and CapacitanceThe PPC Series of ultra-thin polymer aluminum elec...8590Product ReleasePolymer Aluminum Electrolytics Provides High Ripple Current and CapacitanceThe PPC Series of ultra-thin polymer aluminum electrolytic capacitors from Cornell Dubilier represents a totally new capacitor form factor. Designed specifically for applications requiring high ripple current and the thinnest possible profiles, type PPC opens up new product design options. In addition to being just 1 mm thin, the PPC uses versatile packaging technology that makes it possible for capacitors to be formed into custom shapes and sizes to accommodate available space. "A single PPC capacitor offers capacitance and ripple current equivalent to dozens of SMT capacitors or a bulky cylindrical device," said Mario DiPietro, Product Manager at Cornell Dubilier. As an example, the company claims that a single PPC capacitor is equivalent to a parallel bank of 50 or more polymer tantalum capacitors and occupies one fourth the height. Also, circuit reliability is improved by using a single component versus an entire array of SMT capacitors. Custom values are available within a capacitance range of 8,000 µF to 20,000 µF, with working voltages ranging from 6.3 to 24 WVDC. The company plans to extend the series to higher operating voltages later in the year. Operating life is 2,000 hours @ 125° C. The PPC is rated for 10 g peak for vibration and withstands shocks up to 100 g's (MIL-STD-202, Method 213, Condition I).09.03.2020 08:30:00Mar\images\news_2020-03-15_12.jpghttps://www.cde.com/new-product/ppccde.com/new-product
Foxy Power EstablishedIndustry veterans Christopher Rocneanu and Michael...8594Industry NewsFoxy Power EstablishedIndustry veterans Christopher Rocneanu and Michael Doktor started Foxy Power, a company specializing in business development, strategic sales and consulting for start-ups and manufacturers with disruptive technologies. Foxy Power provides sophisticated and custom-tailored hands-on support for the introduction of new products and sales for established product lines. For any further questions please contact sales@foxypower.com or call +4915121063411.06.03.2020 13:00:00Mar\images\news_foxypower.jpgsales@foxypower.comsales@foxypower.com
SiC MOSFET Power Module for E-mobilityCISSOID announces a 3-Phase SiC MOSFET Intelligent...8591Product ReleaseSiC MOSFET Power Module for E-mobilityCISSOID announces a 3-Phase SiC MOSFET Intelligent Power Module (IPM) platform for E-mobility. This IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers. Co-optimizing the electrical, mechanical and thermal design of the power module and its proximity control, this scalable platform will improve time-to-market for Electric Car OEMs and electric motor manufacturers willing to rapidly adopt SiC-based inverters for more efficient and compact motor drives. With this SiC-based IPM solution, CISSOID maintains its focus on addressing challenges for automotive and industrial markets. The first product out of this scalable platform, a 3-Phase 1200V/450A SiC MOSFET IPM, features low conduction losses, with 3.25mOhms On resistance, and low switching losses, with respectively 8.3mJ turn-on and 11.2mJ turn-off energies at 600V/300A. It reduces losses by at least a factor 3 with respect to state-of-the-art IGBT power modules. The module is water-cooled through a lightweight AlSiC pin-fin baseplate for a junction-to-fluid thermal resistance of 0.15°C/W. The power module is rated for junction temperature up to 175°C. The IPM withstands isolation voltages up to 3600V (50Hz, 1min). The built-in gate driver includes three on-board isolated power supplies (one per phase) delivering each up to 5W allowing to easily drive the power module up to 25KHz and at ambient temperatures up to 125°C.05.03.2020 07:30:00Mar\images\news_2020-03-15_11.jpghttp://www.cissoid.com/news/sic-mosfet-intelligent-power-module-for-e-mobility.htmlcissoid.com/news
Acquisition Will Accelerate GaN ExpertiseSTMicroelectronics announced it has signed an agre...8601Industry NewsAcquisition Will Accelerate GaN ExpertiseSTMicroelectronics announced it has signed an agreement to acquire a majority stake in French Gallium Nitride (GaN) innovator Exagan. Exagan's expertise in epitaxy, product development and application know-how will broaden and accelerate ST's power GaN roadmap and business for automotive, industrial and consumer applications. Exagan will continue to execute its product roadmap and will be supported by ST in the deployment of its products. Terms of the transaction were not disclosed and closing of the acquisition remains subject to customary regulatory approvals from French authorities. The signed agreement also provides for the acquisition by ST of the remaining minority stake in Exagan 24 months after the closing of the acquisition of the majority stake. The transaction is funded with available cash. "ST has built strong momentum in silicon carbide and is now expanding in another very promising compound material, gallium nitride, to drive adoption of the power products based on GaN by customers across the automotive, industrial and consumer markets" said Jean-Marc Chery, President and CEO of STMicroelectronics. "The acquisition of a majority stake in Exagan is another step forward in strengthening our global technology leadership in power semiconductors and our long-term GaN roadmap, ecosystem and business. It comes in addition to ongoing developments with CEA-Leti in Tours, France, and the recently-announced collaboration with TSMC."05.03.2020 06:00:00Mar\images\news_st.jpghttps://newsroom.st.com/media-center/press-item.html/c2946.htmlnewsroom.st.com
Dual & Quad Channel USB-to-UART/MPSSE Bridge ICsFTDI Chip's latest series of multi-channel USB int...8585Product ReleaseDual & Quad Channel USB-to-UART/MPSSE Bridge ICsFTDI Chip's latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol. Available in both 2-channel (FT2233HP) and 4-channel (FT4233HP) versions, the Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities. Furthermore, they are fully compliant with Rev 3.0 of the USB power delivery (PD) specification. Each features a Type-C/PD controller for taking care of all negotiation and power gauging, then deciding on the appropriate course of action (thereby offloading work that the system microcontroller would otherwise have to perform). This will enable any equipment that these ICs are integrated into to either draw or provide power as the situation dictates - with power levels of up to 100W being supported. Based on a 32-bit RISC processor core, with 8kB of data RAM and 48kB of code ROM embedded, the PD Policy Engine manages the respective PD ports. The PD1 port can act as either a power sink or power source, while the PD2 port only acts as a power sink.04.03.2020 13:30:00Mar\images\news_2020-03-15_17.jpghttps://www.ftdichip.com/FT-X.htmftdichip.com
Module Meets the Requirements of Industrial Voltage NetworkThe power modules with fixed 3.3 or 5 V output vol...8588Product ReleaseModule Meets the Requirements of Industrial Voltage NetworkThe power modules with fixed 3.3 or 5 V output voltages are now also available with an input voltage of 36 V, following on from versions with maximum input voltages of 28 and 42 V. The components in a SIP-3 package represent cost-effective solutions to meet the requirements for the transient capability of a 24 V industrial voltage network. The modules operate from 6 to 36 V VIN and generate a fixed output voltage of 3.3 or 5 V at a current of up to 1 A. The FDSM series of MagI³C power modules are fully integrated DC/DC voltage converters with fixed output voltage. The modules comprise the power stage, controller, inductors, and effective operational input and output capacitors. They also come with thermal overload and short circuit protection. No external components are required for operation. The workload of circuit design is thus reduced to a minimum. This allows new applications to be brought to market quickly with very low development costs. The standard THT housing for easy mounting is pin-compatible with the L78x linear controllers.04.03.2020 10:30:00Mar\images\news_2020-03-15_14.jpghttps://www.we-online.de/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_112639.phpwe-online.de/news
Financing to Advance its GaN Power Conversion BusinessTransphorm announced it raised $21.5 million in a ...8599Industry NewsFinancing to Advance its GaN Power Conversion BusinessTransphorm announced it raised $21.5 million in a private placement equity financing. Prior to the financing, Transphorm Technology completed a reverse merger with Peninsula Acquisition Corporation, a public Delaware corporation, whereby Transphorm became a wholly owned subsidiary of Peninsula. Following the merger, Peninsula changed its name to Transphorm, Inc., and will continue the historical business of Transphorm. Previous members of Transphorm's Board of Directors, David Kerko, Eiji Yatagawa, Brittany Bagley, Mario Rivas and Dr. Umesh Mishra will remain as directors of the Company. "We are thrilled to announce this new equity financing which will support and accelerate our product development, manufacturing, and sales for our GaN power solutions," said Mario Rivas, CEO. Mr. Rivas continued, "We believe the success of this financing demonstrates confidence and support in Transphorm's team, technology and products by both our current partners as well as our new investors." "Our core capabilities in GaN epitaxy, design, process and circuit applications have positioned us well to innovate and address the power conversion systems needs of our customers," said Dr. Primit Parikh, Co-founder and COO. "We have created an integrated device model and developed highly reliable, high performance GaN device technology, as well as amassed one of the largest intellectual property portfolios in the GaN power industry," Dr. Parikh added.03.03.2020 08:00:00Mar\images\news_2020-03-15_3.jpghttps://www.transphormusa.com/en/news/21_million_private_equity_reverse_merger/transphormusa.com/news
Partnership with Distributor in TurkeyPanasonic Factory Solutions and Ankatek, a technic...8600Industry NewsPartnership with Distributor in TurkeyPanasonic Factory Solutions and Ankatek, a technical distributors of high-tech capital goods for electronics manufacturing in Turkey, announce their future cooperation. Ankatek will distribute the portfolio of Panasonic Factory Solutions, especially the automation products such as placement machines, printers and software for industry sectors like telecommunications, automotive, IT and consumer electronics. With a lot of experience in technical sales, Ankatek is a valuable partner who will bring Panasonic Industry's smart factory solutions directly to customers in Turkey. "For Panasonic Factory Solution, the partnership with Ankatek is a logical step to bring our proven hardware and software solutions closer to customers in Turkey. We are very much looking forward to an intensive cooperation," says Nils Heininger, Division Director Factory Solutions. Selim Ergül, Managing Director of Ankatek, is looking forward to the cooperation: "We are pleased to have found an experienced partner and global player for SMD Factory Solutions. Panasonic is also an expert beyond the SMD line, especially when it comes to the important topic of Smart Factory and machine communication".02.03.2020 07:00:00Mar\images\news_2020-03-15_2.jpghttps://eu.industrial.panasonic.com/news-and-events/news/partnership-distributor-ankatekeu.industrial.panasonic.com/news
Innovation Creates FutureAs a manufacturer of machines for thermal process ...8583Product ReleaseInnovation Creates FutureAs a manufacturer of machines for thermal process solutions from –50°C up to +450 °C, SMT Thermal Discoveries presents its complete portfolio with innovations in the areas of SMD reflow soldering, vacuum soldering, curing and temperature treatment for temperature function tests at the exhibition SMTconnect in Nuremberg. With the new reflow generation by SMT, the customer receives an improved heat transfer in the reflow soldering system due to the optimized airflow in the proven 3:1 zone concept. Flexible profile settings are easy to implement by combining "recipes" and "products" in the Thermal Tools operating software. The advanced, low-maintenance "KAT" process gas cleaning system is integrated directly into the process area and does not require any additional energy consumption. In contrast to conventional process gas cleaning systems, SMT has been relying on systems without any complex and fragile tubing for years. The customer benefits and saves not only energy losses in the tubes, but also an annual, several days lasting maintenance. Moreover, the customer can change the catalyst himself, thereby increasing the availability of the plant again. In the new reflow generation, cooling is done from above and below with one fan per zone only, which means better cooling performance with consistently low power consumption.27.02.2020 15:30:00Feb\images\news_2020-03-15_19.jpghttps://www.smt-wertheim.de/en/company/news.htmlsmt-wertheim.de/news
Programmable DC Power SuppliesMagna-Power Electronics released 35 models to its ...8589Product ReleaseProgrammable DC Power SuppliesMagna-Power Electronics released 35 models to its expansive MagnaDC programmable DC power supply product line with increased output isolation ratings now up to 6,000 Vdc. The 35 new isolated high voltage models join over 1,000 models in Magna-Power's MagnaDC offering, with voltage ratings now from 5 Vdc to 6,000 Vdc, current ratings from 0.2 Adc to 24,000 Adc, and power ratings from 1.5 kW to 2,000 kW+. The new high voltage models address applications across many industries, including: capacitor testing and charging, semiconductor ion implantation and physical vapor deposition, tethered DC-powered vehicles, cable testing, among many others. The new isolated high voltage models include new models across many Magna-Power products series, including:<br>• 5 new 3,000 Vdc models in the 2U 2 kW to 10 kW XR Series<br>• 16 new 5,000 Vdc and 6,000 Vdc models in the 3U-8U 5 kW to 50 kW TS Series<br>• 8 new 5,000 Vdc and 6,000 Vdc models in the floor-standing 30 to 75 kW MS Series<br>• 6 new 5,000 Vdc and 6,000 Vdc models in the 100 kW to 250 kW floor-standing MT Series<br><br>The models are offered in the same physical dimensions as Magna-Power's existing models of the same power ratings, providing among the highest power density available on the market for high-voltage high-power products.26.02.2020 09:30:00Feb\images\news_2020-03-15_13.jpghttps://magna-power.com/company/news/2020-02-26-magna-power-expands-isolated-magnadc-programmable-dc-power-supplies-to-6-000-vdc-with-35-new-modelsmagna-power.com/news
