Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Low-Temperature Alloy Technology
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Full press release:
indium.com/news-releases
  • Product Release
  • 2019-11-21

Indium Corporation continues to innovate alloy technologies with a high-performance, high-reliability low-temperature alloy. Durafuse LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse LT provides a solution for heat-sensitive components and flex polymers, prevents thermal warpage of processor components and multilayer boards and meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications.

SiC Schottky Diode for DC Electric Vehicle Charging
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Full press release:
caly-technologies.com/caly
  • Product Release
  • 2019-11-21

CALY Technologies is very pleased to announce the release of a 25A, 1700V SiC Schottky Diode (KE17DJ25) ideally suited for high-efficiency power conversion applications, such as Electrical Vehicle (EV) charging applications, Industrial Power and Renewable Energy converters. The KE17DJ25 is commercially available in wafer, bare die and 2-lead TO-247 package, allowing designers to use the device in a broad range of configurations. The TO-247-2L package option make possible the use of 1700V devices in high-pollution environments, such as charging stations and solar inverters. CALY Technologies SiC Schottky diodes offer nearly zero reverse recovery and state-of-the-art forward voltage drop, leading to extremely low switching and conduction losses. This contributes to achieve higher efficiency systems, being faster, cooler, smaller and less costly than attainable with silicon (Si) devices. CALY Technologies offer wafers and bare die products with metallization compatible with top brazed connections (clips, power skins) as well as with standard wire bonding. Thanks to the very short lead time offered by CALY Technologies, KE17DJ25 devices can be used in new designs as well as drop in replacements of other commercially available 25A, 1700V SiC Schottky diodes.

Ultra-Low IR Schottky Barrier Diodes
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Full press release:
rohm.com/news
  • Product Release
  • 2019-11-20

ROHM recently announced the availability of 200V ultra-low IR Schottky Barrier Diodes (SBD) optimized for automotive applications including powertrains and xEVs. The RBxx8BM/NS200 expands on the RBxx8 lineup of SBDs enabling high temperature operation that have already been proven in the automotive market in Japan. This series offers ultra-low leakage current (IR) characteristics to achieve high withstand voltage of 200V. Replacing Fast Recovery Diodes (FRD) and rectifier diodes typically used in vehicle systems with ROHM's new SBDs make it possible to improve forward voltage (VF) characteristics significantly (11% lower than conventional FRDs). This reduces application power losses and allows smaller package designs by reducing heat generation, contributing to greater space savings. In recent years, the technological trend in Drive Systems for 48V mild hybrids is mechanical integration, in which the motor and peripheral circuits are combined into a single module. This demands high efficiency and high voltage SBDs capable of stable operation at high temperatures. At the same time, higher voltage SBDs are required in systems utilizing conventional 150V components to increase functionality and reliability. ROHM has been offering the RBxx8 lineup of ultra-low IR SBDs that withstand up to 150V compatible with high temperature automotive environments. This latest series adds 200V models to meet the new automotive requirements.

Compact Resettable eFuse IC
  • Product Release
  • 2019-11-20

Toshiba Electronics Europe announced their first ever range of eFuse IC products. The range consists of six products in the TCKE8xx series that support various protection functions for power supply lines. Whereas conventional fuses perform a sacrificial function, physically breaking the electrical link to the circuit they are protecting, eFuses offer a resettable solution that additionally provide further protection features that a typical fuse cannot. This includes functions such as a highly accurate over-current limit, overvoltage protection, and over-temperature protection in addition to short-circuit protection. Compared to polymeric positive temperature coefficient (PPTC) devices that are also resettable, they react significantly faster, can be reset directly via an external logic signal, and retain their low on-resistance even after multiple trip events. The series is provided in three categories: no overvoltage protection, 5 V (VOVC = 6.04 V), and 12 V (VOVC = 15.1 V). Each overvoltage category is also offered in auto-retry or latched options as the response after a fault event. The status of the latch type is recovered by the application of an external signal, while the auto-retry is capable of re-enabling its output automatically. This provides developers with a choice of options to best suit their application's needs.

5G Network Test Solutions
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Full press release:
rohde-schwarz.com/news
  • Industry News
  • 2019-11-20

Rohde & Schwarz has licensed Qualcomm Technologies' Interface Control Document for 5G, that describes the unique messages that come from the Snapdragon X55 5G Modem-RF System. For Rohde & Schwarz, access to these messages is critical to the development of test solutions such as QualiPoc, for example, that captures and analyses these messages for determining network quality and customer quality of experience. Any type of interaction between a mobile device and the mobile network requires hundreds, if not thousands, of unique messages that are sent back-and-forth that verify all aspects of a mobile phone call or data session. The quantity and complexity of messaging continues to increase as more features and capabilities are added. This trend will no doubt continue as the industry begins to migrate from 4G/LTE to 5G. Hans-Peter Bobst, CEO of Rohde & Schwarz SwissQual AG: "Having early and complete access to the Interface Control Document allows us to develop more comprehensive test solutions faster, providing our customers with what they need when they need it. Our customers can rest assured that any measurements they make with our test equipment is technically accurate and legally grounded."

Silicon Carbide Wafer Supply Agreement
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Full press release:
st.com/media-center
  • Industry News
  • 2019-11-19

Cree and STMicroelectronics announced the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree's advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics over the next several years. The increased wafer supply enables the semiconductor leaders to address the rapidly growing demand for silicon carbide power devices globally, particularly in automotive and industrial applications. The adoption of silicon carbide-based power solutions is rapidly growing across the automotive market as the industry seeks to accelerate its move from internal combustion engines to electric vehicles, enabling greater system efficiencies that result in electric cars with longer range and faster charging, while reducing cost, lowering weight and conserving space. In the industrial market, silicon carbide modules enable smaller, lighter and more cost-effective inverters, converting energy more efficiently to unlock new clean energy applications.

Partnership to Deliver Automotive and Industrial Solutions
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Full press release:
cree.com/news
  • Industry News
  • 2019-11-18

Cree and ABB's Power Grids business have announced a partnership to jointly expand the rollout of silicon carbide in the rapidly-growing high-power semiconductor market. The agreement incorporates the use of Cree's Wolfspeed silicon carbide-based semiconductors into ABB's comprehensive product portfolio, enabling Cree to broaden its customer base while accelerating ABB's entry into the fast-expanding EV sector. Cree's products will be included as part of ABB's power semiconductor product portfolio, across power grids, train and traction, industrial and e-mobility sectors. Specifically, Cree's industry-leading silicon carbide devices will be assembled into ABB power modules. "Cree is committed to leading the global semiconductor market's transition to more energy efficient, higher performing silicon carbidebased solutions. ABB has a longstanding heritage as the world market leader in industrial power electrification solutions, so expanding our work with them will help increase the adoption of transformative and eco-friendly alternatives in the power and automotive sectors," said Cree CEO Gregg Lowe. "Together, this partnership delivers Wolfspeed silicon carbide into new markets, such as power grids and high-speed trains for the continued advancement of the power, traction, industrial and EV markets." "The partnership with Cree supports ABB's strategy in developing energy-efficient silicon carbide semiconductors in the automotive and industrial sectors," said Rainer Käsmaier, Managing Director of Semiconductors at ABB's Power Grids business. "It emphasizes ABB's commitment to continuous technological innovation to shape the future of a smarter and greener society."

Strategic Partnership for Si - and SiC Power Modules
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Full press release:
danfoss.com/news
  • Industry News
  • 2019-11-14

ZF Friedrichshafen AG and Danfoss Silicon Power GmbH have stepped up their existing cooperation, with a new strategic partnership for silicon- and silicon-carbide power modules. The partners plan to improve the efficiency of electric drivelines by leveraging engineering and cost benefits at the interface between power modules and inverters. One of the first major milestones in this new initiative is a supply contract for Danfoss power modules destined for large-scale ZF volume production projects. Power modules are used in so-called power electronics, which serve as electronic controls for electrified drives. "We are proud to join this partnership with ZF. We believe this closer cooperation between Danfoss and ZF has the potential to be a game changer for the development and innovation of future drivetrains for electrification of vehicles. Together we can enable an acceleration of the transition of the transport sector," says Kim Fausing, President and CEO of the Danfoss Group. The partnership will see the two companies engage in joint research and development, with Danfoss also supplying power modules for silicon applications. Beside 400 Volt standard applications the two companies have also begun co-developing an 800 Volt Silicon Carbide power module for a large volume production project, aiming to position themselves at the forefront of this new segment. "This is a robust long-term partnership that enables ZF and Danfoss to pool their strengths. Coming together on this opens up significant innovation potential to improve the technical and commercial competitiveness of our inverters. We will utilize this advantage in all our drivetrain applications; from Hybrid- up to Full Electric Applications." explains Jörg Grotendorst, Head of ZF's E-Mobility Division. ZF's E-Mobility division supplies electric drive systems and components, while Danfoss Silicon power GmbH (DSP) is a specialist in silicon and silicon-carbide power modules. By joining forces to produce innovative open technology solutions for e-mobility drivelines, they aim to make a vital contribution to cutting vehicle emissions. In electric and hybrid vehicles, power modules control the efficiency of the energy supply to the drive, battery and onboard electronics. This means that the development of space-saving inverters and more efficient power modules is crucial to reducing emissions over the long term.

Motion Tracking System VR Demo Kit 
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Full press release:
grupopremo.com/content
  • Product Release
  • 2019-11-14

Amfitech releases the Generation 2.0 of the Electromagnetic Motion Tracking System – AmfiTrack - with built-in PREMO magnetic sensors. The new generation brings improvements in performance and use. The system includes several hardware and firmware updates. The users will be able to install updates of the system firmware by themselves. Amfitech will be releasing firmware updates which can be uploaded without having to return the kits for service.Several videos are available where real-time performance of the Generation 2.0 system is shown. AmfiTrack VR application demo: https://www.youtube.com/watch?v=xRy3sDUQD9w ; AmfiTrack 4 pcs Gen2 sensors in mating application: https://www.youtube.com/watch?v=uAZ3ZEZJc3Y&t=1s

Bernd Hops to Take Over as Head of Corporate Communications
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Full press release:
infineon.com/press-releases
  • People
  • 2019-11-12

From January 2020, Bernd Hops (46), currently Head of External Communications, will take over as Head of Communications and Public Authorities & Associations at Infineon Technologies. He will succeed Klaus Walther, who held this position from 2013. In this capacity, Mr. Hops will report to Chief Executive Officer Dr. Reinhard Ploss and have global responsibility for internal, external and political communication. "I am delighted that Bernd Hops is taking on this important and challenging task. He knows our company extremely well and has already made an important contribution to demonstrating Infineon's relevance for the economy and society. I wish him all the best and every success in his new role," says Dr. Reinhard Ploss, Chief Executive Officer of Infineon. "I personally thank Klaus Walther for his tireless commitment to sustainable enhancing our company's reputation. In the past years he has made a significant contribution with his strong strategic expertise and extensive network to positioning Infineon successfully in a challenging environment." Bernd Hops has held management positions within Corporate Communications at Infineon since 2013. The graduate of the Georg-von-Holtzbrinck School for Business Journalists previously worked, among other things, as an editor for the "Tagesspiegel" and "Financial Times Deutschland" newspapers and at the consulting firm Roland Berger Strategy Consultants.

DC-DC Converter in Conduction Cooled Format
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Full press release:
powersystemtechnology.com/news
  • Product Release
  • 2019-11-12

Power System Technology announces the introduction of PST14X family, very high power density 320W DC-DC converter in conduction cooled format. In a very small package 160*50*25mm,with input voltage ranges of 9-50Vdc, 18-36Vdc, 16-50Vdc, PST14X incorporates EMI filtering, input active reverse polarity and transient protection, output protections, very robust mechanical package and connection, required in most of the severe environment for industrial, railways, defense type of applications. The converter provides high power density thanks to the integration of Vicor Corp. DCM modules, high efficiency (>90%), input-to-output isolation, soft start, overtemperature protection, input over/undervoltage lockout. The outputs are short-circuit proof. The 100°C baseplate operation allows operation in high temperature environment. The output can be configured in many different output voltages from 3,3V to 48Vdc, others possibilities are even possible as semi- standard versions. With the -MV option, the converter is protected against surges and transients MIL-STD-704 and MIL-STD-1275, EMI filtered built to meet MIL-STD 461 and ruggedizzed according MIL-STD-810.

Strategic Partnership with Mycronic
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Full press release:
indium.com/news-releases
  • Industry News
  • 2019-11-12

Indium Corporation and Mycronic have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications. The partnership with Mycronic will expand Indium Corporation's portfolio of proven products designed to address evolving industry challenges. The collaboration will also ensure that new products are fully vetted and tested before users begin evaluations, testing, and ultimately high-volume production. "At Indium Corporation, we believe that materials science changes the world," said Ross Berntson, Indium Corporation President and Chief Operating Officer. "Through this partnership and by collaborating with Mycronic's engineers on our new PicoShot solder product offerings, we're able to bring to market new and innovative solder paste solutions to fit our customers' needs." Mycronic's MY700 platform is a leading technology for jet printing in the electronics industry, providing solutions to most production- related difficulties of applying solder paste. The solder paste coming out of this partnership will also be compatible with the previous-generation jet printer, MY600, and support existing Mycronic customers. "It is important for Mycronic to mutually develop solder paste solutions with key players like Indium Corporation," said Clemens Jargon, Vice President Global SMT at Mycronic. "This partnership will enable us to reach out to a much broader customer base all around the globe, and support them on enhanced jet printing applications."

Purchase of CUI Power Assets
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Full press release:
belfuse.com/news
  • Industry News
  • 2019-11-11

Bel Fuse Inc. announced that the Company has entered into an asset purchase agreement with CUI, in which CUI will sell the majority of its Power business to Bel for $32.0 million, plus the assumption of certain liabilities and subject to closing working capital adjustments. Based in Tualatin, Oregon, the CUI Power Business, a division of CUI Global Inc., had TTM sales of approximately $37 million with products and distribution that offer strong opportunities for growth. Daniel Bernstein, CEO of Bel, said, "The CUI Power Business' extensive product portfolio and distribution channel fits squarely within our growth strategy. Their product portfolio will round out Bel's current Power Products offering, allowing us to better address all our customer power needs. In addition, we look forward to utilizing CUI's success with the electronic catalog distributors throughout the Bel\Cinch product groups and capitalizing on CUI's enviable strong relationship with these distributors. Electronic Catalog Distributors are playing a vital role in demand creation, and over the past four years this segment has been our fastest growing business. The combination of Bel and the CUI Power Business will substantially strengthen our Power Group and unite complementary capabilities, sales channels and customer relationships." The all-cash transaction is expected to close in the fourth quarter of 2019, and will be funded with available cash on hand, some or all of which may be sourced from our revolving credit facility.

High Isolation Automotive Transformer
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Full press release:
mornsun-power.com/about
  • Product Release
  • 2019-11-08

MORNSUN launched an automotive transformer, the CTTH0505-1T. This compact size transformer has an isolation voltage of up to 6000VDC, and all components meet AEC-Q200 standard. From design, verification to production processes, this device is completely in accordance with IATF16949 system requirements. In addition, the CTTH0505-1T transformer can be used with MORNSUN SCM1201 fixed input push-pull controller IC to supply power for the secondary side of an isolated data interface such as RS232, RS485 or CAN bus. It's designed for pure digital circuit, analog acquisition circuit, data exchange circuit.

Surface-Mount Fully Integrated Current Sensors
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Full press release:
allegromicro.com/news-room
  • Product Release
  • 2019-11-07

Allegro MicroSystems announced significant ease-of-use enhancements to its popular high current fully integrated ACS772/3 current sensor "CB" package family. These automotive grade high voltage isolation current sensors already provide economical and precise solutions for both AC and DC current sensing up to 400A. Building on that leadership and deep customer-understanding, Allegro's surface-mount leadform option for the CB package is the answer to many customer challenges by providing a flexible solution for space constrained applications. "This is a classic, 'You asked – we listened.'  innovation with purpose moment for us," explains Shaun Milano, Business Unit Director for Current Sensors. "Our customers want flexibility, and we're excited to provide these innovative, robust solutions in this new surface-mount option to complement our highly popular through-hole version. High current PCB designs improve power density and efficiency and this surface-mount option allows customers to realize these advantages with a simpler manufacturing process." The ACS772/3 family of current sensor ICs has an enhanced feature set that helps engineers simplify their bill of materials and improve efficiency in the toughest of applications.

Trench Schottky with Multilayer Varistors
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Full press release:
taiwansemi.com/news
  • Product Release
  • 2019-11-06

The TSUPxM45SH & TSUPxM60SH Schottky rectifiers offer low leakage current and low forward voltage drop. The series devices are optimized for the automotive applications with low power loss, high efficiency – maximum leakage current is only 20mA at high temperature operation. The series devices include 5A/10A/15A forward current and maximum VRRM is 45V/60V. All these capabilities are packed into SMPC4.6U (TO-277A compatible) package. This is a wettable flank package, it enhances the solder joint and AOI testability. It is also low profile with typical height of 1.1mm, RoHS compliant and halogen free. The series devices include 5A/10A/15A forward current and maximum VRRM is 45V/60V. All these capabilities are packed into SMPC4.6U (TO-277A compatible) package.

Synchronous DC/DC Buck Regulator
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Full press release:
aosmd.com/news
  • Product Release
  • 2019-11-06

Alpha and Omega Semiconductor introduced AOZ6682CI and AOZ6683CI. These devices are high efficiency, simple-to-use synchronous buck regulators. The AOZ6682CI and AOZ6683CI are both available in an ultra-thin, thermally enhanced TSOT23-6 package and deliver 2A and 3A output current, respectively. The new devices offer high efficiency over the full load range, allowing greener power conversion for a variety of consumer electronics applications such as LCD TVs, set-top boxes, high definition Blu-rayTM Disc Players and Networking terminals. The new devices incorporate a low resistance synchronous buck power stage that enables up to 95% efficiency. Combined with a thermally enhanced package, the AOZ6682CI and AOZ6683CI achieve 10°C cooler operation at full load compared to similar competing devices. Under heavy load conditions, the devices operate in a fixed frequency continuous-conduction mode (CCM). At light loads or in standby mode, the devices employ a proprietary pulse energy mode (PEM) control scheme. This control scheme and low quiescent current of 200uA, allows the buck converter design to achieve industry-leading efficiencies of 89% at light loads. "Modern consumer equipment must achieve less than 0.5W in standby power consumption and this is a tough problem for system designers to solve," said Kenny Hu, Power IC Marketing Manager at AOS. "The newest 2A and 3A additions to the EZBuck family simplify this task, offering up to 6% improved efficiency compared to competing devices thanks to low quiescent current and a proprietary power-saving light load control scheme."

Registration Now Open for APEC 2020
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Full press release:
apec-conf.org/news
  • Event News
  • 2019-11-06

Registration for the 35th Annual Applied Power Electronics Conference –APEC 2020– is now open. The conference and exhibition, running March 15-19 at the New Orleans Ernest N. Morial Convention Center, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronic engineer. Outstanding technical content, including Technical Program Papers, Industry Sessions and Professional Education Seminars, is offered at one of the lowest registration costs of any IEEE conference. APEC 2020 promises to provide attendees with a truly significant professional experience. Complete details for registering and hotel booking can be found at http://www.apec-conf.org/conference/registration. APEC has secured discounted rates at eight hotels near the New Orleans Convention Center. Attendees are encouraged to secure their hotel reservations early, as these hotels are expected to book up well in advance of the conference. Hotel reservations can only be made following conference registration. Links to APEC’s contracted hotels will be sent via an automatic registration confirmation email. For more details, please visit the Travel Information page.

Automotive Chip Bead Inductor
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Full press release:
press/taiyo-yuden-europe
  • Product Release
  • 2019-11-05

TAIYO YUDEN has announced the mass-production of the AEC-Q200 (reliability qualification test standard for automotive passive components) qualified noise suppression component, power chip bead inductor FB Series Type T, FB TH1608 (1.6×0.8×0.8 mm). This product is a noise suppression component for power lines used in powertrains and other automotive components such as engines and transmissions, as well as communications infrastructure devices such as servers and base station communication devices. Based on our unique internal structure and sophisticated material technology an  structural design, FB Series Type T has achieved an operating temperature of 150°C and is suitable for wideband noise suppression up to GHz frequencies. Commercial production of this product started in September 2019 at our overseas subsidiary TAIYO YUDEN (PHILIPPINES), INC. (Lapulapu City, Cebu, Philippines) at a rate of 10 million units per month.

ISO 9001:2015 Certification Received
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Full press release:
gansystems.com/newsroom
  • Industry News
  • 2019-11-05

GaN Systems announced that the company received International Organization for Standardization (ISO) 9001:2015 certification for the design and manufacture of power semiconductor products. Both GaN Systems’ Canadian headquarters and Taiwanese operations facilities received ISO certification from the British Standards Institute (BSI), the world's first national standards body and one of the largest. The certification represents third-party validation of the company’s strong commitment to providing high-quality products and services that align with the standards of excellence required by major multinational customers. The ISO 9000 family of standards is designed to ensure that GaN Systems meets the needs of customers and other stakeholders via its quality management systems (QMS) while meeting and exceeding qualification requirements for its Joint Electron Device Engineering Council (JEDEC) and Automotive Electronics Council (AEC-Q101) qualified GaN power transistor products. ISO 9001 is considered the leading standard for quality management systems and performance worldwide. The ISO 9001:2015 standard is the most recent version with significant enhancements since the last ISO 9001:2008 update. “The ISO 9001:2015 revision demands a higher degree of leadership and management commitment than the previous standards. This commitment is consistent with our mission to be the place designers can go to realize all the system benefits of GaN in their power conversion applications,” said Jim Witham, CEO of GaN Systems.

Strategic Partnership to Create Electric Drivelines
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Full press release:
cree.com/news
  • Industry News
  • 2019-11-05

ZF Friedrichshafen AG and Cree announce a strategic partnership to create industry-leading, highly efficient electric drivelines. With this strategic partnership, ZF and Cree are intensifying their existing cooperation. “We’re delighted that we're building on our cooperation with Cree using their Wolfspeed silicon carbide technology and are absolutely convinced that combining our strengths will further improve efficiency and competitive edge for our components and systems,” says Jörg Grotendorst, Head of the ZF E-Mobility Division. The future use of silicon carbide-based power semiconductors will increase the range for electric vehicles in contrast to today's standard silicon technology. Due to high battery costs, the efficient electric drive represents an enormous growth potential for the foreseeable future. In particular, silicon carbide technology in conjunction with the 800-volt vehicle electrical system voltage makes a significant contribution to further increasing efficiency. “Partnering with a tier-one leading global automotive supplier like ZF for the use of silicon carbide-based power inverters in next generation electric vehicles is indicative of the integral role silicon carbide plays in extending the capabilities of EVs everywhere,” said Gregg Lowe, CEO of Cree. Electrified drivelines are making vast contributions to achieving worldwide emission targets and making mobility more sustainable. Cree’s technology will initially be used to fulfill orders that ZF has already received for silicon carbide based electric drives from several leading global automakers. Through the partnership, ZF expects to make silicon carbide electric drivelines available to the market by 2022.

Expert to Present at EPTC
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Full press release:
indium.com/news-releases
  • People
  • 2019-11-05

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging. Thum will present Soldering Material Evolution for Heterogeneous Integration, which outlines trends in soldering material technology for heterogeneous integration, including solder paste, and flip-chip and ball-attach fluxes. Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelor’s degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.

European Sales Director Thorsten Scheidler
  • People
  • 2019-11-05

Palomar Technologies announced that Thorsten Scheidler has joined SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, as SST Sales Director Europe. Mr. Scheidler has over 15 years of sales and technical support experience within the power electronics and semiconductor industries in Europe. His primary responsibilities will be in implementing sales strategies to achieve the company’s global sales objectives, with a focus on the in ever growing power electronics market. “Thorsten Scheidler has extensive experience in backend processes for the Power and Automotive Electronics and his experience is aligned with SST’s growth objectives in these markets. We are very excited to have Thorsten join the SST sales team,” said Rich Hueners, Vice President of Sales & Marketing, Palomar Technologies. Prior to joining SST, Mr. Scheidler served as Key Account Manager Europe for Kulicke & Soffa Germany GmbH.

Power Line EMC Filter Family for Lighting Equipment
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Full press release:
schaffner.com/news
  • Product Release
  • 2019-11-04

Schaffner introduces a single-phase EMC filter. With a 350 VAC rating, the filter can be used in typical single-phase applications (120 VAC and 230 VAC). Or industrial applications when utilizing phase to neutral voltage off three phase power. Example: 480 VAC P-P / 277 VAC P-N and 600 VAC P-P / 347VAC P-N. The parts are very compact and are designed specifically for lighting applications with enhanced EMC performance at target frequencies along with an extended operational temperature range. The filters have all the required safety approvals (UL, CSA, ENEC and CQC) and are compliant to REACH and RoHS directives.

100WActive PFC Enclosed Switching Power Supply
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Full press release:
mornsun-power.com/news-center
  • Product Release
  • 2019-11-04

MORNSUN released an enclosed switching power supply series LMF100-20Bxx with active PFC (Power factor correction). The LMF100-20Bxx series features universal input voltage range of 85-264Vac, accepts AC or DC input and the PF (Power factor) is up to 0.98. In addition, its emissions meet CISPR32 CLASS B without extra components. The series also meets IEC/EN/UL62368, EN60335, GB4943 safety standards. Protections of output short circuit, over-current, over-voltage, over-temperature are included. MTBF is more than 300,000 h and the dimension is 10% smaller than conventional products, which make this series ideal for industrial, civil, smart home, smart building applications. It’s widely used in applications of industrial automation machinery, industrial control system, mechanical and electrical equipment, instrumentation, intelligent building, household appliance, etc.

Acquiring Chengdu OK New Energy, Ltd.
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Full press release:
avx.com/press-releases
  • Industry News
  • 2019-11-01

AVX Corporation announced that it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE). After four years of strong collaborative efforts between COKNE and AVX on the manufacturing and development of supercapacitors, AVX is delighted to complete the full vertical integration under the AVX umbrella. During the announcement, Chief Operating Officer Jeff Schmersal stated, “The COKNE team has been instrumental in the co-development of AVX’s low ESR cylindrical SuperCap series. We look forward to a long and prosperous relationship, with continual dedication toward further supercap advancements”. The vertical acquisition further demonstrates AVX’s strong commitment to supercapacitor technology, used in markets such as Industrial, Medical, Automotive, IoT, and Alternative Energy. AVX is a leading worldwide manufacturer, supplier, and reseller of a broad line of electronic components and interconnect, sensing and control devices and related products. AVX’s components can be found in products manufactured in a very broad range of industries worldwide.

Support for the Development of Battery Maintenance Free IoT Equipment
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Full press release:
renesas.com/press-center
  • Product Release
  • 2019-10-31

Renesas Electronics introduced its RE Family, which encompasses the company’s current and future lineup of energy harvesting embedded controllers. The RE Family is based on Renesas’ proprietary SOTB™ (Silicon on Thin Buried Oxide) process technology, which dramatically reduces power consumption in both the active and standby states, eliminating the need for battery replacement or recharging. Following the mass production of the RE01 Group (formerly known as the R7F0E embedded controllers), the first of the RE Family, the new RE01 Group Evaluation Kit was launched, which allows users working with the RE01 Group of devices to jump start system evaluations for energy harvesting applications. "Energy harvesting eliminates the labor and costs associated with battery maintenance and is a key solution contributing to environmental conservation," said Hiroto Nitta, Senior Vice President, Head of SoC Business, IoT and Infrastructure Business Unit at Renesas. "I am extremely pleased that Renesas’ technology innovation with SOTB has enabled these alternative energy solutions, and with the new RE01 Evaluation Kit, Renesas will be making it possible for engineers around the world to quickly start the evaluation. We hope this will accelerate the spread of IoT equipment powered by energy harvesting."

Tamper-Resistant Receptacles
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Full press release:
schurter.com/newsroom
  • Product Release
  • 2019-10-30

SCHURTER’s latest series of appliance outlets NR020 and NR021 combine classic features with new ones to meet increased fire protection and safety standards according to UL 498 Tamper Resistant, as well as facilitating compliance of receptacles used in Household and Commercial Furniture and Furniture Power Distribution Units (FPDUs), according to UL 962 and UL 962A. Higher temperature ratings and added configurations for series NR010 and NR020 respond to power demands facing Datacom infrastructures today. SCHURTER’s NR021 NEMA 5-15R Tamper Resistant series meets the expanded code requirements according to UL 498. Additionally, with the option of an added insulated wall between the L, N terminals, compliance with the Spill Test, outlined in UL 962 Sec. 62, is more cost effective and efficient for manufacturers of Household and Commercial Furniture and Furniture Power Distribution Units (FPDUs). Packing density of equipment for data communication and storage continues to be regularly revolutionized with the surge of usage and functionality. Increasing ambient temperatures go hand in hand with these advancements, as demand trickles down to the smallest components to keep pace with emerging needs of the appliance manufacturers. The NR010 and NR020 series have an operating temperature range of -25 °C to 150 °C in response to the power needs of the Datacom industry. In addition, the NR010 with IDC terminals provides a version with an independent L terminal. The neutral and ground terminals can still be bussed, while the line terminal can be used for maximum load according to UL rating 15 A, 125 V. It also extends the capability of adding functionality to each outlet individually.

Power Electronics Moscow 2019
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Full press release:
proton-electrotex.com/news
  • Industry News
  • 2019-10-30

To stay relevant on the modern fast-paced market, it is essential for every company to monitor the latest trends and offer its customers competitive products and technologies. To achieve it, Proton-Electrotex participates in the most significant global events. Proton-Electrotex took part in 16th International exhibition of power electronics components and modules – Power Electronics 2019. The exhibition was held in Crocus Expo, Moscow on 22-24 of October. Proton-Electrotex traditionally presents its latest research and new products there. Besides, specialists of the company showcase samples of existing portfolio already known to customers. Besides, researchers of the company were presenting few reports: T. Fedorov. New technology Engineer: «WEB version of the software for calculation IGBT power converters» and D. Malyy. Lead Research Engineer: «Fast hybrid IGBT modules – an alternative to SiC MOSFET in modern energy efficient mid-power converters» and «Ensuring quality of IGBT modules made by Proton-Electrotex at design and production stages». The exhibition was held in a comfortable and working atmosphere. Representatives of Proton-Electrotex held few discussions with their clients and international colleagues. We will be happy to provide more information on our products, please send your questions to email marketing@proton-electrotex.com. Photo and video report will be published soon in social networks of Proton-Electrotex and official website.

