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Expert to Present at China Semiconductor Packaging Test Symposium
Indium Corporation's Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium on June 21-23 in Jiangyin, China. Hu's presentation, Challenges in Materials Application for SIP, will detail the solder paste characteristics required to achieve consistency in fine-feature printing using types 6 and 7 solder pastes.
http://www.indium.com/
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