High-Voltage Half-Bridge Motor-DriverPower Integrations announced that its BridgeSwitch...8586Product ReleaseHigh-Voltage Half-Bridge Motor-DriverPower Integrations announced that its BridgeSwitch integrated half-bridge (IHB) motor-driver IC family has been expanded and now supports applications requiring up to 400 W. BridgeSwitch ICs feature high- and low-side advanced FREDFETs (Fast Recovery Diode Field Effect Transistors) with integrated lossless current sensing, resulting in inverter efficiency of up to 99.2% in brushless DC (BLDC) motor-drive applications. This industry-leading efficiency performance along with the distributed thermal footprint provided by the IHB driver eliminates the need for a heatsink, reducing both system cost and weight. The 400 W BRD1167 and BRD1267 BridgeSwitch ICs deliver up to 1.33 A RMS, 11.5 A DC output peak current. Like the rest of the BridgeSwitch family, they are self-powered and available in the same compact InSOP-24C surface-mount package. These devices can drive single- or multi-phase high-voltage, synchronous or asynchronous motors, and support all popular MCU and motor control algorithms. All BridgeSwitch ICs feature cycle-by-cycle hardware–based overcurrent, over/under-voltage and over-temperature protection features, which eliminate the software component from many protection functions. This simplifies IEC 60335 and 60730 certification, saving time and cost.25.02.2020 12:30:00Feb\images\news_2020-03-15_16.jpghttps://motor-driver.power.com/news/2020-02-25-bridgeswitch-bldc-motor-driver-ic-family-expands-400-w/motor-driver.power.com/news
More Female Leaders WantedToday, 30 percent of Danfoss employees are women, ...8614PeopleMore Female Leaders WantedToday, 30 percent of Danfoss employees are women, but only 20 percent of leadership positions are occupied by women. Therefore, it is now becoming a focus area for the entire Danfoss global organization to ensure that the number of female leaders is increased by 50 percent. “We have come a long way, but we are aware that in order to achieve our ambitious target of increasing our female leaders rate by 50%, an extraordinary effort is required. We need to go new and unconventional ways, challenge ourselves and send an unambiguous signal both to ourselves that this effort has a high priority and to our outside world that Danfoss is an attractive company for both genders,” says Ilonka Nussbaumer, head of HR at Danfoss. With the headline - diversity and inclusion, Danfoss is now launching a large number of significant and concrete efforts. It is about telling even more about Danfoss as a workplace and about the many opportunities you have as an employee. There will be a stronger focus on the recruitment process, on retaining talented women, and on developing and empowering female employees to become tomorrow's successful leaders. “We know that in many of the core countries, we operate in, females are still underrepresented in STEM educations. For us, this means that we have a responsibility to make engineering and STEM educations even more attractive to women. As an engineering and technology company, we must seize the opportunity to lead globally and show that more female leaders have and are of central importance to the future development of companies,” says Ilonka Nussbaumer.25.02.2020 12:00:00Feb\images\news_2020-04-01_7.jpghttps://www.danfoss.com/en/about-danfoss/news/cf/danfoss-wants-more-female-leaders/danfoss.com/news
Swedish GaN-on-SiC Wafer Specialist Reports GrowthSweGaN AB announced strong results for 2019 with 3...8598Industry NewsSwedish GaN-on-SiC Wafer Specialist Reports GrowthSweGaN AB announced strong results for 2019 with 300% year-on-year growth from 2018. "2019 was an outstanding year for SweGaN with a doubling of commercial orders and collaboration in multiple prestigious EU projects", says Olof Kordina, CEO, SweGaN. The technology was highlighted in the largest Swedish technical magazine Ny Teknik which selected SweGaN as one of the most promising and innovative young companies. A featured article in Applied Physics Letters, Volume 115, Issue 22, "Transmorphic Epitaxial Growth of AlN Nucleation Layers on SiC Substrates for High-Breakdown Thin GaN Transistors", showed the material´s unique very high electrical breakdown voltage making it ideal for power devices. In 2020, we will continue focusing on ground-breaking product development, building our manufacturing capabilities and further energizing our global network of customers and strategic partners. In addition, SweGaN has further strengthened its board of directors with the introduction of new members Agneta Franksson and Richard Weil at its annual meeting.25.02.2020 09:00:00Feb\images\news_SweGaN.pnghttps://swegan.se/pressrelease.htmlswegan.se/pressrelease
Series of Intelligent MOSFET Power ModulesAlpha and Omega Semiconductor announced the releas...8592Product ReleaseSeries of Intelligent MOSFET Power ModulesAlpha and Omega Semiconductor announced the release of an intelligent power module, AIM702H50B, specialized for low-power BLDC motor drives system such as fan motors in home appliances and air-conditioners that require highly compact size with reliable and efficient design allowance. The IPM7 series consists of advanced super junction MOSFETs designed for motor drive and high voltage gate driving ICs with an integrated bootstrap circuit in an ultra-compact surface mountable package. "A BLDC-based inverter has been widely used in fan motors because it is quicker, quieter, and more energy-efficient than the conventional solutions using dc motors or ac induction motors with on/off control. Nowadays, its demand and expansion are becoming a mandatory requirement due to energy saving and regulations. Without a doubt, IPM7 will bring a lot of advantages for fan motor applications by significantly enhancing the cost-effective development of the system, reducing the inverter board size, and obtaining easy and reliable PCB assembly. Quick and precise detection of fault temperature in IPM7 will play a significant role in fan motor drives to secure a reliable design as well as a long time of operation," said Dr. Brian Suh, Vice President of IGBT/IPM product lines at AOS.25.02.2020 06:30:00Feb\images\news_2020-03-15_10.jpghttp://www.aosmd.com/res/news/news-article-1582654986201/AIM702H50B%20PR.pdfaosmd.com/news
Fully Integrated Wireless-Charging ICIn the age of 5G communication with ever-increasin...8566Product ReleaseFully Integrated Wireless-Charging ICIn the age of 5G communication with ever-increasing demand for more power and higher efficiency, STMicroelectronics' STWLC68 product family provides the best solution for wireless-charging applications with industry-leading efficiency, highest power transfer, and safety. ST's wireless-charging products operate as both a high-power receiver and a transmitter enabling rapid power transfer and power sharing with FOD (Foreign Object Detection) and other important ST-proprietary safety IPs. ST's proprietary high-voltage technology, paired with excellent mixed signal design and highest quality assurance, enables our customers to deliver cutting-edge wireless-charging products. The STWLC68 family of highly integrated devices needs a very low external BoM (Bill of Materials), ideal for integration in a wide range of applications from small wearables and appliances to larger ones like smartphones and tablets. Being WPC Qi 1.2.4 compliant, the STWLC68 is fully compatible with all Qi certified devices in the market. With its fully integrated low-impedance, high-voltage synchronous rectifier and low drop-out linear regulator, the STWLC68 achieves high efficiency and low power dissipation, critical for applications that are highly sensitive to unnecessary heat buildup. An I2C interface allows firmware and platform parameters to be customized in the device and the configuration can be programmed into the embedded OTP. Additional firmware patching improves the IC's application flexibility.24.02.2020 15:30:00Feb\images\news_2020-03-01_16.jpghttps://newsroom.st.com/media-center/press-item.html/n4235.htmlnewsroom.st.com/media-center
Remote Control DIN-Rail Power Supply RangePULS Power has added a 40A output model to its rem...8570Product ReleaseRemote Control DIN-Rail Power Supply RangePULS Power has added a 40A output model to its remote-controlled DIN-Rail power supply family. The remote-control feature is particularly useful in smart buildings and industrial systems where centralised control of multiple system components is required and allows system administrators and building automation controllers to switch power supplies on or off by use of an external signal switch or transistor gate. The 24VDC, 40A output QS40.241 DIN-rail power supply joins the already very successful CP20.241-V1 24VDC, 20A model and both belong to the PULS DIMENSION series, which provide efficient solutions for designers and systems integrators requiring powerful and space-saving DIN rail power supplies. The QS40.241 DIN-rail power supply offers extremely high efficiency in a very compact footprint by using the latest synchronous rectification technology, a bridgeless PFC circuit and a number of other proprietary design details. Large power reserves of 150% and built-in large sized output capacitors support the starting of heavy loads such as DC motors or capacitive loads. In many cases this allows the use of a unit from a lower wattage class saving space reducing costs.24.02.2020 12:30:00Feb\images\news_2020-03-01_12.jpghttps://www.pulspower.com/products/show/product/detail/cp20241-v1/pulspower.com
DC/DC Power Density in a SIP-8 PackageRECOM announces the launch of its RS12-Z series of...8568Product ReleaseDC/DC Power Density in a SIP-8 PackageRECOM announces the launch of its RS12-Z series of 4:1 input DC/DC converters, providing 12W in a SIP-8 package. Leveraging advanced planar technology, RECOM now offers a full 12W output in the industry-standard SIP-8 package from their new RS12-Z series of DC/DC converters up to 75 °C in free air, the highest power available in this format. With a footprint of just 2cm², the range features 4:1 inputs of 9 – 36V or 18 – 75V with surge ratings to 50V and 100V respectively and regulated single outputs of 3.3, 5, 12, 15 or 24V, all trimmable +/-10% and with remote on/off control. Short circuit and under-voltage protection are included along with 3kVDC/1s isolation and EN 62368-1 certification. EN 55032 class A or class B EMC levels are met with a simple, low cost external filter. The series features a metal casing providing EMI shielding as well as enhanced thermal performance with case tabs providing mechanical stability and additional heat sinking to the customer's PCB. "We have incorporated radical design changes in our new RS12-Z series, with a planar transformer construction and metal casing to push the limits of power density achievable in the SIP-8 package" commented Steve Roberts, Innovation Manager at RECOM. "The series is ideal for nominal 12, 24 or 48V systems where real estate is at a premium and full power is needed over a wide temperature range."24.02.2020 11:30:00Feb\images\news_2020-03-01_14.jpghttps://recom-power.com/en/rec-n-new-standard-set-for-dc!sdc-power-density-in-a-sip-8-package-100.html?2recom-power.com
Battery Cell Competence CenterKeysight Technologies announced the use of Keysigh...8574Industry NewsBattery Cell Competence CenterKeysight Technologies announced the use of Keysight's Scienlab Battery Test Solution for comprehensive battery cell test in the recently opened BMW Group Battery Cell Competence Center in Munich, Germany. Keysight's Scienlab Battery Test Solution is comprised of Keysight's Scienlab Battery Test Systems to provide precise measurement results, and PathWave Lab Operations software, which ensures an optimized test lab operation by managing resources, hardware and information. Comprehensive functions provided by the solution support the planning and execution of test procedures including schedule definition, management, control and monitoring of the battery test systems and device under test. It also analyzes test results as well as the overall efficiency of the lab to identify potential improvements. "Our long-standing partnership with the BMW Group is based on mutual inspiration and collaboration as we work together to address the challenges associated with automotive power train electrification," stated Dr. Michael Schugt, senior manager of Keysight's Automotive and Energy Scienlab E-Mobility business. "We are proud to support the car manufacturers objectives with our innovative solutions and extensive expertise in battery test to continue driving e-mobility forward."21.02.2020 13:00:00Feb\images\news_keysight.pnghttps://about.keysight.com/en/newsroom/pr/2020/21feb-nr20023.shtmlabout.keysight.com/newsroom
Ball-Attach and Flip-Chip Flux IntroducedIndium Corporation has expanded its flux portfolio...8584Product ReleaseBall-Attach and Flip-Chip Flux IntroducedIndium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. WS-446HF is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces-including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.<br><br>• Includes a chemistry that eliminates dendrite issues, especially critical for fine-pitch flip-chip applications<br>• Provides tackiness suitable for holding solder spheres and large die in place during assembly, eliminating missing balls and reducing die tilt and non-wet-opens due to warpage<br>• Delivers consistent pin transfer, printing, and dipping performance, ensuring consistent joint quality and improving production yields<br>• Eliminates the need for multiple fluxing steps, enabling a single-step ball-attach process and eliminating the warpage-inducing effects of prefluxing<br>• Has good cleanability with room temperature DI water, avoiding the formation of white residue20.02.2020 14:30:00Feb\images\news_2020-03-15_18.jpghttps://www.indium.com/corporate/communications/news/indium-corp-introduces-new-ball-attach-and-flip-chip-flux/indium.com/news
System for Designing and Measuring Power SystemsRidley Engineering will release a product March 16...8572Product ReleaseSystem for Designing and Measuring Power SystemsRidley Engineering will release a product March 16, 2020 to enhance its product line. The RidleyBox combines the following-a lifetime license for RidleyWorks Design Software, a 4-channel Frequency Response Analyzer, a 4-channel 200 MHz Oscilloscope, a Ridley Universal Injector, and an Intel computer-all in one product. Live demonstrations will be available at the Applied Power Electronics Conference in New Orleans, LA March 18-20, 2020 in the Exhibit Hall, booth 1517. "This began as a concept to condense our labs for travel and teaching. The resulting product is one from which the entire power electronics community can benefit," commented Dr. Ridley.20.02.2020 14:30:00Feb\images\news_2020-03-01_10.jpghttp://www.ridleyengineering.com/ridleyengineering.com
Power Supply Series Includes Two and Four Channel ModelsFor any test and measurement application requiring...8567Product ReleasePower Supply Series Includes Two and Four Channel ModelsFor any test and measurement application requiring up to four independent DC power supplies with full flexibility, full functionality, full safety and full connectivity, the Rohde &Schwarz NGP800 power supply series will boost the efficiency in any lab or production line. Users benefit from the large 5" high resolution touch screen, which also displays detailed statistics. The five R&S NGP800 models meet the needs of users seeking minimum device footprint for two or four independent power supplies, with maximum flexibility for voltages up to 250 V, currents up to 80 A and power up to 800 W. Each channel supplies up to 200 W with a maximum of 20 A or 64 V, also covering 48 V automotive and industrial applications. Channels can be operated fully independently or synchronized; the electrically equivalent and galvanically isolated outputs can be wired in series for outputs up to 250 V or in parallel for up to 80 A. The tracking function makes it possible for users to adjust voltage and current simultaneously on selected channels, with programmable output delays used to meet specific power-up sequences. The supplied voltage can be ramped up to the required level in any period from 10 ms to a minute. All outputs operate in either constant voltage mode or constant current mode.20.02.2020 13:30:00Feb\images\news_2020-03-01_15.jpghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/new-r-s-ngp800-power-supplies-boost-efficiency-with-up-to-four-independent-channels-in-a-single-compact-instrument-press-release-detailpage_229356-781952.html?change_c=truerohde-schwarz.com/news-press