SP-Cap Conductive Polymer-Aluminum-Electrolytic-Capacitors
  • Product Release
  • 2019-10-29

Panasonic Industry Europe has added a long-life surface mount type series to its industry-leading product line of SP-Cap Conductive Polymer-Aluminum-Electrolytic capacitors. Available with a rated voltage of 2.0VDC or 2.5VDC, GY capacitors benefit from huge capacitance values (680µF up to 820µF) and a very low ESR characteristics (3mO max.) which is unique in the market. The components are able to withstand +105°C for up to 2.000 hours making them ideal for use in demanding applications. Also with the high ripple current of only 10.200 mA r.m.s. maximum, the new GY capacitor series is a perfect component for power circuits in servers, base stations as well as further industrial applications. As all SP-Cap range capacitors, the GY series devices feature excellent noise reduction capability and frequency characteristics, a long life span and their ESR values have little change even at low temperatures since the electrolyte is solid. The components are RoHS compliant and halogen free.

Expanding its Portfolio with Industrial-Grade Devices
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Full press release:
infineon.com/market-news
  • Product Release
  • 2019-10-29

Infineon Technologies broadens its CoolGaN TM series with two devices. The CoolGaN 400 V device (IGT40R070D1 E8220) is tailored for premium HiFi audio systems where end users demand every detail of their high resolution sound tracks. These have been conventionally addressed by bulky linear or tube amplifiers. With the CoolGaN 400 V switch as class D output stage, audio designers are able to deliver excellent listening experience to their prospective audio fans. The CoolGaN 600 V industrial-grade device (IGLD60R190D1) enables performance and cost optimization for low- and mid-power applications, such as in the area of low-power SMPS and telecom rectifiers. Every product within the Infineon CoolGaN family meets JEDEC standards. Infineon’s CoolGaN 600 V portfolio is now also extended with a new 190 m?, industrial-grade HEMT. This product was developed to fit any consumer and industrial application on an optimized cost with the aim to lower the technology entry barrier. Easy design-in is supported with a standardized DFN 8x8 packaging and the matching driver ICs from the GaN EiceDRIVER™ series.

Marco Palma Joins as Senior FAE Manager
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Full press release:
epc-co.com/news
  • People
  • 2019-10-29

To support its accelerating design activity, and to provide local technical support to EPC’s customers in Europe, Efficient Power Conversion Corporation (EPC) is proud to announce that Marco Palma, a seasoned expert, has joined the EPC technical leadership team as Senior FAE Manager for Europe. Based in Turin, Italy, Marco brings over 20 years of field experience within the semiconductor industry working with customers to define innovative solutions to meet the unique challenges of each customer design. His primary responsibilities at EPC involve direct collaboration with customers throughout Europe to create and implement technical solutions to meet their design challenges. “Marco Palma is an electronics engineer with extensive experience in assisting customers to implement leading edge power semiconductor solutions in industrial and automation markets,” said Nick Cataldo, senior vice president of global sales and marketing. Marco joins EPC from Infineon, where he was Director, Technical Marketing and Applications. Marco has held senior technical leadership positions with a strong focus on customer support and product definition. “I am very excited to have the opportunity to work with the EPC. I look forward to working with customers to incorporate EPC’s leading-edge gallium nitride FETs and integrated circuits into their products,” commented Marco on his appointment.

Topnotch Conferences to Provide Founded Insights
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Full press release:
sensor-test.de/press
  • Event News
  • 2019-10-28

From the 23rd to the 25th of June, 2020, the SENSOR+TEST – the leading international trade fair for sensor, measurement, and testing technology – will be accompanied again by two first-rate conferences: The SMSI 2020 – the Sensor and Measurement Science International, is to be held for the first time, while the ettc2020, the European Test and Telemetry Conference, is to be held for the fourth time in Nuremberg. Members of enterprises and institutes can start to submit their contributions as of today. “The success story of the scientific conferences in the area of sensor and measuring technology parallel to the SENSOR+TEST goes back to over 30 years. However, with this new format, we’re going to advance this success to a worldwide and scientifically leading event with our partners from industry and research as well as with the national and international measurement institutes,” says Holger Bödeker, the organizer of the SENSOR+TEST, regarding the new format. Interested authors, developers, researchers, and other scientists have the opportunity to submit their contributions until 31 January 2020 at www.smsi-conference.com/call-for-papers.

PCIM Asia is Calling for Papers
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Full press release:
pcimasia-expo.cn
  • Event News
  • 2019-10-28

PCIM Asia, sister event of PCIM Europe in Nuremberg, Germany, offers unique opportunities to one of the fastest growing markets for power electronics. Held in parallel with the exhibition is the PCIM Asia Conference, one of the most important and influential conferences for power electronics in Asia. Now it is calling professionals from industry and academia to submit their abstracts before 31 December 2019, to present their latest research in technological trends and applications in the Asian power electronics industry in front of over 500 experts.

Acquisition of Chinese EV Charging Provider
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Full press release:
new.abb.com
  • Industry News
  • 2019-10-28

ABB is to acquire a majority stake of 67 percent in Shanghai Chargedot New Energy Technology Co., Ltd. (“Chargedot”), a leading Chinese e-mobility solution provider. The transaction is expected to be completed in the coming months and ABB has the possibility to increase its stake further in the next three years. Since its establishment in 2009, Shanghai-based Chargedot has made a significant contribution to the uptake of electric vehicles in China. The company supplies AC and DC charging stations, as well as the necessary software platform to a range of customers that includes EV manufacturers, EV charging network operators and real estate developers. It has approximately 185 employees and its other shareholders among others include Shanghai SAIC Anyo Charging Technology Co., Ltd., a subsidiary of SAIC. Chargedot is a natural fit for ABB, which as a global leader in sustainable transportation infrastructure, already offers solutions from grid distribution to charging points for cars and trucks, as well as for the electrification of ships, railways, trams, buses and cable cars. The acquisition will strengthen ABB’s relationship with leading Chinese electric vehicle manufacturers and broaden the company’s e-mobility portfolio with hardware and software developed specifically for local requirements. ABB Robotics is the leading supplier of robot units and software to the assembly lines of Chinese EV manufacturers. “This investment is a further demonstration of ABB’s commitment to enabling sustainable mobility,” said Tarak Mehta, President of ABB's Electrification business.

Key to Success of Digital Companies
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Full press release:
we-online.com/news
  • Industry News
  • 2019-10-25

Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, at one of the most important digital future conferences worldwide, the DLD Tel Aviv, emphasized in his opening speech "when technology meets customer" design support of hardware and the availability of components can decide on the failure or success of innovation. In his speech, Gerfer stressed the importance of an innovative hardware partner for the success of digital companies: "Würth Elektronik is not just a hardware supplier, we rather see ourselves as our customers' real partner. We know them and their needs thoroughly and focus our product development on them. 'Can't' is not part of our vocabulary. If there is still no solution to a particular challenge, then we'll invent one. This is the reason why Würth Elektronik, as an innovative technology company, is behind many successes, albeit invisibly ... the 'secret ingredient of industry' as it were. There are plenty of examples of customer-driven innovations from Würth Elektronik, including REDEXPERT, an online platform developed in-house that has become known worldwide as the most precise option for AC loss calculation in switch mode power supplies. Another area to improve the CO2 footprint is 'Horticulture Farming'. Through its cooperation with the Technical University of Munich, Würth Elektronik supports users with practice-relevant data for the selection of the best Horticulture LEDs, adapted to the respective plant species.

High Energy-Density Thin-Film Battery
news image
Full press release:
leti-cea.com/cea-tech
  • Industry News
  • 2019-10-23

There has been great progress in miniaturizing electronics but the miniaturization of power sources hasn't kept pace. Although integrated electrochemical capacitors offer high power density, high frequency response and novel form factors, their low energy densities are of limited value for MEMS and autonomous device applications that require long periods between charging. CEA-Leti researchers will discuss a thin-film battery with the highest areal energy density yet reported (890 µAh/cm-2) and high power density (450 µAh/cm-2). Built on silicon wafers using UV photolithography and etching for the successive deposition and patterning of each layer, the thin-film battery integrates a 20µm-thick LiCoO2 cathode in a Li-free anode configuration. It showed good cycling behavior over 100 cycles, and the fact it was built using a wafer-level process opens up the possibility to tightly integrate this battery technology with future electronic devices. ("Millimeter-Scale Thin-Film Batteries for Integrated High Energy-Density Storage," S. Oukassi et al., CEA-Leti)

Open Frame Power Supplies for Industrial Applications
news image
Full press release:
prbx.com
  • Product Release
  • 2019-10-23

Cosel announced a series of open frame compact power supplies that are EN62477-1 OVC III certified for demanding industrial applications. Benefiting from the latest power switching technologies, the LHA150F is 30% smaller and gains up to 4.5 efficiency points compared to the previous LFA150F, whilst the more powerful LHA300F gains up to 6 points of efficiency and is 50% smaller than the LFA300F. In addition to higher efficiency, by using an LLC resonant topology and an active filter, noise and ripple levels have been reduced. Designed for use in a wide range of applications, the LHA150F and LHA300F offer a wide temperature range from -10 to +70 degrees C. The power supplies are UL/EN62368-1 certified. With the increased levels of systems integration, factory automation requires more compact power supplies able to work with the highest levels of safety in a variety of environments. Meeting the Over Voltage Category level III (OVCIII) specified in the EN62477-1, Cosel's LHA150F and LHA300F offer system designers a simple and easy to use AC/DC power supply that complies with the high isolation levels needed in order to connect their equipment to the facility distribution panel without the need for an additional isolation transformer. Designed for worldwide applications, the LHA150F and LHA300F have an input voltage range of 85VAC to 264VAC single phase and conform to the safety standards input voltage range of 100-240VAC (50/60Hz).

Up to 90 Watts of Power Over Ethernet Wiring
news image
Full press release:
microchip.com/pressreleasepage
  • Product Release
  • 2019-10-23

As the industry adopts the latest generation of PoE technology for managing data and power over a single Ethernet cable, users face the challenge of making pre-standard powered devices (PDs) work alongside new IEEE® 802.3bt-2018-compliant PDs in an existing Ethernet infrastructure. Microchip Technology has eased the transition with IEEE 802.3bt-2018-compliant PoE injectors and midspans for users and power sourcing equipment (PSE) chipsets for system developers that enable both pre-standard and IEEE-compliant PDs to receive up to 90W of power without changing switches or cabling. “As both a system and chipset supplier that has contributed to IEEE 802.3bt-2018 and all major standards leading up to it, we are ideally positioned to provide an easy migration path for meeting 30W to 90W device powering needs with plug-and-play convenience,” said Iris Shuker, PoE business unit manager with Microchip. “Combining extensive PD interoperability with firmware upgradability and more than 15 years of proven technology, our PSE chipsets offer a unique architecture that eliminates the need to redesign system boards or offer separate pre-standard and IEEE-compliant product lines. They are also at the heart of our IEEE 802.3bt-2018-compliant PoE injectors and midspans that bridge the interoperability gap for users.”

Soft-Switching Gate Drive Solution
news image
Full press release:
pre-switch.com/news
  • Product Release
  • 2019-10-22

Pre-Switch has announced that its soft-switching IGBT and silicon carbide gate driver architecture, including the Pre-Drive3 controller board, powered by the Pre-Flex FPGA, and RPG gate driver board, can significantly reduce the cost of solar inverters. The two-stage architecture delivers the same switching loss performance – or better – as a five-level design, resulting in reduced cost, control complexity and BOM count. Also, Pre-Switch enables the simplification and size reduction of inverters and filters used in renewable energy systems, enabling energy to be put back into the grid easily and efficiently. The Pre-Switch soft-switching platform enables a doubling of power output for a typical inverter, or an increase in switching speed by a factor of up to 20 times. Previously, soft-switching has never been successfully-implemented for DC/AC systems with varying input voltage, temperature and load conditions. However, Pre-Switch has overcome the challenges by using Artificial Intelligence (AI) to constantly-adjust the relative timing of elements within the switching system required to force a resonance to offset the current and voltage wave forms – thereby minimizing switching losses. Explains Pre-Switch CEO, Bruce T. Renouard: "Our benefit for solar energy system designers is that our soft-switching architecture eliminates half of the system losses. So we are able to achieve performance levels with a simple two stage design that would require five stages using conventional multi-level techniques."

Product Development with Software Suite
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Full press release:
about.keysight.com/newsroom
  • Product Release
  • 2019-10-22

Keysight Technologies announced the PathWave Test 2020 software suite, which delivers an integrated experience for leading electronic manufacturers to accelerate time-to-market of their digital and wireless platforms and products. Developed on the Keysight PathWave software platform, the PathWave Test 2020 software suite enables 5G, IoT and automotive engineers and managers to streamline test data processing and analysis to speed product introductions and secure a competitive advantage in the market. PathWave Test 2020 software provides data sharing and management between platform software tools including test automation, advanced measurement, signal creation and generation, as well as data analytics.  This integrated software platform allows application-tailored solutions to be developed and deployed to significantly accelerate electronic test workflows and product introductions. "The digital transformation happening today in engineering enterprises relies on accelerating time-to-market using best in class software and hardware, " said Jay Alexander, chief technology officer at Keysight Technologies. "Keysight's PathWave Test 2020 software suite reflects our commitment to creating powerful software solutions that help our customers streamline their workflows. " At the core of the PathWave Test 2020 software suite is PathWave Desktop Edition, providing users with access to the platform for launching and managing applications in the design and test ecosystem.

Announcement and Call for Proposals
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Full press release:
semikron.com/news-press
  • Industry News
  • 2019-10-20

The SEMIKRON Innovation Award and the SEMIKRON Young Engineer Award is given for outstanding innovations in projects, prototypes, services or novel concepts in the field of power electronics in Europe, combined with notable societal benefits in form of supporting environmental protection and sustainability by improving energy efficiency and conservation of resources. Both prizes have been initiated and are donated by the SEMIKRON Foundation which is awarding the prizes in cooperation with the European ECPE Network. With the award the SEMIKRON Foundation wants to motivate people of all ages and organisations of any legal status to deal with innovations in power electronics, a key technology of the 21th century, in order to improve environmental protection and sustainability by energy efficiency and conservation of resources. The SEMIKRON Innovation and Young Engineer Prizes 2020 will be awarded in the frame of the ECPE Annual Event in March 2020 in Berlin. A single person or a team of researchers can be awarded. SEMIKRON Innovation Award includes prize money of EUR 10,000.00. SEMIKRON Young Engineer Award for researchers who have not yet completed their 30th year of age includes prize money of EUR 3,000.00. The deadline for submission ends on 15.01.2020! Please send your proposal resp. your application with the reference ´SEMIKRON Innovation Award´by email to Thomas Harder, General Manager of ECPE e.V., thomas.harder@ecpe.org. The receipt of your proposal will be confirmed by email immediately. Your proposal comprising 3-5 pages in total should be structured according to the headline given below and submitted in English language.

Alloy Solder Paste at Productronica
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Full press release:
indium.com/news-releases
  • Industry News
  • 2019-10-17

Indium Corporation will feature an innovative alloy and solder paste with high-reliability and enhanced-performance capabilities at Productronica, Hall A4, Booth 214, November 12-15, in Munich, Germany. Indium8.9HF Solder Paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process. Indalloy292 is an innovative alloy that is engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.

Collaborate to Drive Electrification of Europe's Buses
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Full press release:
bmz-group.com/media
  • Industry News
  • 2019-10-17

In a major step forward in the electrification of Europe's public transport networks, BMZ, HORIBA MIRA and ZIEHL-ABEGG have teamed up to offer a unique turnkey service for converting existing bus fleets to e-Buses. As part of its environmental policy to reduce CO2 emissions from public vehicles, the EU has released a new vehicle directive that mandates the percentage of buses that must be emissionfree by 2025 and 2030. It lays out targets for each EU member, with Germany for example, targeted with having 22.5% of all buses as zero emission, increasing to 32.5% by 2030. This will drive huge demand for the development of new electric buses to meet these targets. In addition, cities including Paris and Berlin have already committed to higher volumes of electrification at earlier dates than the mandate requires. While the onus has traditionally been on bringing new electrical buses to market, not to be overlooked is the role retrofitting existing buses will play in meeting these crucial targets. In order to achieve this, existing bus, owner, operators and manufacturers will need to act now to invest in retrofitting. Bringing together several decades of combined experience and expertise in the development and integration of electric drives for buses, BMZ, HORIBA MIRA and ZIEHL-ABEGG will develop and supply highly efficient, safe and reliable, electric powertrain solutions to electric bus manufacturers, operators and owners, with the option of a complete retrofit service for customers that need it.

Ultra-Low Clamping Voltage High-Surge TVS
news image
Full press release:
aosmd.com/news
  • Product Release
  • 2019-10-16

Alpha and Omega Semiconductor introduced the AOZ8621UNI, a series of Transient Voltage Suppressor (TVS) for VBUS protection using the latest high-surge TVS platform. This series is ideal for USB Type-C Power Delivery, including but not limited to laptops and smartphones. The AOZ8621UNI series covers a reverse working voltage (VRWM) range from 5V to 22V, which meets the requirement of USB Power Delivery. Required VRWM can be selected according to the maximum operating voltage on the Type-C VBUS pin. The AOZ8621UNI series is housed in a DFN 2x2 package and is ideally suited to fit the small footprint requirement of Type-C application small electronic devices. “With such low breakdown voltage, low clamping voltage, and high-surge current, AOS believes the new high-surge TVS platform will contribute to reducing the ESD and EOS failure rate in our partners’ and customers’ products,” said Michael K. S. Ng, Sr. Marketing Manager of the TVS product line at AOS.

Bipolar Transistors up to 8 A
news image
Full press release:
nexperia.com/press-releases
  • Product Release
  • 2019-10-16

Nexperia announced high quality, high reliability automotive (AEC-Q101-qualified) and consumer/industrial-qualified MJD 3 A and 8 A power bipolar transistors. The product family includes eight parts in both 80 V and 100 V NPN and PNP versions. These well-known devices in industry-standard footprint now complement Nexperia's existing portfolio of high performance bipolar power transistors and further expand the company's total power bipolar discrete offering. Applications include: LED automotive lighting; backlight dimming in LCD displays; linear voltage regulators; relay replacement; motor drives; laser printers and MOSFET drivers. Nexperia Product Manager, Frank Matschullat, comments: "Nexperia is respected as a high volume, high quality supplier with a broad customer base. Widening our bipolar transistor portfolio with these higher current MJD devices enables design engineers to benefit from the recognised Nexperia performance advantages. This supports industry's desire to add efficiency to the supply chain and focus on few premium logistics suppliers such as Nexperia."

Miniature Resettable Thermal Cutoff Devices
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Full press release:
bourns.com/press-releases
  • Product Release
  • 2019-10-16

Bourns introduced the company's smallest miniature resettable Thermal Cutoff (TCO) devices designed for overtemperature and overcurrent protection of lithium polymer and prismatic cells. The Bourns Model CB Series is the company's next generation of axial leaded TCO devices that control abnormal, excessive current virtually instantaneously, up to rated limits. This latest series is more than 26 percent smaller than Bourns' successful NR Series, yet has the same current carrying capability. The devices' low-profile 0.8 mm height and body width of 2.5 mm makes this series ideal for smaller batteries in smartphones and portable electronics, yet their high current carrying capability also makes them optimal for next-generation notebook and tablet PC battery cells. Offering resistance levels as low as 2.2 milliohms, the Bourns Model CB Series has current capabilities from 6 A up to 11 A at 60 °C as well as a welding projection option. These new miniature resettable TCO devices are available in four trip temperature options of 72 °C, 77 °C, 82 °C and 85 °C with a ±5 °C tolerance. The temperature options can be further narrowed upon request. In addition, the construction of the CB Series uses a high corrosion resistant bimetal mechanism to withstand most humid environments.

Materials Meet Requirements for SiC and GaN Applications
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Full press release:
smp.de/press
  • Product Release
  • 2019-10-15

SMP has developed "All Mode" EMC filters with high frequency stability. The High Frequency Composite Materials (HFCM) developed and manufactured by SMP are effective for frequencies up to the gigaHertz range and satisfy all of the requirements to which modern SiC and GaN applications are subject. The All Mode design damps both differential mode and common mode noise. By combining HFCM and All Mode technology it is possible to reduce the number of filter components needed in the system by about 50 percent. Among other advantages, this also means that common mode chokes or filters can be dispensed with. EMC filters reduce interference currents and voltage spikes in power converter systems which are generated by parasitic effects and cyclic elements of the system. The material plays an important part in this, as SMP's Managing Director Johannes Gemenetzis explains: "The target is to achieve a stable inductance at the working point over the entire frequency spectrum in order to maximize the interference suppression. Compared to the standard technologies which use materials such as ferrite, electrical steel sheets and nanocrystalline ribbon, the All Mode EMC filters are up to 40 percent lighter and reduce interference levels by as much as 40 dB[µV]."

Modular Power Supplies Offer up to 18 Outputs
news image
Full press release:
emea.lambda.tdk.com/news
  • Product Release
  • 2019-10-15

TDK Corporation announces the introduction of the 2000W rated QM8B series of AC-DC power supplies with the capability of providing up to 18 outputs. This further extends the QM modular power supply series to now cover 550W to 2000W.  Like all the models in the QM series, the QM8B features low acoustic noise and full MoPPs isolation.  With both medical and industrial safety certifications, the QM8B addresses a wide range of applications, including BF rated medical equipment, test and measurement, broadcast, communications and renewable energy. Accepting a wide range 90-264Vac 47-440Hz input, the QM8B can deliver 1500W output power or 2000W with a high line input of 180-264Vac.  Available output voltages range from 2.8V to 105.6V and up to eight single or dual modules can be fitted.  Optional standby/signal modules can be specified with a choice of one or two standby voltages (5V, 12V and 13.5V at up to 2A), a PMBus™ communication interface and unit inhibit or unit enable, and an AC Good signal. The units can operate in ambient temperatures of -20°C to +70°C, derating output power and output current by 2.5% per °C above 50°C.  Overall case dimensions are a compact 200 x 63.3 x 268mm (W x H x D), and the weight is between 2.3 to 3.4kg, depending on the module configuration.

Collaboration Unveils Transistor Wafer Process Technology
news image
Full press release:
searchforthenext.com
  • Industry News
  • 2019-10-15

A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by implementing a fundamental change at transistor level reaching back five decades to the early bipolar IC era before CMOS became mainstream, using a new process called Bizen. Bizen applies the principles of quantum tunnel mechanics to any computing or power technology. When compared to CMOS, Bizen results in a five-fold lead time reduction - down from 15 weeks to just three weeks. Moreover, the new process achieves a three-fold increase in gate density that produces a matching three-fold reduction in die size. Lastly, Bizen halves the number of process layers required. All this is achieved while equalling or bettering the speed and low power capabilities offered by current CMOS devices. David Summerland, CEO SFN explains: "The CMOS processing industry is hitting a brick wall as shrinking geometries bash up against the laws of physics. We went back to the very beginning and found a way to commercialize quantum tunnel mechanics in silicon or wide bandgap device manufacture. The result is 'Bizen' – Bipolar/Zener – which retains the advantages of traditional bipolar processing yet removes the disadvantages by using Zener quantum tunnel mechanics. This results in lower dynamic power, higher speed and higher gate density, halving the number of process layers required, reducing material use by two thirds, and slashing manufacturing time."

Dual channel PPTC Protects from Overcurrents
news image
Full press release:
littelfuse.com/news-releases
  • Product Release
  • 2019-10-15

Littelfuse announced a series of 250V Telecom PPTCs designed to help make telecom and network equipment more reliable. The TSM250-130 series protects against power cross and induced power surges as defined in ITU, Telcordia GR1089 and IEC 62368-1. Because it combines two resistance-matched PPTCs in a single surface-mount housing, it reduces the board space required by 50%, simplifies assembly, and offers Tip and Ring resistance balance. Part of the Littelfuse PolySwitch family of resettable overcurrent protection devices for telecommunications and networking equipment, the new series is ideal for Customer Premise Equipment (CPE), Central Office (CO) equipment, Subscriber Line Interface Cards (SLIC) and VoIP port on set top boxes. "Featuring two resistance-matched PPTCs in a single surface-mount housing, the TSM250-130 Series delivers Tip and Ring overcurrent protection while using 50% less PCB area," said Stephen Li, Global Product Manager at Littelfuse. "With its high surge capability, it helps end users comply with ITU-T K.20, K.21 and K.45 as well as Telcordia GR-1089 intra-building standards." The TSM250-130 Series PPTCs are available in tape and reel format in quantities of 3,000.

Battery Scientists Prepare to Boost Power and Lifetime of Advanced Lead Batteries
news image
Full press release:
batteryinnovation.org
  • Industry News
  • 2019-10-15

Researchers have unveiled a program designed to produce high performance batteries in the United States (U.S.) for renewables energy storage and improved hybrid electric cars. The Consortium for Battery Innovation (CBI) has published the program in an innovation roadmap for advanced lead batteries which sets out research priorities for the next three years. U.S. members of the Consortium, which include battery manufacturers, universities and research institutes, are working together on pre-competitive research to fast-track innovation. Q1 2019 saw 148.8 MW deployed by the U.S. energy storage market, a massive 232% increase from the same period last year. The Consortium anticipates this growth record to set an upward trend in demand for battery energy storage. The U.S. will need a range of battery technologies - including lithium and advanced lead batteries – if energy storage demand is to be met. The plans outlined in the innovation roadmap will also help car-makers accelerate the roll out of start-stop and micro-hybrid vehicles, aiming to increase the dynamic charge acceptance of lead batteries by storing more of the energy created when a car brakes. More than 275 million cars and trucks in the U.S. utilize lead batteries.

Supporting Students of the TU Ilmenau in Formula Student
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Full press release:
rohm.com/news
  • Industry News
  • 2019-10-15

Starting immediately ROHM will be active in Formula Student Electric & Driverless: The company signed a sponsoring contract with the Team Starcraft of the Technical University Ilmenau, Germany. As part of the cooperation, ROHM will provide students with products from its extensive portfolio for the development of their vehicles. The team will also receive financial support. In Formula Student, university teams compete in an international design and racing competition that is not just about the fastest racecar. The goal of every team is to achieve the optimal overall package of construction, performance, and financial and sales planning. The Formula Student is divided into three classes: In addition to classic combustion vehicles and modern electric vehicles, there has been a class for autonomous vehicles since 2017. Team Starcraft consisting of students from TU Ilmenau has been active in Formula Student since 2006. With this cooperation ROHM expands its contacts to leading universities in Europe. In addition, ROHM wants to prove the application possibilities and advantages of its products in the automotive sector. "It's nice to see how much heart and soul the students put into their work," said Toshimitsu Suzuki, President of ROHM Semiconductor Europe. "ROHM is proud to support the next generation of top engineers and contribute to the mobility of tomorrow."

Introducing New Brand Identity System
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Full press release:
rigol.eu
  • Industry News
  • 2019-10-11

RIGOL Technologies is proud to announce the launch of its redesigned brand identity system as well as the 3rd generation brand tagline "Possibilities and More". The new brand identity is intended to permanently enhance both the divison's customer focus and its internal and external transparency. The new design features a modern, communicative, and refreshed design, which also conveys the brand core value via a younger, brighter, and more passionate, brand identity. The release of RIGOL's new brand identity system further enhanced the in-depth deployment of RIGOL's internationalization strategy. This means that RIGOL will be extended from product and technology innovation to customer-centered. RIGOL is also push innovations forward for the test and measurement industry. The own chipset and the new oscilloscope architecture show the way to the future. In addition to the Analog Front End Chip (named Beta Phoenics), Rigol also have developed the Signal Processing Chip (named Ankaa), which supports 10GSa/s data acquisition capability, and the Probe Amplifier Chip (named Gamma Phoenics), which will support differential probes up to 6GHz. The ASICs are based entirely on RIGOL IP and were developed entirely inhouse.

Putting the Electric Car in the Fast Lane
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Full press release:
izm.fraunhofer.de/news
  • Industry News
  • 2019-10-11

Skeptics of electromobility have raised critical questions, such as how fast an electric car can be driven and the maximum distances it can cover. That depends on the built-in power electronics – the heart of electromobility, if you will. Three factors are decisive when it comes to the installation of power electronics: space, weight, and efficiency. The semiconductor material silicon carbide (SiC) meets these conditions because it has a higher degree of efficiency and can or must be installed more compactly than conventional semiconductors made of silicon only. Although some electric cars already run on SiC semiconductors, there is still considerable potential here to fully exploit the efficiency of the SiC semiconductor material. The key to the success of SiC lies in the packaging of the semiconductors. In order to be able to use the material for large-scale industrial production, the SiC Modul project will take industrial framework conditions into consideration right from the start. For example, the module being developed within the project is based on a traditional printed circuit board design that has already been established in industry and is easy to implement.

Akira Yoshino Received the Nobel Prize in Chemistry 2019
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Full press release:
asahi-kasei.co.jp/news
  • People
  • 2019-10-10

Dr. Akira Yoshino, Honorary Fellow at Asahi Kasei, has won this year's Nobel Prize in Chemistry, the Royal Swedish Academy of Sciences announced on October 9 in Stockholm. Yoshino, 71, a professor at Meijo University, Japan, shares the prize with two other scientists for their development of lithium-ion batteries – Professor John B. Goodenough from the US and chemist M. Stanley Whittingham from Great Britain. Their invention is used as rechargeable batteries for mobile phones, laptop computers and other devices. It can also store significant amounts of energy from solar and wind power, making possible a fossil fuel-free society, and will be an important driver for the electrification in the automotive industry. With the spread of mobile electronic devices such as the Sony Walkman from the 1970s, the need for lightweight and compact rechargeable batteries to replace the common and non-rechargeable primary cells increased. Lithium was identified early on as a powerful anode material for rechargeable batteries. However, the easy inflammability and susceptibility to short circuits with the cathode posed great challenges to science and for a long time prevented the practical use of lithium-ion batteries. "There was a lot of R&D on portable electronics in the 1980s, and so small and lightweight batteries, with high energy density and rechargeability were also needed. But nobody really knew what kind of rechargeable battery was going to be needed. The big buzzword at first was "portable", soon joined by "cordless" and "wireless". I just sort of sniffed out the direction that trends were moving. You could say I had a good sense of smell", Yoshino told about these early years.

