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14Military-Grade Laptop PSU is 90% Smaller and Lighter, 80% Lower Cost
16International Symposium on Power Semiconductor Devices and ICs—ISPSD 2018
20Book Review: “Electric Powertrain”
22Secrets of ‘Fluid-Like’ Heat Flow in Solid Semiconductor at Nanoscale
24Automotive Traction Inverter Utilizing SiC Technology
30x-GaN 2.0: The Destination FiT10 is Demonstrably Exceeded
36USB Type-C: Consumer Convenience Comes with Design Challenges
38Gate Drive Optocouplers for GaN Power Devices
42Inevitability of Near Chip-Scale SMD Packaging for Power GaN & SiC
46Preventing Start-Up Issues Due to Output Inrush in Switching Converters
5499% PFC Efficiency – with Silicon, at Low Cost!
58Modular Real-Time Development Platform for Power Electronic Systems

Editorial
What a Hot PCIM Europe!

For the first time since 2005, PCIM Europe was held in June. OK, for perfectionists, PCIM 2006 ended on June 1st. This one brought nice weather - and the opportunity to sit outside until late in the evening to review the day at the show and the ton of impressions. Bodo was still able to enjoy Spargel from the menu. And as hot as the weather was when entering the halls, so also were the “Hot” contents: 506 exhibitors from all around the world, presenting to over 11,000 visitors. Things are getting so large; it was nice to find most of the booths at the same place as last year.

PCIM is clearly committed to be an important event in Europe, with large players as well as smaller companies seeing the show as a must to attend. And they are right, proving loyalty and solidarity to an event being held since 1979. I will bet it stays the same next year for its 30th anniversary.

And while Wide Band Gap material product applications are still at a very early stage of development, it was interesting to see some big players trying to get a foot in both SiC and GaN. New teams, facilities and laboratories, and strategic cooperation between established companies from “the other technology”, seem to me like logical steps towards servicing customers by offering the whole package – certainly a sign of some maturity. It’ll be very interesting to see how these developments work out - see the News section in this issue to illustrate what I’m referring to.

But while Wide Band Gap surely was the dominating topic, a lot of other interesting things were presented. For example, using Artificial Intelligence via IC’s, to eliminate switching losses in Power Conversion, is a really interesting new approach, as presented by a Silicon Valley based company. Again, more information can be found in this issue.

And not to forget Bodo’s traditional Podium’s Discussion! Every single chair was taken, with many interested people making the effort of standing to catch the latest news from SiC and GaN experts. A big thank you to all the presenters for taking the time to participate in the podium!
Don’t worry if you missed it, we will have most of the presentations published in upcoming issues.

Bodo’s magazine is delivered by postal service to all places in the world. It is the only magazine that spreads technical information on power electronics globally. We have EETech as a partner to serve North America more efficiently. If you are using any kind of tablet or smart phone, you will find all of our content on the website www.eepower.com. If you speak the language, or just want to have a look, don’t miss our Chinese version: www.bodospowerchina.com

My Green Power Tip for July:
Use a fan instead of ramping up your air conditioner. A ceiling fan can make a room feel noticeably cooler and uses 10 percent of the energy of a central air conditioner.

Best Regards
Holger
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