BCD-on-SOI Technology PlatformX-FAB Silicon Foundries SE has announced the avail...8587Product ReleaseBCD-on-SOI Technology PlatformX-FAB Silicon Foundries SE has announced the availability of medium-voltage transistors – complementing the company's leading 180nm BCD-on-SOI technology platform (XT018). The medium voltage devices cover voltages from 12V to 32V. With that customers now have access to a complete portfolio of different voltage options – covering a 10V to 200V voltage range. These complementary NMOS/PMOS devices support automotive AEC-Q100 grade 0 designs and deliver competitive on-resistance (Rdson) figures combined with robust safe-operating areas for Rdson, Idsat and Vth. Designs may be optimized for operational performance and size by selecting the most appropriate transistors. X-FAB's XT018 technology is also the only one that offers a full range of automotive grade-0 qualified memory options, including SONOS-based Flash and embedded EEPROM. In addition to the availability of the medium-voltage devices, X-FAB has also announced the full volume production of the 70V to 125V high-voltage transistors that it first released last summer. These devices are mainly targeted at the growing market for automotive 48V board net and battery management system (BMS) ICs. X-FAB has already received a number of customer designs that utilize the different voltage options in automotive, industrial and consumer applications. BCD-on-SOI is superior in many aspects when compared to conventional bulk BCD technologies, making it very attractive to design engineers.20.02.2020 11:30:00Feb\images\news_2020-03-15_15.jpghttps://www.xfab.com/about-x-fab/news/newsdetail/article/x-fabs-automotive-180nm-bcd-on-soi-technology-platform-further-optimized-for-smart-actuators-and-po/?tx_ttnews%5BbackPid%5D=98&cHash=f0cfbcd6bc698f4b655476c1eb44528axfab.com/news
Becoming a Carbon-Neutral CompanyInfineon Technologies AG will become carbon-neutra...8575Industry NewsBecoming a Carbon-Neutral CompanyInfineon Technologies AG will become carbon-neutral by 2030. The company presented its plans at its Annual General Meeting in Munich. Infineon is thus making an active contribution to reducing CO 2 worldwide and achieving the targets defined in the Paris Climate Agreement. The objective relates to its own greenhouse gas footprint and includes not only all direct emissions, but also indirect emissions from electricity and heat production. Emissions are to be cut by 70 percent over the 2019 levels by 2025. Energy efficiency and hence reducing CO 2 emissions have long been core elements of Infineon's business model. Making life greener is part of the company's mission. Through the use of its products and solutions by the customers of Infineon, 40 times more CO 2 can currently be avoided than is generated during production. With its goal of going carbon neutral, the company is thus taking the next strategic step to fulfill its own mission. "Climate change threatens the global ecosystem and so the very existence of mankind," said Dr. Reinhard Ploss, Chief Executive Officer of Infineon. "It's an acknowledged fact that we need to act. With our goal to become carbon-neutral, we are making a pledge by which others outside the company can measure us."20.02.2020 08:00:00Feb\images\news_2020-03-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2020/INFXX202002-030.htmlinfineon.com/press-releases
Accelerate Market Adoption of Gallium Nitride-Based ProductsSTMicroelectronics and TSMC are collaborating to a...8576Industry NewsAccelerate Market Adoption of Gallium Nitride-Based ProductsSTMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market. Through this collaboration, ST's innovative and strategic GaN products will be manufactured using TSMC's leading GaN process technology. GaN is a wide bandgap semiconductor material which offers significant benefits over traditional Silicon-based semiconductors for power applications. These benefits include greater energy efficiency at higher power, leading to a substantial reduction in parasitic power losses. GaN technology also allows the design of more compact devices for better form factors. Additionally, GaN-based devices switch at speeds as much as 10X faster than Silicon-based devices while operating at higher peak temperatures. These robust and intrinsic material characteristics make GaN ideally suited for broad-based adoption in evolving automotive, industrial, telecom, and specific consumer applications across both the 100V and the 650V clusters. Specifically, Power GaN and GaN IC technology-based products will enable ST to provide solutions for medium and high-power applications with better efficiency compared to silicon technologies on the same topologies, including automotive converters and chargers for hybrid and electric vehicles. Power GaN and GaN IC technologies will help accelerate the megatrend of the electrification of consumer and commercial vehicles.20.02.2020 07:00:00Feb\images\news_2020-03-01_2.jpghttps://newsroom.st.com/media-center/press-item.html/c2943.htmlnewsroom.st.com/media-center
Belgian National Company OpenedWürth Elektronik continues its international expan...8577Industry NewsBelgian National Company OpenedWürth Elektronik continues its international expansion course and with the opening of Würth Elektronik België BV which celebrated the 23rd sales branch. From Turnhout, to the east of Antwerp, electronics developers and manufacturers throughout Belgium and Luxembourg are supported by five technical field staffers, who in turn are supported by a three back office staff. Components and samples are supplied within 24 hours from the central warehouses in Germany and France. Würth Elektronik has been active in Belgium with local employees since 2006. This is now followed by the conversion into a separate national company. "The foundation of the new company is a logical step in the positive development of the Würth Elektronik eiSos Group in BeNeLux. This creates the basis for further growth," said Thomas Schrott, CEO of the Würth Elektronik eiSos Group, on the occasion of the foundation of the Belgian sales office. The Country Manager is Dimitri Verhaert, who has established Würth Elektronik in the Belgian market with growing success since 2006.20.02.2020 06:00:00Feb\images\news_2020-03-01_1.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_112563.phpwe-online.com/news
Successful Business Year 2019BMZ Poland, second largest production site of the ...8596Industry NewsSuccessful Business Year 2019BMZ Poland, second largest production site of the international BMZ Group, doubles production area and reports 10% sales growth and thereby record results for the business year 2019. The past year 2019 led to a very positive result at the Polish subsidiary BMZ Poland, particularly in terms of operating profit growth. The economic situation has become more volatile, while global growth has slowed noticeably. Despite an increasingly difficult market environment, BMZ Poland remains on its course. This is a confirmation of the BMZ Group's continuous growth averaging 30% per year. In each month of the past year, activities were focused on sales and, in particular, results, which led to a significantly higher gross margin of 11% at the end of 2019, an increase of almost 50% over the previous year, confirming the confidence of customers in the BMZ brand. These good performances are the result of implemented optimization and production process balancing changes. New key customers, all leading OEMs in Europe, from the e-bus and power tool sectors are opening up access to fast-growing markets such as bus electrification. These customers ensure a stable order situation throughout 2020.19.02.2020 11:00:00Feb\images\news_2020-03-15_6.jpghttps://www.bmz-group.com/media/attachments/2020/02/19/010-pm-poland-2019-turnover_englisch.pdfbmz-group.com/media
Investment for Design Center in Dublin, IrelandMaxim Integrated announced the opening of a design...8579Industry NewsInvestment for Design Center in Dublin, IrelandMaxim Integrated announced the opening of a design center in Dublin, Ireland. The design center will focus on product development and conducting research and development in the areas of analog semiconductor design to deliver Maxim's innovative solutions across many end markets. To make this vision a reality, the company will recruit a strong team of mixed-signal and analog design engineers at this facility. The $25M investment will be primarily geared towards recruiting talent, equipment and building costs, as well as research and development. Located on the south side of Dublin, this is Maxim's seventh design center located in Europe. "With our rich history and depth of talent, I'm thrilled that Maxim Integrated has chosen Dublin for this important investment," said John Kirwan, vice president of Global Customer Operations at Maxim Integrated. "We encourage collaboration between employees representing a wealth of diverse, global experiences, from recent graduates of local universities to veteran designers who have been in the industry for many years." "Maxim's innovative IC designers create products that truly excite their design engineering customers and change everyday lives," said David Dwelley, chief technology officer at Maxim Integrated. "With this new facility, we plan to reinvent the way we develop technology and push innovation even further, giving our customers the products they need to succeed."19.02.2020 10:00:00Feb\images\news_2020-03-01_5.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_2079143579#.XlOS3fpcNI4.mailtomaximintegrated.com/newsroom
Developing of A/D Converter Circuit TogetherRenesas Electronics and Hitachi announced a techno...8578Industry NewsDeveloping of A/D Converter Circuit TogetherRenesas Electronics and Hitachi announced a technology collaboration to enable continuous-time digital calibration of a delta-sigma (&Delta;&Sigma;) modulator and an analog-to-digital (A/D) converter circuit. Designed to boost the performance of &Delta;&Sigma; A/D converters for stable performance under the harsh conditions required for automotive semiconductor devices, the technology comprises enhanced precision by using a least mean square (LMS) algorithm to measure and calibrate the transfer function of a continuous-time &Delta;&Sigma; modulator, and the world’s first multi-rate LMS search algorithm, which lowers the order and operating frequency of the coefficient search circuit and FIR digital filter to reduce power consumption. The results of this joint effort with Hitachi were presented by Renesas on February 18 at the International Solid-State Circuits Conference (ISSCC) 2020. In recent years, as advanced driver assistance systems (ADAS) and self-driving vehicles come closer to becoming a reality, there has been an increasing need for automobiles to incorporate a variety of sensors, such as millimeter wave radar, LiDAR, and ultrasonic wave sensors, in order to detect objects and people, and to provide an awareness of the vehicle’s surroundings. A/D converters used to convert analog signals from such sensors into digital signals must operate at a high speed and with high precision. However, the harsh conditions specific to automotive vehicles have made obtaining stable performance an important issue. 19.02.2020 09:00:00Feb\images\news_2020-03-01_4.jpghttps://www.renesas.com/eu/en/about/press-center/news/2020/news20200219.htmlrenesas.com/press-center
High Clearance / Creepage Distance Isolation Power Transformer SeriesBourns introduced its high clearance/creepage dist...8565Product ReleaseHigh Clearance / Creepage Distance Isolation Power Transformer SeriesBourns introduced its high clearance/creepage distance isolation power transformer series. Bourns Model HCT series high-voltage isolation push-pull transformers are AEC-Q200 compliant. Bourns designed its latest transformer series to support isolated interface power for CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower-power LAN. Solutions that simplify isolated interface power are required in a broad range of applications including those designed to meet Industry 4.0 and in low/medium risk medical sensors, communication PHYs and metering. The capabilities of the Bourns Model HCT series are also ideal solutions for circuits requiring low DC power and any application where isolation from potentially hazardous voltages are needed such as from a high-voltage battery. The Bourns Model HCT series features an input range of 3.3 to 5 V and delivers 3.3 to 15 V and up to 350 mA output, configured in a variety of turns ratios. The series is constructed with a ferrite toroid core for high coupling factor and efficiency. Furthermore, the power transformers are offered in a low-profile 6.5 mm housing with reinforced insulation, at least 8 mm clearance / creepage distance and 4.2kVac withstanding voltage to provide an elevated degree of isolation from high voltage hazards.19.02.2020 06:30:00Feb\images\news_2020-03-01_17.jpghttps://www.bourns.com/news/press-releases/pr/2020/02/19/bourns-introduces-high-clearance-creepage-distance-isolation-power-transformer-seriesbourns.com/news
Linear Thermistors Offer High AccuracyTexas Instruments (TI) expanded its temperature se...8571Product ReleaseLinear Thermistors Offer High AccuracyTexas Instruments (TI) expanded its temperature sensing portfolio to include linear thermistors that deliver up to 50% higher accuracy than negative temperature coefficient (NTC) thermistors. The higher accuracy of TI's thermistors enables operation closer to the thermal limits of the other components and the overall system, helping engineers maximize performance while reducing bill-of-materials (BOM) and total solution cost. TI's thermistors deliver reliable, highly accurate thermal measurements, particularly at temperatures above 80°C. This is especially important for industrial, automotive and consumer applications where precise, real-time temperature readings are fundamental to system performance and protection. NTC thermistors provide less accurate temperature readings due to their low sensitivity and high resistance tolerance at temperature extremes. To compensate for these challenges, many engineers calibrate at three points across the temperature range or use multiple thermistors to monitor different temperature ranges. These approaches can still produce unreliable temperature readings, which can require systems to shut down before reaching their true thermal limit. The linearity and high accuracy of TI's thermistors enable single-point calibration, which maximizes system performance and simplifies design.17.02.2020 10:30:00Feb\images\news_2020-03-01_11.jpghttps://news.ti.com/industrys-smallest-linear-thermistors-help-engineers-reach-new-thermal-limitsnews.ti.com