The Car of the Future on Europe's Roads
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Full press release:
infineon.com/market-news
  • Industry News
  • 2019-10-10

By 2030, 50% of newly registered vehicles will be electrically powered, connected or automated. This dramatic upsurge in functionality requires a new system approach in vehicle architecture to support electromobility and highly automated driving. Conventional cars were already equipped in 2014 with between 70 and 100 connected electronic control units (ECUs), and this figure would continue to rise driven by growing demands for environmental compatibility, efficiency, safety and convenience. The European project "Integrated Components for Complexity Control in affordable electrified cars", 3Ccar for short, was set up to tackle this challenge. 48 partners from 14 different countries have worked on and presented innovative highly integrated semiconductor-based solutions. "What we need in order to reach our ambitious objectives are a strong European ecosystem, innovation and long-term collaboration within major strategic research projects," says Dr. Sabine Herlitschka, CEO of Infineon Technologies Austria AG and Chair of the ECSEL Joint Undertaking. Infineon Technologies AG was responsible for managing and coordinating the project. The project was financed by the European Union, the German Federal Ministry of Education and Research (BMBF), other participating countries and partners from industry. The research budget amounted to 54 million euros. The 3Ccar project kicked off in 2015 and ran for 41 months. The eleven German partners have now presented their research results in a final report.

Low Profile QFN-package Power Module
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Full press release:
recom-power.com/newsroom
  • Product Release
  • 2019-10-09

RECOM’s latest addition to its DC/DC converter portfolio is one of the smallest in its class of low profile QFN-packaged buck regulator power modules. The RPX-2.5 module is exceptional due to its flip-chip technology which increases power density and improves thermal management. RECOM’s power module offers a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package. The RPX-2.5 provides an input range from 4.5 to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. It has an efficiency of up to 91%, and it is thermally optimized due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications. To facilitate rapid testing, RECOM also offers an evaluation board for this product so that customers will be able to quickly and easily test. Converter samples, evaluation boards, and OEM pricing are available from all authorized distributors or directly from RECOM.

AEC-Q200 Qualified Multilayer Varistors
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Full press release:
avx.com/press-releases
  • Product Release
  • 2019-10-08

AVX Corporation released a series of automotive-qualified multilayer varistors (MLVs) especially designed to exhibit lower breakdown- and clamping-voltage to working-voltage ratios than other standard varistors. Comprised of zinc-oxide-based (ZnO-based) ceramic semiconductor devices with nonlinear, bidirectional voltage-current (V-I) characteristics similar to those of back-to-back Zener diodes, but with greater current and energy handling capabilities and the addition of EMI/RFI attenuation, the new VLAS Series Low-Clamp TransGuard® Automotive MLVs combine bi-directional overvoltage circuit protection and broadband EMI/RFI filtering functions in a single, space-saving, surface-mount (SMT) device that is qualified to AEC-Q200, proven to deliver high-reliability performance, and capable of achieving very low clamping-to-working-voltage ratios that were previously only achievable with transient voltage suppression (TVS) diodes. This allows the new VLAS Series MLVs to extend the multifunctional advantages of varistor technology to sensitive automotive, industrial, and general electronics applications that require tighter clamping voltage performance for enhanced overvoltage protection, as well as the extreme optimization of physical space, including infotainment systems, engine control units (ECUs), microcontroller units (MCUs), and displays. The series also exhibits high current- and energy-handling capabilities, very fast, sub-nanosecond (<1nS) response times to ESD strikes, multiple-strike capabilities, high energy absorption (i.e., load dump), low leakage, and excellent solderability; doesn’t require any current or energy derating over the entire range of rated operating temperatures, which spans -55°C to 125°C; and can provide significant space savings when used to replace TVS diode and electromagnetic compatibility (EMC) capacitor pairings.

4.5A Two-Input Power Mux for IoT Applications
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Full press release:
glfipower.com/news
  • Product Release
  • 2019-10-08

GLF Integrated Power introduces the GLF74130, a two-input Power Mux IC that offers significant efficiency improvement over traditional diode-based solutions. The tiny (1.27 mm x 1.67 mm) Wafer Level Chip Scale Packaged (WLCSP) Power Mux IC provides automatic/manual selection between two 1.5V to 5.5V input power sources with up to 4.5A continuous output current. The device’s small footprint and industry-leading combination of low RON (20 mOs), low supply current (4 µA), and ultra-low standby current (50 nA) offer an exceptional solution for smart IoT devices and IoT tracking systems.  

Powering Towards the PCIM Europe 2020
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Full press release:
pcim.mesago.com/press
  • Event News
  • 2019-10-08

In less than six months, the leading international exhibition and conference for power electronics will open its doors once again: It is already clear that the PCIM Europe will continue to grow in 2020. Both the exhibition space and the number of exhibitor registrations have already exceeded the previous year's figures. The PCIM Europe will continue to expand its position as the world's leading exhibition for power electronics and its applications in the upcoming year. In Nuremberg from 5 – 7 May 2020, visitors will be able to experience an even greater range of products and components in the field of power electronics. The online exhibitor search provides an overview of all companies that have registered for PCIM Europe 2020 so far. The fact that electromobility is an important field of application for power electronics is illustrated by the great number of companies that will be presenting corresponding products from the field of power electronics on site. Therefore, the focus topic E-mobility will be presented at the PCIM Europe 2020 with an E-mobility area and a forum as last time. Exhibitors will be able to draw attention to their main booth and their E-mobility products with a branded poster wall and information material at the E-mobility Area. The program at the E-mobility Forum includes numerous lectures on innovative products for electric mobility on all three days of the exhibition.

4-Pin Package SiC MOSFETs
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Full press release:
rohm.com/news
  • Product Release
  • 2019-10-08

ROHM announced the availability of six trench gate structure SiC MOSFETs (650V/1200V), the SCT3xxx xR series, ideal for server power supplies, UPS systems, solar power inverters, and EV charging stations requiring high efficiency. The series utilizes a 4-pin package (TO-247-4L) that maximizes switching performance, making it possible to reduce switching loss by up to 35% over conventional 3-pin package types (TO-247N). This contributes to lower power consumption in a variety of applications. In recent years, the growing needs for cloud services due to the proliferation of AI and IoT has increased the demand for data centers worldwide. But for servers used in data centers, one major challenge is how to reduce power consumption as capacity and performance increase. At the same time, SiC devices are attracting attention due to their smaller loss over mainstream silicon devices in the power conversion circuits of servers. Furthermore, as the TO-247-4L package enables to reduce switching loss over conventional packages, it is expected to be adopted in high output applications such as servers, base stations, and solar power generation.

SMSI Call for Papers
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Full press release:
ama-sensorik.de/press
  • Event News
  • 2019-10-08

The AMA Association for Sensors and Measurement is commencing a Call for Papers for the Sensor and Measurement Science International 2020 (SMSI). This international conference is going to take place parallel to the SENSOR+TEST 2020 trade fair from 22 to 25 June 2020 in Nuremberg, Germany. The submission deadline for contributions and poster presentations is 31 January 2020. The new conference replaces the previous AMA conferences as of 2020. The former thematic focus on sensors and instrumentation will be complemented in the new format by measuring technology and metrology. The SMSI 2020 links national and international representatives from research, science, and industry. One pillar of the conference, sensor technology, will deal with sensor principles, materials, technology, and application and is to integrate the satellite conference IRS² 2020. Another pillar, measuring technology, is to include its technological foundations, advanced methods, networked systems, and new AI approaches in measuring. The area of metrology deals with traceability, advanced calibration, and testing methods as well as with new measuring regulations and standards. The parallel SENSOR+TEST 2020 trade fair, as an information platform for sensor, measuring, and testing technology, also serves to expand the innovation dialog among the conference participants beyond the SMSI 2020 itself.

Maintenance Service Predicts When Drives Need Replacing
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Full press release:
new.abb.com/news
  • Product Release
  • 2019-10-08

ABB has extended the scope of its ABB Ability Digital Powertrain concept that connects drives, motors, pumps and bearings with a Condition-Based Maintenance service option for drives. This option provides the earliest possible warning of any abnormal conditions that might cause a drive to fail prematurely. The service is targeted for drives in critical applications in the oil and gas, metals, water and wastewater, and pulp and paper industries, where it is essential to avoid costly unplanned plant shutdowns. The Condition-Based Maintenance service continuously monitors key components in a variable speed drive (VSD) – the fans, the semiconductors, and capacitors. Thermal, voltage, and power sensors collect data on the ambient temperature and load variations of the components and measure the daily impact on their lifetime. Cloud-based algorithms and statistical analysis estimate the level of stress on components and calculate their remaining life. If failure is predicted before the next planned maintenance, operation management can make a fully informed decision to take action and prevent an unplanned shutdown. In some cases, the Condition-Based Maintenance service could indicate that the drive components are under less stress than normal and will last longer than expected. Therefore, regular preventive maintenance intervals can be extended to increase productivity and reduce costs.

Jason Cuadra Appointed as VP Engineering
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Full press release:
pre-switch.com
  • People
  • 2019-10-08

Pre-Switch has announced the appointment of Jason Cuadra to the position of VP Engineering. An industry veteran with over 25 years' experience in power converter design, Cuadra has in-depth knowledge including of magnetics, EMC, control, resonant conversion, design automation, and high volume production. He is an experienced engineering manager, having led teams in the testing and development of new technology. He joins Pre-Switch from Loon LLC (Google X) where he designed and re-architected the power converters on the payload of Loon's stratospheric balloons for providing LTE cellular service to users in remote areas of the world. Cuadra's previous applications management responsibilities include reference board design, customer engagement and working closely with Marketing, Sales, and FAEs. Comments Bruce T. Renouard, CEO, Pre-Switch: "We are very pleased to have Jason join our team where his design and management skills will be a great asset to us. His customer-facing and sales support experience will be instrumental in continuing our accelerating new product development." Pre-Switch's forced-resonant soft-switching topology replaces the traditional IGBT driver or Silicon Carbide driver with a common intelligent controller board, the Pre-Drive3, and an application-specific plug-in RPG (Resonant Power Gate) module optimized for the customer's chosen SiC or IGBT package. The Pre-Switch architecture reduces cost, increases efficiency and extends EV range by 5-12%, while reducing size and weight.

SiC Semiconductors Make Electric Cars More Efficient
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Full press release:
bosch-presse.de/pressportal
  • Industry News
  • 2019-10-08

Nowadays, all cars feature semiconductors. There are more than 50 of them in every vehicle that rolls off the production line. The microchips made of silicon carbide (SiC) that Bosch has developed will now help electromobility make a great leap forward. In the future, the chips made of this extraordinary material will set the pace in the power electronics – the command center for electric and hybrid vehicles. With this silicon carbide technology, Bosch is systematically expanding its semiconductor know-how. The company will be using the SiC semiconductors in its own power electronics in the future. For its customers, this brings together the best of both worlds, as Bosch is the only automotive supplier that also manufactures semiconductors. "Thanks to our deep understanding of systems in e-mobility, the benefits of silicon carbide technology flow directly into the development of components and systems," Harald Kroeger, member of the Bosch board of management, says. As one of the leading manufacturers of automotive semiconductors, Bosch has been exploiting this globally unique advantage for almost 50 years. In addition to power semiconductors, these include microelectromechanical systems (MEMS) and application-specific integrated circuits (ASICs).

Flexible 12-Channel Automotive LED Driver
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Full press release:
st.com/media-center
  • Product Release
  • 2019-10-07

The STMicroelectronics ALED1262ZT 12-channel LED driver targets advanced automotive rear combination lamps and interior lighting, bringing features to support complex and innovative visual effects. Independent 7-bit PWM dimming on all channels allows flexible control of tail, stop, and indicator lights, with dynamic effects. Each channel delivers constant output current at 19V for controlling multi-LED series strings. Adjustment from 6mA to 60mA ensures a wide dimming range with high maximum brightness. The LED lighting driver responds to I2C commands from a host microcontroller and provides two pre-programmed configurations that allow standalone operation for extra flexibility. With diagnostic features including open-LED detection and over-temperature warning with thermal shutdown, the ALED1262ZT ensures long-lasting robustness and stability. The input-voltage range from 5.5V to 38V allows use in direct battery-connected systems. In addition, the ALED1262ZT is designed for low-noise operation, with slow turn-on/off time per channel and spread-spectrum clock operation to simplify integration with other in-vehicle electronics. ST has also released an evaluation board, STEVAL-LLL002V1, available from www.st.com or distributors, to help designers explore the ALED1262ZT's features and jump-start new lighting designs.

Diverse Program Entices Key Players and Startups
  • Event News
  • 2019-10-03

In its 9th year the co-hosted LED professional Symposium +Expo (LpS), Trends in Lighting Forum &Show (TiL) and for the first time the Digital Addressable Lighting Interface (DALI) Summit gathered in the unique setting of Bregenz, Austria. The three international conference and exhibition events were carefully curated to bring together a unique blend of award winning industry talent including; architects, planners, lighting designers, scientists and technologists. The event brought focus to the continuing relevance of interdependent technologies, human centric design and more acutely, sustainability. The approach of combining distinct lighting fields by Luger Research; LpS 2019, TiL 2019 and DALI Summit 2019, succeeded in inciting conversations and knowledge sharing to facilitate the evolution of lighting in the complex global environment. The combined three day event presented delegates with the opportunity to interact with an extensive selection of prominent keynote speakers from the lighting design world, scientists, and technologists. The opera stage and theatre spaces were utilised for panel discussions, lectures and workshops crossing disciplines and sectors of industry. Another insightful aspect to the event was a lively press conference and CEO + Influencer panel allowing promulgation of news, industry opinion and key expectations and challenges for the coming years in the lighting industry.

Expanding the Portfolio of Current Compensated Chokes
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Full press release:
schaffner.com/news
  • Product Release
  • 2019-10-02

The RC chokes are available with horizontal and vertical mounting options. Standard current ranges are from 0.25 to 0.7A with voltages up to 250VAC. The RC choke stands for Reduced Complexity choke, featuring small form factor common mode choke design without potting. This reduces the weight improves the quality , due to less process steps in production. It also fulfills customer expectations in terms of recyclability and environmental friendliness. The design approach taken for the RC choke is the first step into a new era of small form factor chokes at Schaffner. The RC choke meets customers expectations with the ability to perform at high ambient temperature (up to 125°C) without losing any mechanical or safety relevant specification (de-rating calculations are provided for operational ambient temperature higher than rated values). The range of 14 different combinations of current, inductance and mounting position makes the series suitable for power supplies and applications like LED lighting, HVAC or medical devices. Schaffner's RC chokes comply with RoHS and REACH requirements and are certified to IEC/EN 60938-2 (VDE 0565-2-1). With their open-frame construction, RC chokes can be easily reviewed by all safety organizations and certified as part of the end product. If required material lists are available upon request.

SiC FET Devices for Global Racing Challenge
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Full press release:
unitedsic.com
  • Industry News
  • 2019-10-02

A Dutch solar car team from University of Twente and Saxion Hogeschool has selected silicon carbide (SiC) devices from UnitedSiC ahead of a major solar racing challenge which took place in October. UnitedSiC provided product samples of their FAST Series of SiC FETs to Solar Team Twente, which they selected on the basis of superior performance. "At the moment, Solar Team Twente develops and produces the entire electrical system of the vehicle, from solar panel, battery, and even the drivetrain. The motor controller and electrical motor are also developed by the team. To ensure we get the best possible performance, we are continuously looking to new technologies, including silicon carbide. With SiC we can reduce our switching losses drastically, while reliability and robustness remain guaranteed." says Devon Screever, Electrical Engineer at Solar Team Twente. "For new designs such as this solar car project, UnitedSiC FAST Series SiC FETs will offer the designers significant system benefits from the device's increased switching frequencies, such as increased efficiency and reduction in the size and cost of passive components," says Anup Bhalla, VP of Engineering at UnitedSiC. "The FAST Series devices offer not only ultra-low gate charge, but also the best reverse recovery characteristics of any device of similar ratings. Solar Team Twente's selection of these products is an indication of just how much of a competitive advantage SiC FETs from UnitedSiC can offer."

High-Performance GaAs Semiconductors
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Full press release:
3-5pe.com
  • Industry News
  • 2019-10-02

High-performance gallium arsenide (GaAs)-based electronics have the potential to help new technologies achieve breakthrough. A study at the Karlsruhe Institute of Technology (KIT) of the development of ultra-fast charging stations for electric vehicles has demonstrated that GaAs diodes from 3-5 Power Electronics GmbH (35PE) Dresden can deliver promising results. "The trials showed that circuits can be laid out much more efficiently than with silicon-carbide-based (SiC) products and that there are close to zero losses," report 35PE Managing Directors Dr. Gerhard Bolenz and Dr. Volker Dudek. A follow-up project is subjecting the GaAs diodes to practical testing with a charging station manufacturer and a further research partner. These high-performance semiconductors, which operate almost without current or voltage, represent 35PE's first new product family since the start of production in spring 2018. "These 'soft switching' applications are particularly suitable for use in electric mobility and industrial electronics, such as plasma welding. The first samples are already being tested with potential customers in Europe and Asia," explain the managing directors. The product family, which was originally designed for diodes in the 600 volt and 1200 volt range, is being expanded to include the 400 volt range due to demand. The engineers are also working on high-performance semiconductors for hard switching applications. In addition to the automotive and industrial sectors, this will appeal to customers in the renewable energy industry.

3rd Edition of Gallium Nitride Textbook
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Full press release:
epc-co.com/News
  • Industry News
  • 2019-10-02

Efficient Power Conversion Corporation (EPC) announce the publication of the third edition of "GaN Transistors for Efficient Power Conversion," a textbook written by power conversion industry experts and published by John Wiley and Sons.  This textbook is designed to provide power system design engineering students, as well as practicing engineers, basic technical and application-focused information on how to design more efficient power conversion systems using gallium nitride-based transistors. Gallium nitride (GaN) is leading edge technology that is displacing the venerable silicon MOSFET in power conversion applications. As silicon approaches its performance limits, GaN devices offer superior conductivity and switching characteristics, allowing designers to greatly increase efficiency, and reduce size, weight, and cost. This timely third edition has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements and emerging applications. This book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and a wide range of applications. Included are Discussions on the fundamental physics of these power semiconductors Practical guidance on layout and other circuit design considerations Application examples employing GaN including lidar for autonomous vehicles, DC-DC power conversion, RF envelope tracking used in 5G communication networks, wireless power, class-D audio, and high radiation environments.

NFC Programming Method for LED Drivers
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Full press release:
infineon.com/market-news
  • Product Release
  • 2019-10-02

For fast and cost-effective implementation of NFC programming for LED drivers, Infineon Technologies developed the NFC-PWM series NLM0011 and NLM0010. NFC programming is an emerging technology designed to replace the labor-intensive "plug-in resistor" current setting method via contactless NFC interface. Besides improving the operational efficiency by enabling automatic programming in the manufacturing line, it creates significant flexibility in the value chain. With this it reduces the LED driver variants, simplifies the selection of LED modules, and allows end-of-line configuration. The devices are NFC wireless-configuration ICs with configurable PWM output, primarily designed for LED applications. They enable cost-effective NFC programming implementation by using a PWM signal directly to control the analog driver IC. Comparing to the microcontroller based solution the system BOM cost is reduced. Both devices have two operation modes, passive and active mode. In the passive mode, the LED driver module is not powered, and the PWM-related parameters can be configured wirelessly via the NFC interface. In the active mode, as soon as the V CC voltage supply is powered, a PWM output is generated according to the stored parameters. With an external R/C filter, the PWM signal is converted to the desired DC voltage to control the current output of an LED driver.

DC/DC Converter Series Comprises 24 Models
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Full press release:
componentsbureau.com/news
  • Product Release
  • 2019-10-02

Components Bureau is now offering a high-quality range of 75-Watt isolated DC/DC converters from Cincon of Taiwan, certified to the latest EN 55032 EMC specification and offering outstanding safety, efficiency, and flexibility. The ECLB75W series comprises 24 models offering a choice of 24V or 48V nominal DC input voltage and regulated single or ± 5V, ±12V, and ±15V, and ±24V output. Compliant with the standard 2" x 1" power-module pinout, the converters come in a 52mm x 30.5mm x 10.2mm shielded metal case with a choice of mountings. There is also a remote on/off control with a choice of positive or inverse logic polarity. The wide input-voltage ratio of 4:1 allows operation from 9V-36V and 18V-75V, enabling use in distributed power architectures, telecommunication equipment, battery-operated devices, and industrial applications. The case operating-temperature range of –40°C to 105°C ensures reliability in challenging environments. As well as meeting EN 55032, which is the new EMC standard covering audio/video, broadcast and entertainment-lighting equipment, the units are also certified to the EN 55022 IT equipment standard. Internally, the converters feature an all-ceramic capacitor design for outstanding power density and reliability. With maximum efficiency over 92.5% and very low no-load power consumption, ECLB75W converters are suited to use in energy-critical systems.

Low Capacitance TVS Diode Arrays
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Full press release:
littelfuse.com/news-releases
  • Product Release
  • 2019-10-01

Littelfuse introduced a series of low capacitance TVS Diode Arrays (SPA Diodes) optimized to protect high-speed differential data lines from electrostatic discharge (ESD), cable discharge events (CDE), electrical fast transients (EFT), and lightning-induced surges, keeping network communications reliable by safeguarding signal integrity. The SP3384NUTG Series can protect up to four channels against up to 15A (IEC 61000-4-5 2nd edition) and up to ±30kV ESD (IEC 61000-4-2) and is available in a compact µDFN package. The combination of low capacitance and low clamping voltage make the SP3384NUTG a robust protection solution for 2.5G/5G/10G Ethernet high-speed data interfaces without signal degradation, resulting in high reliability for a variety of applications. Typical markets and applications for the SP3384NUTG Series TVS Diodes include Datacenter, Telecom and Consumer Electronics.  "Building upon similar footprints in 1GbE and 5GbE applications, the SP3384NUTG expands our portfolio to fill a market need for ultra-strong ESD and surge protection for today's fastest 10GbE consumer ethernet solutions," said Tim Micun, Director of Business Development, TVS Diode Arrays (SPA Diodes). "It is also packaged in a compact configuration that is familiar to the datacenter, telecom and consumer electronics industries."

One-Millionth GaN-Based IC
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Full press release:
power.com/press-releases
  • Industry News
  • 2019-09-30

Power Integrations announced the delivery of its one-millionth InnoSwitch3 switcher IC featuring the company's PowiGaN gallium-nitride technology. In an event at the Shenzhen headquarters of Anker Innovations, Power Integrations CEO Balu Balakrishnan presented the one-millionth GaN-based IC to Anker CEO Steven Yang. Anker is a leading manufacturer of chargers and adapters, supplying retailers worldwide with powerful, compact USB PD adapters and a wide range of chargers and adapters for laptops, smart mobile devices, set-top boxes, displays, appliances, networking gear and gaming products. InnoSwitch3 offline CV/CC flyback switcher ICs with PowiGaN technology are up to 95% efficient across the load range. Very low switching and conduction losses of PowiGaN primary switch allows delivery of as much as 100 W from a space saving InSOP 24D surface mount package in enclosed adapter applications without requiring a heatsink. Quasi-resonant InnoSwitch3-CP, InnoSwitch3-EP and InnoSwitch3-Pro ICs combine the primary power switch, primary and secondary control with safety isolated high speed link (FluxLink) in between, as well as the secondary SR driver and feedback circuits in a single surface-mounted package. The superior switching performance of PowiGaN technology results in substantially higher efficiency, enabling very compact adapter designs. Commented Mr. Balakrishnan: "Anker is a world leader in compact charger design, and was the first high-volume customer for InnoSwitch3 products with PowiGaN. I'm pleased to recognize Anker's foresight and technical excellence, and to thank Mr. Yang for his critical contribution to the first successful mass-market deployment of high-voltage GaN technology."

Adaptable Buck-Boost Converters Deliver up to 2.5 A
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Full press release:
news.ti.com
  • Product Release
  • 2019-09-30

Texas Instruments introduced a family of four high-efficiency, low-quiescent-current (IQ) buck-boost converters that feature tiny packaging with minimal external components for a small solution size. The integrated TPS63802, TPS63805, TPS63806 and TPS63810 DC/DC noninverting buck-boost converters offer wide input and output voltage ranges that scale to support multiple battery-driven applications, helping engineers simplify and accelerate their designs. Each of the devices in the family automatically selects buck, buck-boost or boost mode according to the operating conditions. Their complete solution size of 19.5 mm2 to 25 mm2 – up to 25% smaller than similar devices – is a result of compact packaging, an advanced control topology requiring few external multilayer ceramic capacitors, and tiny 0.47-µH inductors. The devices offer a wide 1.3-V to 5.5-V input and 1.8-V to 5.2-V output voltage range, which helps engineers speed their designs and encourages reuse across multiple applications. These DC/DC converters are the latest addition to TI’s industry-leading low-IQ power-management portfolio, providing low 11- to 15-µA IQ for excellent light-load efficiency while minimizing power losses and extending run times in battery-driven applications such as portable electronic point-of-sale terminals, grid infrastructure metering devices, wireless sensors and handheld electronic devices.

3DCoil Electro-Magnetic Sensor
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Full press release:
grupopremo.com/content
  • Product Release
  • 2019-09-27

PREMO announces the 3DC14EMR-ULP series, the lowest profile 3D antenna coil available (below 50% when compared to other antenna coils in the market today). The majority of the 3D electromagnetic sensors available in the market have minimum heights of 3.2mm. The lowest profile 3D coil prior to the release of the ULP series was the PREMO 3DC06 series with a maximum height of 2.5mm. The 1.65mm height target has been the biggest challenge during the last 2 years. It was achieved by a joint ecosystem development effort between BQ, UC3M University and Premo. The entire project was under the scope of a CDTI-Spain (Center for the Development of Industrial Technology) research project called ASUMP. This is a true ultra low-profile sensor with a 12mm x 14mm footprint and a 1.65mm maximum height that is able to be integrated into ultra-thin devices such as SmartCard-type key fobs, traditional automotive key fobs, special miniaturized key fobs (sport keys), Smartphones (to be used as a digital key with the same user experience of current PKE access), and other devices such as hand-held controllers where EMMT (electromagnetic motion tracking technology) is used for 6DoF applications (real high- precision motion-tracking systems with no limitations in terms of line of sight, ultra-low latency, low power consumption, etc.).

High-Voltage Dual-Channel Solenoid Driver IC
  • Product Release
  • 2019-09-26

Toshiba Electronics Europe has launched a dual-channel solenoid driver IC that provides a high-voltage drive with low ON resistance. The TB67S112PG driver IC is suited to a wide variety of applications including domestic appliances (air-conditioners and refrigerators), industrial equipment (banking terminals such as ATMs, office automation equipment, and factory automation equipment). Toshiba's solenoid driver IC lineup currently includes 4- and 8-channel devices (TB67S111PG and TB67S158NG/FTG). The new TB67S112PG completes the lineup, by providing support for dual-channel applications at a lower price point. The device incorporates two channels, each consisting of a low-side MOSFET and a regenerative common diode that can independently drive a solenoid or relay at voltages up to 50V. A low ON resistance of only 0.3O allows for a higher output voltage, resulting in higher motor torque, and reducing heat generation during motor operation. Safe operation is enabled through the provision of overcurrent detection (ISD), under voltage lockout (UVLO) detection and thermal shutdown detection (TSD), which, additionally, sets a flag to notify the system controller of a thermal shutdown event.

ECPE Events
news image
Full press release:
ecpe.org/events
  • Event News
  • 2019-09-26

• ECPE Tutorial 'Thermal Engineering of Power Electronic Systems - Part II: Thermal Management and Reliability'
4 - 5 November 2019, Nuremberg, Germany

• ECPE Tutorial 'Power Circuits for Clean Switching and Low Losses'
6 - 7 November 2019, Barcelona, Spain

• ECPE Tutorial 'Power Semiconductor Devices & Technologies'
20 - 21 November 2019, Rüsselsheim (close to Frankfurt am Main), Germany

• ECPE Workshop 'Power Semiconductors in Medium Voltage Applications - SiC vs. Silicon'
3 - 4 December 2019, Freiburg i.B., Germany

• ECPE Workshop 'Power Semiconductor Robustness - What Kills Power Devices?'
13 January (afternoon) - 14 January 2020, Munich, Germany

• ECPE Workshop 'Magnetic Components in power Electronics' - further information will be published soon
19 - 20 February 2020, Grenoble, France

Rolling Jamming Transmitters
news image
Full press release:
schurter.com/Newsroom
  • Product Release
  • 2019-09-26

Exactly tailored to the needs of electric vehicles is the latest filter series FPAB, which - as usual at SCHURTER - can be fully customized. This single-stage filter places a high value on robustness, impermeability to dust and moisture. Thanks to the use of a well-sealed connector from Tyco, which is popular in the automotive industry, it is particularly lightweight and used universally. All connections are screwed to withstand even the most stubborn vibrations. SCHURTER is certified according to IATF16949 and serves a large number of customers with fuses which have been tested according to AEC-Q200 for various applications (battery management, climate control, engine related electronics for diesel/petrol engines and many more). Millions and millions of fuses to protect against overcurrent and overtemperature are in use worldwide. The close networking with international automotive organizations and the industry itself make SCHURTER a competent partner for all questions concerning the protection of electronics in automotive engineering. In addition, SCHURTER has a competence center for EMC solutions, which has been developing tailor-made solutions for industrial and medical applications for decades. Test us. We would also be pleased to demonstrate our EMC competence to you on site.

MOSFETs in TO-Leadless Packaging Technology
news image
Full press release:
aosmd.com/news
  • Product Release
  • 2019-09-26

Alpha and Omega Semiconductor introduced the TO-Leadless (TOLL) package in combination with a 60V and 100V Shield-Gate Technology (SGT) providing the highest current capability in its voltage class. The TOLL package has the highest current capacity due to AOS' innovative technology, which utilizes a clip to achieve the in-rush current. The TOLL packaging technology offers a very low package resistance and inductance due to the clip technology when compared to other TO-Leadless packages. This packaging technology uses a standard wire-bonding technology which enables improved EMI performance. The AOTL66608 (60V), AOTL66610 (60V), and AOTL66912 (100V) have a 30% smaller footprint compared to a TO-263 (D2PAK) package and has a higher current capability which enables the designer to reduce the number of MOSFETs in parallel. The device's offer a higher power density compared to existing solutions. They are ideally suited for industrial BLDC motor applications and battery management. "Using the AOS TOLL package with clip technology offers performance improvement in a robust package. The AOTL66608, AOTL66610, and AOTL66912 can simplify new designs with the higher current capability to enable savings in overall system cost due to a reduced number of devices in parallel," said Peter H. Wilson, Marketing Director of MOSFET product line at AOS.