Automotive CAN Isolated Transceiver ModuleThanks to the simple CAN bus transmission and wiri...8569Product ReleaseAutomotive CAN Isolated Transceiver ModuleThanks to the simple CAN bus transmission and wiring, as well as the strong anti-interference ability, CAN bus has become the preferred communication protocol for the automotive electronics industry. Mornsun released an automotive CAN transceiver module series CTD-CAN. From design, verification to production processes, this CTD-CAN series is completely in accordance with IATF16949 system requirements and meets AEC-Q100 standards. With the design concept of compact size, SMD package high reliability and efficient production, the CTD-CAN series adopts IC integrated technology to integrate power isolation, signal isolation, CAN transceiver and bus protection in one module, which effectively solves the bus interference, abnormal communication issues. It can be used in applications of automotive electronics, automotive peripherals, instrumentation, communication, grid, etc.13.02.2020 08:30:00Feb\images\news_2020-03-01_13.jpghttp://www.mornsun-power.commornsun-power.com
Electrically Conductive Plastic Offers Flammability RatingChomerics Europe, a division of Parker Hannifin Co...8573Product ReleaseElectrically Conductive Plastic Offers Flammability RatingChomerics Europe, a division of Parker Hannifin Corporation, has launched PREMIER PBT-250FR for EMI shielding in automotive applications. This polybutylene terephthalate (PBT) plastic will come to the assistance of any design engineer seeking a single pellet, electrically conductive, flame retardant material offering high levels of reliability whenever there is potential for fuel exposure or issues surrounding automotive fluid compatibility, thus providing complete peace of mind for the customer and end user. Of particular note, at 2.5mm thick, the material has been designated 5VA, the highest flammability rating from UL 94, the Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances. This level of flame retardant performance is obviously essential when the application involves highly flammable fluids. A 5VA rating means burning stops inside 60 seconds on a vertical specimen without dripping (and without creating a hole in the specimen). For those who require a thinner EMI housing, PREMIER PBT-250FR carries a UL 94 rating of V-0 at 1.5mm thick. "In ongoing discussions with our partners, one request we kept hearing over and over was how an electrically conductive plastic with a 5VA flammability rating would address a major gap in the marketplace," states John Beswick, engineered plastics solutions business unit manager, Parker Chomerics.12.02.2020 09:30:00Feb\images\news_2020-03-01_9.jpghttp://www.parker.com/chomericsparker.com/chomerics
Thermal Conductivity Materials for High Power ApplicationsHenkel announced the expansion of its award-winnin...8564Product ReleaseThermal Conductivity Materials for High Power ApplicationsHenkel announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. BERGQUIST GAP PAD TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today, an innovation which earned the material a coveted Circuits Assembly NPI Award at last month's IPC APEX EXPO event. "Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm," explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. "High-end routers, servers, switches and base band units continue to pack more capability into already small footprints. High thermal conductivity solutions are a necessity to dissipate the resulting heat for assurance of system reliability and optimal performance." Well-known for their high compliance, surface conformability and low stress, BERGQUIST GAP PADs have long been employed for telecom and datacom applications to effectively minimize the adverse impact of heat on device operation and lifetime. Henkel, addressing current and future market requirements, developed the latest GAP PAD to manage the challenging thermal loads inherent with increased power densities.12.02.2020 07:30:00Feb\images\news_2020-03-01_18.jpghttps://www.henkel-northamerica.com/press/press-releases-and-kits/2020-12-02-henkel-expands-line-of-high-thermal-conductivity-bergquist-gap-pads-for-high-power-applications-1030918henkel-northamerica.com/press-releases
Battery Electric Vehicle Architectures CongressTo realise the transition towards zero-emission hi...8557Event NewsBattery Electric Vehicle Architectures CongressTo realise the transition towards zero-emission high-efficiency vehicles, battery weight reduction and design of lightweight structures become the main challenge for the automotive industry. To realise the transition, OEMs need to identify the right strategies in selecting and utilising lightweight materials; taking safety, performance, production volume and manufacturability into consideration, for longer range, with lower cost. Optimisation in design, engineering and manufacturing are key issues for all OEMs. In order to directly address these, and identify solutions, LBCG is delighted to announce the Battery Electric Vehicle Architectures & Lightweight Materials 2020 Congress, May 5 & 6, 2020, Munich, Germany, a combination of our successful BEVA series and GALM series on BEV lightweight structures and material utilisation.10.02.2020 12:00:00Feb\images\news_bevaeurope.jpghttp://www.beva-alm-europe.combeva-alm-europe.com
Source-Down 25 V Power MOSFETInfineon Technologies is focusing on system innova...8552Product ReleaseSource-Down 25 V Power MOSFETInfineon Technologies is focusing on system innovation with enhancements on component level by addressing the challenges of modern power management designs. The Source Down is the new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS TM 25 V in a PQFN 3.3x3.3 mm. The device sets a new industry benchmark in MOSFET performance, reducing on-state resistance (R DS(on)) and offering superior thermal management capability to the marketplace. The product is well-suited for a wide range of applications such as drives, SMPS (including server, telecom, and OR-ing) and battery management. The package concept connects the source potential (instead of the drain potential) to the thermal pad. Along with the enabled new PCB layout possibilities, this helps achieving ever higher power density and performance. Two different footprint versions are released – the Source-Down Standard-Gate and the Source-Down Center-Gate in a PQFN 3.3x3.3 mm package. The Source-Down Standard-Gate footprint is based on the current PQFN 3.3x3.3 mm pinout configuration. The location of the electrical connection remains the same, simplifying the drop-in replacement of today's standard Drain-Down packages with the new Source-Down package. For the Center-Gate version, the gate-pin is moved to the center supporting easy parallel configuration of multiple MOSFETs.10.02.2020 10:30:00Feb\images\news_2020-02-15_12.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFPMM202002-026.htmlinfineon.com/market-news
Iso 13485:2016 Certification AchievedEOS Power is proud to announce that it has receive...8558Industry NewsIso 13485:2016 Certification AchievedEOS Power is proud to announce that it has received certification for ISO 13485:2016, Quality management system for Medical devices. The certification was granted by LL-C Certification, Czech Republic. EOS Power is engaged in design, manufacturing and selling of Medical grade power supplies. EOS Provides standard, modified and custom design power solutions to customer needs. All Medical grade power supplies are approved to latest medical certifications required globally and now in addition EOS Power design process, manufacturing and quality systems are certified to ISO13485 standards. This allows EOS Power to become a "one stop" solution for medical device manufacturers for their power supply and any EMS/PCBA requirements required in their medical application. ISO 13485:2016 standard is recognized by the Global Harmonization Task Force (GHTF) and has become the model QMS standard for the medical industry. "EOS Power's manufacturing facility obtaining ISO 13485:2016 certification is an advantage when working with Medical customers, allows us to add potential opportunities in the medical device markets we have being missing where this certification was required." says Mr. Paul Scholz, VP-Sales. This certification provides additional leverage with customers, added Ms. Teresa Fernandez, EMEA Sales Manager. "Successfully achieving ISO 13485:2016 certification is a huge milestone for EOS Power in its journey of becoming a world class organization. This will certainly help to position EOS Power as a global leader in the medical device industry" says Mr. Vijay Gujarathi, COO and Director.06.02.2020 11:00:00Feb\images\news_eos.pnghttp://eospower.com/News/NEWS-20-004_EOS%20POWER%20ACHIEVES%20ISO%20134852016%20CERTIFICATION.pdfeospower.com/News.pdf
EMEA Distribution AgreementSCHURTER and TTI are pleased to announce the signi...8597Industry NewsEMEA Distribution AgreementSCHURTER and TTI are pleased to announce the signing of an EMEA distribution agreement. This will extend the long-standing, successful cooperation in France to include the rest of Europe, Africa and the Middle East. TTI, Inc. was founded in 1971 and now has over 6700 employees across the globe. With the acquisition of Mateleco in France in 2008, TTI has become an important distributor of SCHURTER products. The SCHURTER portfolio and TTI's Specialist passive, electromechanical and discrete strategy are a perfect fit "We are delighted to now be able to offer SCHURTER high quality products to even more customers and combine our value propositions to provide the best service to our customers. We are looking forward to a successful launch and long term partnership", says Felix Corbett, Supplier Marketing Director at TTI Europe. Laurent Brühl, Managing Director of SCHURTER S.A.S., sums up: "TTI has proven to be a reliable and competent partner who has been able to clearly exceed its ambitious goals in the past years of successful cooperation. With TTI as an EMEA wide distributor we will be able to serve various markets even better in the future". With over 133 subsidiaries in Europe, America and Asia, TTI is established as one of the largest distributors of electromechanical components.06.02.2020 10:00:00Feb\images\news_schurter.pnghttps://www.schurter.com/Newsroom/Timeline/TTI-and-SCHURTER-sign-EMEA-Distribution-Agreementschurter.com/Newsroom
PCIM Europe 2020's Trending Topics and HighlightsEvery year the power electronics industry from all...8561Event NewsPCIM Europe 2020's Trending Topics and HighlightsEvery year the power electronics industry from all over the world meets at the PCIM Europe in Nuremberg. In 2020, trade visitors of the leading international exhibition and conference for power electronics can, once again, look forward to highly specialized highlight topics and an attractive program of lectures. From 5 - 7 May 2020, Nuremberg will revolve around power electronics and its applications. Some 500 exhibiting companies from 30 countries are expected to present a broad range of products and solutions to trade visitors – from components to intelligent systems along the entire value chain. New trends and developments will be presented to the public for the first time at the meeting point for experts from industry and science. Trade visitors will receive a deeper insight into product innovations and enjoy a personal exchange with manufacturers – whether they come from the field of power electronic converter systems, sensors, semiconductors, passive components or power quality and energy storage. For those interested in power electronics for electric mobility, the E-mobility Area is the first place to go. Here, numerous suppliers will provide information on relevant products and components from this application area. In addition, there is a special E-mobility Forum with exciting technical presentations to be discovered on all three days of the exhibition.06.02.2020 08:00:00Feb\images\news_2020-02-15_3.jpghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/prieview.htmlpcim.mesago.com/press
Intelligent Power Devices Enabling Standalone System ProtectionROHM announced the availability of the BV2Hx045EFU...8555Product ReleaseIntelligent Power Devices Enabling Standalone System ProtectionROHM announced the availability of the BV2Hx045EFU-C, a family of high voltage (41V) dual channel output high side switch (Intelligent Power Devices, IPD) optimized for automotive ECUs in transmission control, engine control, and other vehicle systems. IPDs are semiconductor devices that protect electronic circuits from breakdown (i.e. due to overcurrent during abnormalities). Unlike conventional fuses, IPD as semiconductor fuses can protect circuits without degrading or breaking down, making it possible to achieve maintenance-free systems. The BV2Hx045EFU-C are the industry's first high-side IPDs capable of providing standalone protection against overcurrent by incorporating an original overcurrent protection function. Conventional IPDs only protect against inrush current at startup, so MCUs and overcurrent detection ICs are needed for protection of steady-state currents, and there is still the possibility of an out of control situation due to compatibility issues with subsequent circuits connected to the IPD output. In contrast, this new series can protect the system against both inrush and steady state overcurrent, ensuring greater system safety by providing a high reliability solution with fewer parts compared to conventional products. In addition, the overcurrent protection range can be adjusted with external components to enable broad compatibility.06.02.2020 07:30:00Feb\images\news_2020-02-15_9.jpghttps://www.rohm.com/news-detail?news-title=industry-s-first-intelligent-power-devices-enabling-standalone-system-protection&defaultGroupId=falserohm.com/news
24V Industrial Power SupplyTDK Corporation announces the introduction of the ...8550Product Release24V Industrial Power SupplyTDK Corporation announces the introduction of the TPS4000-24 power supply rated at up to 4,080W at 24V. The TPS series can operate automatically from 400, 440, and 480Vac nominal delta or WYE inputs, without wiring changes or the need for large, costly step-down transformers. This industrial grade power supply is ideal for use in a wide range of applications including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, laser cutting and RF power amplifiers. The TPS4000 is fully featured with output voltage and current programming, warning signals, configurable remote on/off, a 12V 0.3A standby voltage and a PMBus interface. Using this communications function allows remote monitoring of the output voltage, output current, internal temperature, status signals and fan speed. The output voltage, over current limit and the remote on/off are programmable via the PMBus. The output voltage is adjustable from 19.2 to 28.5V and the current limit point by 70-105% using front panel potentiometers or an analogue 0-5Vdc voltage. An internal ORing FET simplifies the parallel operation of up to 8 units for redundant or higher power requirements. Excluding the output busbars, the unit measures 107 x 84.4 x 335mm, making it suitable for 2U high racking systems. The weight of the product is just 4kg.05.02.2020 12:30:00Feb\images\news_2020-02-15_14.jpghttps://www.emea.lambda.tdk.com/de-en/news/article.aspx?cid=15646emea.lambda.tdk.com/news
ees Europe 2020: Energy Storage for CompaniesFrom June 17 to 19, 2020, ees Europe is set to sho...8580Event Newsees Europe 2020: Energy Storage for CompaniesFrom June 17 to 19, 2020, ees Europe is set to showcase a wide range of market-ready energy storage systems at Messe Mu¨nchen and highlight the progress made by the storage industry as a whole over the past few years. The exhibition is part of The smarter E Europe, the innovation hub for new energy solutions. 55 percent of managers are reporting competitive advantages as a result of their commitment to the climate, while 79 percent say an improved brand reputation has been their biggest economic advantage. Moreover, 52 percent are finding that investors have greater trust in them, and 63 percent say that they are driving innovation as a result of their climate targets. The potential of reducing carbon emissions and the economic benefits of using intelligent energy storage systems are so great that innovative solutions are now being implemented in numerous areas across a variety of economic sectors. The energy industry has come to understand that it's not enough to simply use batteries on their quest to become carbon neutral – the battery production process also needs to be optimized in terms of carbon emission reductions. The battery manufacturer "Northvolt", for example, wants to manufacture the world's greenest battery using hydropower from the north of Sweden. Its plant in Skelleftea° is operated using electricity from hydropower, with excess heat stored and fed into the local power grid. The raw materials used for the batteries are obtained from reliable, secure sources. From 2024 onwards, the company intends to supply more than 400,000 car batteries each year.04.02.2020 12:00:00Feb\images\news_2020-03-01_7.jpghttps://www.ees-europe.com/en/news-press/for-journalists/press-releases/press-release/ees-europe-2020-energy-storage-for-companies-saving-co2-maintaining-an-image-and-reducing-costs-3744ees-europe.com/news-press
The World of Power Semiconductor Devices Meets in ViennaThe 32nd International Symposium on Power Semicond...8563Event NewsThe World of Power Semiconductor Devices Meets in ViennaThe 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) will be held in Vienna, Austria, May 17–21, 2020. It is the premier forum for technical discussion in all areas of power semiconductor devices, power integrated circuits, their hybrid technologies, and applications. With an attendance of about 500 experts it is firmly established as the must-attend conference for the power semiconductor industry reflecting the growing importance of power electronics and power semiconductors for a sustainable world. It is technical co-sponsored by IEEE and its societies EDS, PELS and IAS, as well as by ECPE and IEEJ. The ISPSD captures all areas of power semiconductor devices and power integrated circuits (low and high voltage power devices & circuits, all semiconductor materials including Si, SiC, GaN and Ga2O3, as well as power semiconductor packaging). The conference offers an attractive short course program on Sunday covering important topics like modelling of package parasitics for fast switching devices, system level optimization of power converters, bipolar and super junction device concepts for SiC, GaN integrated circuit design, processes and devices with materials beyond SiC & GaN (like AlN, Ga2O3), and last but not least silicon high power devices (IGBTs and Fast Recovery Diodes).03.02.2020 06:00:00Feb\images\news_ispsd.pnghttps://www.ispsd2020.com/ispsd2020.com
E Cores Solve Challenging Power Conversion ApplicationsMicrometals continues to expand their prototyping ...8556Product ReleaseE Cores Solve Challenging Power Conversion ApplicationsMicrometals continues to expand their prototyping and custom core capabilities with the expansion of E Core variations available. Micrometals E Cores are renowned for their performance and quality by delivering exceptional part-to-part consistency. With over 20 industry standard E Core sizes, from 12.7mm to 210mm, in both Iron and Alloy materials, Micrometals leads the industry in COTS shapes and materials. One significant advantage to Micrometal's E Cores are their distributed gap materials, which do not require any gapping to improve saturation like ferrite cores. The expanded prototyping and customization capabilities allows Micrometals to customize their standard E Cores by shaping the outer legs or center post to improve the usability for customers. This customization permits the use of pre-wound coils for higher winding density compared to traditionally square shaped E Cores. Further, these custom E Cores deliver superior performance compared to similar shaped cores that are custom tooled. Jim Cox, Micrometals President commented "For decades, our customers have trusted Micrometals cores to deliver exceptional reliability, consistency and performance. With these expanded customization capabilities we deliver that same performance and consistency, but with more application friendly features that exceed our customer's expectations in terms of performance and functionality. Customer are also thrilled that they can get these as prototypes or production parts without any tooling costs, allowing them to test multiple designs without a large investment."01.02.2020 06:30:00Feb\images\news_2020-02-15_8.jpghttps://www.micrometals.com/shapes/e-coremicrometals.com/shapes/e-core
PEMD 202010th International Conference on Power Electronics...8516Event NewsPEMD 202010th International Conference on Power Electronics, Machines and Drives<br><br>21 - 23 April 2020. East Midlands Conference Centre, Nottingham, UK<br><br>We're pleased to be a media partner of #PEMD2020 – the IET's popular conference on power electronics, machines and drives. The conference includes 39 sessions of the high quality, technical content that PEMD is so well known for. You will gain insight into the latest developments, learn from authors worldwide and put you and your organisation ahead of the game! Technical sessions include novel converter topologies and applications, permanent magnet machines, machine control, advanced manufacturing and power electronic converters for energy systems. See the full programme at29.01.2020 12:00:00Jan\images\news_2020-02-01_26.jpghttps://events2.theiet.org/pemd/index.cfm?utm_source=advertising&utm_medium=web&utm_campaign=pemd&utm_content=bodos_powertheiet.org/pemd
Low RDS(on) MOSFETNexperia announced the release of its lowest-ever ...8554Product ReleaseLow RDS(on) MOSFETNexperia announced the release of its lowest-ever RDS(on) power MOSFET. The PSMNR51-25YLH sets a new standard of 0.57 m? at 25 V. Utilising Nexperia's NextPowerS3 technology, this performance is offered without compromising other important parameters such as maximum drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG. Very low RDS(on) devices are required in many applications such as ORing, hot-swap operation, synchronous rectification, motor control and battery protection, to reduce I²R losses and increase efficiency. However, some competing devices with similar RDS(on) values suffer from reduced SOA – a measure of the ruggedness of the MOSFET – and reduced ID(max)) ratings due to shrinking cell-pitches. Nexperia's PSMNR51-25YLH MOSFET offers a maximum drain current rating up to 380 Amps. This parameter is especially important in motor control applications where motor-stall can result in very high current surges for short periods, which the MOSFET must withstand for safe and reliable operation. Some competitors provide only computed ID(max) whereas Nexperia demonstrates continuous current capability up to 380 Amps. The device is packaged in LFPAK56, Nexperia's 5mm x 6mm Power-SO8 compatible package, offering a high performance copper-clip construction which absorbs thermal stresses, increasing quality & lifetime reliability.29.01.2020 08:30:00Jan\images\news_2020-02-15_10.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-extends-market-leading-low-rds-on-mosfet-performance-with-the-release-of-its-0.57-m-product-in-lfpak56.htmlnexperia.com/press-releases
Wide Bandgap Power AmplifierMouser Electronics continues to push forward with ...8546Product ReleaseWide Bandgap Power AmplifierMouser Electronics continues to push forward with new product introduction activity in the analogue space, by adding further Qorvo devices to its expansive portfolio. The 100-W QPA3069 power amplifier is predominantly focused on defence and avionics applications (such as radar). This high power density IC covers the 2.7-GHz to 3.5-GHz radio frequency (RF) band and offers a 25-dB power gain along with a 53% power-added efficiency (PAE). Fabricated using Qorvo's 0.25-µm gallium nitride on silicon carbide (GaN-on-SiC) semiconductor process, this high-performance S-band amplifier has greater than 58-dBm of saturated output power and is subject to only minimal power losses. It is supplied in a compact 7.0-mm × 7.0-mm × 0.85mm package, with each of its two RF ports incorporating a DC blocking capacitor. A minus 40 to 85 degree Celsius operational temperature range is supported.28.01.2020 16:30:00Jan\images\news_2020-02-15_18.jpghttps://www.mouser.com/pressroom/mouser.com/pressroom
Jetting Solder PasteIndium Corporation continues to develop innovative...8551Product ReleaseJetting Solder PasteIndium Corporation continues to develop innovative solder paste solutions to fit customers' needs. PicoShot NC-5M is designed for customers needing a no-clean halogen-free SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules. PicoShot NC-5M jetting solder paste is the first material to come out of Indium Corporation's new partnership with Mycronic, a global leader in dispensing and jet printing equipment. PicoShot NC-5M is a no-clean halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic's MY 600/700 jetting systems. PicoShot can be used in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield attach, and microBGA. It also complements the stencil printing of Indium8.9HF. Designed as a no-clean solder paste, PicoShot can be cleaned easily with industry standard cleaning solutions. Indium Corporation also offers a PicoShot NC-5M conditioner (purging gel) designed to allow the rapid purging, cleaning, and long-term storage of jetting, dispense, and microdispense systems without the use of liquid solvents. PicoShot Conditioner C-1 is a chemically benign, bright blue-colored translucent, viscous gel that aids in visual endpoint detection and prevents inconsistent dispense volumes and clogging caused by solder paste dry-out.28.01.2020 11:30:00Jan\images\news_2020-02-15_13.jpghttps://www.indium.com/corporate/communications/news/solder-paste-solutions/indium.com/news
Shining the Spotlight on Intelligent Charging Systems The expansion of charging infrastructure is one of...8559Event NewsShining the Spotlight on Intelligent Charging Systems The expansion of charging infrastructure is one of the most important factors that will determine the success of the transportation transition. With this in mind, many European countries are stepping up investments in this infrastructure. Smart charging is resulting in e-mobility becoming increasingly intelligent by, for example, charging electric cars when it makes economic sense to do so or by allowing car batteries to temporarily store electricity for use in the car owner's home or the power grid. A new white paper produced by the European business association SmartEN (Smart Energy Europe) in cooperation with Power2Drive Europe, the international exhibition for charging infrastructure and e-mobility, sheds light on the latest trends. The topic will also be a key feature of the exhibition itself, which will take place in Munich from June 17 to 19, 2020. One highlight of the event will be the introduction of new smart charging and vehicle-to-grid concepts (V2G).28.01.2020 10:00:00Jan\images\news_2020-02-15_5.jpghttps://www.powertodrive.de/en/news-press/for-journalists/press-releases/press-release/power2drive-europe-2020-shining-the-spotlight-on-intelligent-charging-systems-3720powertodrive.de/press-releases
Signal Integrity Debugging with Jitter DecompositionRohde & Schwarz has developed method for analyzing...8521Product ReleaseSignal Integrity Debugging with Jitter DecompositionRohde & Schwarz has developed method for analyzing the individual components of jitter, providing electronic circuit designers with previously unavailable in-depth knowledge invaluable for debugging high-speed signals. As data rates increase and voltage swings decrease, the jitter in digital interfaces becomes a significant percentage of the signaling interval, and potential source of failures. Increasingly, engineers require tools that accurately characterize the signal jitter including the break-down into its individual components. The R&S RTO-/ RTP-K133 advanced jitter analysis option introduces an analytic approach to separating the individual components of jitter such as random jitter, and deterministic jitter components, such as data dependent and periodic jitter. This approach is based on a parametric signal model that fully characterizes the behavior of the transmission link under test. A core benefit of this Rohde & Schwarz method is that the jitter model includes the complete waveform characteristic of the signal under test, in contrast to conventional methods that reduce the data to a set of Time Interval Error measurements. The result is consistent measurement data even for relatively short signal sequences, plus previously unavailable information such as the step response, or a distinction between vertical and horizontal periodic jitter.23.01.2020 08:30:00Jan\images\news_2020-02-01_21.jpghttps://www.rohde-schwarz.com/us/about/news-press/all-news/rohde-schwarz-improves-signal-integrity-debugging-with-innovative-jitter-decomposition-approach-for-its-oscilloscopes-press-release-detailpage_229356-765120.html?change_c=truerohde-schwarz.com/news-press
Non-Isolated Converter Saves Board AreaTDK Corporation announces the addition of the TDK-...8519Product ReleaseNon-Isolated Converter Saves Board AreaTDK Corporation announces the addition of the TDK-Lambda brand i6A4W SIP (Single Inline Package) to the popular i6A series of 250W rated non-isolated DC-DC converters. Requiring less than 3 cm2 (0.47in2) of board area, this provides a saving of 60% over the i6A 1/16th brick package. Offering adjustment ranges of up to 3.3V to 40V the 10 to 20A rated step-down converters can accept input voltages between 9 and 53V. The i6A4W series allows the creation of multiple, high current output voltages from a single output 12V, 24V, 36V or 48V AC-DC power supply, and is suitable for use in communications, industrial, test and measurement, broadcast and portable equipment. With overall dimensions of 33 mm x 11.4 mm x 24.8 mm (L x W x H), these converters have ultra-high efficiencies of up to 97%. This allows operation in ambient temperatures of -40°C to +125°C with the minimised output derating, even in low airflow and high ambient temperature conditions. The product's optimised dynamic voltage response reduces the need for external capacitors, saving cost and additional board space. Standard features include a trim pin for output voltage adjustment, + remote sense, remote on-off (positive or negative logic), input under-voltage, over-current and over-temperature protection. Power good, operating frequency synchronisation and output sequencing are available as options.22.01.2020 10:30:00Jan\images\news_2020-02-01_23.jpghttp://www.emea.lambda.tdk.com/i6aemea.lambda.tdk.com/i6a