Transformer for High Power, High Frequency Applications
news image
Full press release:
murata.com/info
  • Product Release
  • 2019-09-26

Murata has announced a transformer technology for high power, high frequency applications that uses a novel winding technique to allow designers to efficiently reach power and frequency levels that were never possible with conventional winding methods. Murata's patented pdqb winding technology makes it possible to construct high frequency transformers of up to and over 400 kW that can operate at frequencies as high as 50 kHz. The pdqb winding technique overcomes the skin and proximity effects as well as other high frequency losses associated with conventional construction methods, delivering an efficient (>99.5 %) solution in a compact footprint. There are a number of further benefits to the winding technique including an increased working voltage and elevated isolation voltage (up to 10 kV). The leakage inductance is highly controllable and interwinding capacitance is low, both of which enhance performance in customer's designs. Thermal performance is also improved, eliminating the space requirements and cost associated with heatsinking. Each design can be optimized by a combination of Murata's transformer expertise and their own simulation software. Murata is able to design custom high power, high frequency transformers operating around 4-50 kHz with power ratings from 30 kW to 400 kW.

Power Electronics Conference 2019
news image
Full press release:
power-conference.com
  • Event News
  • 2019-09-26

Power Electronics is rapidly moving towards Wide Bandgap, because the key for the next essential step in energy efficiency lies in the use of new materials, such as GaN (gallium nitride) and SiC (silicon carbide) which allow for greater power efficiency, smaller size, lighter weight and lower overall cost. Wide Bandgap Semiconductors are transforming power electronics designs across many applications such as data centers, renewable energy, automotive and many more. This 1-day technical conference will explain why, how and where this is happening. Conference delegates will be provided with the knowledge necessary to make their decisions on where, how and which Wide Bandgap platforms and devices can play a role in current or upcoming designs.

Battery Interconnect Systems Streamline Custom Design and Assembly
  • Product Release
  • 2019-09-25

Interplex has announced availability of the Cell-PLX custom battery interconnect systems. This technology streamlines the design and manufacturing of robust interconnects for battery modules across an extensive range of industries. Battery module designs vary widely by manufacturer and specific application, be it for electric vehicles (EVs) and automotive power applications, land and maritime transportation, or wind energy storage. However, all of them fundamentally require robust mechanical and electrical interconnect systems to integrate and interface with the array of battery module cells. Cell-PLX addresses these intricate complexities with a custom battery interconnect system that connects battery cells to current collectors, and a customizable lead frame interface to the battery management system. By tackling the full range of design requirements, it delivers a customized power solution that effectively handles the increasing variety of battery module sizes and configurations. According to Craig Kennedy, Product Portfolio Director for Battery Interconnect Systems, "as battery applications rapidly advance, flexibility and customization is key to success. Cell-PLX is customizable to specific application designs. It supports various current density requirements, with single or multi-layered current collectors and dielectric layers of different thicknesses. With our advanced high-speed manufacturing processes, cell connection terminals on the current collector can be made thinner than the current collector itself. This assures a reliable weld joint to the battery cells while maintaining minimum current density requirements."

Expert to Present at ITW EAE Seminar
news image
Full press release:
indium.com/news-releases
  • People
  • 2019-09-24

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the ITW EAE Smart Stencil Printing Solutions seminar, October 23-24, in Dreieich, Germany. Karch's presentation, Voiding and How to Optimize Current Printing Processes, will examine the evolution of solder paste for the elimination of voiding. He will also discuss stencil design, specifications, and other printing tips and tricks to help engineers optimize their processes. As a Regional Technical Manager, Karch provides support, including sharing process knowledge and making technical recommendations, for the use of Indium Corporation's solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer and has earned his Six Sigma Yellow Belt. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Integrated Point-of-Load Regulator
news image
Full press release:
infineon.com/market-news
  • Product Release
  • 2019-09-23

Infineon Technologies introduces the OptiMOS IR3826(A)M integrated point-of-load DC-DC voltage regulator. It is a fully integrated and highly efficient device in two versions (IR3826AM for 16 A and IR3826M for 23 A) for applications such as netcom router and switches, datacom, telecom base stations, server and enterprise storage. The voltage regulator can operate from an input voltage of 12 V (5 V to 17 V) and provide up to 16 A or 23 A continuous current. It enables high-switching-frequency operations with enhanced efficiency and reduced power losses compared to previous generations of Infineon's offering. Furthermore, the device supports high switching frequency of up to 1.5 MHz for small PCB size and less capacitors. Both current ratings are offered in PQFN package with 5 mm x 6 mm footprint for easy scalability. Parts are pin-compatible to the previous product offerings to allow risk-free efficiency upgrade with minimum design effort. The IR3826(A)M solves the heat challenge without or with minimum airflow in thermally constrained application designs such us 3.3 V or 5 V supply voltages. Additionally, it supports applications that operate with high ambient temperature, e.g., 85°C for telecom. The state-of-the-art PWM Gen 3 engine of the devices allows operation with fixed frequency to reduce noise in multi-rail telecom or high-end Netcom applications, like base stations. The devices are fully RoHS2 compliant without an exemption to accommodate future regulations.

SiC Device Manufacturing Facility
news image
Full press release:
cree.com/news
  • Industry News
  • 2019-09-23

Cree, Inc. announced plans to establish a silicon carbide corridor on the East Coast of the United States with the creation of the world's largest silicon carbide fabrication facility. The company will build a state-of-the-art, automotive-qualified 200mm power and RF wafer fabrication facility in Marcy, New York, complemented by its mega materials factory expansion currently underway at its Durham headquarters. The fabrication facility, part of a previously announced project to dramatically increase capacity for its Wolfspeed silicon carbide and GaN business, will be a bigger, highly-automated factory with greater output capability. Through a strategic partnership with the office of Governor Andrew M. Cuomo and other state and local agencies and entities, the decision to build in New York will allow for both continued future expansion of capacity and significant net cost savings for Cree. As a result, Cree will continue to drive the transition from silicon to silicon carbide technology to meet the increasing demand for the company's groundbreaking Wolfspeed technology that supports the growing electric vehicle (EV), 4G/5G mobile and industrial markets. "Silicon carbide is one of the most pivotal technologies of our time, and is at the heart of enabling innovation across a wide range of today's most groundbreaking and revolutionary markets, including the transition from the internal combustion engine to electric vehicles and the rollout of ultra-fast 5G networks," said Gregg Lowe, CEO of Cree.

Project for Open Source Test Automation
news image
Full press release:
keysight.com/newsroom
  • Industry News
  • 2019-09-23

Keysight Technologies, in conjunction with the OpenTAP project community, is pleased to welcome four new participants to the OpenTAP project: 5G-VINNI, Page Electronica NV, TandM Solutions and Tokalabs. The OpenTAP project comprises a growing community of developers dedicated to the idea of effortless automation. The core technology is a test sequencer, with the community continuously adding plugins and solutions that support faster development, new functionality and optimization in test. Through these contributions and the enhanced collaboration possible with its open-core approach, OpenTAP is inspiring developers to innovate automation solutions in testing and measurement, and beyond. Dan Thomasson, vice president of Keysight Labs, commented: "OpenTAP's architecture is designed for extensibility, making it flexible for many different use cases. It is exciting to see all the ways it is being put to use by the growing community. "

20A 40Vdc MIL-COTS EMI Filters
news image
Full press release:
us.tdk-lambda.com/news
  • Product Release
  • 2019-09-20

TDK Corporation announces the introduction of the TDK-Lambda FQA series of EMC filters, with a rating of +/-40Vdc at 20A. The FQA has a rugged encapsulated quarter-brick package with a choice of flanged or non-flanged baseplates. These modules are suitable for use in a wide variety of harsh and demanding environments, including MIL-COTS vehicle and airborne applications. The FQA series is designed with a high differential and common mode noise attenuation. This simplifies system level compliance to MIL-STD-461G standards. The modules also provide input spike protection to MIL-STD-1275D and RTCA/DO-160G. Qualifying testing is consistent with MIL-STD-883F and MIL-STD-202G. The PCB mount FQA can be cooled using either an industry standard ¼ brick heatsink, or conduction cooled via a cold plate. The non-flanged package size measures 60.6 x 39 x 12.7mm (L x W x H) and the flanged version 60.6 x 55.9 x 12.7mm. The total DC resistance of the filter is typically 12mO, minimizing power losses. The filters are available with standard production screening (-S suffix) and a baseplate temperature rating of -40°C to +115°C, or with enhanced screening (-M suffix) and an extended temperature rating of -55°C to +115°C. Enhanced screening includes functional testing at high and low temperatures and a 96 hour burn-in period with temperature cycling.

Cleaning Machines, Cleaning Agents and Analytical Support
news image
Full press release:
zestron.com/news
  • Product Release
  • 2019-09-19

Using the motto "Make the Cleaning Check", ZESTRON will be exhibiting a selection of state-of-the-art cleaning machines from leading international manufacturers. Visitors who are looking for a new cleaning system will be shown diverse, innovative and proven technologies. ZESTRON's process engineers and experts from the equipment manufacturers are available to answer questions about the technology as well as the compatible cleaning chemistry. In addition to the selection of machines and cleaning agents, the focus is on process monitoring. Trade show visitors can get information about innovative test methods and measuring concepts that help to ensure the reliability of electronic assemblies and to optimize production processes.

Medical 40-65W External Power Supplies
news image
Full press release:
emea.lambda.tdk.com/news
  • Product Release
  • 2019-09-19

TDK Corporation announces the introduction of the TDK-Lambda brand DTM65-D external power supplies rated at up to 65W output power. Certified to the IEC 60601-1 medical standard, the series complies with the latest EU CoC (Code of Conduct) Tier 2 v5 and US DoE Level VI efficiency standards. Applications include medical products, industrial computing, life sciences and laboratory equipment. Packaged in a rugged, vent-free enclosure, the DTM65-D measures 132mm x 69mm x 40mm (L x W x H). Eight outputs are available (5V, 12V, 15V, 19V, 24V, 28V, 36V and 48V) with connections made using a standard 4-pin power DIN latching connector, with other types available upon request. The 90 - 264Vac input assures global operation and is applied through a three-pin IEC 320-C14 receptacle. The operating temperature is -20ºC to +60ºC, which derates linearly to 75% load from 51ºC to 60ºC. Average efficiency is greater than 89% (>87.3% for the 5V model) and the off-load power consumption is less than 0.15W.

Katja Stolle Takes Over as Exhibition Director
news image
Full press release:
electronica.de/newsroom
  • People
  • 2019-09-19

electronica trade fair and conference have a new Exhibition Director. Katja Stolle, who has been with Messe München over 13 years, is now leading the project team. The next electronica will be held in Munich from November 10 to 13, 2020. Katja joined Messe München in 2006 after earning a degree in humanities. In 2012, she took over the exhibition management of analytica – the leading international trade fair for laboratory technology, analysis and biotechnology. Over the past six years, she has led the LASER World of PHOTONICS and the World of Photonics Congress. She was primarily responsible for the strategic and conceptual enhancement of the world's leading trade fair for photonic components, systems and applications. Katja Stolle reports to Ms. Barbara Müller, who will continue to oversee the global electronic network at Messe München in her position as Exhibition Group Director. The new position represents both a challenge and motivation for Katja: "electronica is without a doubt the world's most important meeting place for the electronics industry. For this reason, I am really excited about the opportunity to enhance the event with the help of my team and expand the internationally leading role that electronica plays."

SOI Industry Consortium Announces Awards
news image
Full press release:
prnewswire.com/news-releases
  • People
  • 2019-09-18

The SOI Industry Consortium announced awards to two luminaries of the semiconductor industry. Jim Cable, Chairman and CTO of pSemi, a Murata Company, and Herb Huang, CEO and GM of Ninbo Semiconductor received awards for their contributions to the advancement of RF-SOI, a leading technology used extensively in chips for cellular communications. The awards were given during a gala following the SOI Consortium's annual RF-SOI Workshop in Shanghai. "Thanks in large part to the innovation, dedication and perseverance of men like Jim Cable and Herb Huang, RF technology based on SOI is now ubiquitous," said Carlos Mazure, Executive Director of the SOI Consortium. "Jim Cable drove the development of SOI and RF switches that are now in every cellphone, and Herb Huang has been a key contributor to SOI technology and a champion of the SOI foundry ecosystem here in China. We are happy and honored to recognize the contributions they have made to advancing RF SOI globally." Jim Cable joined pSemi (formerly Peregrine Semiconductor) in 1996 and held technical leadership roles before serving as CEO from 2002 to 2017. An early pioneer of SOI technology, Cable believed SOI would ultimately replace other technologies in the RF front end, and he pushed his team to innovate.

EMV 2020 in Cologne
news image
Full press release:
emv.mesago.com/press
  • Event News
  • 2019-09-18

Numerous companies will present their products and services in the field of electromagnetic compatibility at the EMV, which will take place in Cologne from 17 - 19 March 2020. The exhibition and conference are ideal platforms for product developers, users and scientists to network and exchange information on the latest developments in the industry. As from 2020, the EMV with its conference, which previously took place every two years in Dusseldorf will be held in Cologne. The Koelnmesse exhibition grounds will be hosting the event in hall 10.2 and the adjacent Congress Centre East, where all participants will benefit from ideal transport links, a restaurant integrated into the hall and short distances between the conference and the trade fair.

SMTconnect 2020 Offers Numerous Ways to Participate
news image
Full press release:
smt.mesago.com/press
  • Event News
  • 2019-09-18

Companies wishing to participate in the SMTconnect, the exhibition for microelectronic components and systems, taking place in Nuremberg from 5 – 7 May 2020, can choose from a variety of offerings. Almost eight months before the next SMTconnect, exhibitor registration is in full swing with more bookings than at the same time last year. When registering, companies can choose between participating with their own stand, a rental stand or one in the following special showcase areas. EMS Park – contract manufacturing in one place After a successful premiere of the EMS Park this year, this special showcase area for contract manufacturers and full-service providers will also be available in 2020. The EMS Park, designed for relaxed but efficient networking opportunities, allows companies to participate with their own stand or a stand package. The enticing catering and networking is the focal point of the area. At the Speakers' Corner, exhibitors have the opportunity to present their topics and solutions to trade visitors from various sectors, such as medical technology, automotive, industrial electronics and many more. "Participation as an exhibitor at the EMS Park was definitely a good investment for us. The discussions we had were very substantial and offer great potential. We were also able to take some new impulses with us," stated Dr. Lars Rebenklau, Groupmanager Systems Integration and Electronic Packaging, Fraunhofer Institute for Ceramic Technologies and Systems IKTS, on his participation in EMS Park 2019.

Regulator Combines Ultra-Low IQ with Fast Transient Response
news image
Full press release:
news.ti.com
  • Product Release
  • 2019-09-17

Texas Instruments introduced an ultra-low-power low-dropout (LDO) linear voltage regulator with the industry's lowest quiescent current (IQ) of sub-25 nA – one-tenth that of competing ultra-small devices. The new regulator features low IQ control at light loads even in dropout conditions, allowing engineers to at least double the battery life of their applications. In addition, it provides best-in-class transient response for faster wake-up, improving application response times and dynamic performance. The small solution footprint helps engineers design smaller, lighter, more efficient products quickly by reducing power-supply solution size, and its common industry packages allow for pin-to-pin drop-in replacement in existing designs. The TPS7A02 helps engineers solve critical design challenges in many power-sensitive, high-precision and low-power applications such as in the grid infrastructure, building automation, medical equipment and wearables markets. The device joins TI's portfolio of low-IQ LDO linear regulators that enable designers to prolong system life. By implementing the TPS7A02 with other ultra-low IQ devices – such as TI's family of ultra-low-power MSP430 microcontrollers (MCUs), the SimpleLink CC2642R MCU, the TLV8802 nanopower operational amplifier or the TMP1075 low-power temperature sensor – engineers can further optimize battery life and performance in their systems.

Improved Performance of 5G Devices
news image
Full press release:
heraeus.com/press
  • Industry News
  • 2019-09-17

As 5G devices are entering the market, the industry is looking for further improvements for future device generations. Heraeus' 5G solution portfolio will enable customers to not only reduce costs, but also to improve performance and quality of 5G. Heraeus has identified four top challenges which require innovative solutions: Challenge #1: Electromagnetic interference (EMI) - Heraeus has developed a one-stop-shop solution based on a specially formulated, particle-free silver ink, an ink-jet printer and curing equipment. Challenge #2: Miniaturization - Welco Solder Paste offers superior fine pitch printing performance due to its excellent rheological properties and thus enables smaller consumer devices – including 5G mobile phones. Challenge #3: Cost pressure - AgCoat Prime – a gold coated silver wire – offers a real alternative to gold wire for the memory device packaging in 5G technology. Challenge #4: High temperatures - Classical soldering processes reach their limits with these requirements. An alternative is sintering. Heraeus' mAgic silver sinter pastes increase the lifetime of devices up to ten times.

High Power TVS Diodes Protect Vulnerable Electronics
news image
Full press release:
littelfuse.com/news-releases
  • Product Release
  • 2019-09-17

Littelfuse, Inc. announced a series of higher surge TVS Diode products in a DO-214AB package. The 8.0SMDJ series is optimized to protect sensitive electronic equipment from transient voltage induced by lightning and other voltage events. Because it combines up to 8000W of peak pulse power dissipation in a compact DO-214AB SMC package, the 8.0SMDJ series offers circuit designers a high-surge, space-saving circuit protection solution that can simplify printed circuit board design and improve reliability significantly. "Compared to other market solutions currently available, the unidirectional and bidirectional 8.0SMDJ series TVS Diodes deliver higher surge protection in a small DO-214AB SMC package. It is ideal for DC12V, DC24V, and DC48V applications either by using single device or two in a series." said Meng Wang, Global Product Manager Power TVS at Littelfuse. "The combination of a high power TVS diode in a compact footprint means circuit designers can conserve precious board space for design optimization opportunities including increased power density and higher production efficiency."

Automotive-Grade Backlight LED Driver
news image
Full press release:
rohm.com/news
  • Product Release
  • 2019-09-17

ROHM announced the availability of the latest LED driver IC, the BD81A76EFV-M, optimized for LCD backlight in instrument cluster, center information displays and car navigation. Unlike conventional drivers with 4 channels that support LCDs up to 8", this IC provides 6 channels of output (with 120mA per channel) that can support LCD panels of up to 10-12" class. At the same time original buck-boost control ensures compatibility with both small and large LCDs using a single driver. This makes it possible to develop a common design of LCD control board suitable for conventional panels along with the latest large-size displays. In recent years, to improve both visibility and design in the automotive field, LCDs are being used in an increasing number of systems including instrument clusters, head-up displays and car navigation. In addition, larger screen sizes are being demanded. They require a greater number of high brightness LEDs for backlight as well as LED drivers featuring multi-channel operation and advanced dimming features that can prevent flicker effects. In response to this increasing market need, ROHM has leveraged its industry-leading analog design technology and incorporated proprietary technologies into its LED drivers to achieve flicker-free operation and to contribute to a common control board design. The BD81A76EFV-M also allows designers to use larger LCD panels in vehicle applications.


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Low-Temperature Alloy TechnologyIndium Corporation continues to innovate alloy tec...8423Product ReleaseLow-Temperature Alloy TechnologyIndium Corporation continues to innovate alloy technologies with a high-performance, high-reliability low-temperature alloy. Durafuse LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse LT provides a solution for heat-sensitive components and flex polymers, prevents thermal warpage of processor components and multilayer boards and meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications.21.11.2019 15:30:00Nov\images\news_2019-12-01_15.jpghttps://www.indium.com/people/marketing-communications/news-releases/indium-corp-announces-innovative-new-low-temp-alloy-techindium.com/news-releases
SiC Schottky Diode for DC Electric Vehicle ChargingCALY Technologies is very pleased to announce the ...8427Product ReleaseSiC Schottky Diode for DC Electric Vehicle ChargingCALY Technologies is very pleased to announce the release of a 25A, 1700V SiC Schottky Diode (KE17DJ25) ideally suited for high-efficiency power conversion applications, such as Electrical Vehicle (EV) charging applications, Industrial Power and Renewable Energy converters. The KE17DJ25 is commercially available in wafer, bare die and 2-lead TO-247 package, allowing designers to use the device in a broad range of configurations. The TO-247-2L package option make possible the use of 1700V devices in high-pollution environments, such as charging stations and solar inverters. CALY Technologies SiC Schottky diodes offer nearly zero reverse recovery and state-of-the-art forward voltage drop, leading to extremely low switching and conduction losses. This contributes to achieve higher efficiency systems, being faster, cooler, smaller and less costly than attainable with silicon (Si) devices. CALY Technologies offer wafers and bare die products with metallization compatible with top brazed connections (clips, power skins) as well as with standard wire bonding. Thanks to the very short lead time offered by CALY Technologies, KE17DJ25 devices can be used in new designs as well as drop in replacements of other commercially available 25A, 1700V SiC Schottky diodes.21.11.2019 09:30:00Nov\images\news_2019-12-01_11.pnghttps://caly-technologies.com/caly-technologies-add-25a-1700v-sic-schottky-diode-electric-vehicle-charging-solutions/caly-technologies.com/caly
Ultra-Low IR Schottky Barrier DiodesROHM recently announced the availability of 200V u...8421Product ReleaseUltra-Low IR Schottky Barrier DiodesROHM recently announced the availability of 200V ultra-low IR Schottky Barrier Diodes (SBD) optimized for automotive applications including powertrains and xEVs. The RBxx8BM/NS200 expands on the RBxx8 lineup of SBDs enabling high temperature operation that have already been proven in the automotive market in Japan. This series offers ultra-low leakage current (IR) characteristics to achieve high withstand voltage of 200V. Replacing Fast Recovery Diodes (FRD) and rectifier diodes typically used in vehicle systems with ROHM's new SBDs make it possible to improve forward voltage (VF) characteristics significantly (11% lower than conventional FRDs). This reduces application power losses and allows smaller package designs by reducing heat generation, contributing to greater space savings. In recent years, the technological trend in Drive Systems for 48V mild hybrids is mechanical integration, in which the motor and peripheral circuits are combined into a single module. This demands high efficiency and high voltage SBDs capable of stable operation at high temperatures. At the same time, higher voltage SBDs are required in systems utilizing conventional 150V components to increase functionality and reliability. ROHM has been offering the RBxx8 lineup of ultra-low IR SBDs that withstand up to 150V compatible with high temperature automotive environments. This latest series adds 200V models to meet the new automotive requirements.20.11.2019 17:30:00Nov\images\news_2019-12-01_17.jpghttps://www.rohm.com/news-detail?news-title=200v-ultra-low-ir-schottky-barrier-diodes&defaultGroupId=falserohm.com/news
Compact Resettable eFuse ICToshiba Electronics Europe announced their first e...8422Product ReleaseCompact Resettable eFuse ICToshiba Electronics Europe announced their first ever range of eFuse IC products. The range consists of six products in the TCKE8xx series that support various protection functions for power supply lines. Whereas conventional fuses perform a sacrificial function, physically breaking the electrical link to the circuit they are protecting, eFuses offer a resettable solution that additionally provide further protection features that a typical fuse cannot. This includes functions such as a highly accurate over-current limit, overvoltage protection, and over-temperature protection in addition to short-circuit protection. Compared to polymeric positive temperature coefficient (PPTC) devices that are also resettable, they react significantly faster, can be reset directly via an external logic signal, and retain their low on-resistance even after multiple trip events. The series is provided in three categories: no overvoltage protection, 5 V (VOVC = 6.04 V), and 12 V (VOVC = 15.1 V). Each overvoltage category is also offered in auto-retry or latched options as the response after a fault event. The status of the latch type is recovered by the application of an external signal, while the auto-retry is capable of re-enabling its output automatically. This provides developers with a choice of options to best suit their application's needs.20.11.2019 16:30:00Nov\images\news_2019-12-01_16.jpghttps://toshiba.semicon-storage.com/eu/company/news/2019/11/linear-20191120-1.htmltoshiba.semicon-storage.com/news
5G Network Test SolutionsRohde & Schwarz has licensed Qualcomm Technologies...8432Industry News5G Network Test SolutionsRohde & Schwarz has licensed Qualcomm Technologies' Interface Control Document for 5G, that describes the unique messages that come from the Snapdragon X55 5G Modem-RF System. For Rohde & Schwarz, access to these messages is critical to the development of test solutions such as QualiPoc, for example, that captures and analyses these messages for determining network quality and customer quality of experience. Any type of interaction between a mobile device and the mobile network requires hundreds, if not thousands, of unique messages that are sent back-and-forth that verify all aspects of a mobile phone call or data session. The quantity and complexity of messaging continues to increase as more features and capabilities are added. This trend will no doubt continue as the industry begins to migrate from 4G/LTE to 5G. Hans-Peter Bobst, CEO of Rohde & Schwarz SwissQual AG: "Having early and complete access to the Interface Control Document allows us to develop more comprehensive test solutions faster, providing our customers with what they need when they need it. Our customers can rest assured that any measurements they make with our test equipment is technically accurate and legally grounded."20.11.2019 15:00:00Nov\images\news_2019-12-01_6.jpghttps://www.rohde-schwarz.com/de/unternehmen/news-und-presse/all-news/pressemitteilungen-detailseite_229356-723200.html?rusprivacypolicy=0rohde-schwarz.com/news
Silicon Carbide Wafer Supply AgreementCree and STMicroelectronics announced the expansio...8435Industry NewsSilicon Carbide Wafer Supply AgreementCree and STMicroelectronics announced the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree's advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics over the next several years. The increased wafer supply enables the semiconductor leaders to address the rapidly growing demand for silicon carbide power devices globally, particularly in automotive and industrial applications. The adoption of silicon carbide-based power solutions is rapidly growing across the automotive market as the industry seeks to accelerate its move from internal combustion engines to electric vehicles, enabling greater system efficiencies that result in electric cars with longer range and faster charging, while reducing cost, lowering weight and conserving space. In the industrial market, silicon carbide modules enable smaller, lighter and more cost-effective inverters, converting energy more efficiently to unlock new clean energy applications.19.11.2019 07:00:00Nov\images\news_2019-12-01_3.pnghttps://www.st.com/content/st_com/en/about/media-center/press-item.html/c2928.htmlst.com/media-center
Partnership to Deliver Automotive and Industrial SolutionsCree and ABB's Power Grids business have announced...8437Industry NewsPartnership to Deliver Automotive and Industrial SolutionsCree and ABB's Power Grids business have announced a partnership to jointly expand the rollout of silicon carbide in the rapidly-growing high-power semiconductor market. The agreement incorporates the use of Cree's Wolfspeed silicon carbide-based semiconductors into ABB's comprehensive product portfolio, enabling Cree to broaden its customer base while accelerating ABB's entry into the fast-expanding EV sector. Cree's products will be included as part of ABB's power semiconductor product portfolio, across power grids, train and traction, industrial and e-mobility sectors. Specifically, Cree's industry-leading silicon carbide devices will be assembled into ABB power modules. "Cree is committed to leading the global semiconductor market's transition to more energy efficient, higher performing silicon carbidebased solutions. ABB has a longstanding heritage as the world market leader in industrial power electrification solutions, so expanding our work with them will help increase the adoption of transformative and eco-friendly alternatives in the power and automotive sectors," said Cree CEO Gregg Lowe. "Together, this partnership delivers Wolfspeed silicon carbide into new markets, such as power grids and high-speed trains for the continued advancement of the power, traction, industrial and EV markets." "The partnership with Cree supports ABB's strategy in developing energy-efficient silicon carbide semiconductors in the automotive and industrial sectors," said Rainer Käsmaier, Managing Director of Semiconductors at ABB's Power Grids business. "It emphasizes ABB's commitment to continuous technological innovation to shape the future of a smarter and greener society."18.11.2019 06:00:00Nov\images\news_2019-12-01_1.jpghttps://www.cree.com/news-events/news/article/cree-and-abb-announce-silicon-carbide-partnership-to-deliver-automotive-and-industrial-solutionscree.com/news
Strategic Partnership for Si - and SiC Power ModulesZF Friedrichshafen AG and Danfoss Silicon Power Gm...8430Industry NewsStrategic Partnership for Si - and SiC Power ModulesZF Friedrichshafen AG and Danfoss Silicon Power GmbH have stepped up their existing cooperation, with a new strategic partnership for silicon- and silicon-carbide power modules. The partners plan to improve the efficiency of electric drivelines by leveraging engineering and cost benefits at the interface between power modules and inverters. One of the first major milestones in this new initiative is a supply contract for Danfoss power modules destined for large-scale ZF volume production projects. Power modules are used in so-called power electronics, which serve as electronic controls for electrified drives. "We are proud to join this partnership with ZF. We believe this closer cooperation between Danfoss and ZF has the potential to be a game changer for the development and innovation of future drivetrains for electrification of vehicles. Together we can enable an acceleration of the transition of the transport sector," says Kim Fausing, President and CEO of the Danfoss Group. The partnership will see the two companies engage in joint research and development, with Danfoss also supplying power modules for silicon applications. Beside 400 Volt standard applications the two companies have also begun co-developing an 800 Volt Silicon Carbide power module for a large volume production project, aiming to position themselves at the forefront of this new segment. "This is a robust long-term partnership that enables ZF and Danfoss to pool their strengths. Coming together on this opens up significant innovation potential to improve the technical and commercial competitiveness of our inverters. We will utilize this advantage in all our drivetrain applications; from Hybrid- up to Full Electric Applications." explains Jörg Grotendorst, Head of ZF's E-Mobility Division. ZF's E-Mobility division supplies electric drive systems and components, while Danfoss Silicon power GmbH (DSP) is a specialist in silicon and silicon-carbide power modules. By joining forces to produce innovative open technology solutions for e-mobility drivelines, they aim to make a vital contribution to cutting vehicle emissions. In electric and hybrid vehicles, power modules control the efficiency of the energy supply to the drive, battery and onboard electronics. This means that the development of space-saving inverters and more efficient power modules is crucial to reducing emissions over the long term.14.11.2019 19:00:00Nov\images\news_2019-12-01_8.jpghttps://www.danfoss.com/en/about-danfoss/news/cf/zf-and-danfoss-seal-strategic-partnership/danfoss.com/news
Motion Tracking System VR Demo Kit Amfitech releases the Generation 2.0 of the Electr...8425Product ReleaseMotion Tracking System VR Demo Kit Amfitech releases the Generation 2.0 of the Electromagnetic Motion Tracking System – AmfiTrack - with built-in PREMO magnetic sensors. The new generation brings improvements in performance and use. The system includes several hardware and firmware updates. The users will be able to install updates of the system firmware by themselves. Amfitech will be releasing firmware updates which can be uploaded without having to return the kits for service.Several videos are available where real-time performance of the Generation 2.0 system is shown. AmfiTrack VR application demo: https://www.youtube.com/watch?v=xRy3sDUQD9w ; AmfiTrack 4 pcs Gen2 sensors in mating application: https://www.youtube.com/watch?v=uAZ3ZEZJc3Y&t=1s14.11.2019 11:30:00Nov\images\news_2019-12-01_13.pnghttps://www.grupopremo.com/content/247-the-revolution-in-the-positioning-and-tracking-system-with-6-degrees-of-freedomgrupopremo.com/content
Bernd Hops to Take Over as Head of Corporate CommunicationsFrom January 2020, Bernd Hops (46), currently Head...8436PeopleBernd Hops to Take Over as Head of Corporate CommunicationsFrom January 2020, Bernd Hops (46), currently Head of External Communications, will take over as Head of Communications and Public Authorities & Associations at Infineon Technologies. He will succeed Klaus Walther, who held this position from 2013. In this capacity, Mr. Hops will report to Chief Executive Officer Dr. Reinhard Ploss and have global responsibility for internal, external and political communication. "I am delighted that Bernd Hops is taking on this important and challenging task. He knows our company extremely well and has already made an important contribution to demonstrating Infineon's relevance for the economy and society. I wish him all the best and every success in his new role," says Dr. Reinhard Ploss, Chief Executive Officer of Infineon. "I personally thank Klaus Walther for his tireless commitment to sustainable enhancing our company's reputation. In the past years he has made a significant contribution with his strong strategic expertise and extensive network to positioning Infineon successfully in a challenging environment." Bernd Hops has held management positions within Corporate Communications at Infineon since 2013. The graduate of the Georg-von-Holtzbrinck School for Business Journalists previously worked, among other things, as an editor for the "Tagesspiegel" and "Financial Times Deutschland" newspapers and at the consulting firm Roland Berger Strategy Consultants.12.11.2019 18:00:00Nov\images\news_2019-12-01_2.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2019/INFXX201911-008.htmlinfineon.com/press-releases
DC-DC Converter in Conduction Cooled FormatPower System Technology announces the introduction...8424Product ReleaseDC-DC Converter in Conduction Cooled FormatPower System Technology announces the introduction of PST14X family, very high power density 320W DC-DC converter in conduction cooled format. In a very small package 160*50*25mm,with input voltage ranges of 9-50Vdc, 18-36Vdc, 16-50Vdc, PST14X incorporates EMI filtering, input active reverse polarity and transient protection, output protections, very robust mechanical package and connection, required in most of the severe environment for industrial, railways, defense type of applications. The converter provides high power density thanks to the integration of Vicor Corp. DCM modules, high efficiency (>90%), input-to-output isolation, soft start, overtemperature protection, input over/undervoltage lockout. The outputs are short-circuit proof. The 100°C baseplate operation allows operation in high temperature environment. The output can be configured in many different output voltages from 3,3V to 48Vdc, others possibilities are even possible as semi- standard versions. With the -MV option, the converter is protected against surges and transients MIL-STD-704 and MIL-STD-1275, EMI filtered built to meet MIL-STD 461 and ruggedizzed according MIL-STD-810.12.11.2019 12:30:00Nov\images\news_2019-12-01_14.pnghttp://www.powersystemtechnology.com/en/new-dc-dc-power-converter-pst14x/powersystemtechnology.com/news
Strategic Partnership with MycronicIndium Corporation and Mycronic have formed a stra...8434Industry NewsStrategic Partnership with MycronicIndium Corporation and Mycronic have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications. The partnership with Mycronic will expand Indium Corporation's portfolio of proven products designed to address evolving industry challenges. The collaboration will also ensure that new products are fully vetted and tested before users begin evaluations, testing, and ultimately high-volume production. "At Indium Corporation, we believe that materials science changes the world," said Ross Berntson, Indium Corporation President and Chief Operating Officer. "Through this partnership and by collaborating with Mycronic's engineers on our new PicoShot solder product offerings, we're able to bring to market new and innovative solder paste solutions to fit our customers' needs." Mycronic's MY700 platform is a leading technology for jet printing in the electronics industry, providing solutions to most production- related difficulties of applying solder paste. The solder paste coming out of this partnership will also be compatible with the previous-generation jet printer, MY600, and support existing Mycronic customers. "It is important for Mycronic to mutually develop solder paste solutions with key players like Indium Corporation," said Clemens Jargon, Vice President Global SMT at Mycronic. "This partnership will enable us to reach out to a much broader customer base all around the globe, and support them on enhanced jet printing applications."12.11.2019 08:00:00Nov\images\news_indium.jpghttps://www.indium.com/people/marketing-communications/news-releases/indium-corp-announces-strategic-partnership-with-mycronicindium.com/news-releases
Purchase of CUI Power AssetsBel Fuse Inc. announced that the Company has enter...8433Industry NewsPurchase of CUI Power AssetsBel Fuse Inc. announced that the Company has entered into an asset purchase agreement with CUI, in which CUI will sell the majority of its Power business to Bel for $32.0 million, plus the assumption of certain liabilities and subject to closing working capital adjustments. Based in Tualatin, Oregon, the CUI Power Business, a division of CUI Global Inc., had TTM sales of approximately $37 million with products and distribution that offer strong opportunities for growth. Daniel Bernstein, CEO of Bel, said, "The CUI Power Business' extensive product portfolio and distribution channel fits squarely within our growth strategy. Their product portfolio will round out Bel's current Power Products offering, allowing us to better address all our customer power needs. In addition, we look forward to utilizing CUI's success with the electronic catalog distributors throughout the Bel\Cinch product groups and capitalizing on CUI's enviable strong relationship with these distributors. Electronic Catalog Distributors are playing a vital role in demand creation, and over the past four years this segment has been our fastest growing business. The combination of Bel and the CUI Power Business will substantially strengthen our Power Group and unite complementary capabilities, sales channels and customer relationships." The all-cash transaction is expected to close in the fourth quarter of 2019, and will be funded with available cash on hand, some or all of which may be sourced from our revolving credit facility.11.11.2019 10:00:00Nov\images\news_cui.pnghttps://www.belfuse.com/news-detail/bel-announces-agreement-to-purchase-cui-power-assetsbelfuse.com/news
High Isolation Automotive TransformerMORNSUN launched an automotive transformer, the CT...8429Product ReleaseHigh Isolation Automotive TransformerMORNSUN launched an automotive transformer, the CTTH0505-1T. This compact size transformer has an isolation voltage of up to 6000VDC, and all components meet AEC-Q200 standard. From design, verification to production processes, this device is completely in accordance with IATF16949 system requirements. In addition, the CTTH0505-1T transformer can be used with MORNSUN SCM1201 fixed input push-pull controller IC to supply power for the secondary side of an isolated data interface such as RS232, RS485 or CAN bus. It's designed for pure digital circuit, analog acquisition circuit, data exchange circuit.08.11.2019 07:30:00Nov\images\news_2019-12-01_9.jpghttps://www.mornsun-power.com/html/about/content/1800664.htmlmornsun-power.com/about
Surface-Mount Fully Integrated Current SensorsAllegro MicroSystems announced significant ease-of...8428Product ReleaseSurface-Mount Fully Integrated Current SensorsAllegro MicroSystems announced significant ease-of-use enhancements to its popular high current fully integrated ACS772/3 current sensor "CB" package family. These automotive grade high voltage isolation current sensors already provide economical and precise solutions for both AC and DC current sensing up to 400A. Building on that leadership and deep customer-understanding, Allegro's surface-mount leadform option for the CB package is the answer to many customer challenges by providing a flexible solution for space constrained applications. "This is a classic, 'You asked – we listened.'  innovation with purpose moment for us," explains Shaun Milano, Business Unit Director for Current Sensors. "Our customers want flexibility, and we're excited to provide these innovative, robust solutions in this new surface-mount option to complement our highly popular through-hole version. High current PCB designs improve power density and efficiency and this surface-mount option allows customers to realize these advantages with a simpler manufacturing process." The ACS772/3 family of current sensor ICs has an enhanced feature set that helps engineers simplify their bill of materials and improve efficiency in the toughest of applications.07.11.2019 08:30:00Nov\images\news_2019-12-01_10.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2019/acs77x-smt-press-releaseallegromicro.com/news-room
Trench Schottky with Multilayer VaristorsThe TSUPxM45SH & TSUPxM60SH Schottky rectifiers of...8395Product ReleaseTrench Schottky with Multilayer VaristorsThe TSUPxM45SH & TSUPxM60SH Schottky rectifiers offer low leakage current and low forward voltage drop. The series devices are optimized for the automotive applications with low power loss, high efficiency – maximum leakage current is only 20mA at high temperature operation. The series devices include 5A/10A/15A forward current and maximum VRRM is 45V/60V. All these capabilities are packed into SMPC4.6U (TO-277A compatible) package. This is a wettable flank package, it enhances the solder joint and AOI testability. It is also low profile with typical height of 1.1mm, RoHS compliant and halogen free. The series devices include 5A/10A/15A forward current and maximum VRRM is 45V/60V. All these capabilities are packed into SMPC4.6U (TO-277A compatible) package. 06.11.2019 20:30:00Nov\images\news_2019-11-15_26.pnghttps://www.taiwansemi.com/en/news/newsletter/tj175-smpc4-6u-trench-schottky-45v-60v-with-aec-q101-qualifiedtaiwansemi.com/news
Synchronous DC/DC Buck RegulatorAlpha and Omega Semiconductor introduced AOZ6682CI...8426Product ReleaseSynchronous DC/DC Buck RegulatorAlpha and Omega Semiconductor introduced AOZ6682CI and AOZ6683CI. These devices are high efficiency, simple-to-use synchronous buck regulators. The AOZ6682CI and AOZ6683CI are both available in an ultra-thin, thermally enhanced TSOT23-6 package and deliver 2A and 3A output current, respectively. The new devices offer high efficiency over the full load range, allowing greener power conversion for a variety of consumer electronics applications such as LCD TVs, set-top boxes, high definition Blu-rayTM Disc Players and Networking terminals. The new devices incorporate a low resistance synchronous buck power stage that enables up to 95% efficiency. Combined with a thermally enhanced package, the AOZ6682CI and AOZ6683CI achieve 10°C cooler operation at full load compared to similar competing devices. Under heavy load conditions, the devices operate in a fixed frequency continuous-conduction mode (CCM). At light loads or in standby mode, the devices employ a proprietary pulse energy mode (PEM) control scheme. This control scheme and low quiescent current of 200uA, allows the buck converter design to achieve industry-leading efficiencies of 89% at light loads. "Modern consumer equipment must achieve less than 0.5W in standby power consumption and this is a tough problem for system designers to solve," said Kenny Hu, Power IC Marketing Manager at AOS. "The newest 2A and 3A additions to the EZBuck family simplify this task, offering up to 6% improved efficiency compared to competing devices thanks to low quiescent current and a proprietary power-saving light load control scheme."06.11.2019 10:30:00Nov\images\news_2019-12-01_12.jpghttp://www.aosmd.com/res/news/news-article-1573068880289/AOZ6682-83CI_PR.pdfaosmd.com/news
Registration Now Open for APEC 2020 Registration for the 35th Annual Applied Power Ele...8416Event NewsRegistration Now Open for APEC 2020 Registration for the 35th Annual Applied Power Electronics Conference –APEC 2020– is now open. The conference and exhibition, running March 15-19 at the New Orleans Ernest N. Morial Convention Center, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronic engineer. Outstanding technical content, including Technical Program Papers, Industry Sessions and Professional Education Seminars, is offered at one of the lowest registration costs of any IEEE conference. APEC 2020 promises to provide attendees with a truly significant professional experience. Complete details for registering and hotel booking can be found at http://www.apec-conf.org/conference/registration. APEC has secured discounted rates at eight hotels near the New Orleans Convention Center. Attendees are encouraged to secure their hotel reservations early, as these hotels are expected to book up well in advance of the conference. Hotel reservations can only be made following conference registration. Links to APEC’s contracted hotels will be sent via an automatic registration confirmation email. For more details, please visit the Travel Information page.06.11.2019 10:00:00Nov\images\news_apec.jpghttps://apec-conf.org/news/registration-now-open-for-apec-2020-in-new-orleans-march-15-19apec-conf.org/news
Automotive Chip Bead Inductor TAIYO YUDEN has announced the mass-production of t...8394Product ReleaseAutomotive Chip Bead Inductor TAIYO YUDEN has announced the mass-production of the AEC-Q200 (reliability qualification test standard for automotive passive components) qualified noise suppression component, power chip bead inductor FB Series Type T, FB TH1608 (1.6×0.8×0.8 mm). This product is a noise suppression component for power lines used in powertrains and other automotive components such as engines and transmissions, as well as communications infrastructure devices such as servers and base station communication devices. Based on our unique internal structure and sophisticated material technology an  structural design, FB Series Type T has achieved an operating temperature of 150°C and is suitable for wideband noise suppression up to GHz frequencies. Commercial production of this product started in September 2019 at our overseas subsidiary TAIYO YUDEN (PHILIPPINES), INC. (Lapulapu City, Cebu, Philippines) at a rate of 10 million units per month.05.11.2019 21:30:00Nov\images\news_2019-11-15_27.pnghttps://www.pressebox.de/pressemitteilung/taiyo-yuden-europe-gmbh/TAIYO-YUDEN-Launched-Automotive-Chip-Bead-Inductor-with-an-Operating-Temperature-of-up-to-150C/boxid/980151press/taiyo-yuden-europe
ISO 9001:2015 Certification ReceivedGaN Systems announced that the company received In...8412Industry NewsISO 9001:2015 Certification ReceivedGaN Systems announced that the company received International Organization for Standardization (ISO) 9001:2015 certification for the design and manufacture of power semiconductor products. Both GaN Systems’ Canadian headquarters and Taiwanese operations facilities received ISO certification from the British Standards Institute (BSI), the world's first national standards body and one of the largest. The certification represents third-party validation of the company’s strong commitment to providing high-quality products and services that align with the standards of excellence required by major multinational customers. The ISO 9000 family of standards is designed to ensure that GaN Systems meets the needs of customers and other stakeholders via its quality management systems (QMS) while meeting and exceeding qualification requirements for its Joint Electron Device Engineering Council (JEDEC) and Automotive Electronics Council (AEC-Q101) qualified GaN power transistor products. ISO 9001 is considered the leading standard for quality management systems and performance worldwide. The ISO 9001:2015 standard is the most recent version with significant enhancements since the last ISO 9001:2008 update. “The ISO 9001:2015 revision demands a higher degree of leadership and management commitment than the previous standards. This commitment is consistent with our mission to be the place designers can go to realize all the system benefits of GaN in their power conversion applications,” said Jim Witham, CEO of GaN Systems. 05.11.2019 14:00:00Nov\images\news_2019-11-15_9.jpghttps://gansystems.com/newsroom/gan-systems-receives-iso-90012015-certification/gansystems.com/newsroom
Strategic Partnership to Create Electric DrivelinesZF Friedrichshafen AG and Cree announce a strategi...8413Industry NewsStrategic Partnership to Create Electric DrivelinesZF Friedrichshafen AG and Cree announce a strategic partnership to create industry-leading, highly efficient electric drivelines. With this strategic partnership, ZF and Cree are intensifying their existing cooperation. “We’re delighted that we're building on our cooperation with Cree using their Wolfspeed silicon carbide technology and are absolutely convinced that combining our strengths will further improve efficiency and competitive edge for our components and systems,” says Jörg Grotendorst, Head of the ZF E-Mobility Division. The future use of silicon carbide-based power semiconductors will increase the range for electric vehicles in contrast to today's standard silicon technology. Due to high battery costs, the efficient electric drive represents an enormous growth potential for the foreseeable future. In particular, silicon carbide technology in conjunction with the 800-volt vehicle electrical system voltage makes a significant contribution to further increasing efficiency. “Partnering with a tier-one leading global automotive supplier like ZF for the use of silicon carbide-based power inverters in next generation electric vehicles is indicative of the integral role silicon carbide plays in extending the capabilities of EVs everywhere,” said Gregg Lowe, CEO of Cree. Electrified drivelines are making vast contributions to achieving worldwide emission targets and making mobility more sustainable. Cree’s technology will initially be used to fulfill orders that ZF has already received for silicon carbide based electric drives from several leading global automakers. Through the partnership, ZF expects to make silicon carbide electric drivelines available to the market by 2022.05.11.2019 13:00:00Nov\images\news_2019-11-15_8.jpghttps://www.cree.com/news-events/news/article/zf-and-cree-advance-the-electric-drivecree.com/news
Expert to Present at EPTCIndium Corporation’s Kenneth Thum, Senior Technica...8414PeopleExpert to Present at EPTCIndium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging. Thum will present Soldering Material Evolution for Heterogeneous Integration, which outlines trends in soldering material technology for heterogeneous integration, including solder paste, and flip-chip and ball-attach fluxes. Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelor’s degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.05.11.2019 12:00:00Nov\images\news_2019-11-15_7.jpghttps://www.indium.com/people/marketing-communications/news-releases/indium-corp-expert-to-present-at-eptcindium.com/news-releases
European Sales Director Thorsten ScheidlerPalomar Technologies announced that Thorsten Schei...8420PeopleEuropean Sales Director Thorsten ScheidlerPalomar Technologies announced that Thorsten Scheidler has joined SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, as SST Sales Director Europe. Mr. Scheidler has over 15 years of sales and technical support experience within the power electronics and semiconductor industries in Europe. His primary responsibilities will be in implementing sales strategies to achieve the company’s global sales objectives, with a focus on the in ever growing power electronics market. “Thorsten Scheidler has extensive experience in backend processes for the Power and Automotive Electronics and his experience is aligned with SST’s growth objectives in these markets. We are very excited to have Thorsten join the SST sales team,” said Rich Hueners, Vice President of Sales & Marketing, Palomar Technologies. Prior to joining SST, Mr. Scheidler served as Key Account Manager Europe for Kulicke & Soffa Germany GmbH.05.11.2019 06:00:00Nov\images\news_2019-11-15_1.jpghttps://www.palomartechnologies.com/news-room/press-releases/sst-vacuum-reflow-systems-a-palomar-solution-hires-thorsten-scheidler-as-new-european-sales-directorpalomartechnologies.com/news-room
Power Line EMC Filter Family for Lighting EquipmentSchaffner introduces a single-phase EMC filter. Wi...8406Product ReleasePower Line EMC Filter Family for Lighting EquipmentSchaffner introduces a single-phase EMC filter. With a 350 VAC rating, the filter can be used in typical single-phase applications (120 VAC and 230 VAC). Or industrial applications when utilizing phase to neutral voltage off three phase power. Example: 480 VAC P-P / 277 VAC P-N and 600 VAC P-P / 347VAC P-N. The parts are very compact and are designed specifically for lighting applications with enhanced EMC performance at target frequencies along with an extended operational temperature range. The filters have all the required safety approvals (UL, CSA, ENEC and CQC) and are compliant to REACH and RoHS directives.04.11.2019 09:30:00Nov\images\news_2019-11-15_15.tifhttps://www.schaffner.com/media/news/details/article/fn-2580-power-line-filter-family-for-lighting-equipment-a-compact-application-specific-line-filte/schaffner.com/news
100WActive PFC Enclosed Switching Power Supply MORNSUN released an enclosed switching power suppl...8409Product Release100WActive PFC Enclosed Switching Power Supply MORNSUN released an enclosed switching power supply series LMF100-20Bxx with active PFC (Power factor correction). The LMF100-20Bxx series features universal input voltage range of 85-264Vac, accepts AC or DC input and the PF (Power factor) is up to 0.98. In addition, its emissions meet CISPR32 CLASS B without extra components. The series also meets IEC/EN/UL62368, EN60335, GB4943 safety standards. Protections of output short circuit, over-current, over-voltage, over-temperature are included. MTBF is more than 300,000 h and the dimension is 10% smaller than conventional products, which make this series ideal for industrial, civil, smart home, smart building applications. It’s widely used in applications of industrial automation machinery, industrial control system, mechanical and electrical equipment, instrumentation, intelligent building, household appliance, etc.04.11.2019 06:30:00Nov\images\news_2019-11-15_12.jpghttps://www.mornsun-power.com/html/about/NewsCenter.htmlmornsun-power.com/news-center
Acquiring Chengdu OK New Energy, Ltd.AVX Corporation announced that it has completed th...8410Industry NewsAcquiring Chengdu OK New Energy, Ltd.AVX Corporation announced that it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE). After four years of strong collaborative efforts between COKNE and AVX on the manufacturing and development of supercapacitors, AVX is delighted to complete the full vertical integration under the AVX umbrella. During the announcement, Chief Operating Officer Jeff Schmersal stated, “The COKNE team has been instrumental in the co-development of AVX’s low ESR cylindrical SuperCap series. We look forward to a long and prosperous relationship, with continual dedication toward further supercap advancements”. The vertical acquisition further demonstrates AVX’s strong commitment to supercapacitor technology, used in markets such as Industrial, Medical, Automotive, IoT, and Alternative Energy. AVX is a leading worldwide manufacturer, supplier, and reseller of a broad line of electronic components and interconnect, sensing and control devices and related products. AVX’s components can be found in products manufactured in a very broad range of industries worldwide. 01.11.2019 16:00:00Nov\images\news_avx.jpghttp://www.avx.com/press-releases/avx-acquires-chengdu-ok-new-energy-ltd/avx.com/press-releases