Reduce System Costs for InvertersThe installed photovoltaic capacity is growing rap...8532Industry NewsReduce System Costs for InvertersThe installed photovoltaic capacity is growing rapidly worldwide. Photovoltaic systems with a total output of around 600 GW now supply clean and cost-effective electricity – replacing around 600 medium-sized coal-fired power plants. SMA Solar Technology AG (SMA) and Infineon Technologies support this growth trend with the latest generation of innovative silicon carbide (SiC)-based solar inverters. The semiconductor material reduces the system costs for inverters and increases their efficiency. The production costs for solar power are thus further reduced. With the Sunny Highpower PEAK3 from SMA, available since 2019, decentralized photovoltaic power plants can be planned flexibly and efficiently up to the megawatt range. The basis for this is the compact design designed for 1500 VDC, which delivers an output of 150 kW per unit. This is made possible by SiC technology from Infineon: Six power modules of the type CoolSiC EasyPACK 2B and 36 gate drivers of the EiceDRIVER family 1ED20 convert the direct current generated by the solar cells into grid-compatible alternating current - with an efficiency of over 99 percent. "Silicon carbide enables us to build the inverters compact, powerful and reliable," said Sven Bremicker, Head of Technology Development Center at SMA. "In the Sunny Highpower PEAK3, the CoolSiC modules almost double the specific output from 0.97 to 1.76 kW/kg. Due to the compact design, the inverters are much easier to transport and much faster to install."21.01.2020 10:00:00Jan\images\news_2020-02-01_10.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFIPC202001-021.htmlinfineon.com/market-news
"Not Knowing the Rules Can Ruin Your Power Converter Design"The Power Sources Manufacturers Association (PSMA)...8560Event News"Not Knowing the Rules Can Ruin Your Power Converter Design"The Power Sources Manufacturers Association (PSMA) Energy Management Committee is sponsoring Industry Session IS29 at APEC2020 on Thursday, March 19th, at 1:45 pm in the Ernest N. Morial New Orleans Convention Center. Four presentations each address an "if" that can throw a wrench into a power converter design:<br>•"If Your Efficiency is Too Low, Your Sales will be Too Low" <br>Ada Cheng, Ada'Clock <br>•"If Your Standby Power is Too High, Your Power Converter Won't Sell" <br>David Chen, Power Integrations' Director Applications Engineering<br>•"If Your Power Converter is Not Safe, You May Have an Expensive Recall" <br>Mark Batulan, Product Safety Engineer, Power Integrations<br>•"EMI: If You Don't Comply, It Will Interfere with Your Sales."<br>Jim Spangler, Spangler Prototype<br>Kevin Parmenter, Taiwan Semiconductor US<br><br>Most power converter designers know that a product design must meet its design specification. They may not be aware of regional standards and regulations that also must be met. The testing of the product and its labeling may have special requirements as well. Failure to comply may mean that the product cannot be marketed or used in some jurisdictions or for some applications. The topics in this Industry Session will address the more important standards and regulations that must be met.<br><br>PSMA Energy Management Committee Meeting Notice<br>Interested individuals are also invited to participate in the PSMA Energy Management Committee meeting on Tuesday, March 17th from 2:00 – 4:00 pm to plan the committee program for the coming year. <br>21.01.2020 09:00:00Jan\images\news_psma.jpghttps://www.psma.com/conferences/APEC#item-6030psma.com
A New Solar Era in Spain Begins By adding an estimated 4.7 GW in 2019, Spain retur...8539Industry NewsA New Solar Era in Spain Begins By adding an estimated 4.7 GW in 2019, Spain returns to the continent's top solar markets and is the clear market leader in Europe. The forecasts for the future development remain promising. According to Solar Power Europe's "European Market Outlook 2019-2023", Spain is expected to have a compound annual growth rate of 34% by 2023 in the medium scenario. A total installed solar PV capacity of 25.6 GW will then be reached. What role corporate sourcing of renewables and PPAs (Power Purchase Agreements) will play in this process and what obstacles still have to be overcome will be discussed on May 19, 2020 at Intersolar Summit Spain in Barcelona. After a successful start in 2019, Intersolar Summit Spain is taking place for the second time and will welcome more than 250 attendees. At the beginning of 2019, the Spanish government approved the submission of the draft Integrated National Energy and Climate Plan 2021-2030 (NECP/ PNIEC). It defines caps on national greenhouse gas emissions, taking into account renewable energy and energy efficiency measures. The main goals are, to reduce greenhouse gas emissions by 21% with respect to 1990, to achieve 42% renewable energy in the country's final energy use, and to achieve 74% renewable energy in electricity generation by 2030.21.01.2020 03:00:00Jan\images\news_2020-02-01_3.jpghttps://www.thesmartere.com/en/home/news-and-publications/press-releases/press-releases-details?tx_news_pi1%5Bnews%5D=3704&cHash=0a6857bb65a5decdd84575120dd26589thesmartere.com/press-releases
Cooling Units Offer Easy InstallationCUI Devices Thermal Management Group announced the...8528Product ReleaseCooling Units Offer Easy InstallationCUI Devices Thermal Management Group announced the addition of two models to its Peltier cooling unit product offering. The CPM-2C and CPM-2H carry 7 A and 8.5 A current ratings respectively, adding to the 6 A current rating of the previously released CPM-2F. As complete Peltier cooling units, the CPM models feature a tighter seal structure for water resistance and absorption of thermal stress as well as easy installation. With wide temperature deltas up to 85.9°C (Th=50°C) and 70 mm x 70 mm package sizes, these thermoelectric cooling units are well suited for industrial, refrigeration, and sealed applications where forced air cooling is not an option. In addition to their tight seal structure and easy installation, the CPM models also integrate CUI Devices' innovative arcTEC structure. This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from premium silicon ingot. When combined, these features reduce stress on the module and improve performance during thermal cycling conditions, while enabling faster, more uniform cooling.21.01.2020 02:30:00Jan\images\news_2020-02-01_14.jpghttps://www.cuidevices.com/news/press-releases/peltier-cooling-units-offer-easy-installation-and-improved-thermal-performancecuidevices.com/press-releases
Current Sensors Combine Small Size and High PerformanceICE Components announces a series of current senso...8529Product ReleaseCurrent Sensors Combine Small Size and High PerformanceICE Components announces a series of current sensors for use in a wide range of pcb mount applications. The ISE current sensors measure both DC and AC current from 50A up to 200A. The sensors include an integrated core to improve accuracy and provide protection from external stray fields. The ISE series is available in four standard current ratings of 50A, 100A, 150A and 200A. For applications of over 5k pcs the current sensors can be programmed for unique current ranges or output slopes. They are rated for an operating temperature range of -40 to +130 degrees C. <br><br>Key Features Include:<br>- Integrated bus bar for easy application onto your pcb<br>- Programmable current measurement slope<br>- 25.4mm x 18mm footprint and 10.8mm low profile height<br>- Integrated shield for EMC immunity<br>- 3 µ-Sec response time (200kHz bandwidth)<br>- High level of output accuracy<br>- Outstanding linearity. Predictable output vs. current measurement <br>- Operates off an input voltage of 5 VDC and provides a 0.5 to 4.5 VDC output voltage that is ratiometric to the input.21.01.2020 01:30:00Jan\images\news_2020-02-01_13.jpghttps://www.icecomponents.com/ise-a-800-seriesicecomponents.com/ise-a-800-series
SEMICON Korea 2020Explore what's happening in the Korea electronics ...8515Event NewsSEMICON Korea 2020Explore what's happening in the Korea electronics manufacturing ecosystem at SEMICON Korea, February 5-7, COEX, Seoul. With over 1,900 booths and over 500 companies from 20 countries you can "Connect, Collaborate, and Innovate." Attend forums in smart manufacturing, metrology and inspection, test, the MEMS & Sensor Summit, AI Summit, and more. Register now.16.01.2020 15:57:00Jan\images\logo_semicon-korea.pnghttps://semi.website/01bpkotxtnsemi.website
Integrated Active Clamp Flyback ControllersSilanna Semiconductor announced that its SZ1101 an...8547Product ReleaseIntegrated Active Clamp Flyback ControllersSilanna Semiconductor announced that its SZ1101 and SZ1105 fully integrated active clamp flyback (ACF) controllers for designing high-power-density AC/DC power adapters are now fully qualified and in production. The SZ1101 33W version is suited for designing mobile phone travel adapters, while the SZ1105 65W version is suited for designing compact adapters for powering notebooks, video game consoles, and multi-port wall chargers. The SZ1101 and SZ1105 Flyback PWM Controllers are unique in that they combine four key ACF components: an advanced adaptive digital ACF controller and three ultra-high-voltage (UHV) components – an active clamp MOSFET, an active clamp FET driver, and a startup voltage regulator. This unprecedented level of integration facilitates designing efficient, high-power-density AC/DC power adapters with low bill-of-material (BOM) cost. Released products and evaluation boards (EVBs) are now available showing industry leading efficiencies in an all-Silicon solution, while achieving more than 6dB margin for Electromagnetic Interference (EMI). "Silanna is excited with the full production release of these parts and is looking forward to the adoption from the many customers currently in design," said Mark Drucker, CEO of Silanna Semiconductor. "Our customers are achieving extremely high power densities by overcoming the thermal challenges of packing increasing amounts of power into today's slim, compact power adapters."16.01.2020 15:30:00Jan\images\news_2020-02-15_17.jpghttps://www.silannasemi.com/pd-max-productssilannasemi.com/pd-max-products
Coalition Dedicated to Corporate Social ResponsibilityMicrochip Technology announced it has joined the R...8538Industry NewsCoalition Dedicated to Corporate Social ResponsibilityMicrochip Technology announced it has joined the Responsible Business Alliance (RBA), a nonprofit coalition of companies dedicated to the improvement of social, environmental and ethical conditions in their global supply chains. The RBA Code of Conduct is a set of social, environmental and ethical industry standards. The standards set out in the Code of Conduct reference international norms and standards including but not limited to the Universal Declaration of Human Rights, ILO International Labor Standards, OECD Guidelines for Multinational Enterprises plus ISO and SA standards. "With the principles of corporate social responsibility as a fundamental part of Microchip's DNA, we remain committed in every aspect of our business and operations to advancing human rights, ethics and health and safety worldwide," said Ganesh Moorthy, president and chief operating officer. "Along with RBA member companies, we align under a set of common values that send a clear message of commitment to the global supply base and to our customers." Microchip's values and operating principles including its Code of Business Conduct and Ethics, certifications, sustainability reporting and other standards are reflected in the company's practices and actions of employees worldwide. Microchip is committed to aligning with organizations and companies worldwide to advocate for principals regarding workforce and labor standards, human rights, sustainability and anti-corruption.16.01.2020 04:00:00Jan\images\logo_microchip.pnghttps://www.microchip.com/en/pressreleasepage/microchip-joins-responsible-business-alliancemicrochip.com/pressreleasepage
Programmable DC Load Product SeriesVitrek introduces the DL Series of Digital, Progra...8549Product ReleaseProgrammable DC Load Product SeriesVitrek introduces the DL Series of Digital, Programmable DC Loads, designed to support the testing requirements for the latest generation of off-line power supplies, dc-dc converters and LED drivers. The DL Series is also equipped to handle a wide range of battery testing requirements. The devices are offered in three power ratings (125W, 250W and 500W), each with input voltages of 0-150V or 0-500 VDC. Unlike comparable programmable DC loads, the DL Series is capable of supporting loading sequences utilizing constant voltage (CV), constant resistance (CR), constant current (CC) and constant power (CW) in any combination in single or arbitrary sequences of up to 100 steps. The DL Series provides high-current transient loading capability twenty times higher than other units in this class while also being capable of generating µA loads. Measurement accuracy is typically an order of magnitude better at lower loading levels and double that of competing devices at higher loads. The instruments allow for a current or power sweep of up to 500 steps in each direction to and from set values and a voltage dependent current loading mode for complex variable output supplies. Standard OCP/OPP/OTP/OVP features and battery test modes are among other loading modes also included.15.01.2020 13:30:00Jan\images\news_2020-02-15_15.jpghttps://vitrek.com/press-release-vitrek-launches-new-programmable-dc-load-product/vitrek.com/press
Multi-Year Silicon Carbide Wafer Supply AgreementROHM and STMicroelectronics announced it signed a ...8531Industry NewsMulti-Year Silicon Carbide Wafer Supply AgreementROHM and STMicroelectronics announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe. The agreement governs the supply of over 120 million dollars of advanced 150mm silicon carbide wafers by SiCrystal to STMicroelectronics during this period of demand ramp-up for silicon carbide power devices. "This additional long-term SiC substrate supply agreement comes on top of the external capacity we have already secured and the internal capacity we are ramping. It will enable ST to increase the volume and balance of the wafers we will need to meet the strong demand ramp-up from customers for automotive and industrial programs over the next years", said Jean-Marc Chery, President and CEO of STMicroelectronics. "SiCrystal is a group company of ROHM and has been manufacturing SiC wafers for many years. We are very pleased to enter into this supply agreement with our longstanding customer ST. We will continue to support our partner to expand silicon carbide business by ramping up wafer quantities continuously and by providing reliable quality at all times", said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company. The adoption of power solutions with SiCs is accelerating in both the automotive and industrial markets. With this agreement, the two companies will contribute to the widespread use of SiC in these markets.15.01.2020 11:00:00Jan\images\news_2020-02-01_11.jpghttps://www.rohm.com/news-detail?news-title=sicrystal-and-st-announce-multi-year-silicon-carbide-wafer-supply-agreement&defaultGroupId=falserohm.com/news