Support for the Development of Battery Maintenance Free IoT EquipmentRenesas Electronics introduced its RE Family, whic...8407Product ReleaseSupport for the Development of Battery Maintenance Free IoT EquipmentRenesas Electronics introduced its RE Family, which encompasses the company’s current and future lineup of energy harvesting embedded controllers. The RE Family is based on Renesas’ proprietary SOTB™ (Silicon on Thin Buried Oxide) process technology, which dramatically reduces power consumption in both the active and standby states, eliminating the need for battery replacement or recharging. Following the mass production of the RE01 Group (formerly known as the R7F0E embedded controllers), the first of the RE Family, the new RE01 Group Evaluation Kit was launched, which allows users working with the RE01 Group of devices to jump start system evaluations for energy harvesting applications. "Energy harvesting eliminates the labor and costs associated with battery maintenance and is a key solution contributing to environmental conservation," said Hiroto Nitta, Senior Vice President, Head of SoC Business, IoT and Infrastructure Business Unit at Renesas. "I am extremely pleased that Renesas’ technology innovation with SOTB has enabled these alternative energy solutions, and with the new RE01 Evaluation Kit, Renesas will be making it possible for engineers around the world to quickly start the evaluation. We hope this will accelerate the spread of IoT equipment powered by energy harvesting."31.10.2019 08:30:00Oct\images\news_2019-11-15_14.jpghttps://www.renesas.com/eu/en/about/press-center/news/2019/news20191031.htmlrenesas.com/press-center
Tamper-Resistant ReceptaclesSCHURTER’s latest series of appliance outlets NR02...8402Product ReleaseTamper-Resistant ReceptaclesSCHURTER’s latest series of appliance outlets NR020 and NR021 combine classic features with new ones to meet increased fire protection and safety standards according to UL 498 Tamper Resistant, as well as facilitating compliance of receptacles used in Household and Commercial Furniture and Furniture Power Distribution Units (FPDUs), according to UL 962 and UL 962A. Higher temperature ratings and added configurations for series NR010 and NR020 respond to power demands facing Datacom infrastructures today. SCHURTER’s NR021 NEMA 5-15R Tamper Resistant series meets the expanded code requirements according to UL 498. Additionally, with the option of an added insulated wall between the L, N terminals, compliance with the Spill Test, outlined in UL 962 Sec. 62, is more cost effective and efficient for manufacturers of Household and Commercial Furniture and Furniture Power Distribution Units (FPDUs). Packing density of equipment for data communication and storage continues to be regularly revolutionized with the surge of usage and functionality. Increasing ambient temperatures go hand in hand with these advancements, as demand trickles down to the smallest components to keep pace with emerging needs of the appliance manufacturers. The NR010 and NR020 series have an operating temperature range of -25 °C to 150 °C in response to the power needs of the Datacom industry. In addition, the NR010 with IDC terminals provides a version with an independent L terminal. The neutral and ground terminals can still be bussed, while the line terminal can be used for maximum load according to UL rating 15 A, 125 V. It also extends the capability of adding functionality to each outlet individually.30.10.2019 15:45:00Oct\images\news_2019-11-15_19.jpghttps://www.schurter.com/Newsroom/Timeline/NEMA-Receptacles-5-15Rschurter.com/newsroom
Power Electronics Moscow 2019To stay relevant on the modern fast-paced market, ...8415Industry NewsPower Electronics Moscow 2019To stay relevant on the modern fast-paced market, it is essential for every company to monitor the latest trends and offer its customers competitive products and technologies. To achieve it, Proton-Electrotex participates in the most significant global events. Proton-Electrotex took part in 16th International exhibition of power electronics components and modules – Power Electronics 2019. The exhibition was held in Crocus Expo, Moscow on 22-24 of October. Proton-Electrotex traditionally presents its latest research and new products there. Besides, specialists of the company showcase samples of existing portfolio already known to customers. Besides, researchers of the company were presenting few reports: T. Fedorov. New technology Engineer: «WEB version of the software for calculation IGBT power converters» and D. Malyy. Lead Research Engineer: «Fast hybrid IGBT modules – an alternative to SiC MOSFET in modern energy efficient mid-power converters» and «Ensuring quality of IGBT modules made by Proton-Electrotex at design and production stages». The exhibition was held in a comfortable and working atmosphere. Representatives of Proton-Electrotex held few discussions with their clients and international colleagues. We will be happy to provide more information on our products, please send your questions to email marketing@proton-electrotex.com. Photo and video report will be published soon in social networks of Proton-Electrotex and official website.30.10.2019 11:00:00Oct\images\news_2019-11-15_6.jpghttps://en.proton-electrotex.com/news/proshla-vystavka-silovaya-elektronika-2019proton-electrotex.com/news
SP-Cap Conductive Polymer-Aluminum-Electrolytic-Capacitors Panasonic Industry Europe has added a long-life su...8393Product ReleaseSP-Cap Conductive Polymer-Aluminum-Electrolytic-Capacitors Panasonic Industry Europe has added a long-life surface mount type series to its industry-leading product line of SP-Cap Conductive Polymer-Aluminum-Electrolytic capacitors. Available with a rated voltage of 2.0VDC or 2.5VDC, GY capacitors benefit from huge capacitance values (680µF up to 820µF) and a very low ESR characteristics (3mO max.) which is unique in the market. The components are able to withstand +105°C for up to 2.000 hours making them ideal for use in demanding applications. Also with the high ripple current of only 10.200 mA r.m.s. maximum, the new GY capacitor series is a perfect component for power circuits in servers, base stations as well as further industrial applications. As all SP-Cap range capacitors, the GY series devices feature excellent noise reduction capability and frequency characteristics, a long life span and their ESR values have little change even at low temperatures since the electrolyte is solid. The components are RoHS compliant and halogen free.29.10.2019 22:30:00Oct\images\news_2019-11-15_28.jpghttps://industrial.panasonic.com/ww/products/capacitors/polymer-capacitors/sp-cap/gy?utm_source=pr&utm_medium=referral&utm_campaign=201910-gy-prindustrial.panasonic.com/capacitors
Expanding its Portfolio with Industrial-Grade Devices Infineon Technologies broadens its CoolGaN TM seri...8405Product ReleaseExpanding its Portfolio with Industrial-Grade Devices Infineon Technologies broadens its CoolGaN TM series with two devices. The CoolGaN 400 V device (IGT40R070D1 E8220) is tailored for premium HiFi audio systems where end users demand every detail of their high resolution sound tracks. These have been conventionally addressed by bulky linear or tube amplifiers. With the CoolGaN 400 V switch as class D output stage, audio designers are able to deliver excellent listening experience to their prospective audio fans. The CoolGaN 600 V industrial-grade device (IGLD60R190D1) enables performance and cost optimization for low- and mid-power applications, such as in the area of low-power SMPS and telecom rectifiers. Every product within the Infineon CoolGaN family meets JEDEC standards. Infineon’s CoolGaN 600 V portfolio is now also extended with a new 190 m?, industrial-grade HEMT. This product was developed to fit any consumer and industrial application on an optimized cost with the aim to lower the technology entry barrier. Easy design-in is supported with a standardized DFN 8x8 packaging and the matching driver ICs from the GaN EiceDRIVER™ series.29.10.2019 10:30:00Oct\images\news_2019-11-15_16.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2019/INFPMM201910-004.htmlinfineon.com/market-news
Marco Palma Joins as Senior FAE Manager To support its accelerating design activity, and t...8417PeopleMarco Palma Joins as Senior FAE Manager To support its accelerating design activity, and to provide local technical support to EPC’s customers in Europe, Efficient Power Conversion Corporation (EPC) is proud to announce that Marco Palma, a seasoned expert, has joined the EPC technical leadership team as Senior FAE Manager for Europe. Based in Turin, Italy, Marco brings over 20 years of field experience within the semiconductor industry working with customers to define innovative solutions to meet the unique challenges of each customer design. His primary responsibilities at EPC involve direct collaboration with customers throughout Europe to create and implement technical solutions to meet their design challenges. “Marco Palma is an electronics engineer with extensive experience in assisting customers to implement leading edge power semiconductor solutions in industrial and automation markets,” said Nick Cataldo, senior vice president of global sales and marketing. Marco joins EPC from Infineon, where he was Director, Technical Marketing and Applications. Marco has held senior technical leadership positions with a strong focus on customer support and product definition. “I am very excited to have the opportunity to work with the EPC. I look forward to working with customers to incorporate EPC’s leading-edge gallium nitride FETs and integrated circuits into their products,” commented Marco on his appointment.29.10.2019 09:00:00Oct\images\news_2019-11-15_4.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2903/Marco-Palma-Joins-Efficient-Power-Conversion-EPC-as-Senior-FAE-Manager-for-Europe.aspxepc-co.com/news
Topnotch Conferences to Provide Founded Insights From the 23rd to the 25th of June, 2020, the SENSO...8411Event NewsTopnotch Conferences to Provide Founded Insights From the 23rd to the 25th of June, 2020, the SENSOR+TEST – the leading international trade fair for sensor, measurement, and testing technology – will be accompanied again by two first-rate conferences: The SMSI 2020 – the Sensor and Measurement Science International, is to be held for the first time, while the ettc2020, the European Test and Telemetry Conference, is to be held for the fourth time in Nuremberg. Members of enterprises and institutes can start to submit their contributions as of today. “The success story of the scientific conferences in the area of sensor and measuring technology parallel to the SENSOR+TEST goes back to over 30 years. However, with this new format, we’re going to advance this success to a worldwide and scientifically leading event with our partners from industry and research as well as with the national and international measurement institutes,” says Holger Bödeker, the organizer of the SENSOR+TEST, regarding the new format. Interested authors, developers, researchers, and other scientists have the opportunity to submit their contributions until 31 January 2020 at www.smsi-conference.com/call-for-papers.28.10.2019 15:00:00Oct\images\news_2019-11-15_10.jpghttps://www.sensor-test.de/press/welcome-to-the-sensor-test-press-center/press-releases/sensor-test-2020-topnotch-conferences-to-provide-founded-insights-into-sensors-and-measurement-futuresensor-test.de/press
PCIM Asia is Calling for PapersPCIM Asia, sister event of PCIM Europe in Nurember...8418Event NewsPCIM Asia is Calling for PapersPCIM Asia, sister event of PCIM Europe in Nuremberg, Germany, offers unique opportunities to one of the fastest growing markets for power electronics. Held in parallel with the exhibition is the PCIM Asia Conference, one of the most important and influential conferences for power electronics in Asia. Now it is calling professionals from industry and academia to submit their abstracts before 31 December 2019, to present their latest research in technological trends and applications in the Asian power electronics industry in front of over 500 experts.28.10.2019 08:00:00Oct\images\news_2019-11-15_3.jpghttps://pcimasia-expo.cn.messefrankfurt.com/content/dam/messefrankfurt-redaktion/pcim_asia/download/pac2020/pcim20%20call%20for%20paper%20eng.pdfpcimasia-expo.cn
Acquisition of Chinese EV Charging ProviderABB is to acquire a majority stake of 67 percent i...8419Industry NewsAcquisition of Chinese EV Charging ProviderABB is to acquire a majority stake of 67 percent in Shanghai Chargedot New Energy Technology Co., Ltd. (“Chargedot”), a leading Chinese e-mobility solution provider. The transaction is expected to be completed in the coming months and ABB has the possibility to increase its stake further in the next three years. Since its establishment in 2009, Shanghai-based Chargedot has made a significant contribution to the uptake of electric vehicles in China. The company supplies AC and DC charging stations, as well as the necessary software platform to a range of customers that includes EV manufacturers, EV charging network operators and real estate developers. It has approximately 185 employees and its other shareholders among others include Shanghai SAIC Anyo Charging Technology Co., Ltd., a subsidiary of SAIC. Chargedot is a natural fit for ABB, which as a global leader in sustainable transportation infrastructure, already offers solutions from grid distribution to charging points for cars and trucks, as well as for the electrification of ships, railways, trams, buses and cable cars. The acquisition will strengthen ABB’s relationship with leading Chinese electric vehicle manufacturers and broaden the company’s e-mobility portfolio with hardware and software developed specifically for local requirements. ABB Robotics is the leading supplier of robot units and software to the assembly lines of Chinese EV manufacturers. “This investment is a further demonstration of ABB’s commitment to enabling sustainable mobility,” said Tarak Mehta, President of ABB's Electrification business. 28.10.2019 07:00:00Oct\images\news_2019-11-15_2.jpghttps://new.abb.com/news/detail/40818/abb-to-strengthen-e-mobility-portfolio-with-acquisition-of-chinese-ev-charging-provider-chargedotnew.abb.com
Key to Success of Digital CompaniesAlexander Gerfer, CTO of the Würth Elektronik eiSo...8364Industry NewsKey to Success of Digital CompaniesAlexander Gerfer, CTO of the Würth Elektronik eiSos Group, at one of the most important digital future conferences worldwide, the DLD Tel Aviv, emphasized in his opening speech "when technology meets customer" design support of hardware and the availability of components can decide on the failure or success of innovation. In his speech, Gerfer stressed the importance of an innovative hardware partner for the success of digital companies: "Würth Elektronik is not just a hardware supplier, we rather see ourselves as our customers' real partner. We know them and their needs thoroughly and focus our product development on them. 'Can't' is not part of our vocabulary. If there is still no solution to a particular challenge, then we'll invent one. This is the reason why Würth Elektronik, as an innovative technology company, is behind many successes, albeit invisibly ... the 'secret ingredient of industry' as it were. There are plenty of examples of customer-driven innovations from Würth Elektronik, including REDEXPERT, an online platform developed in-house that has become known worldwide as the most precise option for AC loss calculation in switch mode power supplies. Another area to improve the CO2 footprint is 'Horticulture Farming'. Through its cooperation with the Technical University of Munich, Würth Elektronik supports users with practice-relevant data for the selection of the best Horticulture LEDs, adapted to the respective plant species.25.10.2019 15:00:00Oct\images\news_2019-10-15_3.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_112124.phpwe-online.com/news
High Energy-Density Thin-Film BatteryThere has been great progress in miniaturizing ele...8381Industry NewsHigh Energy-Density Thin-Film BatteryThere has been great progress in miniaturizing electronics but the miniaturization of power sources hasn't kept pace. Although integrated electrochemical capacitors offer high power density, high frequency response and novel form factors, their low energy densities are of limited value for MEMS and autonomous device applications that require long periods between charging. CEA-Leti researchers will discuss a thin-film battery with the highest areal energy density yet reported (890 µAh/cm-2) and high power density (450 µAh/cm-2). Built on silicon wafers using UV photolithography and etching for the successive deposition and patterning of each layer, the thin-film battery integrates a 20µm-thick LiCoO2 cathode in a Li-free anode configuration. It showed good cycling behavior over 100 cycles, and the fact it was built using a wafer-level process opens up the possibility to tightly integrate this battery technology with future electronic devices. ("Millimeter-Scale Thin-Film Batteries for Integrated High Energy-Density Storage," S. Oukassi et al., CEA-Leti)23.10.2019 17:17:00Oct\images\news_2019-11-01_12.jpghttp://www.leti-cea.com/cea-tech/leti/englishleti-cea.com/cea-tech
Open Frame Power Supplies for Industrial ApplicationsCosel announced a series of open frame compact pow...8369Product ReleaseOpen Frame Power Supplies for Industrial ApplicationsCosel announced a series of open frame compact power supplies that are EN62477-1 OVC III certified for demanding industrial applications. Benefiting from the latest power switching technologies, the LHA150F is 30% smaller and gains up to 4.5 efficiency points compared to the previous LFA150F, whilst the more powerful LHA300F gains up to 6 points of efficiency and is 50% smaller than the LFA300F. In addition to higher efficiency, by using an LLC resonant topology and an active filter, noise and ripple levels have been reduced. Designed for use in a wide range of applications, the LHA150F and LHA300F offer a wide temperature range from -10 to +70 degrees C. The power supplies are UL/EN62368-1 certified. With the increased levels of systems integration, factory automation requires more compact power supplies able to work with the highest levels of safety in a variety of environments. Meeting the Over Voltage Category level III (OVCIII) specified in the EN62477-1, Cosel's LHA150F and LHA300F offer system designers a simple and easy to use AC/DC power supply that complies with the high isolation levels needed in order to connect their equipment to the facility distribution panel without the need for an additional isolation transformer. Designed for worldwide applications, the LHA150F and LHA300F have an input voltage range of 85VAC to 264VAC single phase and conform to the safety standards input voltage range of 100-240VAC (50/60Hz).23.10.2019 14:14:00Oct\images\news_2019-11-01_24.jpghttps://www.prbx.com/2019/10/cosel-announces-low-profile-open-frame-ovc-iii-certified-power-supplies-for-industrial-applications/prbx.com
Up to 90 Watts of Power Over Ethernet Wiring As the industry adopts the latest generation of Po...8404Product ReleaseUp to 90 Watts of Power Over Ethernet Wiring As the industry adopts the latest generation of PoE technology for managing data and power over a single Ethernet cable, users face the challenge of making pre-standard powered devices (PDs) work alongside new IEEE® 802.3bt-2018-compliant PDs in an existing Ethernet infrastructure. Microchip Technology has eased the transition with IEEE 802.3bt-2018-compliant PoE injectors and midspans for users and power sourcing equipment (PSE) chipsets for system developers that enable both pre-standard and IEEE-compliant PDs to receive up to 90W of power without changing switches or cabling. “As both a system and chipset supplier that has contributed to IEEE 802.3bt-2018 and all major standards leading up to it, we are ideally positioned to provide an easy migration path for meeting 30W to 90W device powering needs with plug-and-play convenience,” said Iris Shuker, PoE business unit manager with Microchip. “Combining extensive PD interoperability with firmware upgradability and more than 15 years of proven technology, our PSE chipsets offer a unique architecture that eliminates the need to redesign system boards or offer separate pre-standard and IEEE-compliant product lines. They are also at the heart of our IEEE 802.3bt-2018-compliant PoE injectors and midspans that bridge the interoperability gap for users.” 23.10.2019 11:30:00Oct\images\news_2019-11-15_17.jpghttps://www.microchip.com/en/pressreleasepage/microchip-solves-interoperability-challenges-of-90W-PoE-wiringmicrochip.com/pressreleasepage
Soft-Switching Gate Drive SolutionPre-Switch has announced that its soft-switching I...8376Product ReleaseSoft-Switching Gate Drive SolutionPre-Switch has announced that its soft-switching IGBT and silicon carbide gate driver architecture, including the Pre-Drive3 controller board, powered by the Pre-Flex FPGA, and RPG gate driver board, can significantly reduce the cost of solar inverters. The two-stage architecture delivers the same switching loss performance – or better – as a five-level design, resulting in reduced cost, control complexity and BOM count. Also, Pre-Switch enables the simplification and size reduction of inverters and filters used in renewable energy systems, enabling energy to be put back into the grid easily and efficiently. The Pre-Switch soft-switching platform enables a doubling of power output for a typical inverter, or an increase in switching speed by a factor of up to 20 times. Previously, soft-switching has never been successfully-implemented for DC/AC systems with varying input voltage, temperature and load conditions. However, Pre-Switch has overcome the challenges by using Artificial Intelligence (AI) to constantly-adjust the relative timing of elements within the switching system required to force a resonance to offset the current and voltage wave forms – thereby minimizing switching losses. Explains Pre-Switch CEO, Bruce T. Renouard: "Our benefit for solar energy system designers is that our soft-switching architecture eliminates half of the system losses. So we are able to achieve performance levels with a simple two stage design that would require five stages using conventional multi-level techniques."22.10.2019 16:20:00Oct\images\news_2019-11-01_17.jpghttps://www.pre-switch.com/newspre-switch.com/news
Product Development with Software Suite Keysight Technologies announced the PathWave Test ...8401Product ReleaseProduct Development with Software Suite Keysight Technologies announced the PathWave Test 2020 software suite, which delivers an integrated experience for leading electronic manufacturers to accelerate time-to-market of their digital and wireless platforms and products. Developed on the Keysight PathWave software platform, the PathWave Test 2020 software suite enables 5G, IoT and automotive engineers and managers to streamline test data processing and analysis to speed product introductions and secure a competitive advantage in the market. PathWave Test 2020 software provides data sharing and management between platform software tools including test automation, advanced measurement, signal creation and generation, as well as data analytics.  This integrated software platform allows application-tailored solutions to be developed and deployed to significantly accelerate electronic test workflows and product introductions. "The digital transformation happening today in engineering enterprises relies on accelerating time-to-market using best in class software and hardware, " said Jay Alexander, chief technology officer at Keysight Technologies. "Keysight's PathWave Test 2020 software suite reflects our commitment to creating powerful software solutions that help our customers streamline their workflows. " At the core of the PathWave Test 2020 software suite is PathWave Desktop Edition, providing users with access to the platform for launching and managing applications in the design and test ecosystem. 22.10.2019 13:30:00Oct\images\news_2019-11-15_20.jpghttps://about.keysight.com/en/newsroom/pr/2019/22oct-nr19135.shtmlabout.keysight.com/newsroom
Announcement and Call for ProposalsThe SEMIKRON Innovation Award and the SEMIKRON You...8385Industry NewsAnnouncement and Call for ProposalsThe SEMIKRON Innovation Award and the SEMIKRON Young Engineer Award is given for outstanding innovations in projects, prototypes, services or novel concepts in the field of power electronics in Europe, combined with notable societal benefits in form of supporting environmental protection and sustainability by improving energy efficiency and conservation of resources. Both prizes have been initiated and are donated by the SEMIKRON Foundation which is awarding the prizes in cooperation with the European ECPE Network. With the award the SEMIKRON Foundation wants to motivate people of all ages and organisations of any legal status to deal with innovations in power electronics, a key technology of the 21th century, in order to improve environmental protection and sustainability by energy efficiency and conservation of resources. The SEMIKRON Innovation and Young Engineer Prizes 2020 will be awarded in the frame of the ECPE Annual Event in March 2020 in Berlin. A single person or a team of researchers can be awarded. SEMIKRON Innovation Award includes prize money of EUR 10,000.00. SEMIKRON Young Engineer Award for researchers who have not yet completed their 30th year of age includes prize money of EUR 3,000.00. The deadline for submission ends on 15.01.2020! Please send your proposal resp. your application with the reference ´SEMIKRON Innovation Award´by email to Thomas Harder, General Manager of ECPE e.V., thomas.harder@ecpe.org. The receipt of your proposal will be confirmed by email immediately. Your proposal comprising 3-5 pages in total should be structured according to the headline given below and submitted in English language.20.10.2019 10:00:00Oct\images\news_2019-11-01_8.jpghttps://www.semikron.com/about-semikron/news-press/detail/announcement-and-call-for-proposals-for-semikron-innovation-award-semikron-young-engineer-award-awarded-by-the-semikron-foundation-1.htmlsemikron.com/news-press
Alloy Solder Paste at ProductronicaIndium Corporation will feature an innovative allo...8380Industry NewsAlloy Solder Paste at ProductronicaIndium Corporation will feature an innovative alloy and solder paste with high-reliability and enhanced-performance capabilities at Productronica, Hall A4, Booth 214, November 12-15, in Munich, Germany. Indium8.9HF Solder Paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process. Indalloy292 is an innovative alloy that is engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.17.10.2019 16:16:00Oct\images\news_indium.jpghttps://www.indium.com/people/marketing-communications/news-releases/indium-corp-to-feature-innovative-alloy-solder-paste-at-productronicaindium.com/news-releases
Collaborate to Drive Electrification of Europe's BusesIn a major step forward in the electrification of ...8431Industry NewsCollaborate to Drive Electrification of Europe's BusesIn a major step forward in the electrification of Europe's public transport networks, BMZ, HORIBA MIRA and ZIEHL-ABEGG have teamed up to offer a unique turnkey service for converting existing bus fleets to e-Buses. As part of its environmental policy to reduce CO2 emissions from public vehicles, the EU has released a new vehicle directive that mandates the percentage of buses that must be emissionfree by 2025 and 2030. It lays out targets for each EU member, with Germany for example, targeted with having 22.5% of all buses as zero emission, increasing to 32.5% by 2030. This will drive huge demand for the development of new electric buses to meet these targets. In addition, cities including Paris and Berlin have already committed to higher volumes of electrification at earlier dates than the mandate requires. While the onus has traditionally been on bringing new electrical buses to market, not to be overlooked is the role retrofitting existing buses will play in meeting these crucial targets. In order to achieve this, existing bus, owner, operators and manufacturers will need to act now to invest in retrofitting. Bringing together several decades of combined experience and expertise in the development and integration of electric drives for buses, BMZ, HORIBA MIRA and ZIEHL-ABEGG will develop and supply highly efficient, safe and reliable, electric powertrain solutions to electric bus manufacturers, operators and owners, with the option of a complete retrofit service for customers that need it.17.10.2019 14:00:00Oct\images\news_2019-12-01_7.pnghttps://bmz-group.com/media/attachments/2019/10/17/072_171019-bmz-horiba-mira-and-ziehl-abegg-collaboration.pdfbmz-group.com/media
Ultra-Low Clamping Voltage High-Surge TVS Alpha and Omega Semiconductor introduced the AOZ86...8408Product ReleaseUltra-Low Clamping Voltage High-Surge TVS Alpha and Omega Semiconductor introduced the AOZ8621UNI, a series of Transient Voltage Suppressor (TVS) for VBUS protection using the latest high-surge TVS platform. This series is ideal for USB Type-C Power Delivery, including but not limited to laptops and smartphones. The AOZ8621UNI series covers a reverse working voltage (VRWM) range from 5V to 22V, which meets the requirement of USB Power Delivery. Required VRWM can be selected according to the maximum operating voltage on the Type-C VBUS pin. The AOZ8621UNI series is housed in a DFN 2x2 package and is ideally suited to fit the small footprint requirement of Type-C application small electronic devices. “With such low breakdown voltage, low clamping voltage, and high-surge current, AOS believes the new high-surge TVS platform will contribute to reducing the ESD and EOS failure rate in our partners’ and customers’ products,” said Michael K. S. Ng, Sr. Marketing Manager of the TVS product line at AOS. 16.10.2019 07:30:00Oct\images\news_2019-11-15_13.jpghttp://www.aosmd.com/res/news/news-article-1571244560113/AOZ8621UNI%20Series_PR.pdfaosmd.com/news
Bipolar Transistors up to 8 ANexperia announced high quality, high reliability ...8372Product ReleaseBipolar Transistors up to 8 ANexperia announced high quality, high reliability automotive (AEC-Q101-qualified) and consumer/industrial-qualified MJD 3 A and 8 A power bipolar transistors. The product family includes eight parts in both 80 V and 100 V NPN and PNP versions. These well-known devices in industry-standard footprint now complement Nexperia's existing portfolio of high performance bipolar power transistors and further expand the company's total power bipolar discrete offering. Applications include: LED automotive lighting; backlight dimming in LCD displays; linear voltage regulators; relay replacement; motor drives; laser printers and MOSFET drivers. Nexperia Product Manager, Frank Matschullat, comments: "Nexperia is respected as a high volume, high quality supplier with a broad customer base. Widening our bipolar transistor portfolio with these higher current MJD devices enables design engineers to benefit from the recognised Nexperia performance advantages. This supports industry's desire to add efficiency to the supply chain and focus on few premium logistics suppliers such as Nexperia."16.10.2019 05:55:00Oct\images\news_2019-11-01_21.jpghttps://www.nexperia.com/about/news-events/press-releases/mjd-bipolar-transistors-up-to-8-a-widen-nexperias-power-portfolio.htmlnexperia.com/press-releases
Miniature Resettable Thermal Cutoff DevicesBourns introduced the company's smallest miniature...8373Product ReleaseMiniature Resettable Thermal Cutoff DevicesBourns introduced the company's smallest miniature resettable Thermal Cutoff (TCO) devices designed for overtemperature and overcurrent protection of lithium polymer and prismatic cells. The Bourns Model CB Series is the company's next generation of axial leaded TCO devices that control abnormal, excessive current virtually instantaneously, up to rated limits. This latest series is more than 26 percent smaller than Bourns' successful NR Series, yet has the same current carrying capability. The devices' low-profile 0.8 mm height and body width of 2.5 mm makes this series ideal for smaller batteries in smartphones and portable electronics, yet their high current carrying capability also makes them optimal for next-generation notebook and tablet PC battery cells. Offering resistance levels as low as 2.2 milliohms, the Bourns Model CB Series has current capabilities from 6 A up to 11 A at 60 °C as well as a welding projection option. These new miniature resettable TCO devices are available in four trip temperature options of 72 °C, 77 °C, 82 °C and 85 °C with a ±5 °C tolerance. The temperature options can be further narrowed upon request. In addition, the construction of the CB Series uses a high corrosion resistant bimetal mechanism to withstand most humid environments.16.10.2019 04:04:00Oct\images\news_2019-11-01_20.jpghttps://www.bourns.com/news/press-releases/pr/2019/10/16/bourns-introduces-its-smallest-miniature-resettable-thermal-cutoff-(tco)-devicesbourns.com/press-releases
Materials Meet Requirements for SiC and GaN ApplicationsSMP has developed "All Mode" EMC filters with high...8371Product ReleaseMaterials Meet Requirements for SiC and GaN ApplicationsSMP has developed "All Mode" EMC filters with high frequency stability. The High Frequency Composite Materials (HFCM) developed and manufactured by SMP are effective for frequencies up to the gigaHertz range and satisfy all of the requirements to which modern SiC and GaN applications are subject. The All Mode design damps both differential mode and common mode noise. By combining HFCM and All Mode technology it is possible to reduce the number of filter components needed in the system by about 50 percent. Among other advantages, this also means that common mode chokes or filters can be dispensed with. EMC filters reduce interference currents and voltage spikes in power converter systems which are generated by parasitic effects and cyclic elements of the system. The material plays an important part in this, as SMP's Managing Director Johannes Gemenetzis explains: "The target is to achieve a stable inductance at the working point over the entire frequency spectrum in order to maximize the interference suppression. Compared to the standard technologies which use materials such as ferrite, electrical steel sheets and nanocrystalline ribbon, the All Mode EMC filters are up to 40 percent lighter and reduce interference levels by as much as 40 dB[µV]."15.10.2019 23:20:00Oct\images\news_2019-11-01_22.jpghttp://www.smp.de/press__news/press__news/october_2019smp.de/press
Modular Power Supplies Offer up to 18 Outputs TDK Corporation announces the introduction of the ...8397Product ReleaseModular Power Supplies Offer up to 18 Outputs TDK Corporation announces the introduction of the 2000W rated QM8B series of AC-DC power supplies with the capability of providing up to 18 outputs. This further extends the QM modular power supply series to now cover 550W to 2000W.  Like all the models in the QM series, the QM8B features low acoustic noise and full MoPPs isolation.  With both medical and industrial safety certifications, the QM8B addresses a wide range of applications, including BF rated medical equipment, test and measurement, broadcast, communications and renewable energy. Accepting a wide range 90-264Vac 47-440Hz input, the QM8B can deliver 1500W output power or 2000W with a high line input of 180-264Vac.  Available output voltages range from 2.8V to 105.6V and up to eight single or dual modules can be fitted.  Optional standby/signal modules can be specified with a choice of one or two standby voltages (5V, 12V and 13.5V at up to 2A), a PMBus™ communication interface and unit inhibit or unit enable, and an AC Good signal. The units can operate in ambient temperatures of -20°C to +70°C, derating output power and output current by 2.5% per °C above 50°C.  Overall case dimensions are a compact 200 x 63.3 x 268mm (W x H x D), and the weight is between 2.3 to 3.4kg, depending on the module configuration.15.10.2019 18:30:00Oct\images\news_2019-11-15_24.jpghttps://www.emea.lambda.tdk.com/uk/news/article.aspx?cid=15500emea.lambda.tdk.com/news
Collaboration Unveils Transistor Wafer Process TechnologyA UK collaboration between Nottingham-based start-...8383Industry NewsCollaboration Unveils Transistor Wafer Process TechnologyA UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by implementing a fundamental change at transistor level reaching back five decades to the early bipolar IC era before CMOS became mainstream, using a new process called Bizen. Bizen applies the principles of quantum tunnel mechanics to any computing or power technology. When compared to CMOS, Bizen results in a five-fold lead time reduction - down from 15 weeks to just three weeks. Moreover, the new process achieves a three-fold increase in gate density that produces a matching three-fold reduction in die size. Lastly, Bizen halves the number of process layers required. All this is achieved while equalling or bettering the speed and low power capabilities offered by current CMOS devices. David Summerland, CEO SFN explains: "The CMOS processing industry is hitting a brick wall as shrinking geometries bash up against the laws of physics. We went back to the very beginning and found a way to commercialize quantum tunnel mechanics in silicon or wide bandgap device manufacture. The result is 'Bizen' – Bipolar/Zener – which retains the advantages of traditional bipolar processing yet removes the disadvantages by using Zener quantum tunnel mechanics. This results in lower dynamic power, higher speed and higher gate density, halving the number of process layers required, reducing material use by two thirds, and slashing manufacturing time."15.10.2019 14:25:00Oct\images\news_2019-11-01_10.jpghttps://www.searchforthenext.comsearchforthenext.com
Dual channel PPTC Protects from OvercurrentsLittelfuse announced a series of 250V Telecom PPTC...8377Product ReleaseDual channel PPTC Protects from OvercurrentsLittelfuse announced a series of 250V Telecom PPTCs designed to help make telecom and network equipment more reliable. The TSM250-130 series protects against power cross and induced power surges as defined in ITU, Telcordia GR1089 and IEC 62368-1. Because it combines two resistance-matched PPTCs in a single surface-mount housing, it reduces the board space required by 50%, simplifies assembly, and offers Tip and Ring resistance balance. Part of the Littelfuse PolySwitch family of resettable overcurrent protection devices for telecommunications and networking equipment, the new series is ideal for Customer Premise Equipment (CPE), Central Office (CO) equipment, Subscriber Line Interface Cards (SLIC) and VoIP port on set top boxes. "Featuring two resistance-matched PPTCs in a single surface-mount housing, the TSM250-130 Series delivers Tip and Ring overcurrent protection while using 50% less PCB area," said Stephen Li, Global Product Manager at Littelfuse. "With its high surge capability, it helps end users comply with ITU-T K.20, K.21 and K.45 as well as Telcordia GR-1089 intra-building standards." The TSM250-130 Series PPTCs are available in tape and reel format in quantities of 3,000.15.10.2019 07:30:00Oct\images\news_2019-11-01_16.jpghttps://www.littelfuse.com/about-us/news/news-releases/2019/10.14-littelfuse-dual-channel-pptc.aspxlittelfuse.com/news-releases
Battery Scientists Prepare to Boost Power and Lifetime of Advanced Lead BatteriesResearchers have unveiled a program designed to pr...8389Industry NewsBattery Scientists Prepare to Boost Power and Lifetime of Advanced Lead BatteriesResearchers have unveiled a program designed to produce high performance batteries in the United States (U.S.) for renewables energy storage and improved hybrid electric cars. The Consortium for Battery Innovation (CBI) has published the program in an innovation roadmap for advanced lead batteries which sets out research priorities for the next three years. U.S. members of the Consortium, which include battery manufacturers, universities and research institutes, are working together on pre-competitive research to fast-track innovation. Q1 2019 saw 148.8 MW deployed by the U.S. energy storage market, a massive 232% increase from the same period last year. The Consortium anticipates this growth record to set an upward trend in demand for battery energy storage. The U.S. will need a range of battery technologies - including lithium and advanced lead batteries – if energy storage demand is to be met. The plans outlined in the innovation roadmap will also help car-makers accelerate the roll out of start-stop and micro-hybrid vehicles, aiming to increase the dynamic charge acceptance of lead batteries by storing more of the energy created when a car brakes. More than 275 million cars and trucks in the U.S. utilize lead batteries.15.10.2019 07:00:00Oct\images\news_batteryinnovation.jpghttps://batteryinnovation.org/u-s-battery-scientists-prepare-to-boost-power-and-lifetime-of-advanced-lead-batteries/batteryinnovation.org
Supporting Students of the TU Ilmenau in Formula StudentStarting immediately ROHM will be active in Formul...8390Industry NewsSupporting Students of the TU Ilmenau in Formula StudentStarting immediately ROHM will be active in Formula Student Electric & Driverless: The company signed a sponsoring contract with the Team Starcraft of the Technical University Ilmenau, Germany. As part of the cooperation, ROHM will provide students with products from its extensive portfolio for the development of their vehicles. The team will also receive financial support. In Formula Student, university teams compete in an international design and racing competition that is not just about the fastest racecar. The goal of every team is to achieve the optimal overall package of construction, performance, and financial and sales planning. The Formula Student is divided into three classes: In addition to classic combustion vehicles and modern electric vehicles, there has been a class for autonomous vehicles since 2017. Team Starcraft consisting of students from TU Ilmenau has been active in Formula Student since 2006. With this cooperation ROHM expands its contacts to leading universities in Europe. In addition, ROHM wants to prove the application possibilities and advantages of its products in the automotive sector. "It's nice to see how much heart and soul the students put into their work," said Toshimitsu Suzuki, President of ROHM Semiconductor Europe. "ROHM is proud to support the next generation of top engineers and contribute to the mobility of tomorrow."15.10.2019 06:00:00Oct\images\news_2019-11-01_3.jpghttps://www.rohm.com/news-detail?news-title=rohm-supports-students-of-the-tu-ilmenau-in-formula-student&defaultGroupId=falserohm.com/news
Introducing New Brand Identity SystemRIGOL Technologies is proud to announce the launch...8359Industry NewsIntroducing New Brand Identity SystemRIGOL Technologies is proud to announce the launch of its redesigned brand identity system as well as the 3rd generation brand tagline "Possibilities and More". The new brand identity is intended to permanently enhance both the divison's customer focus and its internal and external transparency. The new design features a modern, communicative, and refreshed design, which also conveys the brand core value via a younger, brighter, and more passionate, brand identity. The release of RIGOL's new brand identity system further enhanced the in-depth deployment of RIGOL's internationalization strategy. This means that RIGOL will be extended from product and technology innovation to customer-centered. RIGOL is also push innovations forward for the test and measurement industry. The own chipset and the new oscilloscope architecture show the way to the future. In addition to the Analog Front End Chip (named Beta Phoenics), Rigol also have developed the Signal Processing Chip (named Ankaa), which supports 10GSa/s data acquisition capability, and the Probe Amplifier Chip (named Gamma Phoenics), which will support differential probes up to 6GHz. The ASICs are based entirely on RIGOL IP and were developed entirely inhouse.11.10.2019 21:00:00Oct\images\news_rigol.jpghttp://www.rigol.eurigol.eu
Putting the Electric Car in the Fast LaneSkeptics of electromobility have raised critical q...8384Industry NewsPutting the Electric Car in the Fast LaneSkeptics of electromobility have raised critical questions, such as how fast an electric car can be driven and the maximum distances it can cover. That depends on the built-in power electronics – the heart of electromobility, if you will. Three factors are decisive when it comes to the installation of power electronics: space, weight, and efficiency. The semiconductor material silicon carbide (SiC) meets these conditions because it has a higher degree of efficiency and can or must be installed more compactly than conventional semiconductors made of silicon only. Although some electric cars already run on SiC semiconductors, there is still considerable potential here to fully exploit the efficiency of the SiC semiconductor material. The key to the success of SiC lies in the packaging of the semiconductors. In order to be able to use the material for large-scale industrial production, the SiC Modul project will take industrial framework conditions into consideration right from the start. For example, the module being developed within the project is based on a traditional printed circuit board design that has already been established in industry and is easy to implement.11.10.2019 13:30:00Oct\images\news_2019-11-01_9.jpghttps://www.izm.fraunhofer.de/en/news_events/tech_news/fraunhofer-izm-is-putting-the-electric-car-in-the-fast-lane.htmlizm.fraunhofer.de/news
Akira Yoshino Received the Nobel Prize in Chemistry 2019Dr. Akira Yoshino, Honorary Fellow at Asahi Kasei,...8386PeopleAkira Yoshino Received the Nobel Prize in Chemistry 2019Dr. Akira Yoshino, Honorary Fellow at Asahi Kasei, has won this year's Nobel Prize in Chemistry, the Royal Swedish Academy of Sciences announced on October 9 in Stockholm. Yoshino, 71, a professor at Meijo University, Japan, shares the prize with two other scientists for their development of lithium-ion batteries – Professor John B. Goodenough from the US and chemist M. Stanley Whittingham from Great Britain. Their invention is used as rechargeable batteries for mobile phones, laptop computers and other devices. It can also store significant amounts of energy from solar and wind power, making possible a fossil fuel-free society, and will be an important driver for the electrification in the automotive industry. With the spread of mobile electronic devices such as the Sony Walkman from the 1970s, the need for lightweight and compact rechargeable batteries to replace the common and non-rechargeable primary cells increased. Lithium was identified early on as a powerful anode material for rechargeable batteries. However, the easy inflammability and susceptibility to short circuits with the cathode posed great challenges to science and for a long time prevented the practical use of lithium-ion batteries. "There was a lot of R&D on portable electronics in the 1980s, and so small and lightweight batteries, with high energy density and rechargeability were also needed. But nobody really knew what kind of rechargeable battery was going to be needed. The big buzzword at first was "portable", soon joined by "cordless" and "wireless". I just sort of sniffed out the direction that trends were moving. You could say I had a good sense of smell", Yoshino told about these early years.10.10.2019 18:00:00Oct\images\news_2019-11-01_7.jpghttps://www.asahi-kasei.co.jp/asahi/en/news/2019/e191009.htmlasahi-kasei.co.jp/news
The Car of the Future on Europe's RoadsBy 2030, 50% of newly registered vehicles will be ...8365Industry NewsThe Car of the Future on Europe's RoadsBy 2030, 50% of newly registered vehicles will be electrically powered, connected or automated. This dramatic upsurge in functionality requires a new system approach in vehicle architecture to support electromobility and highly automated driving. Conventional cars were already equipped in 2014 with between 70 and 100 connected electronic control units (ECUs), and this figure would continue to rise driven by growing demands for environmental compatibility, efficiency, safety and convenience. The European project "Integrated Components for Complexity Control in affordable electrified cars", 3Ccar for short, was set up to tackle this challenge. 48 partners from 14 different countries have worked on and presented innovative highly integrated semiconductor-based solutions. "What we need in order to reach our ambitious objectives are a strong European ecosystem, innovation and long-term collaboration within major strategic research projects," says Dr. Sabine Herlitschka, CEO of Infineon Technologies Austria AG and Chair of the ECSEL Joint Undertaking. Infineon Technologies AG was responsible for managing and coordinating the project. The project was financed by the European Union, the German Federal Ministry of Education and Research (BMBF), other participating countries and partners from industry. The research budget amounted to 54 million euros. The 3Ccar project kicked off in 2015 and ran for 41 months. The eleven German partners have now presented their research results in a final report.10.10.2019 10:00:00Oct\images\news_3car.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2019/INFBEX201908-097.htmlinfineon.com/market-news
Low Profile QFN-package Power Module RECOM’s latest addition to its DC/DC converter por...8403Product ReleaseLow Profile QFN-package Power Module RECOM’s latest addition to its DC/DC converter portfolio is one of the smallest in its class of low profile QFN-packaged buck regulator power modules. The RPX-2.5 module is exceptional due to its flip-chip technology which increases power density and improves thermal management. RECOM’s power module offers a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package. The RPX-2.5 provides an input range from 4.5 to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. It has an efficiency of up to 91%, and it is thermally optimized due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications. To facilitate rapid testing, RECOM also offers an evaluation board for this product so that customers will be able to quickly and easily test. Converter samples, evaluation boards, and OEM pricing are available from all authorized distributors or directly from RECOM. 09.10.2019 12:30:00Oct\images\news_2019-11-15_18.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-low-profile-qfn-package-power-module-74.html?4recom-power.com/newsroom
AEC-Q200 Qualified Multilayer Varistors AVX Corporation released a series of automotive-qu...8396Product ReleaseAEC-Q200 Qualified Multilayer Varistors AVX Corporation released a series of automotive-qualified multilayer varistors (MLVs) especially designed to exhibit lower breakdown- and clamping-voltage to working-voltage ratios than other standard varistors. Comprised of zinc-oxide-based (ZnO-based) ceramic semiconductor devices with nonlinear, bidirectional voltage-current (V-I) characteristics similar to those of back-to-back Zener diodes, but with greater current and energy handling capabilities and the addition of EMI/RFI attenuation, the new VLAS Series Low-Clamp TransGuard® Automotive MLVs combine bi-directional overvoltage circuit protection and broadband EMI/RFI filtering functions in a single, space-saving, surface-mount (SMT) device that is qualified to AEC-Q200, proven to deliver high-reliability performance, and capable of achieving very low clamping-to-working-voltage ratios that were previously only achievable with transient voltage suppression (TVS) diodes. This allows the new VLAS Series MLVs to extend the multifunctional advantages of varistor technology to sensitive automotive, industrial, and general electronics applications that require tighter clamping voltage performance for enhanced overvoltage protection, as well as the extreme optimization of physical space, including infotainment systems, engine control units (ECUs), microcontroller units (MCUs), and displays. The series also exhibits high current- and energy-handling capabilities, very fast, sub-nanosecond (<1nS) response times to ESD strikes, multiple-strike capabilities, high energy absorption (i.e., load dump), low leakage, and excellent solderability; doesn’t require any current or energy derating over the entire range of rated operating temperatures, which spans -55°C to 125°C; and can provide significant space savings when used to replace TVS diode and electromagnetic compatibility (EMC) capacitor pairings. 08.10.2019 19:30:00Oct\images\news_2019-11-15_25.jpghttp://www.avx.com/press-releases/vlas-series-multilayer-varistor-aecq200-qualified-low-clamp/avx.com/press-releases
4.5A Two-Input Power Mux for IoT Applications GLF Integrated Power introduces the GLF74130, a tw...8398Product Release4.5A Two-Input Power Mux for IoT Applications GLF Integrated Power introduces the GLF74130, a two-input Power Mux IC that offers significant efficiency improvement over traditional diode-based solutions. The tiny (1.27 mm x 1.67 mm) Wafer Level Chip Scale Packaged (WLCSP) Power Mux IC provides automatic/manual selection between two 1.5V to 5.5V input power sources with up to 4.5A continuous output current. The device’s small footprint and industry-leading combination of low RON (20 mOs), low supply current (4 µA), and ultra-low standby current (50 nA) offer an exceptional solution for smart IoT devices and IoT tracking systems.  08.10.2019 17:30:00Oct\images\news_2019-11-15_23.jpghttp://www.glfipower.com/home/news/glf-s-introduces-ultra-high-efficiency-4a-two-input-power-mux-for-iot-applicationsglfipower.com/news
Powering Towards the PCIM Europe 2020In less than six months, the leading international...8388Event NewsPowering Towards the PCIM Europe 2020In less than six months, the leading international exhibition and conference for power electronics will open its doors once again: It is already clear that the PCIM Europe will continue to grow in 2020. Both the exhibition space and the number of exhibitor registrations have already exceeded the previous year's figures. The PCIM Europe will continue to expand its position as the world's leading exhibition for power electronics and its applications in the upcoming year. In Nuremberg from 5 – 7 May 2020, visitors will be able to experience an even greater range of products and components in the field of power electronics. The online exhibitor search provides an overview of all companies that have registered for PCIM Europe 2020 so far. The fact that electromobility is an important field of application for power electronics is illustrated by the great number of companies that will be presenting corresponding products from the field of power electronics on site. Therefore, the focus topic E-mobility will be presented at the PCIM Europe 2020 with an E-mobility area and a forum as last time. Exhibitors will be able to draw attention to their main booth and their E-mobility products with a branded poster wall and information material at the E-mobility Area. The program at the E-mobility Forum includes numerous lectures on innovative products for electric mobility on all three days of the exhibition.08.10.2019 15:00:00Oct\images\news_2019-11-01_5.jpghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/powering.htmlpcim.mesago.com/press
4-Pin Package SiC MOSFETsROHM announced the availability of six trench gate...8375Product Release4-Pin Package SiC MOSFETsROHM announced the availability of six trench gate structure SiC MOSFETs (650V/1200V), the SCT3xxx xR series, ideal for server power supplies, UPS systems, solar power inverters, and EV charging stations requiring high efficiency. The series utilizes a 4-pin package (TO-247-4L) that maximizes switching performance, making it possible to reduce switching loss by up to 35% over conventional 3-pin package types (TO-247N). This contributes to lower power consumption in a variety of applications. In recent years, the growing needs for cloud services due to the proliferation of AI and IoT has increased the demand for data centers worldwide. But for servers used in data centers, one major challenge is how to reduce power consumption as capacity and performance increase. At the same time, SiC devices are attracting attention due to their smaller loss over mainstream silicon devices in the power conversion circuits of servers. Furthermore, as the TO-247-4L package enables to reduce switching loss over conventional packages, it is expected to be adopted in high output applications such as servers, base stations, and solar power generation.08.10.2019 14:03:00Oct\images\news_2019-11-01_18.jpghttps://www.rohm.com/news-detail?news-title=4-pin-package-sic-mosfets&defaultGroupId=falserohm.com/news
SMSI Call for PapersThe AMA Association for Sensors and Measurement is...8358Event NewsSMSI Call for PapersThe AMA Association for Sensors and Measurement is commencing a Call for Papers for the Sensor and Measurement Science International 2020 (SMSI). This international conference is going to take place parallel to the SENSOR+TEST 2020 trade fair from 22 to 25 June 2020 in Nuremberg, Germany. The submission deadline for contributions and poster presentations is 31 January 2020. The new conference replaces the previous AMA conferences as of 2020. The former thematic focus on sensors and instrumentation will be complemented in the new format by measuring technology and metrology. The SMSI 2020 links national and international representatives from research, science, and industry. One pillar of the conference, sensor technology, will deal with sensor principles, materials, technology, and application and is to integrate the satellite conference IRS² 2020. Another pillar, measuring technology, is to include its technological foundations, advanced methods, networked systems, and new AI approaches in measuring. The area of metrology deals with traceability, advanced calibration, and testing methods as well as with new measuring regulations and standards. The parallel SENSOR+TEST 2020 trade fair, as an information platform for sensor, measuring, and testing technology, also serves to expand the innovation dialog among the conference participants beyond the SMSI 2020 itself.08.10.2019 10:00:00Oct\images\news_2019-10-15_9.jpghttps://www.ama-sensorik.de/en/press/ama-press-releases-2019/ama-sensorik.de/press
Maintenance Service Predicts When Drives Need ReplacingABB has extended the scope of its ABB Ability Digi...8379Product ReleaseMaintenance Service Predicts When Drives Need ReplacingABB has extended the scope of its ABB Ability Digital Powertrain concept that connects drives, motors, pumps and bearings with a Condition-Based Maintenance service option for drives. This option provides the earliest possible warning of any abnormal conditions that might cause a drive to fail prematurely. The service is targeted for drives in critical applications in the oil and gas, metals, water and wastewater, and pulp and paper industries, where it is essential to avoid costly unplanned plant shutdowns. The Condition-Based Maintenance service continuously monitors key components in a variable speed drive (VSD) – the fans, the semiconductors, and capacitors. Thermal, voltage, and power sensors collect data on the ambient temperature and load variations of the components and measure the daily impact on their lifetime. Cloud-based algorithms and statistical analysis estimate the level of stress on components and calculate their remaining life. If failure is predicted before the next planned maintenance, operation management can make a fully informed decision to take action and prevent an unplanned shutdown. In some cases, the Condition-Based Maintenance service could indicate that the drive components are under less stress than normal and will last longer than expected. Therefore, regular preventive maintenance intervals can be extended to increase productivity and reduce costs.08.10.2019 02:27:00Oct\images\news_2019-11-01_14.jpghttps://new.abb.com/news/detail/36666/condition-based-maintenance-service-predicts-when-drive-components-need-replacingnew.abb.com/news
Jason Cuadra Appointed as VP EngineeringPre-Switch has announced the appointment of Jason ...8391PeopleJason Cuadra Appointed as VP EngineeringPre-Switch has announced the appointment of Jason Cuadra to the position of VP Engineering. An industry veteran with over 25 years' experience in power converter design, Cuadra has in-depth knowledge including of magnetics, EMC, control, resonant conversion, design automation, and high volume production. He is an experienced engineering manager, having led teams in the testing and development of new technology. He joins Pre-Switch from Loon LLC (Google X) where he designed and re-architected the power converters on the payload of Loon's stratospheric balloons for providing LTE cellular service to users in remote areas of the world. Cuadra's previous applications management responsibilities include reference board design, customer engagement and working closely with Marketing, Sales, and FAEs. Comments Bruce T. Renouard, CEO, Pre-Switch: "We are very pleased to have Jason join our team where his design and management skills will be a great asset to us. His customer-facing and sales support experience will be instrumental in continuing our accelerating new product development." Pre-Switch's forced-resonant soft-switching topology replaces the traditional IGBT driver or Silicon Carbide driver with a common intelligent controller board, the Pre-Drive3, and an application-specific plug-in RPG (Resonant Power Gate) module optimized for the customer's chosen SiC or IGBT package. The Pre-Switch architecture reduces cost, increases efficiency and extends EV range by 5-12%, while reducing size and weight.08.10.2019 00:02:00Oct\images\news_2019-11-01_2.jpghttps://www.pre-switch.com/single-post/2019/10/08/Soft-Switching-Pioneer-Pre-Switch-Appoints-Jason-Cuadra-as-VP-Engineeringpre-switch.com
SiC Semiconductors Make Electric Cars More EfficientNowadays, all cars feature semiconductors. There a...8392Industry NewsSiC Semiconductors Make Electric Cars More EfficientNowadays, all cars feature semiconductors. There are more than 50 of them in every vehicle that rolls off the production line. The microchips made of silicon carbide (SiC) that Bosch has developed will now help electromobility make a great leap forward. In the future, the chips made of this extraordinary material will set the pace in the power electronics – the command center for electric and hybrid vehicles. With this silicon carbide technology, Bosch is systematically expanding its semiconductor know-how. The company will be using the SiC semiconductors in its own power electronics in the future. For its customers, this brings together the best of both worlds, as Bosch is the only automotive supplier that also manufactures semiconductors. "Thanks to our deep understanding of systems in e-mobility, the benefits of silicon carbide technology flow directly into the development of components and systems," Harald Kroeger, member of the Bosch board of management, says. As one of the leading manufacturers of automotive semiconductors, Bosch has been exploiting this globally unique advantage for almost 50 years. In addition to power semiconductors, these include microelectromechanical systems (MEMS) and application-specific integrated circuits (ASICs).08.10.2019 00:01:00Oct\images\news_2019-11-01_1.jpghttps://www.bosch-presse.de/pressportal/de/en/bosch-poised-for-leap-in-e-mobility-technology-201158.htmlbosch-presse.de/pressportal
Flexible 12-Channel Automotive LED DriverThe STMicroelectronics ALED1262ZT 12-channel LED d...8370Product ReleaseFlexible 12-Channel Automotive LED DriverThe STMicroelectronics ALED1262ZT 12-channel LED driver targets advanced automotive rear combination lamps and interior lighting, bringing features to support complex and innovative visual effects. Independent 7-bit PWM dimming on all channels allows flexible control of tail, stop, and indicator lights, with dynamic effects. Each channel delivers constant output current at 19V for controlling multi-LED series strings. Adjustment from 6mA to 60mA ensures a wide dimming range with high maximum brightness. The LED lighting driver responds to I2C commands from a host microcontroller and provides two pre-programmed configurations that allow standalone operation for extra flexibility. With diagnostic features including open-LED detection and over-temperature warning with thermal shutdown, the ALED1262ZT ensures long-lasting robustness and stability. The input-voltage range from 5.5V to 38V allows use in direct battery-connected systems. In addition, the ALED1262ZT is designed for low-noise operation, with slow turn-on/off time per channel and spread-spectrum clock operation to simplify integration with other in-vehicle electronics. ST has also released an evaluation board, STEVAL-LLL002V1, available from www.st.com or distributors, to help designers explore the ALED1262ZT's features and jump-start new lighting designs.07.10.2019 17:22:00Oct\images\news_2019-11-01_23.jpghttps://www.st.com/content/st_com/en/about/media-center/press-item.html/n4170.htmlst.com/media-center
Diverse Program Entices Key Players and StartupsIn its 9th year the co-hosted LED professional Sym...8382Event NewsDiverse Program Entices Key Players and StartupsIn its 9th year the co-hosted LED professional Symposium +Expo (LpS), Trends in Lighting Forum &Show (TiL) and for the first time the Digital Addressable Lighting Interface (DALI) Summit gathered in the unique setting of Bregenz, Austria. The three international conference and exhibition events were carefully curated to bring together a unique blend of award winning industry talent including; architects, planners, lighting designers, scientists and technologists. The event brought focus to the continuing relevance of interdependent technologies, human centric design and more acutely, sustainability. The approach of combining distinct lighting fields by Luger Research; LpS 2019, TiL 2019 and DALI Summit 2019, succeeded in inciting conversations and knowledge sharing to facilitate the evolution of lighting in the complex global environment. The combined three day event presented delegates with the opportunity to interact with an extensive selection of prominent keynote speakers from the lighting design world, scientists, and technologists. The opera stage and theatre spaces were utilised for panel discussions, lectures and workshops crossing disciplines and sectors of industry. Another insightful aspect to the event was a lively press conference and CEO + Influencer panel allowing promulgation of news, industry opinion and key expectations and challenges for the coming years in the lighting industry.03.10.2019 12:12:00Oct\images\news_2019-11-01_11.jpghttps://www.led-professional-symposium.com/news-2led-professional-symposium.com/news
Expanding the Portfolio of Current Compensated ChokesThe RC chokes are available with horizontal and ve...8374Product ReleaseExpanding the Portfolio of Current Compensated ChokesThe RC chokes are available with horizontal and vertical mounting options. Standard current ranges are from 0.25 to 0.7A with voltages up to 250VAC. The RC choke stands for Reduced Complexity choke, featuring small form factor common mode choke design without potting. This reduces the weight improves the quality , due to less process steps in production. It also fulfills customer expectations in terms of recyclability and environmental friendliness. The design approach taken for the RC choke is the first step into a new era of small form factor chokes at Schaffner. The RC choke meets customers expectations with the ability to perform at high ambient temperature (up to 125°C) without losing any mechanical or safety relevant specification (de-rating calculations are provided for operational ambient temperature higher than rated values). The range of 14 different combinations of current, inductance and mounting position makes the series suitable for power supplies and applications like LED lighting, HVAC or medical devices. Schaffner's RC chokes comply with RoHS and REACH requirements and are certified to IEC/EN 60938-2 (VDE 0565-2-1). With their open-frame construction, RC chokes can be easily reviewed by all safety organizations and certified as part of the end product. If required material lists are available upon request.02.10.2019 18:18:00Oct\images\news_2019-11-01_19.jpghttps://www.schaffner.com/media/news/details/article/the-schaffner-group-in-switzerland-is-expanding-the-already-successful-product-portfolio-of-current/schaffner.com/news
SiC FET Devices for Global Racing ChallengeA Dutch solar car team from University of Twente a...8387Industry NewsSiC FET Devices for Global Racing ChallengeA Dutch solar car team from University of Twente and Saxion Hogeschool has selected silicon carbide (SiC) devices from UnitedSiC ahead of a major solar racing challenge which took place in October. UnitedSiC provided product samples of their FAST Series of SiC FETs to Solar Team Twente, which they selected on the basis of superior performance. "At the moment, Solar Team Twente develops and produces the entire electrical system of the vehicle, from solar panel, battery, and even the drivetrain. The motor controller and electrical motor are also developed by the team. To ensure we get the best possible performance, we are continuously looking to new technologies, including silicon carbide. With SiC we can reduce our switching losses drastically, while reliability and robustness remain guaranteed." says Devon Screever, Electrical Engineer at Solar Team Twente. "For new designs such as this solar car project, UnitedSiC FAST Series SiC FETs will offer the designers significant system benefits from the device's increased switching frequencies, such as increased efficiency and reduction in the size and cost of passive components," says Anup Bhalla, VP of Engineering at UnitedSiC. "The FAST Series devices offer not only ultra-low gate charge, but also the best reverse recovery characteristics of any device of similar ratings. Solar Team Twente's selection of these products is an indication of just how much of a competitive advantage SiC FETs from UnitedSiC can offer."02.10.2019 16:00:00Oct\images\news_2019-11-01_6.jpghttps://unitedsic.com/solar-team-twente-chooses-unitedsic-silicon-carbide-fet-devices-for-global-racing-challenge/unitedsic.com
High-Performance GaAs SemiconductorsHigh-performance gallium arsenide (GaAs)-based ele...8363Industry NewsHigh-Performance GaAs SemiconductorsHigh-performance gallium arsenide (GaAs)-based electronics have the potential to help new technologies achieve breakthrough. A study at the Karlsruhe Institute of Technology (KIT) of the development of ultra-fast charging stations for electric vehicles has demonstrated that GaAs diodes from 3-5 Power Electronics GmbH (35PE) Dresden can deliver promising results. "The trials showed that circuits can be laid out much more efficiently than with silicon-carbide-based (SiC) products and that there are close to zero losses," report 35PE Managing Directors Dr. Gerhard Bolenz and Dr. Volker Dudek. A follow-up project is subjecting the GaAs diodes to practical testing with a charging station manufacturer and a further research partner. These high-performance semiconductors, which operate almost without current or voltage, represent 35PE's first new product family since the start of production in spring 2018. "These 'soft switching' applications are particularly suitable for use in electric mobility and industrial electronics, such as plasma welding. The first samples are already being tested with potential customers in Europe and Asia," explain the managing directors. The product family, which was originally designed for diodes in the 600 volt and 1200 volt range, is being expanded to include the 400 volt range due to demand. The engineers are also working on high-performance semiconductors for hard switching applications. In addition to the automotive and industrial sectors, this will appeal to customers in the renewable energy industry.02.10.2019 14:00:00Oct\images\news_2019-10-15_4.pnghttp://www.3-5pe.com/3-5pe.com
3rd Edition of Gallium Nitride TextbookEfficient Power Conversion Corporation (EPC) annou...8366Industry News3rd Edition of Gallium Nitride TextbookEfficient Power Conversion Corporation (EPC) announce the publication of the third edition of "GaN Transistors for Efficient Power Conversion," a textbook written by power conversion industry experts and published by John Wiley and Sons.  This textbook is designed to provide power system design engineering students, as well as practicing engineers, basic technical and application-focused information on how to design more efficient power conversion systems using gallium nitride-based transistors. Gallium nitride (GaN) is leading edge technology that is displacing the venerable silicon MOSFET in power conversion applications. As silicon approaches its performance limits, GaN devices offer superior conductivity and switching characteristics, allowing designers to greatly increase efficiency, and reduce size, weight, and cost. This timely third edition has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements and emerging applications. This book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and a wide range of applications. Included are Discussions on the fundamental physics of these power semiconductors Practical guidance on layout and other circuit design considerations Application examples employing GaN including lidar for autonomous vehicles, DC-DC power conversion, RF envelope tracking used in 5G communication networks, wireless power, class-D audio, and high radiation environments.02.10.2019 10:00:00Oct\images\news_2019-10-15_1.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2900/EPC-Launches-3rd-Edition-of-Gallium-Nitride-GaN-Textbook-with-Power-Conversion-Applications-Focus.aspxepc-co.com/News
NFC Programming Method for LED DriversFor fast and cost-effective implementation of NFC ...8378Product ReleaseNFC Programming Method for LED DriversFor fast and cost-effective implementation of NFC programming for LED drivers, Infineon Technologies developed the NFC-PWM series NLM0011 and NLM0010. NFC programming is an emerging technology designed to replace the labor-intensive "plug-in resistor" current setting method via contactless NFC interface. Besides improving the operational efficiency by enabling automatic programming in the manufacturing line, it creates significant flexibility in the value chain. With this it reduces the LED driver variants, simplifies the selection of LED modules, and allows end-of-line configuration. The devices are NFC wireless-configuration ICs with configurable PWM output, primarily designed for LED applications. They enable cost-effective NFC programming implementation by using a PWM signal directly to control the analog driver IC. Comparing to the microcontroller based solution the system BOM cost is reduced. Both devices have two operation modes, passive and active mode. In the passive mode, the LED driver module is not powered, and the PWM-related parameters can be configured wirelessly via the NFC interface. In the active mode, as soon as the V CC voltage supply is powered, a PWM output is generated according to the stored parameters. With an external R/C filter, the PWM signal is converted to the desired DC voltage to control the current output of an LED driver.02.10.2019 09:30:00Oct\images\news_2019-11-01_15.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2019/INFPMM201910-001.htmlinfineon.com/market-news
DC/DC Converter Series Comprises 24 ModelsComponents Bureau is now offering a high-quality r...8368Product ReleaseDC/DC Converter Series Comprises 24 ModelsComponents Bureau is now offering a high-quality range of 75-Watt isolated DC/DC converters from Cincon of Taiwan, certified to the latest EN 55032 EMC specification and offering outstanding safety, efficiency, and flexibility. The ECLB75W series comprises 24 models offering a choice of 24V or 48V nominal DC input voltage and regulated single or ± 5V, ±12V, and ±15V, and ±24V output. Compliant with the standard 2" x 1" power-module pinout, the converters come in a 52mm x 30.5mm x 10.2mm shielded metal case with a choice of mountings. There is also a remote on/off control with a choice of positive or inverse logic polarity. The wide input-voltage ratio of 4:1 allows operation from 9V-36V and 18V-75V, enabling use in distributed power architectures, telecommunication equipment, battery-operated devices, and industrial applications. The case operating-temperature range of –40°C to 105°C ensures reliability in challenging environments. As well as meeting EN 55032, which is the new EMC standard covering audio/video, broadcast and entertainment-lighting equipment, the units are also certified to the EN 55022 IT equipment standard. Internally, the converters feature an all-ceramic capacitor design for outstanding power density and reliability. With maximum efficiency over 92.5% and very low no-load power consumption, ECLB75W converters are suited to use in energy-critical systems.02.10.2019 02:30:00Oct\images\news_2019-11-01_25.jpghttps://www.componentsbureau.com/news/dcdc-converter-series-comprises-24-models/componentsbureau.com/news
Low Capacitance TVS Diode ArraysLittelfuse introduced a series of low capacitance ...8355Product ReleaseLow Capacitance TVS Diode ArraysLittelfuse introduced a series of low capacitance TVS Diode Arrays (SPA Diodes) optimized to protect high-speed differential data lines from electrostatic discharge (ESD), cable discharge events (CDE), electrical fast transients (EFT), and lightning-induced surges, keeping network communications reliable by safeguarding signal integrity. The SP3384NUTG Series can protect up to four channels against up to 15A (IEC 61000-4-5 2nd edition) and up to ±30kV ESD (IEC 61000-4-2) and is available in a compact µDFN package. The combination of low capacitance and low clamping voltage make the SP3384NUTG a robust protection solution for 2.5G/5G/10G Ethernet high-speed data interfaces without signal degradation, resulting in high reliability for a variety of applications. Typical markets and applications for the SP3384NUTG Series TVS Diodes include Datacenter, Telecom and Consumer Electronics.  "Building upon similar footprints in 1GbE and 5GbE applications, the SP3384NUTG expands our portfolio to fill a market need for ultra-strong ESD and surge protection for today's fastest 10GbE consumer ethernet solutions," said Tim Micun, Director of Business Development, TVS Diode Arrays (SPA Diodes). "It is also packaged in a compact configuration that is familiar to the datacenter, telecom and consumer electronics industries."01.10.2019 02:30:00Oct\images\news_2019-10-15_12.jpghttps://www.littelfuse.com/about-us/news/news-releases/2019/09.30-protect-10gbe-high-speed-differential-data-lines.aspxlittelfuse.com/news-releases