SiC-based Power Converters Using Gate Drive Evaluation PlatformLittelfuse, Inc. announced the Gate Drive Evaluati...8524Product ReleaseSiC-based Power Converters Using Gate Drive Evaluation PlatformLittelfuse, Inc. announced the Gate Drive Evaluation Platform (GDEV). The evaluation platform helps designers evaluate SiC MOSFETs, SiC Schottky diodes, and other peripheral components like gate driver circuitry, so that they can better understand how silicon carbide technologies will behave in converter applications under continuous operating conditions. The GDEV offers quick connect header pin terminals that allow for rapid and consistent comparison of different gate drive circuits, unlike most other SiC evaluation platforms. The GDEV supports an 800 V DC link input voltage and up to 200 kHz switching frequency. "The Gate Drive Evaluation Platform (GDEV) is a critical addition to our SiC technology portfolio because SiC is still relatively new and there are some unknowns surrounding the operating characteristics under various conditions," said Corey Deyalsingh, Director, Power Control at Littelfuse.  "The GDEV helps engineers understand the operating characteristics of SiC devices. By utilizing this evaluation platform, designers will be better informed about the incredibly energy efficient opportunities that SiC technologies present. Equipped with that knowledge, we anticipate that designers will be more likely to incorporate SiC into their future designs."15.01.2020 06:30:00Jan\images\news_2020-02-01_18.jpghttps://www.littelfuse.com/about-us/news/news-releases/2020/01.14-accelerate-the-design-cycles-of-power-converters.aspxlittelfuse.com/news-releases
Aluminum Electrolytic Snap-in CapacitorsCornell Dubilier Electronics, Inc. (CDE) introduce...8527Product ReleaseAluminum Electrolytic Snap-in CapacitorsCornell Dubilier Electronics, Inc. (CDE) introduces its 381LL series of long-life snap-in aluminum electrolytic capacitors. The series, designated with an expected life of 8,000 hours at full-rated conditions, demonstrates superb stability in capacitance and DC leakage current over time on test. The snap-in series is targeted for use in critical applications where long life and reliability are paramount. Capacitance values range from 740µF to 100,000µF at working voltages of 16 to 250 WVDC with ripple current ratings up to 10 Amps @ 105 °C. The snap-in series is available in two pin configurations in the smaller diameters with 4 and 5 pin options in the larger diameters. General applications include any circuit requiring high capacitance with low ESR, high ripple current and long life. This includes switch-mode power supplies, UPS systems, solar and other high-power inverters. CDE's 381LL, long-life aluminum electrolytic capacitors are available from the company's franchised distributors.15.01.2020 03:30:00Jan\images\news_2020-02-01_15.jpghttps://www.cde.com/news/2020/1/381-383llcde.com/news
Gate Drivers for Fast Switching SiC Power ModulesCISSOID delivers robust Gate Drivers for XM3 SiC M...8522Product ReleaseGate Drivers for Fast Switching SiC Power ModulesCISSOID delivers robust Gate Drivers for XM3 SiC MOSFET Power Modules from Wolfspeed. Aiming high power density converters, the Gate Driver board safely drives the fast switching SiC power modules to achieve low losses and operates in high temperature environments found inside space-constrained motor drives, compact power supplies or fast battery chargers. The CMT-TIT0697 Gate Driver board has been designed to be directly mounted on CAB450M12XM3 1200V/450A SiC MOSFET Power Modules. With an on-board isolated power supply delivering up to 2.5W per channel without derating up to 125°C (Ta), the gate driver can drive XM3 modules up to 100KHz, enabling high power density. Peak gate current up to 10A and immunity to high dV/dt (>50KV/µs) make possible to drive the power module with zero gate resistance achieving minimum switching losses. The board withstands isolation voltages up to 3600V (50Hz, 1min) and offers creepage distances of 14mm. Protection functions such as undervoltage lockout (UVLO), Active Miller Clamping (AMC), Desaturation detection and Soft-shut-down (SSD) ensure the safe drive and reliable protection of the power module in case of fault events. 14.01.2020 07:45:00Jan\images\news_2020-02-01_20.jpghttp://www.cissoid.com/news/cissoid-delivers-robust-gate-drivers-for-wolfspeed-fast-switching-sic-power-modules.htmlcissoid.com/news
Gate Drivers Achieve Automotive QualificationPower Integrations announced the launch of its aut...8523Product ReleaseGate Drivers Achieve Automotive QualificationPower Integrations announced the launch of its automotive-qualified SID1181KQ SCALE-iDriver gate driver for 750 V-rated IGBTs. The part expands the company's range of auto-qualified driver ICs, following the introduction of the 1200 V SID1182KQ driver IC. Compact, efficient and highly robust, the driver IC uses Power Integrations' high-speed FluxLink communications technology to ensure system safety even during fault conditions. FluxLink technology dramatically improves the reliability and isolation capability of the new AEC-Q100-qualified gate drivers, replacing optocouplers and capacitive or silicon-based inductively coupled solutions. SCALE-iDriver devices also include critical protection features such as desaturation monitoring, primary and secondary Undervoltage Lock-out (UVLO) and Advanced Soft Shut Down (ASSD) that protect the switch during short-circuit turn-off. Comments Michael Hornkamp, senior director of marketing for automotive gate-driver products at Power Integrations: "The SCALE-iDriver family with FluxLink technology supports safe, cost-effective designs for a wide range of IGBT drivers for electric vehicle applications including powertrain, on-board chargers and charger stations, and other high reliability drivers and inverters." SCALE-iDriver ICs minimize the number of external components required, eliminating tantalum and electrolytic capacitors and simplifying the isolated power supply, requiring only one transformer secondary winding. A simple two-layer PCB can be used, further increasing design simplicity and easing supply-chain management.14.01.2020 07:30:00Jan\images\news_2020-02-01_19.jpghttps://investors.power.com/investors/press-releases/press-release-details/2020/Power-Integrations-Highly-Robust-SCALE-iDriver-Gate-Drivers-Achieve-AEC-Q100-Automotive-Qualification/default.aspxpower.com/press-releases
TestConX Keynote on Materials Science InnovationsIndium Corporation's Ross Berntson, President and ...8535PeopleTestConX Keynote on Materials Science InnovationsIndium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held March 1-4, 2020 in Mesa, Arizona, USA. Demands for entertainment connectivity, edge computing, energy efficiency, speed, convenience, safety, and much more are driving changes in electronic architecture, especially advanced packaging. In his presentation entitled "Materials Science Innovation in Advanced Packaging", Berntson will examine the advances in materials technologies, with an emphasis on the interconnect systems and thermal management necessary to support these new packages. Performance, processing challenges, and total cost will be discussed for each material, and Berntson will also share some of the roadmap gaps that need to be addressed with new materials and possible solutions. Ross Berntson is President and Chief Operating Officer for Indium Corporation. He is responsible for Indium Corporation's global sales, marketing, technical support, operations, engineering, human resources, and product R&D functions. Berntson joined Indium Corporation in 1996 as a Product Specialist. He quickly rose to the roles of Product Manager, Marketing Leader, Sales Leader, and Tech Support Leader. Most recently, he has served as Executive Vice President and President of Indium Corporation's Asia Holdings. Berntson lived in Singapore for two years, learning much about the daily activities in Southeast Asia and China. While there, he expanded his understanding of the regional business needs and opportunities for our company.14.01.2020 07:00:00Jan\images\news_2020-02-01_7.jpghttps://www.indium.com/corporate/communications/news/TestConX/indium.com/news-releases
Relay with Power Contacts on NO and NC SideMore than 30 years ago, Panasonic changed the way ...8545Product ReleaseRelay with Power Contacts on NO and NC SideMore than 30 years ago, Panasonic changed the way how to design safety modules by bringing a low profile 8pole safety relay on the market. Now the launch of the new 1a1b SFM relay will start the next phase of the market revolution. With a height of only 7.8mm and reflow soldering capability, SFM provides great design possibilities and is ready for future production processes. As all Panasonic Industry safety relays, SFM offers power contacts on both NO (6A) and NC (4A) side to control loads like valves directly without another relay in between. Contrarywise, the silver alloy contacts can handle low level loads down to 10V 1mA as well to support e.g. signaling boards in the railway sector. A very high shock and vibration resistance = 20g, low coil holding power of 100mW, an ambient temperature range from -40°C to 85°C and reinforced insulation = 5.5mm (V=230V overvoltage category III, 6KV) on NO side contribute to an almost unlimited field of applications.13.01.2020 17:30:00Jan\images\news_2020-02-15_19.jpghttp://industry.panasonic.euindustry.panasonic.eu
Supervisory Board with New Line-UpThe terms of office of all employee representative...8562Industry NewsSupervisory Board with New Line-UpThe terms of office of all employee representatives on the Supervisory Board and of six of the eight members on the side of the shareholders will expire at the close of the Annual General Meeting of Infineon Technology. The future employee representatives were already elected in December 2019. The remaining members are to be elected by the shareholders at the upcoming Annual General Meeting; the Supervisory Board proposes Xiaoqun Clever, Dr. Friedrich Eichiner, Dr. Ulrich Spiesshofer and Margret Suckale for election. The re-election of the current shareholder representatives Hans-Ulrich Holdenried and Dr. Manfred Puffer is also planned. The current mandates of the Supervisory Board members Dr. Wolfgang Eder and Géraldine Picaud remain unaffected by the election process at the upcoming Annual General Meeting. Peter Bauer, Dr. Herbert Diess, Prof. Dr. Renate Köcher and Dr. Eckart Sünner will therefore no longer be members of the Supervisory Board.13.01.2020 07:00:00Jan\images\news_2020-02-15_2.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2020/INFXX202001-020.htmlinfineon.com/press
DC/DC Converter for Industrial & Railway ApplicationsTRACO POWER announces their THN 10 WIR series of 1...8520Product ReleaseDC/DC Converter for Industrial & Railway ApplicationsTRACO POWER announces their THN 10 WIR series of 10 watt high-density DC/DC Converters in the industry standard 1" x 1" footprint and qualified for rugged industrial and railway applications and certified to EN 50155 and EN 61373 standards. The THN 10WIR series of ruggedized 10 Watt DC/DC converters are designed and manufactured for high reliability in harsh environments. The converters have ultra-wide wide 4:1 input ranges of 9-36, 18-78 and 36-160 VDC with single and dual outputs ranging from 3.3-24 VDC. The innovative design provides high efficiencies up to 90% and enables a full load operating temperature range from -40 to +80°C without derating and increased resistance against electromagnetic interference, shock/vibration and thermal shock. All models are safety approved to IEC/EN/UL 62368-1 with CB Report and EN 50155 certified qualifying them for harsh environments in industrial, railway and transportation systems and further qualified for fire behavior of components per EN 45545-2. Features include: an internal EN 55032 class A input filter; input under-voltage-lockout; short circuit protection; remote On/Off; and output voltage trim. All models offer extreme reliability with an MTBF in excess of 2.3 million hours and are supported by TRACO POWER'S 3 year warranty.10.01.2020 09:30:00Jan\images\news_2020-02-01_22.jpghttp://www.tracopower.us/thn10wirtracopower.us/tthn10wir
SMD Fuse Family ExtendedThe proven UMF 250 SMD fuse family is extended by ...8543Product ReleaseSMD Fuse Family ExtendedThe proven UMF 250 SMD fuse family is extended by a 15 A version. SCHURTER is now offering the UMF 250 in a total of 15 rated currents between 500 mA and 15 A. It is particularly suitable for electromobility applications with higher rated currents.With its quick characteristics (small melting integral) according to IEC 60127-4, the UMF 250 is the logical addition to the successful UMT 250 range. It is sealed against potting compound to achieve a hermetic seal for use in intrinsically safe applications according to ATEX and IECEx requirements. Thanks to its high cycle stability and minimal temperature derating, it is extremely robust and resistant to ageing. Thanks to its low internal resistance, the UMF 250 is ideally suited for primary and secondary protection on SMD circuit boards. Applications of the UMF 250 include the protection of battery-powered systems with high switch-off capacities of 500 A @ 125 VDC (e.g. electromobility). The fuse is also suitable for primary protection in the AC range, for example in voltage regulator modules and charging stations. The UMF 250 can is a halogen-free and RoHS-compliant fuse for lead-free soldering processes. The solder surface compatibility with the most important competitor products allows SCHURTER to offer the UMF 250 as a replacement product. The fuse is cURus approved.09.01.2020 19:30:00Jan\images\news_2020-02-15_21.jpghttps://www.schurter.com/Newsroom/Timeline/UMF-250-Rated-Current-Extensionschurter.com/Newsroom
North Carolina State University to Host EnerHarvThe Power Sources Manufacturers Association (PSMA)...8530Event NewsNorth Carolina State University to Host EnerHarvThe Power Sources Manufacturers Association (PSMA) and North Carolina StateUniversity (NCSU) are pleased to announce the EnerHarv 2020 International Workshop on Energy Harvesting and Micro-Power Management will be held from June 16-18, 2020 in Raleigh, North Carolina and hosted by North Carolina State University. The event will be managed by the Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (ASSIST) at NCSU. EnerHarv 2020 will build upon the inaugural event held in 2018 at the Tyndall National Institute in Cork, Ireland. The mission remains the same - to create a focal point for a community of experts and users of energy harvesting & related technologies to share knowledge, best practices, roadmaps, experiences and to create opportunities for collaboration primarily in the wireless IoT edge device sector. "EnerHarv was set up as a key biennial event to help solve the 'trillion sensor challenge' of 2025, recognizing that most of the world's IoT devices will require a portable power source such as a battery needing to outlive the device that it powers," commented Brian Zahnstecher, PSMA Energy Harvesting Committee and EnerHarv Co-Chair.09.01.2020 12:00:00Jan\images\news_enerharv.pnghttps://www.psma.com/technical-forums/energy-harvesting/workshoppsma.com/workshop