One-Millionth GaN-Based ICPower Integrations announced the delivery of its o...8362Industry NewsOne-Millionth GaN-Based ICPower Integrations announced the delivery of its one-millionth InnoSwitch3 switcher IC featuring the company's PowiGaN gallium-nitride technology. In an event at the Shenzhen headquarters of Anker Innovations, Power Integrations CEO Balu Balakrishnan presented the one-millionth GaN-based IC to Anker CEO Steven Yang. Anker is a leading manufacturer of chargers and adapters, supplying retailers worldwide with powerful, compact USB PD adapters and a wide range of chargers and adapters for laptops, smart mobile devices, set-top boxes, displays, appliances, networking gear and gaming products. InnoSwitch3 offline CV/CC flyback switcher ICs with PowiGaN technology are up to 95% efficient across the load range. Very low switching and conduction losses of PowiGaN primary switch allows delivery of as much as 100 W from a space saving InSOP 24D surface mount package in enclosed adapter applications without requiring a heatsink. Quasi-resonant InnoSwitch3-CP, InnoSwitch3-EP and InnoSwitch3-Pro ICs combine the primary power switch, primary and secondary control with safety isolated high speed link (FluxLink) in between, as well as the secondary SR driver and feedback circuits in a single surface-mounted package. The superior switching performance of PowiGaN technology results in substantially higher efficiency, enabling very compact adapter designs. Commented Mr. Balakrishnan: "Anker is a world leader in compact charger design, and was the first high-volume customer for InnoSwitch3 products with PowiGaN. I'm pleased to recognize Anker's foresight and technical excellence, and to thank Mr. Yang for his critical contribution to the first successful mass-market deployment of high-voltage GaN technology."30.09.2019 18:00:00Sep\images\news_2019-10-15_5.jpghttps://investors.power.com/investors/press-releases/press-release-details/2019/Power-Integrations-Delivers-One-Millionth-GaN-Based-InnoSwitch3-IC/default.aspxpower.com/press-releases
Adaptable Buck-Boost Converters Deliver up to 2.5 A Texas Instruments introduced a family of four high...8399Product ReleaseAdaptable Buck-Boost Converters Deliver up to 2.5 A Texas Instruments introduced a family of four high-efficiency, low-quiescent-current (IQ) buck-boost converters that feature tiny packaging with minimal external components for a small solution size. The integrated TPS63802, TPS63805, TPS63806 and TPS63810 DC/DC noninverting buck-boost converters offer wide input and output voltage ranges that scale to support multiple battery-driven applications, helping engineers simplify and accelerate their designs. Each of the devices in the family automatically selects buck, buck-boost or boost mode according to the operating conditions. Their complete solution size of 19.5 mm2 to 25 mm2 – up to 25% smaller than similar devices – is a result of compact packaging, an advanced control topology requiring few external multilayer ceramic capacitors, and tiny 0.47-µH inductors. The devices offer a wide 1.3-V to 5.5-V input and 1.8-V to 5.2-V output voltage range, which helps engineers speed their designs and encourages reuse across multiple applications. These DC/DC converters are the latest addition to TI’s industry-leading low-IQ power-management portfolio, providing low 11- to 15-µA IQ for excellent light-load efficiency while minimizing power losses and extending run times in battery-driven applications such as portable electronic point-of-sale terminals, grid infrastructure metering devices, wireless sensors and handheld electronic devices.30.09.2019 16:30:00Sep\images\news_2019-11-15_22.jpghttps://news.ti.com/new-family-adaptable-buck-boost-converters-delivers-up-to-2.5-in-tiny-footprint-to-shrink-board-spacenews.ti.com
3DCoil Electro-Magnetic SensorPREMO announces the 3DC14EMR-ULP series, the lowes...8351Product Release3DCoil Electro-Magnetic SensorPREMO announces the 3DC14EMR-ULP series, the lowest profile 3D antenna coil available (below 50% when compared to other antenna coils in the market today). The majority of the 3D electromagnetic sensors available in the market have minimum heights of 3.2mm. The lowest profile 3D coil prior to the release of the ULP series was the PREMO 3DC06 series with a maximum height of 2.5mm. The 1.65mm height target has been the biggest challenge during the last 2 years. It was achieved by a joint ecosystem development effort between BQ, UC3M University and Premo. The entire project was under the scope of a CDTI-Spain (Center for the Development of Industrial Technology) research project called ASUMP. This is a true ultra low-profile sensor with a 12mm x 14mm footprint and a 1.65mm maximum height that is able to be integrated into ultra-thin devices such as SmartCard-type key fobs, traditional automotive key fobs, special miniaturized key fobs (sport keys), Smartphones (to be used as a digital key with the same user experience of current PKE access), and other devices such as hand-held controllers where EMMT (electromagnetic motion tracking technology) is used for 6DoF applications (real high- precision motion-tracking systems with no limitations in terms of line of sight, ultra-low latency, low power consumption, etc.).27.09.2019 10:30:00Sep\images\news_2019-10-15_16.pnghttps://www.grupopremo.com/content/242-premo-launches-the-3d14emr-ulp-seriesgrupopremo.com/content
High-Voltage Dual-Channel Solenoid Driver ICToshiba Electronics Europe has launched a dual-cha...8348Product ReleaseHigh-Voltage Dual-Channel Solenoid Driver ICToshiba Electronics Europe has launched a dual-channel solenoid driver IC that provides a high-voltage drive with low ON resistance. The TB67S112PG driver IC is suited to a wide variety of applications including domestic appliances (air-conditioners and refrigerators), industrial equipment (banking terminals such as ATMs, office automation equipment, and factory automation equipment). Toshiba's solenoid driver IC lineup currently includes 4- and 8-channel devices (TB67S111PG and TB67S158NG/FTG). The new TB67S112PG completes the lineup, by providing support for dual-channel applications at a lower price point. The device incorporates two channels, each consisting of a low-side MOSFET and a regenerative common diode that can independently drive a solenoid or relay at voltages up to 50V. A low ON resistance of only 0.3O allows for a higher output voltage, resulting in higher motor torque, and reducing heat generation during motor operation. Safe operation is enabled through the provision of overcurrent detection (ISD), under voltage lockout (UVLO) detection and thermal shutdown detection (TSD), which, additionally, sets a flag to notify the system controller of a thermal shutdown event.26.09.2019 22:22:00Sep\images\news_2019-10-15_19.jpghttps://toshiba.semicon-storage.com/eu/company/news/2019/09/linear-20190926-1.htmltoshiba.semicon-storage.com/news
ECPE Events• ECPE Tutorial 'Thermal Engineering of Power Elec...8360Event NewsECPE Events• ECPE Tutorial 'Thermal Engineering of Power Electronic Systems - Part II: Thermal Management and Reliability'<br>4 - 5 November 2019, Nuremberg, Germany<br> <br>• ECPE Tutorial 'Power Circuits for Clean Switching and Low Losses'<br>6 - 7 November 2019, Barcelona, Spain<br> <br>• ECPE Tutorial 'Power Semiconductor Devices & Technologies'<br>20 - 21 November 2019, Rüsselsheim (close to Frankfurt am Main), Germany<br> <br>• ECPE Workshop 'Power Semiconductors in Medium Voltage Applications - SiC vs. Silicon'<br>3 - 4 December 2019, Freiburg i.B., Germany<br> <br>• ECPE Workshop 'Power Semiconductor Robustness - What Kills Power Devices?'<br>13 January (afternoon) - 14 January 2020, Munich, Germany<br> <br>• ECPE Workshop 'Magnetic Components in power Electronics' - further information will be published soon<br>19 - 20 February 2020, Grenoble, France26.09.2019 20:00:00Sep\images\news_ecpe.pnghttps://www.ecpe.org/events/workshops-tutorials/all/ecpe.org/events
Rolling Jamming TransmittersExactly tailored to the needs of electric vehicles...8345Product ReleaseRolling Jamming TransmittersExactly tailored to the needs of electric vehicles is the latest filter series FPAB, which - as usual at SCHURTER - can be fully customized. This single-stage filter places a high value on robustness, impermeability to dust and moisture. Thanks to the use of a well-sealed connector from Tyco, which is popular in the automotive industry, it is particularly lightweight and used universally. All connections are screwed to withstand even the most stubborn vibrations. SCHURTER is certified according to IATF16949 and serves a large number of customers with fuses which have been tested according to AEC-Q200 for various applications (battery management, climate control, engine related electronics for diesel/petrol engines and many more). Millions and millions of fuses to protect against overcurrent and overtemperature are in use worldwide. The close networking with international automotive organizations and the industry itself make SCHURTER a competent partner for all questions concerning the protection of electronics in automotive engineering. In addition, SCHURTER has a competence center for EMC solutions, which has been developing tailor-made solutions for industrial and medical applications for decades. Test us. We would also be pleased to demonstrate our EMC competence to you on site.26.09.2019 12:30:00Sep\images\news_2019-10-15_22.jpghttps://www.schurter.com/en/Newsroom/Timeline/Rolling-Jamming-Transmittersschurter.com/Newsroom
MOSFETs in TO-Leadless Packaging TechnologyAlpha and Omega Semiconductor introduced the TO-Le...8352Product ReleaseMOSFETs in TO-Leadless Packaging TechnologyAlpha and Omega Semiconductor introduced the TO-Leadless (TOLL) package in combination with a 60V and 100V Shield-Gate Technology (SGT) providing the highest current capability in its voltage class. The TOLL package has the highest current capacity due to AOS' innovative technology, which utilizes a clip to achieve the in-rush current. The TOLL packaging technology offers a very low package resistance and inductance due to the clip technology when compared to other TO-Leadless packages. This packaging technology uses a standard wire-bonding technology which enables improved EMI performance. The AOTL66608 (60V), AOTL66610 (60V), and AOTL66912 (100V) have a 30% smaller footprint compared to a TO-263 (D2PAK) package and has a higher current capability which enables the designer to reduce the number of MOSFETs in parallel. The device's offer a higher power density compared to existing solutions. They are ideally suited for industrial BLDC motor applications and battery management. "Using the AOS TOLL package with clip technology offers performance improvement in a robust package. The AOTL66608, AOTL66610, and AOTL66912 can simplify new designs with the higher current capability to enable savings in overall system cost due to a reduced number of devices in parallel," said Peter H. Wilson, Marketing Director of MOSFET product line at AOS.26.09.2019 07:30:00Sep\images\news_2019-10-15_15.jpghttp://www.aosmd.com/res/news/news-article-1569519641412/AOTL66608-66610-66912_PR.pdfaosmd.com/news
Transformer for High Power, High Frequency ApplicationsMurata has announced a transformer technology for ...8356Product ReleaseTransformer for High Power, High Frequency ApplicationsMurata has announced a transformer technology for high power, high frequency applications that uses a novel winding technique to allow designers to efficiently reach power and frequency levels that were never possible with conventional winding methods. Murata's patented pdqb winding technology makes it possible to construct high frequency transformers of up to and over 400 kW that can operate at frequencies as high as 50 kHz. The pdqb winding technique overcomes the skin and proximity effects as well as other high frequency losses associated with conventional construction methods, delivering an efficient (>99.5 %) solution in a compact footprint. There are a number of further benefits to the winding technique including an increased working voltage and elevated isolation voltage (up to 10 kV). The leakage inductance is highly controllable and interwinding capacitance is low, both of which enhance performance in customer's designs. Thermal performance is also improved, eliminating the space requirements and cost associated with heatsinking. Each design can be optimized by a combination of Murata's transformer expertise and their own simulation software. Murata is able to design custom high power, high frequency transformers operating around 4-50 kHz with power ratings from 30 kW to 400 kW.26.09.2019 01:30:00Sep\images\news_2019-10-15_11.jpghttps://www.murata.com/en-eu/products/info/power/magnetics/2019/0926?intcid5=com_prd_xxx_xxx_rn_xxxmurata.com/info
Power Electronics Conference 2019Power Electronics is rapidly moving towards Wide B...8342Event NewsPower Electronics Conference 2019Power Electronics is rapidly moving towards Wide Bandgap, because the key for the next essential step in energy efficiency lies in the use of new materials, such as GaN (gallium nitride) and SiC (silicon carbide) which allow for greater power efficiency, smaller size, lighter weight and lower overall cost. Wide Bandgap Semiconductors are transforming power electronics designs across many applications such as data centers, renewable energy, automotive and many more. This 1-day technical conference will explain why, how and where this is happening. Conference delegates will be provided with the knowledge necessary to make their decisions on where, how and which Wide Bandgap platforms and devices can play a role in current or upcoming designs.26.09.2019 00:00:00Sep\images\news_2019-10-01_0.jpghttps://www.power-conference.compower-conference.com
Battery Interconnect Systems Streamline Custom Design and AssemblyInterplex has announced availability of the Cell-P...8350Product ReleaseBattery Interconnect Systems Streamline Custom Design and AssemblyInterplex has announced availability of the Cell-PLX custom battery interconnect systems. This technology streamlines the design and manufacturing of robust interconnects for battery modules across an extensive range of industries. Battery module designs vary widely by manufacturer and specific application, be it for electric vehicles (EVs) and automotive power applications, land and maritime transportation, or wind energy storage. However, all of them fundamentally require robust mechanical and electrical interconnect systems to integrate and interface with the array of battery module cells. Cell-PLX addresses these intricate complexities with a custom battery interconnect system that connects battery cells to current collectors, and a customizable lead frame interface to the battery management system. By tackling the full range of design requirements, it delivers a customized power solution that effectively handles the increasing variety of battery module sizes and configurations. According to Craig Kennedy, Product Portfolio Director for Battery Interconnect Systems, "as battery applications rapidly advance, flexibility and customization is key to success. Cell-PLX is customizable to specific application designs. It supports various current density requirements, with single or multi-layered current collectors and dielectric layers of different thicknesses. With our advanced high-speed manufacturing processes, cell connection terminals on the current collector can be made thinner than the current collector itself. This assures a reliable weld joint to the battery cells while maintaining minimum current density requirements."25.09.2019 04:30:00Sep\images\news_2019-10-15_17.jpghttps://interplex.com/betteryourbattery/interplex.com/betteryourbattery
Expert to Present at ITW EAE SeminarIndium Corporation expert Andreas Karch, Regional ...8331PeopleExpert to Present at ITW EAE SeminarIndium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the ITW EAE Smart Stencil Printing Solutions seminar, October 23-24, in Dreieich, Germany. Karch's presentation, Voiding and How to Optimize Current Printing Processes, will examine the evolution of solder paste for the elimination of voiding. He will also discuss stencil design, specifications, and other printing tips and tricks to help engineers optimize their processes. As a Regional Technical Manager, Karch provides support, including sharing process knowledge and making technical recommendations, for the use of Indium Corporation's solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer and has earned his Six Sigma Yellow Belt. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.24.09.2019 15:00:00Sep\images\news_2019-10-01_11.jpghttps://www.indium.com/people/marketing-communications/news-releases/indium-corp-expert-to-present-at-itw-eae-seminarindium.com/news-releases
Integrated Point-of-Load RegulatorInfineon Technologies introduces the OptiMOS IR382...8349Product ReleaseIntegrated Point-of-Load RegulatorInfineon Technologies introduces the OptiMOS IR3826(A)M integrated point-of-load DC-DC voltage regulator. It is a fully integrated and highly efficient device in two versions (IR3826AM for 16 A and IR3826M for 23 A) for applications such as netcom router and switches, datacom, telecom base stations, server and enterprise storage. The voltage regulator can operate from an input voltage of 12 V (5 V to 17 V) and provide up to 16 A or 23 A continuous current. It enables high-switching-frequency operations with enhanced efficiency and reduced power losses compared to previous generations of Infineon's offering. Furthermore, the device supports high switching frequency of up to 1.5 MHz for small PCB size and less capacitors. Both current ratings are offered in PQFN package with 5 mm x 6 mm footprint for easy scalability. Parts are pin-compatible to the previous product offerings to allow risk-free efficiency upgrade with minimum design effort. The IR3826(A)M solves the heat challenge without or with minimum airflow in thermally constrained application designs such us 3.3 V or 5 V supply voltages. Additionally, it supports applications that operate with high ambient temperature, e.g., 85°C for telecom. The state-of-the-art PWM Gen 3 engine of the devices allows operation with fixed frequency to reduce noise in multi-rail telecom or high-end Netcom applications, like base stations. The devices are fully RoHS2 compliant without an exemption to accommodate future regulations.23.09.2019 20:30:00Sep\images\news_2019-10-15_18.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2019/INFPMM201909-095.htmlinfineon.com/market-news
SiC Device Manufacturing FacilityCree, Inc. announced plans to establish a silicon ...8339Industry NewsSiC Device Manufacturing FacilityCree, Inc. announced plans to establish a silicon carbide corridor on the East Coast of the United States with the creation of the world's largest silicon carbide fabrication facility. The company will build a state-of-the-art, automotive-qualified 200mm power and RF wafer fabrication facility in Marcy, New York, complemented by its mega materials factory expansion currently underway at its Durham headquarters. The fabrication facility, part of a previously announced project to dramatically increase capacity for its Wolfspeed silicon carbide and GaN business, will be a bigger, highly-automated factory with greater output capability. Through a strategic partnership with the office of Governor Andrew M. Cuomo and other state and local agencies and entities, the decision to build in New York will allow for both continued future expansion of capacity and significant net cost savings for Cree. As a result, Cree will continue to drive the transition from silicon to silicon carbide technology to meet the increasing demand for the company's groundbreaking Wolfspeed technology that supports the growing electric vehicle (EV), 4G/5G mobile and industrial markets. "Silicon carbide is one of the most pivotal technologies of our time, and is at the heart of enabling innovation across a wide range of today's most groundbreaking and revolutionary markets, including the transition from the internal combustion engine to electric vehicles and the rollout of ultra-fast 5G networks," said Gregg Lowe, CEO of Cree.23.09.2019 15:00:00Sep\images\news_2019-10-01_3.jpghttps://www.cree.com/news-events/news/article/cree-announces-update-to-capacity-expansion-plancree.com/news
Project for Open Source Test AutomationKeysight Technologies, in conjunction with the Ope...8334Industry NewsProject for Open Source Test AutomationKeysight Technologies, in conjunction with the OpenTAP project community, is pleased to welcome four new participants to the OpenTAP project: 5G-VINNI, Page Electronica NV, TandM Solutions and Tokalabs. The OpenTAP project comprises a growing community of developers dedicated to the idea of effortless automation. The core technology is a test sequencer, with the community continuously adding plugins and solutions that support faster development, new functionality and optimization in test. Through these contributions and the enhanced collaboration possible with its open-core approach, OpenTAP is inspiring developers to innovate automation solutions in testing and measurement, and beyond. Dan Thomasson, vice president of Keysight Labs, commented: "OpenTAP's architecture is designed for extensibility, making it flexible for many different use cases. It is exciting to see all the ways it is being put to use by the growing community. "23.09.2019 09:00:00Sep\images\news_keysight.pnghttps://about.keysight.com/en/newsroom/pr/2019/23sep-nr19125.shtmlkeysight.com/newsroom
20A 40Vdc MIL-COTS EMI FiltersTDK Corporation announces the introduction of the ...8324Product Release20A 40Vdc MIL-COTS EMI FiltersTDK Corporation announces the introduction of the TDK-Lambda FQA series of EMC filters, with a rating of +/-40Vdc at 20A. The FQA has a rugged encapsulated quarter-brick package with a choice of flanged or non-flanged baseplates. These modules are suitable for use in a wide variety of harsh and demanding environments, including MIL-COTS vehicle and airborne applications. The FQA series is designed with a high differential and common mode noise attenuation. This simplifies system level compliance to MIL-STD-461G standards. The modules also provide input spike protection to MIL-STD-1275D and RTCA/DO-160G. Qualifying testing is consistent with MIL-STD-883F and MIL-STD-202G. The PCB mount FQA can be cooled using either an industry standard ¼ brick heatsink, or conduction cooled via a cold plate. The non-flanged package size measures 60.6 x 39 x 12.7mm (L x W x H) and the flanged version 60.6 x 55.9 x 12.7mm. The total DC resistance of the filter is typically 12mO, minimizing power losses. The filters are available with standard production screening (-S suffix) and a baseplate temperature rating of -40°C to +115°C, or with enhanced screening (-M suffix) and an extended temperature rating of -55°C to +115°C. Enhanced screening includes functional testing at high and low temperatures and a 96 hour burn-in period with temperature cycling.20.09.2019 14:14:00Sep\images\news_2019-10-01_18.jpghttps://www.us.tdk-lambda.com/lp/news/press-release-september-19th-2019-20a-40vdc-mil-cots-emi-filters-simplify-compliance-to-mil-std-461g-mil-std-1275d-and-rtca-do-160g/us.tdk-lambda.com/news
Cleaning Machines, Cleaning Agents and Analytical SupportUsing the motto "Make the Cleaning Check", ZESTRON...8322Product ReleaseCleaning Machines, Cleaning Agents and Analytical SupportUsing the motto "Make the Cleaning Check", ZESTRON will be exhibiting a selection of state-of-the-art cleaning machines from leading international manufacturers. Visitors who are looking for a new cleaning system will be shown diverse, innovative and proven technologies. ZESTRON's process engineers and experts from the equipment manufacturers are available to answer questions about the technology as well as the compatible cleaning chemistry. In addition to the selection of machines and cleaning agents, the focus is on process monitoring. Trade show visitors can get information about innovative test methods and measuring concepts that help to ensure the reliability of electronic assemblies and to optimize production processes.19.09.2019 19:19:00Sep\images\news_2019-10-01_20.pnghttps://www.zestron.com/en/news/press-releases/detail/cleaning-machines-cleaning-agents-and-analytical-support-at-the-productronica.htmlzestron.com/news
Medical 40-65W External Power SuppliesTDK Corporation announces the introduction of the ...8400Product ReleaseMedical 40-65W External Power SuppliesTDK Corporation announces the introduction of the TDK-Lambda brand DTM65-D external power supplies rated at up to 65W output power. Certified to the IEC 60601-1 medical standard, the series complies with the latest EU CoC (Code of Conduct) Tier 2 v5 and US DoE Level VI efficiency standards. Applications include medical products, industrial computing, life sciences and laboratory equipment. Packaged in a rugged, vent-free enclosure, the DTM65-D measures 132mm x 69mm x 40mm (L x W x H). Eight outputs are available (5V, 12V, 15V, 19V, 24V, 28V, 36V and 48V) with connections made using a standard 4-pin power DIN latching connector, with other types available upon request. The 90 - 264Vac input assures global operation and is applied through a three-pin IEC 320-C14 receptacle. The operating temperature is -20ºC to +60ºC, which derates linearly to 75% load from 51ºC to 60ºC. Average efficiency is greater than 89% (>87.3% for the 5V model) and the off-load power consumption is less than 0.15W.19.09.2019 14:30:00Sep\images\news_2019-11-15_21.jpghttps://www.emea.lambda.tdk.com/de-en/news/article.aspx?cid=15290emea.lambda.tdk.com/news
Katja Stolle Takes Over as Exhibition Directorelectronica trade fair and conference have a new E...8341PeopleKatja Stolle Takes Over as Exhibition Directorelectronica trade fair and conference have a new Exhibition Director. Katja Stolle, who has been with Messe München over 13 years, is now leading the project team. The next electronica will be held in Munich from November 10 to 13, 2020. Katja joined Messe München in 2006 after earning a degree in humanities. In 2012, she took over the exhibition management of analytica – the leading international trade fair for laboratory technology, analysis and biotechnology. Over the past six years, she has led the LASER World of PHOTONICS and the World of Photonics Congress. She was primarily responsible for the strategic and conceptual enhancement of the world's leading trade fair for photonic components, systems and applications. Katja Stolle reports to Ms. Barbara Müller, who will continue to oversee the global electronic network at Messe München in her position as Exhibition Group Director. The new position represents both a challenge and motivation for Katja: "electronica is without a doubt the world's most important meeting place for the electronics industry. For this reason, I am really excited about the opportunity to enhance the event with the help of my team and expand the internationally leading role that electronica plays."19.09.2019 10:00:00Sep\images\news_2019-10-01_1.jpghttps://electronica.de/press/newsroom/press-releases/katja-stolle-takes-over-as-electronica-exhibition-director.htmlelectronica.de/newsroom
SOI Industry Consortium Announces AwardsThe SOI Industry Consortium announced awards to tw...8336PeopleSOI Industry Consortium Announces AwardsThe SOI Industry Consortium announced awards to two luminaries of the semiconductor industry. Jim Cable, Chairman and CTO of pSemi, a Murata Company, and Herb Huang, CEO and GM of Ninbo Semiconductor received awards for their contributions to the advancement of RF-SOI, a leading technology used extensively in chips for cellular communications. The awards were given during a gala following the SOI Consortium's annual RF-SOI Workshop in Shanghai. "Thanks in large part to the innovation, dedication and perseverance of men like Jim Cable and Herb Huang, RF technology based on SOI is now ubiquitous," said Carlos Mazure, Executive Director of the SOI Consortium. "Jim Cable drove the development of SOI and RF switches that are now in every cellphone, and Herb Huang has been a key contributor to SOI technology and a champion of the SOI foundry ecosystem here in China. We are happy and honored to recognize the contributions they have made to advancing RF SOI globally." Jim Cable joined pSemi (formerly Peregrine Semiconductor) in 1996 and held technical leadership roles before serving as CEO from 2002 to 2017. An early pioneer of SOI technology, Cable believed SOI would ultimately replace other technologies in the RF front end, and he pushed his team to innovate.18.09.2019 13:00:00Sep\images\news_2019-10-01_6.jpghttps://www.prnewswire.com/news-releases/soi-industry-consortium-announces-awards-during-shanghai-event-300920780.htmlprnewswire.com/news-releases
EMV 2020 in CologneNumerous companies will present their products and...8338Event NewsEMV 2020 in CologneNumerous companies will present their products and services in the field of electromagnetic compatibility at the EMV, which will take place in Cologne from 17 - 19 March 2020. The exhibition and conference are ideal platforms for product developers, users and scientists to network and exchange information on the latest developments in the industry. As from 2020, the EMV with its conference, which previously took place every two years in Dusseldorf will be held in Cologne. The Koelnmesse exhibition grounds will be hosting the event in hall 10.2 and the adjacent Congress Centre East, where all participants will benefit from ideal transport links, a restaurant integrated into the hall and short distances between the conference and the trade fair.18.09.2019 11:00:00Sep\images\news_2019-10-01_4.jpghttps://emv.mesago.com/events/en/press/press-releases/emv-press-releases/new-exhibitors.htmlemv.mesago.com/press
SMTconnect 2020 Offers Numerous Ways to ParticipateCompanies wishing to participate in the SMTconnect...8357Event NewsSMTconnect 2020 Offers Numerous Ways to ParticipateCompanies wishing to participate in the SMTconnect, the exhibition for microelectronic components and systems, taking place in Nuremberg from 5 – 7 May 2020, can choose from a variety of offerings. Almost eight months before the next SMTconnect, exhibitor registration is in full swing with more bookings than at the same time last year. When registering, companies can choose between participating with their own stand, a rental stand or one in the following special showcase areas. EMS Park – contract manufacturing in one place After a successful premiere of the EMS Park this year, this special showcase area for contract manufacturers and full-service providers will also be available in 2020. The EMS Park, designed for relaxed but efficient networking opportunities, allows companies to participate with their own stand or a stand package. The enticing catering and networking is the focal point of the area. At the Speakers' Corner, exhibitors have the opportunity to present their topics and solutions to trade visitors from various sectors, such as medical technology, automotive, industrial electronics and many more. "Participation as an exhibitor at the EMS Park was definitely a good investment for us. The discussions we had were very substantial and offer great potential. We were also able to take some new impulses with us," stated Dr. Lars Rebenklau, Groupmanager Systems Integration and Electronic Packaging, Fraunhofer Institute for Ceramic Technologies and Systems IKTS, on his participation in EMS Park 2019.18.09.2019 10:00:00Sep\images\news_2019-10-15_10.jpghttps://smt.mesago.com/events/en/press/press-releases/smt-press-releases/various-offerings-exhibitors.htmlsmt.mesago.com/press
Regulator Combines Ultra-Low IQ with Fast Transient ResponseTexas Instruments introduced an ultra-low-power lo...8353Product ReleaseRegulator Combines Ultra-Low IQ with Fast Transient ResponseTexas Instruments introduced an ultra-low-power low-dropout (LDO) linear voltage regulator with the industry's lowest quiescent current (IQ) of sub-25 nA – one-tenth that of competing ultra-small devices. The new regulator features low IQ control at light loads even in dropout conditions, allowing engineers to at least double the battery life of their applications. In addition, it provides best-in-class transient response for faster wake-up, improving application response times and dynamic performance. The small solution footprint helps engineers design smaller, lighter, more efficient products quickly by reducing power-supply solution size, and its common industry packages allow for pin-to-pin drop-in replacement in existing designs. The TPS7A02 helps engineers solve critical design challenges in many power-sensitive, high-precision and low-power applications such as in the grid infrastructure, building automation, medical equipment and wearables markets. The device joins TI's portfolio of low-IQ LDO linear regulators that enable designers to prolong system life. By implementing the TPS7A02 with other ultra-low IQ devices – such as TI's family of ultra-low-power MSP430 microcontrollers (MCUs), the SimpleLink CC2642R MCU, the TLV8802 nanopower operational amplifier or the TMP1075 low-power temperature sensor – engineers can further optimize battery life and performance in their systems.17.09.2019 18:33:00Sep\images\news_2019-10-15_14.jpghttps://news.ti.com/no-trade-offs-industrys-lowest-quiescent-current-ultra-small-ldo-linear-regulator-can-help-double-battery-life-in-power-sensitive-industrial-and-personal-electronicsnews.ti.com
Improved Performance of 5G DevicesAs 5G devices are entering the market, the industr...8337Industry NewsImproved Performance of 5G DevicesAs 5G devices are entering the market, the industry is looking for further improvements for future device generations. Heraeus' 5G solution portfolio will enable customers to not only reduce costs, but also to improve performance and quality of 5G. Heraeus has identified four top challenges which require innovative solutions: Challenge #1: Electromagnetic interference (EMI) - Heraeus has developed a one-stop-shop solution based on a specially formulated, particle-free silver ink, an ink-jet printer and curing equipment. Challenge #2: Miniaturization - Welco Solder Paste offers superior fine pitch printing performance due to its excellent rheological properties and thus enables smaller consumer devices – including 5G mobile phones. Challenge #3: Cost pressure - AgCoat Prime – a gold coated silver wire – offers a real alternative to gold wire for the memory device packaging in 5G technology. Challenge #4: High temperatures - Classical soldering processes reach their limits with these requirements. An alternative is sintering. Heraeus' mAgic silver sinter pastes increase the lifetime of devices up to ten times.17.09.2019 16:00:00Sep\images\news_2019-10-01_5.jpghttps://www.heraeus.com/en/group/press_group/corporate_news/2019_group/10_Heraeus_offers_new_solutions_for_improved_performance_of_5G_devices.htmlheraeus.com/press
High Power TVS Diodes Protect Vulnerable ElectronicsLittelfuse, Inc. announced a series of higher surg...8328Product ReleaseHigh Power TVS Diodes Protect Vulnerable ElectronicsLittelfuse, Inc. announced a series of higher surge TVS Diode products in a DO-214AB package. The 8.0SMDJ series is optimized to protect sensitive electronic equipment from transient voltage induced by lightning and other voltage events. Because it combines up to 8000W of peak pulse power dissipation in a compact DO-214AB SMC package, the 8.0SMDJ series offers circuit designers a high-surge, space-saving circuit protection solution that can simplify printed circuit board design and improve reliability significantly. "Compared to other market solutions currently available, the unidirectional and bidirectional 8.0SMDJ series TVS Diodes deliver higher surge protection in a small DO-214AB SMC package. It is ideal for DC12V, DC24V, and DC48V applications either by using single device or two in a series." said Meng Wang, Global Product Manager Power TVS at Littelfuse. "The combination of a high power TVS diode in a compact footprint means circuit designers can conserve precious board space for design optimization opportunities including increased power density and higher production efficiency."17.09.2019 13:45:00Sep\images\news_2019-10-01_14.jpghttps://www.littelfuse.com/about-us/news/news-releases/2019/09.17-high-power-tvs-diodes-from-littelfuse-protect-vulnerable-electronics.aspxlittelfuse.com/news-releases
Automotive-Grade Backlight LED DriverROHM announced the availability of the latest LED ...8323Product ReleaseAutomotive-Grade Backlight LED DriverROHM announced the availability of the latest LED driver IC, the BD81A76EFV-M, optimized for LCD backlight in instrument cluster, center information displays and car navigation. Unlike conventional drivers with 4 channels that support LCDs up to 8", this IC provides 6 channels of output (with 120mA per channel) that can support LCD panels of up to 10-12" class. At the same time original buck-boost control ensures compatibility with both small and large LCDs using a single driver. This makes it possible to develop a common design of LCD control board suitable for conventional panels along with the latest large-size displays. In recent years, to improve both visibility and design in the automotive field, LCDs are being used in an increasing number of systems including instrument clusters, head-up displays and car navigation. In addition, larger screen sizes are being demanded. They require a greater number of high brightness LEDs for backlight as well as LED drivers featuring multi-channel operation and advanced dimming features that can prevent flicker effects. In response to this increasing market need, ROHM has leveraged its industry-leading analog design technology and incorporated proprietary technologies into its LED drivers to achieve flicker-free operation and to contribute to a common control board design. The BD81A76EFV-M also allows designers to use larger LCD panels in vehicle applications.17.09.2019 13:13:00Sep\images\news_2019-10-01_19.jpghttps://www.rohm.com/news-detail?news-title=automotive-grade-backlight-led-driver&defaultGroupId=falserohm.com/news