Quad-Output DC/DC µModule RegulatorsAnalog Devices, Inc. introduced the LTM4668 and LT...8517Product ReleaseQuad-Output DC/DC µModule RegulatorsAnalog Devices, Inc. introduced the LTM4668 and LTM4668A µModule regulators, quad-output DC/DC regulators with up to 4.8A output capability. The devices integrate switching controllers, power FETs, inductors and support components, easing the design process while reducing power consumption and board space. They are ideal for telecom, networking and industrial applications. Operating over an input voltage range of 2.7V to 17V, the LTM4668 and LTM4668A support an output voltage range of 0.6V to 5.5V. The devices support frequency synchronization, PolyPhase operation, selectable Burst Mode operation, 100% duty cycle and low IQ operation. Their high switching frequency and a current mode architecture enable a very fast transient response to line and load changes without sacrificing stability. The LTM4668 and LTM4668A are available today in 6.25mm x 6.25mm x 2.1mm BGA packages.09.01.2020 11:45:00Jan\images\news_2020-02-01_25.pnghttp://www.analog.comanalog.com
The Lighting Industry Comes TogetherThe focus for the workshops and panel discussions ...8533Event NewsThe Lighting Industry Comes TogetherThe focus for the workshops and panel discussions at LpS/TiL in Bregenz will be centred around the third industrial revolution and what this really means for lighting designers, technologists, manufacturers and regulators.  All parties can inspire, contribute and influence the next steps companies must make in order to satisfy end-users and harness IoT capabilities. A new industrial revolution is characterized by three major technological advances occurring almost simultaneously; new energy sources, new communication channels and new transport options. Renewable energy sources, the world of the Internet, IoT and self-propelled traffic on land and in the air show these developments in concrete terms. After 200 years of industrial activity, resource depletion and climate change, the lighting industry is navigating future technologies, infrastructure and investment decisions.  There is a palpable biosphere consciousness and drive to protect nature and the environment, to guard our habitat for future generations as well as for ourselves. LpS/TiL 2020 will explore how and with what the light sector, including Photonics, can contribute. The new world for architects is dominated by smart retro-fit programmes and data-driven optimization.  The new world for manufacturers is designing for a circular economy including interoperability and standardization. Eminent speakers from these fields will come together to help share perspectives and understand the necessary collaborations and obstacles ahead.09.01.2020 09:00:00Jan\images\news_2020-02-01_9.jpghttps://www.led-professional-symposium.com/third-industrial-revolution-ignites-debate-for-lps-til-2020led-professional-symposium.com
Competence for System Solutions of Universal ChargersInfineon Technologies expands with Rompower its ex...8537Industry NewsCompetence for System Solutions of Universal ChargersInfineon Technologies expands with Rompower its expertise for the development of universal chargers with high efficiency and compact design. These USB-PD chargers (Power Delivery) with the universal USB-C connector enable the power supply of e.g. monitors or smart speakers and charge the batteries of mobile devices such as smartphones or tablets. Today, these plugs already perform other functions, such as fast charging smartphones. Using the USB-PD technology, smartphones can be fully charged in less than an hour. USB-PD is made possible by the universal USB-C connector, which allows for higher data transfer and higher power transfer compared to widely established micro-USB and USB-A/B connectors. The next development stage for all these functions will be permanently installed USB-PD wall outlets. With a maximum power output of 100 W made possible by the USB-PD standard, they not only support fast charging of mobile devices, but also function as permanently installed adapters. In the medium term, USB-PD charging sockets will be used in public buildings, such as airports and hotels, as well as in private households and will reduce the need for adapters and chargers. Within the partnership, Infineon will contribute its semiconductor expertise, Rompower will offer its technologies and international know-how in the system area as well as in the construction of compact, small and highly efficient charging solutions. The first step is the development of system solutions for compact fast chargers for smartphones and USB-PD wall outlets. 09.01.2020 05:00:00Jan\images\news_infineon.pnghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFPMM202001-019.htmlinfineon.com/market-news
Quarter-Brick with Digital Control for Telecom and Compute EquipmentArtesyn Embedded Power announced the BDQ1300, a 13...8542Product ReleaseQuarter-Brick with Digital Control for Telecom and Compute EquipmentArtesyn Embedded Power announced the BDQ1300, a 1300 watt quarter-brick dc-dc converter, designed to provide the highest efficiency on-board 12V output for telecom, computing and server applications, with optional digital control. With efficiency rated over 97 percent, the BDQ1300 is designed as a voltage source for non-isolated point-of-load converters. It can accept an input voltage range from 40 to 60 volts, making it ideal for 48-volt data center and communications network equipment. Rated for up to 110 amps, the Artesyn BDQ1300 is a fully isolated dc-dc converter, which can be applied with separate input and output ground connections. This isolation means that EMI management and any possible fault condition can be contained within the primary side of the converter. The modules use a standard high-current quarter-brick pin-out. A pair of power pins are provided for the positive output and ground connections to enable the current to be conducted to the host PCB. Conduction losses from the module are minimized using large diameter pins.08.01.2020 20:30:00Jan\images\news_2020-02-15_22.jpghttp://www.advancedenergy.comadvancedenergy.com
Fuses Designed for Automotive and In-Rush Current ApplicationsBel Fuse-Circuit Protection announces their 0680L ...8548Product ReleaseFuses Designed for Automotive and In-Rush Current ApplicationsBel Fuse-Circuit Protection announces their 0680L Series of ceramic surface mount fuses with in-rush current withstand capability in a 2410 SMD package size. These slow blow fuses are designed for automotive and applications which require high DC voltage ratings and high DC interrupting ratings. Bel's 0680L Series fuses are compatible with the 260º, IR Pb-free solder process and feature a current rating from 375mA to 12A and a wide operating temperature range of -55º to 125ºC. These fuses are also AEC-Q200 compliant, RoHS compliant (with exemption 7(a)), halogen free (MSL = 1) and lead free. In addition, they are packaged in tape and reel for the auto-insert SMD process and meet the Bel automotive qualification, which is based on the AEC-Q test plan. Typical application use for the 0680L Series includes notebooks, LCD/LED monitors and TVs, PC computers and office electronic equipment, industrial and medical equipment, PoE, PoE+, power supplies, storage systems, telecommunication systems, wireless base stations, white goods, game consoles and battery charging circuit protection applications which require slow blow or time delay fuses to power the 2410 chip. The 0680L Series is in stock with Digi-Key and Mouser in up to 1,000 or 5,000 pieces in tape and reel. Product samples also available upon request.08.01.2020 14:30:00Jan\images\news_2020-02-15_16.pnghttps://belfuse.com/news-detail/bel-fuse-circuit-protection-announces-0680l-series-of-slow-blow-2410-smd-fusesbelfuse.com/news
Thermal Management Solutions for High-power ApplicationsHeat sinks are used in a myriad of devices for bot...8518Product ReleaseThermal Management Solutions for High-power ApplicationsHeat sinks are used in a myriad of devices for both electronic and mechanical applications such as automotive LED headlights, HVAC systems and ECUs, as well as busbars and power modules for energy applications. Traditionally, thermal management takes the form of extruded, forged or die-casted heat sinks connected to heat-generating electronics. However, with the rise of more powerful microelectronics and the push toward more compact designs, it becomes increasingly difficult to accommodate the bulky size and weight of these conventional designs. Interplex's heat sink design approaches that enable design freedom with 3D individualizable fin characteristics. These approaches provide for tight integration into the target sub-systems, minimize product cost, and enable fast ramp-up to high-volume production. Product engineers now have an expanded range of custom thermal management solutions that deliver on excellent heat dissipation while significantly reducing weight.08.01.2020 10:45:00Jan\images\news_2020-02-01_24.jpghttps://interplex.com/resources/power/technical-bulletins/integrated-thermal-management-solutions-with-custom-manufacturable-heat-sink-designs-2/?utm_source=tb&utm_medium=email&utm_campaign=201912-HeatSink&utm_content=fullTBinterplex.com/power
Transistor Technology Reaches Record FrequenciesScientists at the Fraunhofer Institute for Applied...8534Industry NewsTransistor Technology Reaches Record FrequenciesScientists at the Fraunhofer Institute for Applied Solid State Physics IAF have succeeded in developing a novel type of transistor with extremely high cut-off frequencies: metal oxide semiconductor HEMTs, in short MOSHEMTs. To achieve this, they have replaced the Schottky barrier of a conventional HEMT with an oxide. The result is a transistor that enables even smaller and more powerful devices. It has already reached record frequencies of 640 GHz. This technology is expected to advance next generation electronics. The high frequency characteristics of high eElectron mobility transistors (HEMTs) have been steadily improved in the past years. The transistors have become increasingly faster by downscaling the gate length to 20 nm. However, a HEMT encounters a problem at such small structure sizes: The thinner the barrier material of InAlAs (indium aluminum arsenide) becomes, the more electrons leak from the current carrying channel through the gate. These unwanted gate leakage currents have a negative impact on the efficiency and durability of the transistor, which renders further downscaling attempts impossible. The current transistor geometry of a conventional HEMT has reached its scaling limit. Silicon MOSFETs (metal oxide semiconductor field effect transistors) are no stranger to this problem, either. However, they possess an oxide layer that can prevent unwanted leakage currents for longer than it is the case with HEMTs.08.01.2020 08:00:00Jan\images\news_2020-02-01_8.jpghttps://www.iaf.fraunhofer.de/en/media-library/press-releases/MOSHEMT.htmliaf.fraunhofer.de/press-releases
Electrolytic Capacitors with Solder LugsAluminium electrolytic capacitors with solder lugs...8525Product ReleaseElectrolytic Capacitors with Solder LugsAluminium electrolytic capacitors with solder lugs are needed in applications where the capacitor is separate from the electronic circuitry and cannot be mounted directly on the printed circuit board. In this case, the solder lugs allow flexible connection by means of a soldered cable. FTCAP (part of the Mersen Group) offers different series with numerous solder lug variations in this product area. The fully welded design increases the life of the capacitors. "There are two basic types of solder lugs or solder pins: with closed and open eyes", explains André Tausche, Managing Director of FTCAP. "The difference is that in the second version the cable can be fed through the eye. But we also offer numerous variations within these two categories. This allows us to offer customers maximum flexibility in connecting the cable." In addition to the extensive product range, solder lug capacitors from FTCAP feature a fully welded design: The life of these capacitors is much longer than that of riveted models. FTCAP electrolytic capacitors with solder lugs provide reliable solutions with high energy density, which in turn allows high discharge currents. Potential areas of application for solder lug capacitors include switch-mode power supplies, computers, industrial electronics, and drive systems.08.01.2020 05:30:00Jan\images\news_2020-02-01_17.jpghttps://www.ftcap.de/en/products/electrolytic-capacitors/solder-terminals/ftcap.de
Introduction to Engineering"Our aim was to inspire children's interest in the...8541Industry NewsIntroduction to Engineering"Our aim was to inspire children's interest in the technical world," explains Peter Fenkl. The Door-Opener Day of the "Show with the Mouse" is held every year when hundreds of German institutions and companies open their doors to children. "As a specialist in quiet and efficient fans and electric motors, Ziehl-Abegg was putting the focus of the 2019 Door-Opener Day on its core area of expertise, the electric motor", says the CEO. <br>The "Show with the Mouse" doesn't aim to be just an "Open Day" – the intention instead is to provide children with glimpses behind the scenes and – as far as possible – enable them to make something themselves. Roughly 100 children between 9 and 12 year came to Ziehl-Abegg in Derrimut (Australia), Singapore (Asia), Johannesburg (South Africa), Cajamar (Brazil), Greensboro (USA) and Kupferzell (Germany). They all built an electric motor. Project manager Sophie Grill emphasises that this international action goes hand in hand with the company's development: "We started selling our products on the international markets in 1972, then 'internationalised' our production and subsequently brought the successful model of dual training to France, Hungary, Brazil and the USA – making an international Door-Opener Day for the "Show with the Mouse" the next logical step."08.01.2020 01:00:00Jan\images\news_2020-02-01_1.jpghttps://www.ziehl-abegg.com/global/en/ziehl-abegg.com
High Voltage Molded Power InductorsCoilcraft has expanded its XEL Family of molded po...8544Product ReleaseHigh Voltage Molded Power InductorsCoilcraft has expanded its XEL Family of molded power inductors to include three higher-voltage series: the XEL401xV, XEL4020V and XEL4030V. All three offer operating voltage ratings of 120 V, 50% higher than the standard versions. They also offer exceptionally low DC resistance and ultra-low AC losses for greater power converter efficiency at high frequencies (2 to 5+ MHz) and high ripple current. XEL40xxV Family inductors measure just 4.0 x 4.0 mm with a maximum height of 3.2 mm and feature a rugged, composite construction that provides magnetic shielding and minimizes audible buzzing. The XEL401xV Series is available in six inductance values from 92 to 780 nH, with current ratings up to 24.0 Amps. The XEL4020V Series has 10 values from 0.08 to 2.2 µH and current ratings up to 33.2 Amps. The XEL4030V Series is offered in 13 values from 0.10 to 6.8 µH and current ratings up to 30.0 Amps. All models offer soft saturation characteristics to withstand high current spikes. They are qualified to AEC-Q200 Grade 1 (-40°C to +125°C) standards and exhibit no thermal aging issues, making them ideal for automotive and other harsh-environment applications. They also feature RoHS-compliant, tin-silver-over-copper terminations and are halogen free.07.01.2020 18:30:00Jan\images\news_2020-02-15_20.jpghttp://www.coilcraft.comcoilcraft.com